CN102202459A - PCB (printed circuit board) with metal micro radiator - Google Patents
PCB (printed circuit board) with metal micro radiator Download PDFInfo
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- CN102202459A CN102202459A CN2011101399481A CN201110139948A CN102202459A CN 102202459 A CN102202459 A CN 102202459A CN 2011101399481 A CN2011101399481 A CN 2011101399481A CN 201110139948 A CN201110139948 A CN 201110139948A CN 102202459 A CN102202459 A CN 102202459A
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Abstract
The invention provides a PCB (printed circuit board) with a metal micro radiator. The PCB comprises a conventional PCB and is characterized in that the PCB also comprises a metal bottom layer which is arranged on a bottom surface of the conventional PCB, a copper layer line is arranged on a bottom surface which is at least far from the metal bottom layer of the upper and lower bottom surfaces of the conventional PCB, one or multiple metal micro radiators integrated into one with the metal bottom layer are arranged on one side which is formed by the contact of the metal bottom layer on the conventional PCB, the one or multiple metal micro radiators protrude from the surface of the metal bottom layer and correspondingly embed into and penetrate through one or multiple cylindrical through holes, a spacing is reserved between the end face of the metal micro radiator and the copper layer line arranged on the bottom surface far from the metal bottom layer of the conventional printed circuit board, so the metal micro radiator and the copper layer line are electrically insulated. By using the metal micro radiator provided by the invention, the heat dissipation problem of the heating elements in the printed circuit board is effectively solved and the metal micro radiator is an idea carrying board for the heating elements and the arrays of the heating elements.
Description
Technical field
The present invention relates to the printed-board technology field, especially a kind of printed circuit board (PCB) that has the little radiator of metal.
Background technology
(Printed Circuit Board PCB) is one of the vitals of electronics industry to printed circuit board (PCB).PCB can provide mechanical support fixing, assembling for electronic component, can realize being electrically connected between the electronic component.In addition, all be printed on numbering and some figures of element on the PCB, this provides convenience for element plug-in mounting, inspection, maintenance.Every kind of electronic equipment almost arrives computer, communication electronic equipment, military armament systems greatly for a short time to electronic watch, calculator, as long as electronic component such as integrated circuit is arranged, for the electric interconnection between them, all will use printed circuit board (PCB).
Traditional printed circuit board (PCB) adopts the structure of hole metallization, and the insulating material between layer and the layer is the FR4 material, and its thermal conductivity is 0.4W/mk, and heat-transfer capability is lower; The metal-base circuit plate of development in recent years, the thermal conductivity of insulating material is 1.3-2.2W/mk between layer and the layer, heat-transfer capability is still limited.For the printed circuit board (PCB) that is provided with a large amount of integrated circuits, especially be provided with the printed circuit board (PCB) of large-power light-emitting diodes (LED), because when integrated circuit or light emitting diode matrix stable operation, caloric value is big, knot working temperature low (about 60 degrees centigrade), require the thermal conductivity of this printed circuit board (PCB) to reach tens of or hundreds of W/mk, obviously, this head and shoulders above the thermal conductivity of insulating material of prior art.
Summary of the invention
At the deficiency of above existing printed circuit board (PCB), the purpose of this invention is to provide a kind of printed circuit board (PCB) that has the little radiator of metal.
The objective of the invention is by realizing by the following technical solutions: a kind of printed circuit board (PCB) that has the little radiator of metal, it comprises a conventional printed circuit board (PCB), it is characterized in that, also comprise a metal back layer with the stacked setting of this routine printed circuit board (PCB), in two bottom surfaces of this routine printed circuit board (PCB) at least the bottom surface away from this metal back layer be provided with copper layer line road, the one side that metal back layer contacts with conventional printed circuit board (PCB) is provided with one or more little radiators of cylindrical metal that are connected as a single entity with metal back layer, the little radiator of these one or more metals protrudes in the metal back layer surface and corresponding the embedding run through in one or more cylindricality through holes of conventional printed circuit board (PCB), spacing is left between the set copper layer line road in a bottom surface away from metal back layer of the end face of the little radiator of metal and conventional printed circuit board (PCB), so that little radiator of metal and copper layer line road electric insulation.
As optimized technical scheme of the present invention, little radiator of described metal and metal back layer electroplate by one-body molded, welding, stickup, heavy copper or the mode of hot pressing fusion is combined as a whole.
As optimized technical scheme of the present invention, described conventional printed circuit board (PCB) is the individual layer printed circuit board.
As optimized technical scheme of the present invention, described conventional printed circuit board (PCB) is double-layer rigid printed circuit board (PCB) or multilayer printed circuit board, and its at least one bottom surface is provided with copper layer line road.
