201223351 六、發明說明： 【發明所屬之技術領域】 本發明係主張關於2010年1〇月η曰申請之韓國專利案號 10-2010-0099002。||以引用的方式併入本文用作參考。 本發明係關於一種輕散熱電路板（radiant heat circuit board) ° 【先前技術】 〇 電路板包含一電路圖案在一絕緣板上。該電路板為一基板用 來安裝電氣元件。 這些電氣元件可包括發熱裝置，例如發光二極體(LED)。發 熱裝置可發出相當多的熱。從發熱裝置發出的熱會增加電路板的 溫度，從而造成發熱裝置的故障以及降低發熱裝置的可靠度。 為解決輻散熱的限制，而提出如圖1的一輻散熱電路板。 圖1為根據習知技術之一輻散熱電路板的剖視圖。 〇 參照圖1，根據習知技術的一輻散熱電路板包括：一金屬板 1包含-輕散熱突出物2、一絕緣層3、一電路圖案4、以及一抗 焊劑5。 *在輕散減雜1〇巾，—發練置2〇接合(attaeh)至輻散 ，、大出物2以傳輸熱至下金屬板卜此處，該發絲置係經由一 焊料6而連接至電路圖案4。 在根據習知技街的轉散熱電路板1〇巾，由於絕緣層3的干 擾’從發熱裝置2G發出的熱並未被傳輸至金屬板1以釋放熱。 【發明内容】 ” 4 201223351 實施例提供具有新型結構的一輻散熱電路板以及具有該輻散 熱電路板的一發熱裝置封裝件。 實施例同時提供具有改善效率的一輻散熱電路板以及具有該 輻散熱電路板的一發熱裝置封裝件。、 在一實施例中，用以安裝複數個發熱裝置的一輻散熱電路板 包括：一金屬板包含該些發熱裝置接合至的一整合式金屬突出 物；一絕緣件暴露該整合式金屬突出物，該絕緣件包括設置在該 0 金屬板上的複數個絕緣層；以及一第一以及一第二電極墊設置在 該絕緣件上，該第一以及該第二電極墊係彼此電性分離。該第一 或該第二電極塾可接收一電藶來自於設置在·緣件的不同絕緣 層上的電路線(circuit wires)。 在另-實施射，-發熱裝置封裝件包括：—_熱電路板 包含複數個裝置安裝區域界定於其中的一整合塾（integrated201223351 VI. Description of the Invention: [Technical Field to which the Invention Is Applicable] The present invention claims Korean Patent No. 10-2010-0099002 for the application of the January 1st, 2010. || is incorporated herein by reference for reference. The present invention relates to a radiant heat circuit board. [Prior Art] A circuit board includes a circuit pattern on an insulating board. The board is a substrate for mounting electrical components. These electrical components may include heat generating devices such as light emitting diodes (LEDs). The heat generating device can emit a considerable amount of heat. The heat generated from the heat generating device increases the temperature of the board, thereby causing malfunction of the heat generating device and reducing the reliability of the heat generating device. In order to solve the limitation of the heat dissipation of the spoke, a heat radiating circuit board as shown in FIG. 1 is proposed. 1 is a cross-sectional view of a heat sink circuit board in accordance with one of the prior art techniques. Referring to Fig. 1, a spoke heat dissipation circuit board according to the prior art includes: a metal plate 1 comprising a light heat sink protrusion 2, an insulating layer 3, a circuit pattern 4, and a solder resist 5. * In the light and smashing 1 〇 towel, - the erection 2 〇 joint to the divergence, the large output 2 to transfer heat to the lower metal plate, the hair is placed through a solder 6 Connected to the circuit pattern 4. In the heat-dissipating circuit board 1 according to the conventional street, heat emitted from the heat generating device 2G due to the interference of the insulating layer 3 is not transmitted to the metal plate 1 to release heat. SUMMARY OF THE INVENTION 4 201223351 Embodiments provide a spoke heat dissipation circuit board having a novel structure and a heat generating device package having the same. The embodiment simultaneously provides a spoke heat dissipation circuit board having improved efficiency and having the same A heat sink package of the heat dissipation circuit board. In one embodiment, a heat sink circuit board for mounting a plurality of heat generating devices includes: a metal plate including an integrated metal protrusion to which the heat generating devices are coupled; An insulating member exposing the integrated metal protrusion, the insulating member comprising a plurality of insulating layers disposed on the 0 metal plate; and a first and a second electrode pad disposed on the insulating member, the first and the The second electrode pads are electrically separated from each other. The first or second electrode electrodes can receive an electric circuit from circuit wires disposed on different insulating layers of the edge member. The heat generating device package comprises: - a thermal circuit board comprising a plurality of device mounting areas defined therein an integrated 塾 (integrated
Pad) ’該整合墊越過該些裝置安裝區域且彼此連接、複數個絕緣 ❹層暴露該整合墊且埋覆jurying}複數個f路圖案、以及複數個 電極墊設置在該些絕緣層上且連接至該些電路圖案；以及複數個 發熱裝置接合至祕合塾和暴露縣-較絲區_該些電極 墊。 一 在再-實施例中，用以安裝複數轉熱裂置之輕散熱電路板 的製造方法包括：形成-整合式金屬如物用來啊接合該些發 ，裝置於-金屬板；形成-絕緣層暴露在麵屬板上職金屬突 _和包括-埋覆的(toied)電路圖案；形成—貫孔暴露在該絕 201223351 緣層中該=覆的電簡；以及形成藉由該貫孔 的電路圖案的-電極塾於絕緣層上。 運接至該埋覆 -或多個實施例將伴隨_及以下說 特徵將彳犧鳴 【實施方式】 在後文中，本發明之示範實施例將伴隨圖示進 以此方式可使熟知此技藝者實現本發明 ;:二 Ο ❹ 例可以不賴來職，且肅限靖齡_1 紘在本_巾者包括（或包含)-些元件，應被 理解，如紋有其鎌制，討魏括U包含或具有）這此元 件’或其可包括（或包含或具有）其它元件與這些元件。一 在圖示中’為清楚陳述，本發明中任何不需要的描述將予以 省略1為清楚綱層與區域的目的’厚度將變大。在圖示中相 同的7G件將代表相同元件，所以它_贿將予以省略。 在說明書中，應被理解，當提及一層、一膜、一區域、或一 板體是在另-層、膜、區域、或減之上時，難可以是直接地 在其它層、區域、或片體、或是多個中介層、多片臈、多個區 域、或多個板體之上。另一方面，應被理解當一層、一膜、一區 域或一板體係直接地在另一者之上時，可以沒有其它的層、膜、 區域、以及板體。 