CN103140036A

CN103140036A - Production method of cooling printed circuit board (PCB)

Info

Publication number: CN103140036A
Application number: CN2011103781396A
Authority: CN
Inventors: 李建成
Original assignee: Boardtek Electronics Corp
Current assignee: Boardtek Electronics Corp
Priority date: 2011-11-24
Filing date: 2011-11-24
Publication date: 2013-06-05

Abstract

According to a production method of a cooling PCB, a substrate can be provided, a circuit layer is arranged on one surface of the substrate, at least one through groove is formed on the substrate, a metal cooling structure is provided with a metal support plate and a plurality of metal cooling members arranged on the metal support plate in a protruding mode, the metal cooling members are fixedly pressed in the through grooves in a hot pressing mode, so that the metal support plate of the metal cooling structure is fixed on the other surface of the substrate, and then steps such as follow-up surface flattening and conductive hole forming are performed to complete the cooling PCB. The production process is simple, so that the cost is reduced, and the metal cooling structure can not only serve as a part of a bottom-layer circuit, but also be used for cooling.

Description

The manufacture method of cooling circuit board

Technical field

The present invention relates to the manufacture method of cooling circuit board, aim to provide a specific location in circuit board and metallic heat dissipating part is set for electronic component is set, help the heat radiation of electronic component, and can reduce production costs.

Background technology

Along with electronic product gradually toward high performance, high frequency, high speed and lightening future development, under the design concept of " light, thin, short, little, multi-functional ", various electronic correlation major parts such as central processing unit (CPU), wafer set (Chipset) etc. are all towards high-speed, multi-functional, high power, direction research and development that volume is little.Therefore, cause the unit volume caloric value in spare part constantly to improve, and the heat dissipation problem of spare part also become the key that electronic component performance promotes.

Multilayer circuit board is for improving the good solution of electronic component and line density, general Multi-layer circuit board structure and processing procedure, normally with plane substrate as substrate, then form adhesion layer or insulating barrier in the single or double of substrate, and then the covering metal circuit layer.Or form the first layer metal circuit layer on substrate after, by a gummed processing procedure, with plurality of circuits layer and adhesion layer lamination in addition, finally by the finish dealing with making of multilayer board of processing.And improving relative with the line density also derivative not good problem of radiating efficiency of element, the element on circuit board needs take air as heat-conduction medium.Yet dispel the heat in the air transmitted mode, the heat that element can't be accumulated is is effectively scattered and disappeared rapidly, and makes the usefulness of element reduce, and even reduces the life-span of element, and this situation is even more serious at multilayer circuit board.

In the development trend of package design, only by the package design of the element enough heat that can't leave, must strengthen heat sinking function by the design of circuit board.Thereby for preventing the accumulation of heat of multilayer circuit board, produced with the practice of heat-conducting glue as the adhesion layer of metallic circuit layer, but the coating heat-conducting glue is to bind element, each metallic circuit layer and substrate, and use amount is quite large, thereby has also increased the manufacturing cost of multilayer circuit board.

Summary of the invention

Technical problem solved by the invention i.e. the manufacture method of cooling circuit board in manufacture method the present invention that a kind of cooling circuit board is provided, utilize metallic heat dissipating part hot pressing to be fixed in substrate, not only processing procedure is easy also can reduce production costs, and can meet user's demand.

can provide a substrate in manufacture method of the present invention, a this substrate wherein surface is provided with line layer, and form at least one groove of wearing in this substrate, and provide a heat dissipation metal structure, this heat dissipation metal structure is provided with a metal support plate and the outstanding metallic heat dissipating part that is arranged on this metal support plate of plural number, utilizing hot pressing mode that this metallic heat dissipating part pressing is fixed in this wears in groove, make the metal support plate of this heat dissipation metal structure be fixed in this substrate another surface, carry out again the steps such as follow-up surfacing and conductive hole moulding, to complete cooling circuit board, processing procedure is easy to reduce costs, this heat dissipation metal structure not only can be as the part of wiring underlayer, more can be used as the use of heat radiation.

Description of drawings

Fig. 1 is the block schematic diagram of manufacture method in the present invention.

Fig. 2 A ~ D is the schematic flow sheet of manufacture method in the present invention.

Fig. 3 arranges the structural representation of electronic component on cooling circuit board in the present invention.

Fig. 4 arranges another structural representation of electronic component on cooling circuit board in the present invention.

Fig. 5 is another structural representation of substrate in the present invention.

The figure number explanation:

Substrate 1

First surface 11

Second surface 12

Wear groove 13

Frame 14

Upper cover 15

Laminated plates 16

Adhered film 17

Heat dissipation metal structure 2

Metal support plate 21

Metallic heat dissipating part 22

Line layer 31

Conductive hole 32

Knitting layer 33

Electronic component 4

Wire 41

Heat-conducting glue 5.

Embodiment

For the clear structure of the present invention of your juror is formed, and overall operation mode, hereby coordinate graphic being described as follows: the present invention's " manufacture method of cooling circuit board ", as shown in Figure 1, it includes the following step at least: steps A, provide a heat dissipation metal structure 2, as shown in Fig. 2 A, this heat dissipation metal structure 2 is provided with a metal support plate 21 and the outstanding metallic heat dissipating part 22 that is arranged on this metal support plate 21 of plural number, this heat dissipation metal structure 2 can be the higher metal materials of coefficient of heat transfer such as gold, copper, aluminium, and it can utilize machinery or the moulding of chemical process mode.

Step B, provide a substrate 1, as shown in Fig. 2 B, this substrate 1 is provided with first, second

relative surface

11,12, and this first surface 11 is formed with line layer 31.

