CN104654247A - Heat dissipation structure of LED lamp, manufacturing method thereof, and LED lamp - Google Patents

Heat dissipation structure of LED lamp, manufacturing method thereof, and LED lamp Download PDF

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Publication number
CN104654247A
CN104654247A CN201310604187.1A CN201310604187A CN104654247A CN 104654247 A CN104654247 A CN 104654247A CN 201310604187 A CN201310604187 A CN 201310604187A CN 104654247 A CN104654247 A CN 104654247A
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CN
China
Prior art keywords
layer
outermost
led lamp
heat dissipation
metal coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310604187.1A
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Chinese (zh)
Inventor
周明杰
杨强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oceans King Lighting Science and Technology Co Ltd
Oceans King Dongguan Lighting Technology Co Ltd
Shenzhen Oceans King Lighting Engineering Co Ltd
Original Assignee
Oceans King Lighting Science and Technology Co Ltd
Oceans King Dongguan Lighting Technology Co Ltd
Shenzhen Oceans King Lighting Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oceans King Lighting Science and Technology Co Ltd, Oceans King Dongguan Lighting Technology Co Ltd, Shenzhen Oceans King Lighting Engineering Co Ltd filed Critical Oceans King Lighting Science and Technology Co Ltd
Priority to CN201310604187.1A priority Critical patent/CN104654247A/en
Publication of CN104654247A publication Critical patent/CN104654247A/en
Pending legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

Abstract

The invention discloses an LED (light-emitting diode) lamp and a heat dissipation structure of the LED lamp. The heat dissipation structure of the lamp comprises a circuit board, a metal heat dissipation layer, and an LED chip. The circuit board comprises an outermost insulation layer and an outermost circuit layer opposite to the outermost insulation layer; the circuit board comprises a circuit region and a non-circuit region, the outermost circuit layer is formed in the circuit region, and the non-circuit region is provided with a through hole passing through the outermost insulation layer and the outermost circuit layer. The metal heat dissipation layer is laminated to the surface of the outermost insulation layer far away from the outermost circuit layer and provided with a metal bump which is corresponding to the through hole, and the metal bump is accommodated in the through hole. The LED chip is arranged on the metal bump and connected with the circuit of the outermost circuit layer. The invention further discloses a method for manufacturing the heat dissipation structure of the LED lamp.