本發明提供-電路板’其中在該電路板中用以安裝複數個發 熱裝置於一金屬板的一墊狀突出物(pad projecti〇n)係被整合以 改善散熱。 201223351 在後文中’將參照圖2至圖6描述根據一實施例的—輕散熱 電路板及具有該輻散熱電路板的一發熱裝置封裝件。、、、 图為根據實;^例之一發熱裝置封裝件的分解透視圖。圖 3繪示圖^的—輻散熱電路板的上視圖。圖4為圖3之發熱袭置 封裝件沿著線Ι-Γ的剖視圖。圖5為圖3之發熱裝置封裝件沿 著線ΙΗΓ的剖棚。圖6制3之發錄置封裝件沿著線 ΙΙΙ-ΙΙΓ的剖視圖。 0 在後文中，將一起描述一輻散熱電路板與具有其之一發熱裝 置封裝件。 ~ 參照圖2至® 6 ’根據—實施儀-發熱裝置封裝件包括一 輕散熱電路板1GIUX及複油钱在||散熱轉板⑽上的發熱 裝置200。 … 輻散熱電路板1〇〇包括成一直線排列的安裝墊115a以安裝 成一直線排列的發熱裝置200。 雖然本實施例繪示條狀式的輻散熱電路板1〇〇，但本發明並 ❹非限定於此。舉例而言，輻散熱電路板1〇〇可以一圓形 (circular)或矩陣形式(matrix type)來提供。 當成一直線排列的該些發熱裝置200安裝在輻散熱電路板 100上時’輕散熱電路板100可包括成一直線排列的該些安裝藝 115a。 幸虽散熱電路板100包括一金屬板110、絕緣層120、140、 160設置在金屬板11〇上、以及電路圖案13〇、153、155、15卜 201223351 152、154、156a、156b、156c、156d 設置在絕緣層 120、I40 上。 金屬板110可以具有優越導熱性的一合金所形成，該合金包 含銅、鋁、錄、金、或鉑中的一者。 金屬板110包括一金屬突出物115，該金屬突出物115構成 用來安裝發熱裝置200的安裝墊i15a。 金屬突出物115從金屬板11〇垂直地突起延伸。金屬突出物 0 U5的部份上表面可作為安裝墊115a用來安裝發熱裝置200。同 牯，金屬突出物115具有一預定寬度，因此一焊料17〇可設置在 其上表面。 金屬突出物115可被整合提供以同時地安裝成一直線排列的 發熱裝置200。 也就是說，設置在發熱裝置2〇〇之下方的金屬突出物115和 設置在相鄰的發熱裝置200之下方的金屬突出物115係彼此連 接。因此，金屬突出物115在發熱裝置2〇〇和相鄰的發熱裝置 ❹ 200之間延伸。 * 金屬板110可經侧或可在金屬板11〇上執行一電鑛或印刷 製程以製造出整合式金屬突出物（integrated齢加 projection)115 ° 如上所述，由於金屬突出物115係被整合地提供在成一直線 排列的發熱裝置200下方，該金屬層係設置在等同於習知技術中 該些發熱裝置2GG之間填充有絕緣層12Q、14Q的—輯，藉以 改善散熱。 8 201223351 整合式金屬突出物115可為開放(opened)以形成一第一絕緣 層 120。 第一絕緣層120可包括複數個絕緣層。同時，第一絕緣層 120將金屬板11〇與設置在其上的第一電路圖案13〇絕緣。 第絕緣層120可由一環氧樹脂類(ep〇Xy_based)絕緣樹脂 所形成。同時，第一絕緣層12〇可作為一黏著層用於接合金屬板 110至一上銅膜層（upper copper film)亦即第一電路圖案13〇的 母體材料(mother material)。 第一電路圖案130設置在第一絕緣層12〇上。第一電路圖案 130係電性連接至—第—電力齡㈣pQwer㈣施以作為 一訊號線，用以傳輸一正電壓至該些第一電極墊155。 第一電路圖案130係設置在整合式金屬突出物115的-侧， 以沿者該金屬突出物115延伸。 第一電路圖案130係被埋覆(buried)以在第一絕緣層120上 形成一第二絕緣層14〇。 第二絕緣層14〇係由具有低導電性（約〇.2W/mk至約〇 4 W/mk)的一環氧樹脂類絕緣樹脂所形成。另一方面，第二絕緣層 140可由具有相對高導電性的一聚亞醯胺(polyimide-based)樹脂 所形成。 藉由庄入树脂至一固態元件21例如：強化纖維、玻璃纖 維或充填物（filler)，而形成的一預浸材(沉印嘴)可被固化 以形成第二絕緣層14〇。 201223351 金屬突出物115可從第二絕緣層i4〇暴露出。同時，第二絕 緣層140可具有一厚度小於金屬突出物115的高度。 複數個第二電路圖案 153、155、151、152、154、i56a、 156b、156c、156d係設置在第二絕緣層14〇上。 該些第二電路圖案 153、155、151、152、154、156a、 156b、156c、156d 包括複數個電力墊 156a、156b、156c、 156d、複數個電極墊153、155以及複數條電路線（circuit 0 wires)151、152、154 連接該些電力墊 156a、156b、156c、156d 至電極墊153、155。 該些電力墊156a、156b、156c、156d係設置在電路板100 的一邊緣區域上。該些電力墊156a、156b、156c、156d接收來 自於外部的一電壓以經由該些電路線15卜；[52、154而提供該電 壓至該些電極墊153、155。 該些電力墊156a、156b、156c、156d藉由埋覆(burying)電 路線151、152、154的一第三絕緣層160而暴露出。電力塾 156a、156b、156c、156d包括一第一電力墊156a用來接收來自 於外部的一正電壓，而第二至第四電力墊156b、156c、156d用 來接收一負電壓。 雖然本實施例之三個電力墊156b、156c、156d用來接收負 電壓’但本發明並不限定於此。舉例而言，電力墊的數量可根據 發熱裝置200的數量以及電路設計而有不同的改變。 201223351 幸田政熱電路板100可區分成複數個分隔(divisi〇n)區域（第 一至第三區域）。分隔區域的數量可等同於用來接收負電壓的電 力墊156b、156c、156d的數量。 每一分隔區域可包括複數個發熱裝置安裝區域，如圖3所 示’三個安裝區域可設置在一分隔區域上。 一安裝墊115a、設置在安裝墊115a 一侧的一第一電極墊 155、以及藉由第三絕緣層160而與第一電極墊155分離的—第 ❹ 二電極墊153係設置在每一安裝區域上。 電極墊153、155可為塾片（pads)用來提供不同的電壓至在 每一發熱裝置安裝區域上的發熱裝置2〇〇。 第-和第二電極塾153、155提供不同極性的電壓至一發熱 裝置安裝區域内。因此，在—發熱裝置安裝區域觸第一和第二 電極墊153、155可具有與相鄰發熱裝置安裝區域内的第一和第 一電極墊153、155不同極性的電屢。 纟第三絕緣層之下方，-發熱裝置安裝區_第二電極整 U 153可連接至相鄰賴裝置絲區域的第—電錄155。此處， 相同電壓可施加至彼此不同且彼此相連的電極# 153、155。 詳細而言’在每-分隔區域中，在每—分顏域中該些第一 電極墊155的第-者係經由穿過第二絕緣層刚的一導通孔 (Via)145而連接至第—電路_關時接收來自於第—電力塾 156a的一正電壓。 11 201223351 在每一分隔區域中，該些第二電極墊153的最後一者係經由 負極電路線(negative circuit wires)151、152、154 而連接至 弟二至第四電力塾156b、156c、156d以接收一負電壓。 因此，於該一分隔區域内，在第一和第二電極塾、155 中，交替地施加至該些發熱裝置安裝區域的一電壓具有交替改變 的極性。然而，該複數個分隔區域可具有相同的電壓分佈 (voltage distribution) ° ❹ 此處，第一和第二電極墊153、155係排列在不同於第一電 路圖案130的一層。該些負極電路線151、152、154可設置在安 裝墊115a的一側與第一和第二電極墊153、155相同的方向。因 此，能夠形成發熱裝置200安裝墊115a的金屬突出物115可在 區域中變寬。 第三絕緣層160暴露出電力墊156a、156b、156c、156d且 將電路線151、152、154埋覆。同時，在每一發熱裝置安裝區域 中，第三絕緣層160暴露出安裝墊U5a亦即金屬突出物ii5a的 ❹ 上表面以及第一和第二電極墊153、155。 此處，在每一暴露出的墊U5a、153、155、156a、156b、 156c、156d，用來形成該些電路圖案的一金屬可經表面處理 (surface-treated)。為了表面處理，可執行使用銀、錄、或金 的一電鑛製程以輕易實現導線搭接（wire bonding)或焊接接合 (solder bonding)。 第二絕緣層160可由一抗焊劑（s〇ider resist)所形成以 保護下部電路圖案。 12 201223351 一焊料170可設置在由第三絕緣層⑽所暴露出的第一和第 二電極墊153、155以及安裝塾115a上以接合發熱裝置至輻 散熱電路板100。 -錫貧（lead solder cream)或無錯錫膏（lead_free s〇lder ⑽咖）可塗佈在金屬突出物115上，然後可安裝上發熱裝置· 以熱處理該組成物(resultant)，藉以形成焊料17〇。 發,、、、裝置200可為-發光裝置，例如··發光二極體(哪）。 Ο 〇 _裝置200的每-電極可連接至第一和第二電極塾脱、既 以發出光。 如上所述’在用以絲該些發熱裝置調触散熱電路板 ⑽令’用以安裝發熱裝置200的電極塾此係使用 15的上表面連接至金屬板110的方式製迕， 115與該些發埶裝置綱魏人式製&且同時金屬突出物 装置咖成。因此，可㈣該些發熱 極塾153、155可iH5執行健贿善賴。同時，電 ⑽了叹置在金屬突出物u 壓的電路財料在下舰騎上 =供正電 屬突出物所__域。 獅嫩上表面上被金 過程。文中’圖7至圖14输示圖2之發熱裝置封裝件的製造 =至==發熱裝置封裝件的製造過程。 13 201223351 此處，金属板110可以具有優越導熱性的一合金所形成，該 合金包含銅、鋁、鎳、金、或鉑中的一者 金屬板110可使用-軋延⑹lling)製程或蚀刻以模製 (molded)成一預定形狀來形成金屬突出物115。 或者疋，可在金屬板11〇上執行一電鍍或印刷製程以形成金 屬突出物115。 此處，考慮到後續將被形成的每一絕緣層12〇、14〇的厚 〇 度，金屬突出物115可具有一高度大於每一絕緣層12〇、14〇的 厚度。 金屬突出物115可設置在輻散熱電路板1〇〇的金屬板11〇中 〜。金屬突出物115最好是設置在對金屬板nQ的兩邊緣不均 專間隔距離的位置。 如圖9所示，一第一絕緣層120和一銅膜層135係形成在金 屬板110上。 0 、第一絕緣層120可藉由塗佈例如環氧樹脂類的樹脂至一強化 纖維玻璃纖維、或一填充物中的預浸材(prepreg)於金屬板 11〇上而形成。同時，第一絕緣層120和銅膜層135可使用銅箔 基板(copper clad lamination, CCL)而形成。 