As optimized technical scheme of the present invention, described conventional printed circuit board (PCB) is individual layer flexible print wiring board, two-layer flexible printed wiring board or multi-layer flexible printed circuit board (PCB), and described metal back layer is bent thin metal layer.
As optimized technical scheme of the present invention, described copper layer line road comprises the heater element connecting portion that is used to connect the heater element pin, and it is arranged at the little radiator end face of contiguous described metal place.
As optimized technical scheme of the present invention, described metal back layer is to be made by copper or aluminium.
As optimized technical scheme of the present invention, the little radiator of described metal is made of aluminum or copper.
As optimized technical scheme of the present invention, the little radiator of described metal is cylindrical a, elliptical cylinder-shape, cube shaped or go up bottom surface and be rhombus, triangle or trapezoidal cylindricality.
The end face of the little radiator of metal is equal with the bottom surface away from metal back layer of conventional printed circuit board (PCB).
The set copper layer line road in the end face of the little radiator of metal and the bottom surface away from metal back layer of conventional printed circuit board (PCB) is equal.
Can be bonding between described metal back layer and the conventional printed circuit board (PCB) by an adhesive layer, for example prepreg is corresponding, and adhesive layer also is provided with the lead to the hole site and the equal corresponding through hole of size that are used to be provided with the little radiator of metal with conventional printed circuit board (PCB).
With respect to prior art, the little radiator of metal that the present invention will have high heat conductance combines with conventional printed circuit board (PCB), heater elements such as light-emitting diode can be installed on the little radiator end face of metal, the heat that distributes during heater element work can conduct to metal back layer through the little radiator of metal, again outside metal back layer conducts to printed circuit board (PCB), the little radiator of metal has solved the heat dissipation problem of the heater element on the printed circuit board (PCB) effectively, so the present invention is the desirable support plate of heater element and array thereof.
Description of drawings
The invention will be further described below in conjunction with accompanying drawing and specific embodiment:
Fig. 1 is a better embodiment generalized section of the present invention.
Embodiment
Fig. 1 is the generalized section of better embodiment of the present invention.
A kind of printed circuit board (PCB) that has the little radiator of metal, it comprises a metal back layer 10 and the insulating barrier 20 of stacked setting, bottom surface away from metal back layer 10 of this insulating barrier 20 is provided with copper layer line road 30, the one side that metal back layer 10 contacts with insulating barrier 20 is provided with one and the little radiator 40 of metal back layer 10 integrated cylindrical metals, the little radiator 40 of this metal protrudes in metal back layer 10 surfaces and embeds in the cylindricality through hole of insulating barrier 20, leaves enough distances between the end face of the little radiator 40 of metal and the copper layer line road 30 to guarantee insulation between little radiator 40 of metal and the copper layer line road 30.Described copper layer line road 30 comprises the two heater element connecting portions 31 that are used to connect the heater element pin, and it is arranged at described metal little radiator 40 end face both sides and insulate with the little radiator 40 of metal.
The pin of heater element such as light-emitting diode, light-emitting diode chip for backlight unit can be welded in heater element connecting portion 31, heater element itself contacts with the end face of the little radiator 40 of metal, heater element work distribute heat, heat conducts to metal back layer 10 by the little radiator 40 of metal, through metal back layer 10 heat is conducted to outside the printed circuit board (PCB) again.
The insulating barrier 20 that the outer surface of the printed circuit board (PCB) that has the little radiator of metal of above-mentioned execution mode is provided with copper layer line road 30 is the individual layer printed circuit board.
Printed circuit board (PCB) of the present invention is not limited only to above-mentioned better embodiment, and is every according to equivalence variation and modification that the present invention did, all covered by the scope of claims of the present invention.For example:
Described conventional printed circuit board (PCB) comprises any existing printed circuit board (PCB), for example: individual layer, bilayer and multilayer printed circuit board.Its printed circuit board that has the little radiator of metal that also can be the respective embodiments described above is connected with flexible print wiring board, has become just/the flexible printed circuit board (PCB) that combines; Also can be flexible print wiring board, as be individual layer, bilayer and multi-layer flexible printed circuit board (PCB), described metal back layer is the bent thin metal layer that is attached to flexible print wiring board, and little radiator of metal and thin metal layer are one-body molded.
Can be bonding between described metal back layer and the conventional printed circuit board (PCB) by an adhesive layer, for example prepreg is corresponding, and adhesive layer also is provided with the lead to the hole site and the equal corresponding through hole of size that are used to be provided with the little radiator of metal with conventional printed circuit board (PCB).