Description

Heat dissipation structure of LED lamp and preparation method thereof and LED lamp
Technical field
The present invention relates to lighting field, particularly relate to a kind of heat dissipation structure of LED lamp and preparation method thereof and LED lamp.
Background technology
Along with maturation and the development of LED technology, increasing occasion all uses LED lamp, as market, supermarket, outdoor signboard, advertisement etc.
The chip of LED lamp is in the market all the surface being attached to circuit board.Concrete, when taking aluminium base as base material, base material forms circuit, then prints insulating lacquer layer, finally LED paster on aluminium base.When taking copper base as base material, base material forms circuit, then prints insulating lacquer layer, finally LED paster on copper base.Two kinds of above modes due to insulating lacquer layer to there is radiating effect all not good, especially the heat radiation of great power LED becomes a difficult problem.
Summary of the invention
Based on this, be necessary heat dissipation structure of LED lamp that a kind of good heat dissipation effect is provided and preparation method thereof and LED lamp.
Its technical scheme is as follows.
First, a kind of heat dissipation structure of LED lamp is provided, comprises,
Circuit board, comprise outermost insulating barrier and the outermost line layer opposing with described outermost insulating barrier, described circuit board comprises line areas and logicalnot circuit district, and described outermost line layer is formed at described line areas, offers the through hole of through described outermost insulating barrier and outermost line layer in described logicalnot circuit district;
Metallic radiating layer, fit in the surface away from described outermost line layer of described outermost insulating barrier, be provided with metal coupling at described metallic radiating layer, described metal coupling is corresponding with described through hole, and described metal coupling is contained in described through hole;
LED chip, is located on described metal coupling, the line electricity conducting of described LED chip and described outermost line layer.
Wherein in an embodiment, described metallic radiating layer comprises conformable region and the non-conformable region adjacent with described conformable region, and described metal coupling is located at described conformable region, and described conformable region is located at by described circuit board.
Wherein in an embodiment, offer fixing hole in described non-conformable region, described metallic radiating layer can be fixed on external module by described fixing hole.
Wherein in an embodiment, the height of described metal coupling is more than or equal to the thickness of described circuit board.
Wherein in an embodiment, the material of described metallic radiating layer is copper.
Wherein in an embodiment, described metallic radiating layer and described metal coupling one-body molded.
Wherein in an embodiment, the thickness of described metallic radiating layer is greater than the thickness of described circuit board, and described metallic radiating layer supports described circuit board.
Wherein in an embodiment, form the protective layer preventing circuit to be oxidized on the surface of described outermost line layer.
Secondly, a kind of LED lamp is also provided, comprises heat dissipation structure of LED lamp as the aforementioned.
Again, a kind of preparation method of heat dissipation structure of LED lamp is provided, comprises step:
Form circuit board, described circuit board comprises outermost insulating barrier and the opposing outermost line layer with described outermost insulating barrier, and described circuit board comprises line areas and logicalnot circuit district, and described line layer is formed at described line areas;
The through hole of through described outermost insulating barrier and outermost line layer is offered in described logicalnot circuit district;
Metallic radiating layer forms metal coupling, described metallic radiating layer is fitted in the surface of described insulating barrier, described metal coupling is contained in described through hole;
LED chip is fitted on described metal coupling, welds the pin of described LED chip and the circuit of described outermost line layer.
The LED chip of the radiator structure of above-mentioned light fixture is directly delivered on metal guide thermosphere by metal coupling to be dispersed into fast in surrounding environment, heat conduction more thorough.For high-power LED chip, because the heat dissipation capacity of chip is comparatively large, conduct heat on large-area metallic radiating layer by metal coupling, the conduction of heat fast thoroughly.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the heat dissipation structure of LED lamp described in an embodiment;
Fig. 2 is the STRUCTURE DECOMPOSITION figure of Fig. 1;
Fig. 3 is the schematic diagram of the circuit board of the heat dissipation structure of LED lamp described in Fig. 1;
Fig. 4 is the schematic diagram of the metallic radiating layer of the heat dissipation structure of LED lamp described in Fig. 1;
Fig. 5 is the flow chart of the preparation method of the heat dissipation structure of LED lamp described in an embodiment.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Better embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make to disclosure of the present invention understand more thorough comprehensively.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique embodiment.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe concrete embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Refer to Fig. 1, a kind of heat dissipation structure of LED lamp is provided in one embodiment, for the heat radiation of LED chip.Heat dissipation structure of LED lamp 10 comprises circuit board 12, metallic radiating layer 14, LED chip 16.
Circuit board comprises outermost insulating barrier and the opposing outermost line layer with described outermost insulating barrier.Described circuit board comprises line areas and logicalnot circuit district.Described outermost line layer is formed at described line areas.The through hole of through described outermost insulating barrier and outermost line layer is offered in described logicalnot circuit district.
Refer to Fig. 1, Fig. 2 and composition graphs 3, circuit board 12 can be lamina, also can be doubling plate or multi-layer sheet.In the illustrated embodiment, be described for lamina for circuit board 12.Circuit board 12 comprises insulating barrier 122 and line layer 124.The material of insulating barrier 122 can be glass fibre, not fabric material or resin.Described insulating barrier 122 comprises opposing first surface 123 and second surface 125.Described first surface 123 is divided into line areas 123a and the logicalnot circuit district 123b adjacent with described line areas 123a.Described line layer 124 is formed at the line areas 123a of described first surface 123.The through hole 126 running through described first surface 123 and second surface 125 is offered at described logicalnot circuit district 123b.The number of through hole 126 is determined according to actual demand, can be one, two or multiple.The shape of through hole 126 does not also limit, and can be rectangle, square or circle.In addition, the protective layer that circuit can be prevented to be oxidized is set on the surface of described line layer.