此處，每一第一絕緣層120和銅膜層135可具有一開口用以 暴露出金屬突出物115。 可執行一物理製程以形成該開口。舉例而言，可執行一鑽孔 製程或雷射製程以形成該開口。 14 201223351 執行熱壓製転（thermo compress i on process )而使第一 絕緣層p和銅膜層135設置在金屬板n〇上且同時該開口暴露 出金屬犬出物115以整合式金屬突出物、第一絕緣層挪、和銅 膜層135。 如圖10所示’銅膜層135經钱刻以形成具有一預定形狀的 第電路圖案130。如圖2和圖3所示，第一電路圖案13〇可Pad) 'The integration pad passes over the device mounting areas and is connected to each other, a plurality of insulating layers expose the integrated pad and embrinate the jurying} a plurality of f-way patterns, and a plurality of electrode pads are disposed on the insulating layers and connected To the circuit patterns; and a plurality of heat generating devices are bonded to the secret electrode and the exposed county-filament region. In a re-embodiment, a method for fabricating a light heat sink circuit board for mounting a plurality of thermal crackings includes: forming an integrated metal material for bonding the hair, device-metal plate, forming-insulating The layer is exposed to the surface metallization of the surface and the toied circuit pattern; the through hole is exposed to the current layer of the 201223351 edge layer; and the through hole is formed The electrode of the circuit pattern is placed on the insulating layer. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; The invention is realized; the second ❹ 可以 可以 可以 可以 可以 , , , , , , , , , , , 靖 靖 靖 靖 靖 靖 靖 靖 靖 靖 靖 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括The U includes or has such an element 'or it may include (or contain or have) other elements and these elements. In the drawings, 'un for illustrative purposes, any unnecessary description in the present invention will be omitted 1 for the purpose of clearing the layers and regions' thickness will become larger. The same 7G pieces in the illustration will represent the same elements, so it will be omitted. In the specification, it should be understood that when a layer, a film, a region, or a plate is referred to as another layer, film, region, or subtraction, it may be directly in other layers, regions, Or a sheet, or a plurality of interposers, a plurality of sheets, a plurality of regions, or a plurality of panels. On the other hand, it should be understood that when one layer, one film, one region, or one plate system is directly above the other, there may be no other layers, films, regions, and plates. The present invention provides a circuit board in which a pad project for mounting a plurality of heat generating devices on a metal plate is integrated to improve heat dissipation. 201223351 Hereinafter, a light-dissipating circuit board and a heat-generating device package having the same will be described with reference to FIGS. 2 through 6 according to an embodiment. The drawing is an exploded perspective view of a heat-generating device package according to the actual example. 3 is a top view of the radiation-dissipating circuit board of FIG. Figure 4 is a cross-sectional view of the heat-generating package of Figure 3 taken along line Ι-Γ. Figure 5 is a cross-sectional view of the heat-generating device package of Figure 3 taken along the line. Figure 6 is a cross-sectional view of the lithography package of the system 3 along the line ΙΙΙ-ΙΙΓ. 0 In the following, a spoke heat dissipation circuit board and a heat generating device package having the same will be described together. ~ Referring to Figures 2 through 6', the heat-emitting device package includes a light-dissipating circuit board 1GIUX and a heat-generating device 200 on the heat-dissipating plate (10). The spoke heat dissipation circuit board 1A includes the mounting pads 115a arranged in a line to be mounted in a line-arranged heat generating device 200. Although the present embodiment shows a strip-shaped radiating heat-dissipating circuit board, the present invention is not limited thereto. For example, the radiating heat sink circuit board 1 can be provided in a circular or matrix type. When the heat generating devices 200 arranged in a line are mounted on the spoke heat dissipation circuit board 100, the light heat dissipation circuit board 100 may include the mounting arts 115a arranged in a line. Fortunately, the heat dissipation circuit board 100 includes a metal plate 110, insulating layers 120, 140, 160 disposed on the metal plate 11A, and circuit patterns 13〇, 153, 155, 15b 201223351 152, 154, 156a, 156b, 156c, 156d is disposed on the insulating layers 120, I40. The metal plate 110 may be formed of an alloy having superior thermal conductivity including one of