That the shape of the little radiator of metal can be is cylindrical, elliptical cylinder-shape, cube shaped, go up bottom surface and be rhombus, triangle, trapezoidal cylindricality etc.
The shape that has a printed circuit board (PCB) of the little radiator of metal can be shapes such as rectangle, circle, ellipse, rhombus, trapezoidal, polygon.
The number of the little radiator of metal that is provided with on the printed circuit board (PCB) needs decision by side circuit, can be one or more.Comprise the little radiator of a plurality of metals as printed circuit board (PCB), the shape of the little radiator of a plurality of metals can be consistent, also can be inconsistent, corresponding position is provided with the through hole that a plurality of shape and size meet the little radiator of these a plurality of metals respectively in the insulating barrier, embeds for the little radiator of metal is corresponding.
In above-mentioned all execution modes, little radiator of metal and metal back layer are not limited to one-body molded, can also combine by the mode that welding, stickup, heavy copper plating or hot pressing are merged.
Described metal back layer is that copper or aluminium are made; The little radiator of described metal is that copper or aluminium are made.
Claims (10)
1. printed circuit board (PCB) that has the little radiator of metal, it comprises a conventional printed circuit board (PCB), it is characterized in that, also comprise a metal back layer with the stacked setting of this routine printed circuit board (PCB), in two bottom surfaces of this routine printed circuit board (PCB) at least the bottom surface away from this metal back layer be provided with copper layer line road, the one side that metal back layer contacts with conventional printed circuit board (PCB) is provided with one or more little radiators of cylindrical metal that are connected as a single entity with metal back layer, the little radiator of these one or more metals protrudes in the metal back layer surface and corresponding the embedding run through in one or more cylindricality through holes of conventional printed circuit board (PCB), spacing is left between the set copper layer line road in a bottom surface away from metal back layer of the end face of the little radiator of metal and conventional printed circuit board (PCB), so that little radiator of metal and copper layer line road electric insulation.
2. the printed circuit board (PCB) that has the little radiator of metal according to claim 1 is characterized in that, little radiator of described metal and metal back layer electroplate by one-body molded, welding, stickup, heavy copper or the mode of hot pressing fusion is combined as a whole.
3. the printed circuit board (PCB) that has the little radiator of metal according to claim 1 is characterized in that, described conventional printed circuit board (PCB) is individual layer printed circuit board, double-layer rigid printed circuit board (PCB) or multilayer printed circuit board.
4. the printed circuit board (PCB) that has the little radiator of metal according to claim 1, it is characterized in that, described conventional printed circuit board (PCB) is individual layer flexible print wiring board, two-layer flexible printed wiring board or multi-layer flexible printed circuit board (PCB), and described metal back layer is bent thin metal layer.
5. the printed circuit board (PCB) that has the little radiator of metal according to claim 1 is characterized in that: described copper layer line road comprises the heater element connecting portion that is used to connect the heater element pin, and it is arranged at the little radiator end face of contiguous described metal edge.
6. the printed circuit board (PCB) that has the little radiator of metal according to claim 1 is characterized in that described metal back layer is made by copper or aluminium, and the little radiator of described metal is made by copper or aluminium.
7. the printed circuit board (PCB) that has the little radiator of metal according to claim 1 is characterized in that,
Can be bonding between described metal back layer and the conventional printed circuit board (PCB) by an adhesive layer, this adhesive layer is provided with the lead to the hole site and the equal corresponding through hole of size that are used to be provided with the little radiator of metal with conventional printed circuit board (PCB).
8. the printed circuit board (PCB) that has the little radiator of metal according to claim 7 is characterized in that, described adhesive layer is a prepreg.
9. the printed circuit board (PCB) that has the little radiator of metal according to claim 1 is characterized in that, the little radiator of described metal is cylindrical a, elliptical cylinder-shape, cube shaped or go up bottom surface and be rhombus, triangle or trapezoidal cylindricality.