Metallic radiating layer fits in the surface away from described outermost line layer of described outermost insulating barrier.Metal coupling is provided with at described metallic radiating layer.Described metal coupling and described through hole one_to_one corresponding.Described metal coupling is contained in described through hole.The line electricity conducting of described LED chip and described outermost line layer.
Incorporated by reference to Fig. 4, in illustrated embodiment, metallic radiating layer 14 fits in the second surface 125 of described insulating barrier 122.Metal coupling 142 is provided with at described metallic radiating layer 14.Described metal coupling 142 and described through hole 126 one_to_one corresponding.Described metal coupling 142 is contained in described through hole 126.LED chip 16 is located on described metal coupling 142, the line electricity conducting of described LED chip 16 and line layer 124.
In illustrated embodiment, described metallic radiating layer 14 comprises conformable region 144 and the non-conformable region 146 adjacent with described conformable region 144.Described metal coupling 142 is located at described conformable region 144.Described conformable region 144 is located at by described circuit board 12.The height of described metal coupling 142 is more than or equal to the thickness of described circuit board 12.When the height of metal coupling is equal with the thickness of circuit board, can the planarization on holding circuit plate surface.The material of described metallic radiating layer 14 is copper.Certainly, the material of metallic radiating layer 14 also can be the metal of aluminium or other perfect heat-dissipatings.Described metallic radiating layer 14 is one-body molded with described metal coupling 142, and integrated design can make heat in LED chip 16 conduct rapidly and thoroughly.Certainly, metallic radiating layer 14 and metal coupling 142 also can separately make.Then metal coupling 142 is fitted on metallic radiating layer 14.The thickness of described metallic radiating layer 14 is greater than the thickness of described circuit board 12, to support described circuit board 12.
Gap, slightly larger than the size of metal coupling 142, is directly left at circuit board 12 and metal coupling 142 in through hole 126 aperture.When the surperficial glue coated of metal coupling 142, unnecessary glue can flow in gap.Prevent glue from overflowing to circuit board 12 surface, avoid causing circuit bad.
Offer fixing hole 147 in described non-conformable region 146, described metallic radiating layer 14 can be fixed on external module by described fixing hole 147.
In other examples, offer the registration holes for contraposition in the conformable region of metallic radiating layer, corresponding circuit board on also offer mating holes for contraposition.Registration holes and mating holes alignment, then projection can be housed in registration holes accurately, and the deviation of fitting can not occur.Also circuit board and metallic radiating layer can be fitted fast simultaneously, production efficiency is provided.
Be understandable that, the number of plies of metallic radiating layer 14 also can be two-layer or two-layer more than.When more than the number of plies of metallic radiating layer 14 is two-layer or two-layer, the carrying out of heat-conducting glue between metallic radiating layer 14, is adopted to fit.The material of metallic radiating layer 14 can identical also can not be identical.As long as the material of good heat conductivity.
The LED chip of the radiator structure of above-mentioned light fixture is directly delivered on metal guide thermosphere by metal coupling to be dispersed into fast in surrounding environment, heat conduction more thorough.For high-power LED chip, because the heat dissipation capacity of chip is comparatively large, conduct heat on large-area metallic radiating layer by metal coupling, the conduction of heat fast thoroughly.
On the other hand, in another embodiment, also provide a kind of LED lamp, comprise foregoing heat dissipation structure of LED lamp 10.
In another embodiment, also provide a kind of preparation method of heat dissipation structure of LED lamp, concrete comprises the following steps.
S200, formation circuit board, described circuit board comprises outermost insulating barrier and the opposing outermost line layer with described outermost insulating barrier, and described circuit board comprises line areas and logicalnot circuit district, and described line layer is formed at described line areas.
Refer to Fig. 5, circuit board can be lamina, doubling plate or multi-layer sheet.In illustrated embodiment, line layer is individual layer is that example is described.There is provided and cover Copper base material, cover the insulating barrier that Copper base material comprises layers of copper and bonds with layers of copper.Insulating barrier comprises opposing first surface and second surface.Layers of copper is bonded in the first surface of insulating barrier.Insulating barrier can be glass fibre, not fabric material or resin.The layers of copper of line areas forms line layer through flow processs such as etching, development, exposures.
S300, offer the through hole of through described outermost insulating barrier and outermost line layer in described logicalnot circuit district.
In illustrated embodiment, after the line layer that completes, in the logicalnot circuit district of insulating barrier, boring obtains through hole, and the number of through hole is determined according to actual demand, can be one, two or multiple.The shape of through hole does not also limit, and can be rectangle, square or circle.
S400, on metallic radiating layer, form metal coupling, described metallic radiating layer is fitted in the surface of described outermost insulating barrier, described metal coupling is contained in described through hole.
In illustrated embodiment, can make satisfactory metal coupling in advance, on metallic radiating layer, coated with thermally conductive glue, is then pressed together on metal coupling on metallic radiating layer.Also can be by metal coupling and metallic radiating layer one-body molded.Then can save the operation be fitted in by metal coupling on metallic radiating layer.The size of metal coupling and the size of through hole match.Through-hole aperture is slightly larger than the size of metal coupling.
S500, LED chip are fitted on described metal coupling, weld the pin of described LED chip and the circuit of described outermost line layer.
In illustrated embodiment, in the surperficial glue coated of metal coupling, LED chip is attached on metal coupling.Because through-hole aperture is slightly larger than the size of metal coupling, between circuit board and metal coupling, leave gap.When metal coupling glue coated, unnecessary glue can flow in gap.Prevent glue from overflowing to circuit board surface, avoid causing circuit bad.
Be understandable that, the making of through hole also can complete before making line layer.Punching machine punch is utilized to be formed.
The heat dissipation structure of LED lamp that said method makes, LED chip is directly delivered on metal guide thermosphere by metal coupling to be dispersed into fast in surrounding environment, heat conduction more thorough.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (10)