copper, aluminum, chrome, gold, or platinum. The metal plate 110 includes a metal protrusion 115 which constitutes a mounting pad i15a for mounting the heat generating device 200. The metal protrusion 115 extends vertically from the metal plate 11〇. A part of the upper surface of the metal protrusion 0 U5 can be used as the mounting pad 115a for mounting the heat generating device 200. In the same manner, the metal protrusion 115 has a predetermined width, so that a solder 17 can be disposed on the upper surface thereof. The metal protrusions 115 can be integrated to be simultaneously mounted in a line-arranged heat generating device 200. That is, the metal protrusions 115 disposed under the heat generating device 2b and the metal protrusions 115 disposed under the adjacent heat generating devices 200 are connected to each other. Therefore, the metal protrusion 115 extends between the heat generating device 2A and the adjacent heat generating device 200. * The metal plate 110 can be subjected to an electrominening or printing process on the side of the metal plate 11 to produce an integrated metal protrusion 115° as described above, since the metal protrusions 115 are integrated Provided below the heat generating device 200 arranged in a line, the metal layer is disposed in a pattern equivalent to the prior art in which the heat generating devices 2GG are filled with the insulating layers 12Q, 14Q, thereby improving heat dissipation. 8 201223351 The integrated metal protrusion 115 can be opened to form a first insulating layer 120. The first insulating layer 120 may include a plurality of insulating layers. At the same time, the first insulating layer 120 insulates the metal plate 11A from the first circuit pattern 13A disposed thereon. The first insulating layer 120 may be formed of an epoxy resin (ep〇Xy_based) insulating resin. At the same time, the first insulating layer 12 can be used as an adhesive layer for bonding the metal plate 110 to an upper copper film, that is, a mother material of the first circuit pattern 13A. The first circuit pattern 130 is disposed on the first insulating layer 12A. The first circuit pattern 130 is electrically connected to - the first power level (four) pQwer (four) is applied as a signal line for transmitting a positive voltage to the first electrode pads 155. The first circuit pattern 130 is disposed on a side of the integrated metal protrusion 115 to extend along the metal protrusion 115. The first circuit pattern 130 is buried to form a second insulating layer 14A on the first insulating layer 120. The second insulating layer 14 is formed of an epoxy resin-based insulating resin having low conductivity (about W2 W/mk to about W 4 W/mk). On the other hand, the second insulating layer 140 may be formed of a polyimide-based resin having relatively high conductivity. A prepreg (sink) formed by laminating the resin to a solid element 21 such as a reinforcing fiber, a glass fiber or a filler can be cured to form a second insulating layer 14?. 201223351 Metal protrusions 115 may be exposed from the second insulating layer i4〇. At the same time, the second insulating layer 140 may have a thickness smaller than the height of the metal protrusions 115. A plurality of second circuit patterns 153, 155, 151, 152, 154, i56a, 156b, 156c, 156d are disposed on the second insulating layer 14A. The second circuit patterns 153, 155, 151, 152, 154, 156a, 156b, 156c, 156d include a plurality of power pads 156a, 156b, 156c, 156d, a plurality of electrode pads 153, 155, and a plurality of circuit lines 0 wires) 151, 152, 154 connect the power pads 156a, 156b, 156c, 156d to the electrode pads 153, 155. The power pads 156a, 156b, 156c, 156d are disposed on an edge region of the circuit board 100. The power pads 156a, 156b, 156c, 156d receive a voltage from the outside to provide the voltage to the electrode pads 153, 155 via the circuit lines 15; The power pads 156a, 156b, 156c, 156d are exposed by a third insulating layer 160 that buryes the electrical paths 151, 152, 154. The power ports 156a, 156b, 156c, 156d include a first power pad 156a for receiving a positive voltage from the outside, and second to fourth power pads 156b, 156c, 156d for receiving a negative voltage. Although the three power pads 156b, 156c, 156d of the present embodiment are used to receive a negative voltage ', the present invention is not limited thereto. For example, the number of power pads can vary differently depending on the number of heat generating devices 200 and the circuit design. 