10. the printed circuit board (PCB) that has the little radiator of metal according to claim 1, it is characterized in that the end face of the little radiator of metal is equal with the bottom surface away from metal back layer of conventional printed circuit board (PCB) or equal with set copper layer line road, the bottom surface away from metal back layer of conventional printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101399481A CN102202459A (en) | 2011-05-27 | 2011-05-27 | PCB (printed circuit board) with metal micro radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101399481A CN102202459A (en) | 2011-05-27 | 2011-05-27 | PCB (printed circuit board) with metal micro radiator |
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| Publication Number | Publication Date |
|---|---|
| CN102202459A true CN102202459A (en) | 2011-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101399481A Pending CN102202459A (en) | 2011-05-27 | 2011-05-27 | PCB (printed circuit board) with metal micro radiator |
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| CN (1) | CN102202459A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711364A (en) * | 2012-04-13 | 2012-10-03 | 乐健线路板（珠海）有限公司 | Printed circuit board realizing weldable metal mini-heat-radiators by metal aluminum and manufacturing method of printed circuit board |
| CN103140036A (en) * | 2011-11-24 | 2013-06-05 | 先丰通讯股份有限公司 | Production method of cooling printed circuit board (PCB) |
| CN103545299A (en) * | 2013-10-21 | 2014-01-29 | 大连德维电子科技有限公司 | High-voltage rectification silicon stack |
| CN104654247A (en) * | 2013-11-25 | 2015-05-27 | 海洋王（东莞）照明科技有限公司 | Heat dissipation structure of LED lamp, manufacturing method thereof, and LED lamp |
| US10051723B2 (en) | 2016-07-29 | 2018-08-14 | Microsoft Technology Licensing, Llc | High thermal conductivity region for optoelectronic devices |
| CN109378308A (en) * | 2014-12-10 | 2019-02-22 | 上海兆芯集成电路有限公司 | Circuit substrate and packaging structure |
| CN112165762A (en) * | 2020-09-27 | 2021-01-01 | 诚亿电子（嘉兴）有限公司 | Copper-based PCB (printed circuit board) containing thermoelectric separation copper boss and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594730A (en) * | 2008-05-26 | 2009-12-02 | 全懋精密科技股份有限公司 | Circuit board with conductive structure |
| CN201426215Y (en) * | 2009-06-17 | 2010-03-17 | 先丰通讯股份有限公司 | Heat dissipating structure of circuit board |
| CN101841974A (en) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | High-thermal conductivity circuit board and method for producing same by using electroplating method |
| CN102026496A (en) * | 2010-12-24 | 2011-04-20 | 乐健线路板（珠海）有限公司 | Method for preparing printed circuit board with insulated micro radiator |
| CN102056418A (en) * | 2010-11-30 | 2011-05-11 | 乐健线路板〔珠海〕有限公司 | Preparation method for printed circuit board with insulating miniature radiators |
| CN102064265A (en) * | 2009-11-11 | 2011-05-18 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and substrate |
-
2011
- 2011-05-27 CN CN2011101399481A patent/CN102202459A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594730A (en) * | 2008-05-26 | 2009-12-02 | 全懋精密科技股份有限公司 | Circuit board with conductive structure |
| CN201426215Y (en) * | 2009-06-17 | 2010-03-17 | 先丰通讯股份有限公司 | Heat dissipating structure of circuit board |
| CN102064265A (en) * | 2009-11-11 | 2011-05-18 | 钰桥半导体股份有限公司 | Semiconductor chip assembly with post/base heat spreader and substrate |
| CN101841974A (en) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | High-thermal conductivity circuit board and method for producing same by using electroplating method |
| CN102056418A (en) * | 2010-11-30 | 2011-05-11 | 乐健线路板〔珠海〕有限公司 | Preparation method for printed circuit board with insulating miniature radiators |
| CN102026496A (en) * | 2010-12-24 | 2011-04-20 | 乐健线路板（珠海）有限公司 | Method for preparing printed circuit board with insulated micro radiator |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103140036A (en) * | 2011-11-24 | 2013-06-05 | 先丰通讯股份有限公司 | Production method of cooling printed circuit board (PCB) |
| CN102711364A (en) * | 2012-04-13 | 2012-10-03 | 乐健线路板（珠海）有限公司 | Printed circuit board realizing weldable metal mini-heat-radiators by metal aluminum and manufacturing method of printed circuit board |
| CN103545299A (en) * | 2013-10-21 | 2014-01-29 | 大连德维电子科技有限公司 | High-voltage rectification silicon stack |
| CN104654247A (en) * | 2013-11-25 | 2015-05-27 | 海洋王（东莞）照明科技有限公司 | Heat dissipation structure of LED lamp, manufacturing method thereof, and LED lamp |
| CN109378308A (en) * | 2014-12-10 | 2019-02-22 | 上海兆芯集成电路有限公司 | Circuit substrate and packaging structure |
| CN109378308B (en) * | 2014-12-10 | 2021-05-28 | 上海兆芯集成电路有限公司 | Circuit substrate and packaging structure |
| US10051723B2 (en) | 2016-07-29 | 2018-08-14 | Microsoft Technology Licensing, Llc | High thermal conductivity region for optoelectronic devices |
| CN112165762A (en) * | 2020-09-27 | 2021-01-01 | 诚亿电子（嘉兴）有限公司 | Copper-based PCB (printed circuit board) containing thermoelectric separation copper boss and manufacturing method thereof |
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Application publication date: 20110928 |