1. a heat dissipation structure of LED lamp, is characterized in that, comprises,
Circuit board, comprise outermost insulating barrier and the outermost line layer opposing with described outermost insulating barrier, described circuit board comprises line areas and logicalnot circuit district, and described outermost line layer is formed at described line areas, offers the through hole of through described outermost insulating barrier and outermost line layer in described logicalnot circuit district;
Metallic radiating layer, fit in the surface away from described outermost line layer of described outermost insulating barrier, be provided with metal coupling at described metallic radiating layer, described metal coupling is corresponding with described through hole, and described metal coupling is contained in described through hole;
LED chip, is located on described metal coupling, the line electricity conducting of described LED chip and described outermost line layer.
2. heat dissipation structure of LED lamp as claimed in claim 1, it is characterized in that, described metallic radiating layer comprises conformable region and the non-conformable region adjacent with described conformable region, and described metal coupling is located at described conformable region, and described circuit board fits in described conformable region.
3. heat dissipation structure of LED lamp as claimed in claim 2, be is characterized in that, offer fixing hole in described non-conformable region, described metallic radiating layer can be fixed on external module by described fixing hole.
4. heat dissipation structure of LED lamp as claimed in claim 1, it is characterized in that, the height of described metal coupling is more than or equal to the thickness of described circuit board.
5. heat dissipation structure of LED lamp as claimed in claim 1, it is characterized in that, the material of described metallic radiating layer is copper.
6. heat dissipation structure of LED lamp as claimed in claim 1, is characterized in that, described metallic radiating layer and described metal coupling one-body molded.
7. heat dissipation structure of LED lamp as claimed in claim 1, it is characterized in that, the thickness of described metallic radiating layer is greater than the thickness of described circuit board, and described metallic radiating layer supports described circuit board.
8. heat dissipation structure of LED lamp as claimed in claim 1, is characterized in that, form the protective layer preventing circuit to be oxidized on the surface of described outermost line layer.
9. a LED lamp, is characterized in that, comprises the heat dissipation structure of LED lamp as described in any one of claim 1-8.
10. a preparation method for heat dissipation structure of LED lamp, is characterized in that, comprises step:
Form circuit board, described circuit board comprises outermost insulating barrier and the opposing outermost line layer with described outermost insulating barrier, and described circuit board comprises line areas and logicalnot circuit district, and described line layer is formed at described line areas;
The through hole of through described outermost insulating barrier and outermost line layer is offered in described logicalnot circuit district;
Metallic radiating layer forms metal coupling, described metallic radiating layer is fitted in the surface of described insulating barrier, described metal coupling is contained in described through hole;
LED chip is fitted on described metal coupling, welds the pin of described LED chip and the circuit of described outermost line layer.
CN201310604187.1A 2013-11-25 2013-11-25 Heat dissipation structure of LED lamp, manufacturing method thereof, and LED lamp Pending CN104654247A (en)