201223351 Kodak's thermal circuit board 100 can be divided into a plurality of divisi〇n areas (first to third areas). The number of separation regions may be equivalent to the number of power pads 156b, 156c, 156d used to receive a negative voltage. Each of the divided regions may include a plurality of heat generating device mounting regions, as shown in Fig. 3, and the three mounting regions may be disposed on a separate region. A mounting pad 115a, a first electrode pad 155 disposed on one side of the mounting pad 115a, and a second electrode pad 153 separated from the first electrode pad 155 by the third insulating layer 160 are disposed in each mounting On the area. The electrode pads 153, 155 may be pads for providing different voltages to the heat generating device 2 on each of the heat generating device mounting regions. The first and second electrodes 塾153, 155 provide voltages of different polarities into a heat generating device mounting area. Therefore, the first and second electrode pads 153, 155 may be in contact with the first and second electrode pads 153, 155 in the mounting region of the heat generating device, and may have different polarities from the first and first electrode pads 153, 155 in the mounting region of the adjacent heat generating device.纟Under the third insulating layer, the heat generating device mounting area _ second electrode integral U 153 can be connected to the first electric 155 of the adjacent slinger wire area. Here, the same voltage can be applied to the electrodes # 153, 155 which are different from each other and connected to each other. In detail, in each of the partition regions, the first of the first electrode pads 155 in each of the sub-areas is connected to the first via a via 145 that passes through the second insulating layer. - Circuit_Off receives a positive voltage from the first power 塾 156a. 11 201223351 In each of the divided regions, the last one of the second electrode pads 153 is connected to the second to fourth power ports 156b, 156c, 156d via negative circuit wires 151, 152, 154. To receive a negative voltage. Therefore, in the first and second electrodes 塾, 155, a voltage alternately applied to the heat generating device mounting regions has an alternately changed polarity. However, the plurality of divided regions may have the same voltage distribution. 此处 Here, the first and second electrode pads 153, 155 are arranged in a layer different from the first circuit pattern 130. The negative circuit lines 151, 152, 154 may be disposed in the same direction as the first and second electrode pads 153, 155 on one side of the mounting pad 115a. Therefore, the metal protrusion 115 capable of forming the mounting pad 115a of the heat generating device 200 can be widened in the area. The third insulating layer 160 exposes the power pads 156a, 156b, 156c, 156d and buryes the circuit lines 151, 152, 154. At the same time, in each of the heat generating device mounting regions, the third insulating layer 160 exposes the upper surface of the mounting pad U5a, i.e., the metal protrusion ii5a, and the first and second electrode pads 153, 155. Here, at each of the exposed pads U5a, 153, 155, 156a, 156b, 156c, 156d, a metal used to form the circuit patterns may be surface-treated. For surface treatment, an electrominening process using silver, recording, or gold can be performed to easily achieve wire bonding or solder bonding. The second insulating layer 160 may be formed of a solder resist to protect the lower circuit pattern. 12 201223351 A solder 170 may be disposed on the first and second electrode pads 153, 155 and the mounting pad 115a exposed by the third insulating layer (10) to engage the heat generating device to the radiating heat dissipation circuit board 100. - lead solder cream or lead-free solder paste (lead_free s〇lder (10) coffee) may be coated on the metal protrusion 115, and then a heat generating device may be mounted to heat-treat the resultant to form a solder 17〇. The hair, the device, and the device 200 may be a light-emitting device, such as a light-emitting diode (which). Each of the electrodes of the Ο 装置 device 200 can be connected to the first and second electrodes to be detached, thereby emitting light. As described above, 'the electrodes for arranging the heat-dissipating circuit board (10) for mounting the heat-generating device 200, the upper surface of the system 15 is connected to the metal plate 110, 115 and The hairpin device is a Weiren system & and at the same time the metal protrusion device is made. Therefore, (4) the fever poles 153, 155 can perform the bribes on the iH5. At the same time, the electricity (10) sighs the circuit material placed on the metal protrusion u pressure on the lower ship to ride = for the positive electric charge __ domain. The lion is golden on the upper surface. Figure 7 to Figure 14 shows the manufacture of the heat-generating device package of Figure 2 = to = = manufacturing process of the heat-generating device package. 