Step C, forming step, at least one groove 13 of wearing of this substrate 1 moulding, this is worn groove 13 and runs through this first,

second surface

11,12, and this forming step can be processed for physical mechanical (for example cutting) or chemical mode (for example chemical etching) moulding.

Step D, heat-press step, 21 of metal support plates in this substrate second surface 12 and this heat dissipation metal structure arrange knitting layer 33, and carry out hot pressing, as shown in Fig. 2 C, this substrate second surface 12 is engaged with metal support plate 21, make each metallic heat dissipating part 22 pressings be fixed in this and wear in groove 13, this metallic heat dissipating part 22 protrudes from this substrate first surface 11, and but these knitting layer 33 overflows wear 22 of groove 13 and each metallic heat dissipating parts in this, to consist of its firm engagement.

Step e, conductive hole forming step, be formed with at least one conductive hole 32 in the nonmetal radiator of substrate 1 22 placements, as shown in Fig. 2 D, with the line layer 31 that connects this first surface metal support plate 21 with this second surface, complete cooling circuit board, after wherein this conductive hole moulding is provided with perforation prior to this substrate, then electroplate formation conductive hole structure in perforation, and can impose the line pattern processing procedure, the line layer 31 of first surface and the metal support plate 21 of second surface are carried out patterning.

Further can carry out step F between this step D and step e, this step F is the surfacing step, on the metal support plate of this metallic heat dissipating part or lower surface carry out surfacing, use these metal support plate 21 thickness of reduction, and remove the resin that knitting layer 33 overflows; Certainly, this step F can be implemented after step D and before step e, perhaps can implement after step e, and this steps A also can be as between step C and step D.

certainly, further can carry out step G after this step F, this step G is the electronic component setting steps, as shown in Figure 3, at least one electronic component 4 is arranged on this metallic heat dissipating part 22, wherein, after prior to this metallic heat dissipating part 22 surfaces, tin cream or heat-conducting glue 5 being set in this step G, again another electronic component 4 is fixed on this metallic heat dissipating part 22 by welding or heat-conducting glue 5, this electronic component 4 also can utilize welding manner or at least one wire 41 to be connected with this line layer 31, and when electronic component 4 energising work, the work thermal source that its work is sent, being able to directly will be worked by the metallic heat dissipating part 22 that is in contact with it, thermal source is rapid effectively to be scattered and disappeared, in embodiment as shown in the figure, this work thermal source is shed by this metallic heat dissipating part 22 belows, more can keep it with the task performance of keeping electronic component and do the life-span, and the metal support plate 21 of this heat dissipation metal structure also can be as the part of wiring underlayer.

Moreover this electronic component 4 can be as shown in Figure 4, and this substrate 1 is provided with two frames 14 and a upper cover 15, and this upper cover 15 is located on two frames 14, with these electronic component 4 sealings.

And in each embodiment described above, this substrate is provided with at least one laminated plates, also can form single layer board or multilayer circuit board, as shown in the embodiment of Fig. 5, this substrate 1 is provided with two

lamination laminates

16, and 16 of each laminated plates can further be bonded with each other by an adhered film 17, utilize this adhered film 17 as the some of substrate 1, not only can replace this laminated plates and reduce costs, more can greatly reduce the thickness of monolith substrate, can more meet compact demand.

Claims

1. the manufacture method of a cooling circuit board, is characterized in that, includes at least the following step:

A, provide a heat dissipation metal structure, this heat dissipation metal structure to be provided with a metal support plate and the outstanding metallic heat dissipating part that is arranged on this metal support plate of plural number;

B, provide a substrate, this substrate to be provided with first, second relative surface, the first surface of this substrate is formed with line layer;

C, forming step, at least one groove of wearing of this molding substrate, this is worn groove and runs through this first, second surface;

D, heat-press step are positioned over this substrate second surface below with this metallic heat dissipating part and carry out hot pressing, and this substrate second surface is engaged with metal support plate, make each metallic heat dissipating part pressing be fixed in this and wear in groove; And

E, conductive hole forming step are formed with at least one conductive hole in the nonmetal radiator of substrate placement, to connect the line layer of this first surface.

2. the manufacture method of cooling circuit board as claimed in claim 1, it is characterized in that, further carry out step F between this step D and step e, this step F is the surfacing step, surfacing is carried out on metal support plate surface in this metallic heat dissipating part, uses this metal support plate thickness of reduction.

3. the manufacture method of cooling circuit board as claimed in claim 1 or 2, is characterized in that, is provided with knitting layer in the heat-press step of this step D between the metal support plate of this substrate second surface and this heat dissipation metal structure, and carries out hot press.

4. the manufacture method of cooling circuit board as claimed in claim 3, is characterized in that, this knitting layer is worn between groove and each metallic heat dissipating part in this in overflow after heat-press step.

5. the manufacture method of cooling circuit board as claimed in claim 3, is characterized in that, this steps A is placed between step C and step D.

6. the manufacture method of cooling circuit board as claimed in claim 2, is characterized in that, further carries out step G after this step F, and this step G is the electronic component setting steps, and at least one electronic component is arranged on this metallic heat dissipating part.

7. the manufacture method of cooling circuit board as claimed in claim 6, is characterized in that, after prior to this heat dissipation metal surface, tin cream or heat-conducting glue being set in this step G, more another electronic component is fixed in this metallic heat dissipating part by welding or heat-conducting glue.

8. the manufacture method of cooling circuit board as claimed in claim 6, is characterized in that, this circuit board is provided with two frames and a upper cover, is covered on this on two frames, with this electronic component sealing.

9. the manufacture method of cooling circuit board as claimed in claim 3, is characterized in that, this substrate is provided with at least one laminated plates, further is bonded with each other by an adhered film between each laminated plates.