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EP1937041A2 (en) * 2006-12-21 2008-06-25 LG Electronics Inc. Printed circuit board, light emitting apparatus having the same and manufacturing method thereof
CN101752354A (en) * 2009-12-18 2010-06-23 中山大学 Packaging substrate structure for LED and production method thereof
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KR101015166B1 (en) * 2010-11-26 2011-02-17 (주)비전테크 Led module structure and method of making the same for optical and thermal property
CN102202459A (en) * 2011-05-27 2011-09-28 乐健线路板(珠海)有限公司 PCB (printed circuit board) with metal micro radiator
CN102404933A (en) * 2011-11-12 2012-04-04 葛豫卿 Printed circuit board applying metal substrate to penetrate heat path and method for making printed circuit board
CN102612261A (en) * 2011-11-20 2012-07-25 葛豫卿 High-heat conduction metal core printed circuit board and preparation method for high-heat conduction metal core printed circuit board
CN202488866U (en) * 2011-11-12 2012-10-10 葛豫卿 Printed circuit board applying metal substrate to penetrate heat path
CN202721195U (en) * 2012-05-04 2013-02-06 江苏广发光电科技有限公司 Heat-radiation substrate used for surface mounting of LED light sources
KR20130020093A (en) * 2011-08-18 2013-02-27 (주)씨에스텍 Equipped with heat transfer material that improves heat and light-emitting diodes
CN202884521U (en) * 2012-05-21 2013-04-17 王定锋 Light-emitting diode (LED) module with high thermal conductivity structure

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1635824A (en) * 2003-12-31 2005-07-06 技嘉科技股份有限公司 Highly radiating multi-layer circuit board and manufacturing method thereof
EP1937041A2 (en) * 2006-12-21 2008-06-25 LG Electronics Inc. Printed circuit board, light emitting apparatus having the same and manufacturing method thereof
CN101752354A (en) * 2009-12-18 2010-06-23 中山大学 Packaging substrate structure for LED and production method thereof
CN101814574A (en) * 2010-04-16 2010-08-25 惠州市华阳多媒体电子有限公司 Light emitting diode base plate heat radiation structure and manufacture method thereof
KR101015166B1 (en) * 2010-11-26 2011-02-17 (주)비전테크 Led module structure and method of making the same for optical and thermal property
CN102202459A (en) * 2011-05-27 2011-09-28 乐健线路板(珠海)有限公司 PCB (printed circuit board) with metal micro radiator
KR20130020093A (en) * 2011-08-18 2013-02-27 (주)씨에스텍 Equipped with heat transfer material that improves heat and light-emitting diodes
CN102404933A (en) * 2011-11-12 2012-04-04 葛豫卿 Printed circuit board applying metal substrate to penetrate heat path and method for making printed circuit board
CN202488866U (en) * 2011-11-12 2012-10-10 葛豫卿 Printed circuit board applying metal substrate to penetrate heat path
CN102612261A (en) * 2011-11-20 2012-07-25 葛豫卿 High-heat conduction metal core printed circuit board and preparation method for high-heat conduction metal core printed circuit board
CN202721195U (en) * 2012-05-04 2013-02-06 江苏广发光电科技有限公司 Heat-radiation substrate used for surface mounting of LED light sources
CN202884521U (en) * 2012-05-21 2013-04-17 王定锋 Light-emitting diode (LED) module with high thermal conductivity structure

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Application publication date: 20150527