13 201223351 Here, the metal plate 110 may be formed of an alloy having superior thermal conductivity, the alloy comprising one of copper, aluminum, nickel, gold, or platinum. The metal plate 110 may be processed or etched using a calendaring process. The metal protrusions 115 are formed by being molded into a predetermined shape. Alternatively, an electroplating or printing process can be performed on the metal plate 11 to form the metal protrusions 115. Here, the metal protrusion 115 may have a height greater than the thickness of each of the insulating layers 12, 14 考虑 in consideration of the thickness of each of the insulating layers 12, 14 后续 which will be formed later. The metal protrusions 115 may be disposed in the metal plate 11 of the spoke heat dissipation circuit board 1 . The metal protrusions 115 are preferably disposed at positions that are unevenly spaced from the edges of the metal plate nQ. As shown in FIG. 9, a first insulating layer 120 and a copper film layer 135 are formed on the metal plate 110. 0. The first insulating layer 120 can be formed by coating a resin such as an epoxy resin into a reinforced fiberglass fiber or a prepreg in a filler on the metal plate 11〇. Meanwhile, the first insulating layer 120 and the copper film layer 135 may be formed using a copper clad lamination (CCL). Here, each of the first insulating layer 120 and the copper film layer 135 may have an opening for exposing the metal protrusions 115. A physical process can be performed to form the opening. For example, a drilling process or a laser process can be performed to form the opening. 14 201223351 Performing a thermo compress i on process to place the first insulating layer p and the copper film layer 135 on the metal plate n〇 while the opening exposes the metal canine 115 to the integrated metal protrusion, An insulating layer and a copper film layer 135. As shown in Fig. 10, the copper film layer 135 is etched to form a first circuit pattern 130 having a predetermined shape. As shown in FIG. 2 and FIG. 3, the first circuit pattern 13 can be
在益屬大出物115的侧表面上沿著金屬突出物115於一直線方向 延伸越過(cross)金屬板11〇。 第-電路圖案13G係被埋覆(buHe(〇以形成一第二絕緣層 、第二絕緣層140可藉由塗佈例如環氧樹脂類的樹脂至一強化 纖維、-翻_、或-填絲巾的職材(卿㈣於金屬板 11〇上而形成。第二絕緣層⑽具有—㈣，闕口與第一絕緣 層120的開口對齊以暴露出金屬突出物ιΐ5。 如圖11所不，用以暴露出下部第—電路圖案⑽的一貫孔 (via hole)141形成在第二絕緣層u〇上。 貫孔141可具有相對於今属4r_卜 屬板110平面(plane)傾斜一預定 角度的侧表面。另一方面，言:^丨,h 貝孔Ul可具有垂直於金屬板110平 面的侧表面。 ，可使用一 UV雷射或 貫孔141可使用-雷射而形成。此處 一 C02雷射。 15 201223351 =’:孔141可使用一物理製程，例如:一鑽孔製程而形 學製一 和第=;=:=形成一導一145 腿。 151、脱、154、156a、156b、On the side surface of the prosperous material 115, the metal plate 11 is crossed in a straight line along the metal protrusion 115. The first-circuit pattern 13G is buried (buHe) to form a second insulating layer, and the second insulating layer 140 can be filled with a resin such as an epoxy resin to a reinforcing fiber, a turn-over, or a fill The material of the scarf (Q) is formed on the metal plate 11 。. The second insulating layer (10) has - (4), and the mouth is aligned with the opening of the first insulating layer 120 to expose the metal protrusion ι 5 . A via hole 141 for exposing the lower first circuit pattern (10) is formed on the second insulating layer u. The through hole 141 may have a tilt with respect to the plane of the current 4r_pad 110. The side surface of the predetermined angle. On the other hand, the b hole U1 may have a side surface perpendicular to the plane of the metal plate 110. It may be formed using a laser or a through hole 141 using a laser. Here is a C02 laser. 15 201223351 = ': Hole 141 can use a physical process, such as: a drilling process and the shape of the first and the first =; =: = form a guide 145 legs. 151, off, 154 , 156a, 156b,
可使用一般的電路_製程作為形成導通孔i45的製程以及 用以形成第一電路圖案153、155、⑸ϋ 156b、156c、156d 的製程。 舉例而言’可執行-電鍍製程以填充該貫孔⑷，藉以形成 導通孔145。然後，一銅膜層可形成在第二絕緣層140上。該銅 膜層可經圖案化以形成第二電路圖案153、155、151、152、 154、156a、156b、156c、156d。A general circuit_process can be used as a process for forming the via holes i45 and a process for forming the first circuit patterns 153, 155, (5) 156 156b, 156c, 156d. For example, an executable-electroplating process is performed to fill the via holes (4), thereby forming via holes 145. Then, a copper film layer may be formed on the second insulating layer 140. The copper film layer can be patterned to form second circuit patterns 153, 155, 151, 152, 154, 156a, 156b, 156c, 156d.
或者，一導電漿可塗覆在貫孔141 後，該銅膜層可堆疊在該填充的貫孔141 些第二電路圖案156c、156d。 153、155、15卜 152、 中以填充貫孔141。然 以及經圖案化以形成該 !54、156a、156b、 或者，不同於圖11，該銅膜層可連續性地堆疊在第二絕緣層 140上，然後可形成穿過該銅膜層和第二絕緣層14〇以暴露出第 一電路圖案130的貫孔141。之後，可執行一電鍍製程以形成具 有導電性的一金屬層於貫孔141a的一側表面。之後，可圖案化 該銅膜層以形成該些第二電路圖案丨53、155、151、、154、 156a、156b、156c、以及 156d。 16 201223351 如圖13所示，該些第二電路圖案153、155、151、152、 154、156a、156b、156c、156d的該些電極墊153、155和該些電 力墊156a、156b、156c、156d以及安裝墊115a係暴露出以埋 覆（bury)該些電路線151、152、154，據此形成一第三絕緣層 160。 可塗佈和固化一抗焊劑以形成第三絕緣層16〇。 此處，可在藉由第三絕緣層160而暴露出的該些電極墊 153、155、該些電力墊156a、156b、156c、156d、以及安裝墊 115a上執行一表面處理，以改善一接合特性。 如圖14所示，一焊料膏(s〇ider cream)丨可塗佈在安裝墊 115a上亦即暴露出的金屬突出物115a之上表面和該些電極塾 153、155且可安裝發熱裂置咖讀行熱處理，據此完成該發 熱裝置封裝件。 —二ux 叮q形成冤極登 153、155於金屬突出物115的一侧。然後，用來施加電力至電極 墊153、155的電路線可堆疊成複數個層。如此，金屬突出物115 的一區域可延伸在輻散熱電路板100的上表面上。 在後文中’包括圖Η發紐置封裝件的— 圖15進行描述。 干凡肿幻、、、 參照圖15，根據一實施例，一背光單元300包括一底蓋 310、一反射層320在絲31〇上、 匕括底盍 μ »赫壯^ 等尤板330在反射層320 上、以及-發熱裝置封裝件接合至底蓋310的—侧表面。 17 201223351 該發熱裝置封裝件可為包括發光裝置200的一發光裝置封带 件。一發光二極體晶片係安裝在該發光裝置封裝件上。 ^ 如圖2至圖14所示，該發光裝置封裝件包括發光裂置2⑽ 其中該輻散熱電路板接合至該發光裝置200。此處，發光裂置 200射出的光朝向導光板33〇a的一侧表面。 發光裝置封裝件可經由一散熱黏著層（radiant adhesion layer) 340而實際地附著至底表面310的—側表面以 及經由一支架（bracket)而被固定。 反射層320可延伸直至導光板33〇的一下端部（1〇wer portion)和發光裝置封裝件的下端部以反射散佈在導光板33〇底 表面的光，藉以射出朝向導光板330上表面的光。 導光板330可為一表面光源其射出從該侧表面朝向該上表面 入射的光。因此’導光板330可均勻地將光射至設置在其上表面 的一顯示面板。 輕散熱電路板可使用在該背光單元以經由底蓋綱而釋出從 發光裝置200產生的熱至外部。 根據實施例，包括輻散熱突出物(灿耐_ prQjecti〇n) 的金屬板可設置在該安裝墊之下方以直接地傳輸從該些發熱裝置 發出的熱至該金屬板，藉以改善熱效率。同時，該練熱突出物 可被整合形成吨行馳發齡置⑽祕輸，藉以改善散 熱。同時，電極墊可設置在該金屬突出物的—侧，而用來施加一 電力至該些電極塾的該些電路線係堆叠如同複數個層以確保在該 輪散熱電路板上表社的金屬突出物變寬的區域。 18 201223351 雖」參考4例之料細性實補來描述實補，但應理 解，熟習此項技藝者可想出將落入本發明之原理的精神及齡内 =幕夕其，修改及’施例。更特定言之，在本發明、圖式及所附 月專她圍之内’所主張組合配置之零部件及/或配置的 各種k化及修改為可⑨的。對於熟悉此項技術者而言，除了零部 ，件及/或配置之變化及修改外，#代崎亦將顯而易見。 ❹ 【圖式簡單說明】 圖1為根據習知技術之一輕散熱電路板的剖視圖。 圖2為根據-實施例之一發熱裝置封裝件的分解透視圖。 圖3繪示圖2的一輻散熱電路板的上視圖。 圖4為圖3之發熱裝置封裝件沿著線，的剖視圖。 圖5為圖3之發熱裝置封裝件沿著線h—h，的剖視圖。 圖6為圖3之發熱裝置封裝件沿著線π卜ΙΠ，的剖視圖。 圖7至圖14繪示圖2之發熱裝置封裝件的製造過程。 Ό 圖15為圖2包括發熱裝置封裝件之背光單元的剖視圖。 【主要元件符號說明】 1 金屬板 2 輻散熱突出物 3 絕緣層 4 電路圖案 5 抗焊劑 19 201223351Alternatively, a conductive paste may be applied to the through holes 141, and the copper film layer may be stacked on the filled through holes 141 of the second circuit patterns 156c, 156d. 153, 155, 15 Bu 152, to fill the through hole 141. And being patterned to form the !54, 156a, 156b, or, unlike FIG. 11, the copper film layer may be continuously stacked on the second insulating layer 140, and then formed through the copper film layer and The second insulating layer 14 is bent to expose the through hole 141 of the first circuit pattern 130. Thereafter, an electroplating process may be performed to form a metal layer having conductivity on one side surface of the through hole 141a. Thereafter, the copper film layer may be patterned to form the second circuit patterns 丨53, 155, 151, 154, 156a, 156b, 156c, and 156d. 16201223351 As shown in FIG. 13, the electrode pads 153, 155 of the second circuit patterns 153, 155, 151, 152, 154, 156a, 156b, 156c, 156d and the power pads 156a, 156b, 156c, The 156d and the mounting pads 115a are exposed to bury the circuit lines 151, 152, 154, thereby forming a third insulating layer 160. A solder resist may be applied and cured to form a third insulating layer 16A. Here, a surface treatment may be performed on the electrode pads 153, 155 exposed by the third insulating layer 160, the power pads 156a, 156b, 156c, 156d, and the mounting pad 115a to improve a bonding. characteristic. As shown in FIG. 14, a solder paste can be coated on the mounting pad 115a, that is, the exposed surface of the metal protrusion 115a and the electrode pads 153, 155 and can be mounted with heat-dissipating The heat treatment of the coffee is performed, and the heat-generating device package is completed accordingly. - Two ux 叮q forms a bungee 153, 155 on one side of the metal protrusion 115. Then, circuit lines for applying power to the electrode pads 153, 155 can be stacked in a plurality of layers. As such, a region of the metal protrusion 115 can extend over the upper surface of the spoke heat dissipation circuit board 100. This will be described later in FIG. 15 including the illustration of the package. According to an embodiment, a backlight unit 300 includes a bottom cover 310, a reflective layer 320 on the wire 31〇, and a bottom plate »μ»赫壮^, etc. The reflective layer 320, and the heat generating device package are bonded to the side surface of the bottom cover 310. 17 201223351 The heat generating device package may be a light emitting device cover member including the light emitting device 200. A light emitting diode chip is mounted on the light emitting device package. As shown in FIGS. 2-14, the light emitting device package includes a light emitting slit 2 (10) to which the heat sink circuit board is bonded. Here, the light emitted from the light-emitting slit 200 faces the one surface of the light guide plate 33A. The light emitting device package can be physically attached to the side surface of the bottom surface 310 via a radiant adhesion layer 340 and secured via a bracket. The reflective layer 320 may extend up to a lower end portion of the light guide plate 33〇 and a lower end portion of the light emitting device package to reflect light scattered on the bottom surface of the light guide plate 33, thereby emitting the light toward the upper surface of the light guide plate 330. Light. The light guide plate 330 may be a surface light source that emits light incident from the side surface toward the upper surface. Therefore, the light guide plate 330 can uniformly emit light to a display panel provided on the upper surface thereof. A light-dissipating circuit board can be used in the backlight unit to release heat generated from the light-emitting device 200 to the outside via the bottom cover. According to an embodiment, a metal plate including a radiation heat sink protrusion (Can _ _ prQjecti 〇 n) may be disposed under the mounting pad to directly transfer heat emitted from the heat generating devices to the metal plate, thereby improving thermal efficiency. At the same time, the heat-protruding protrusions can be integrated to form a tortoise (10) secret to improve heat dissipation. At the same time, the electrode pads may be disposed on the side of the metal protrusions, and the circuit line stacks for applying a power to the electrode pads are like a plurality of layers to ensure the metal on the heat dissipation circuit board of the wheel. The area where the protrusion is widened. 18 201223351 Although it is described with reference to the details of the four examples, it should be understood that those skilled in the art can devise the spirit and age that will fall within the principles of the present invention. Example. More specifically, various variations and modifications of the components and/or configurations of the claimed combination are contemplated by the present invention, the drawings, and the accompanying drawings. For those skilled in the art, in addition to changes and modifications to the parts, components and/or configurations, #代崎 will also be obvious. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a light heat dissipation circuit board according to one of the prior art. 2 is an exploded perspective view of a heat generating device package according to an embodiment. 3 is a top view of the one-radiation heat dissipation circuit board of FIG. 2. 4 is a cross-sectional view of the heat generating device package of FIG. 3 taken along the line. Figure 5 is a cross-sectional view of the heat generating device package of Figure 3 taken along line h-h. Figure 6 is a cross-sectional view of the heat generating device package of Figure 3 taken along line π. 7 to 14 illustrate a manufacturing process of the heat generating device package of FIG. 2. Figure 15 is a cross-sectional view of the backlight unit of Figure 2 including the heat-generating device package. [Main component symbol description] 1 Metal plate 2 Radial heat sink protrusion 3 Insulation layer 4 Circuit pattern 5 Solder resist 19 201223351
6 焊料 10 輻散熱電路板 20 發熱裝置 100 幸§散熱電路板 110 金屬板 115 金屬突出物 115a 安裝墊 130 第一電路圖案 135 銅膜層 120、140、160 絕緣層 141 貫孔 145 導通孔 151、152、154 電路線 153 、 155 電極墊 156a、156b、156c、156d 電力墊 170 焊料 200 發熱裝置 300 背光單元 310 底蓋 320 反射層 330 導光板 340 散熱黏著層 206 solder 10 spoke heat dissipation circuit board 20 heat generating device 100 for example heat dissipation circuit board 110 metal plate 115 metal protrusion 115a mounting pad 130 first circuit pattern 135 copper film layer 120, 140, 160 insulating layer 141 through hole 145 through hole 151, 152, 154 circuit lines 153, 155 electrode pads 156a, 156b, 156c, 156d power pad 170 solder 200 heat generating device 300 backlight unit 310 bottom cover 320 reflective layer 330 light guide plate 340 heat dissipation adhesive layer 20