CN114867210A - Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by milling machine method - Google Patents
Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by milling machine method Download PDFInfo
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- CN114867210A CN114867210A CN202210560814.5A CN202210560814A CN114867210A CN 114867210 A CN114867210 A CN 114867210A CN 202210560814 A CN202210560814 A CN 202210560814A CN 114867210 A CN114867210 A CN 114867210A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- Microelectronics & Electronic Packaging (AREA)
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention belongs to the field of circuit board production, in particular to a production process for improving the thermoelectric separation heat conduction efficiency of a metal circuit board by a milling machine method, aiming at the problem that the existing good heat conduction on a heating power element cannot be completed, the following scheme is proposed, and the production process comprises the following steps: s1, manufacturing a circuit diagram, an insulating layer PP diagram, a copper substrate three-dimensional diagram and a film diagram according to circuit requirements; s2, pressing the copper foil and the insulating layer; s3, etching a circuit; s4, punching the insulating layer; s5, machining the copper base material by using a milling machine; s6, circuit layer, insulating layer and copper base material, the invention can directly skip the limit of the heat conductivity coefficient of the insulating layer about 5W/(M K), directly increase the heat conductivity coefficient of the copper about 400W/(M K), increase the heat conductivity coefficient of the whole circuit board from about 5W/(M K) to about 400W/(M K), and increase the heat conductivity about 80 times.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a production process for improving the thermoelectric separation heat conduction efficiency of a metal circuit board by a milling machine method.
Background
The heat-generating electronic component needs to conduct heat out, so that the service life of the component can be prolonged, and the heat conduction to the circuit board is required. As shown in the figure, the heat conduction path is a set of heat conduction path in which a heating type power element generates heat, the heat is conducted to the circuit layer, the circuit layer is conducted to the insulating layer, the insulating layer is conducted to the heat dissipation layer, the heat dissipation layer is combined with the radiator, and finally heat dissipation (cooling) is completed.
The thermal conductivity of copper is about 400W/(M × K), and the thermal conductivity of the metal substrate insulating layer is only about 5W/(M × K). Therefore, the thermal conductivity of such copper-based circuit boards is only about 5W/(M × K). Good heat conduction to the heating power element cannot be accomplished.
Disclosure of Invention
The invention aims to solve the defect that good heat conduction on a heating power element cannot be completed in the prior art, and provides a production process for improving the thermoelectric separation heat conduction efficiency of a metal circuit board by a milling machine method.
In order to achieve the purpose, the invention adopts the following technical scheme:
the production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by a milling machine method comprises the following steps:
s1, manufacturing a circuit diagram, an insulating layer PP diagram, a copper substrate three-dimensional diagram and a film diagram according to circuit requirements;
s2, pressing the copper foil and the insulating layer;
s3, etching a circuit;
s4, punching the insulating layer;
s5, machining the copper base material by using a milling machine;
s6, pressing the circuit layer, the insulating layer and the copper substrate;
s7, manufacturing a solder mask layer and a character layer;
and S8, drilling and forming.
Preferably, in S1, when the circuit diagram is designed, a horizontal plane is used as a layer of circuit design, only one layer of circuit design is made for a single-layer metal substrate, and when the circuit layer is designed, the heat dissipation pad is not designed in the film file of the circuit layer, and the heat dissipation pad is designed on the copper substrate, that is, the heat dissipation layer is designed.
Preferably, in S2, the copper foil and the insulating layer are laminated by a laminating machine.
Preferably, in S3, the heat-dissipating pad is etched away when the film pattern or the screen pattern is formed.
Preferably, in S4, holes are formed in the insulating layer based on the position of the heat dissipation pad as a coordinate and the size of the pad at the coordinate point, so that the insulating layer can be manufactured by a laser cutting process with a small manufacturing number, the heat dissipation pad can be manufactured by a punch press process with a large manufacturing number, and the corresponding hole sites can be manufactured based on the position and size of the heat dissipation pad.
Preferably, in S5, the copper substrate is processed by a milling machine process, the heat dissipation pad is left as it is, and the portion other than the heat dissipation pad is processed, where the processed height is the height value a of the heat dissipation pad.
Preferably, a = copper foil thickness + PP thickness; the copper foil means: a circuit layer copper foil; PP means: an insulating layer.
Preferably, in S6, the finished product with the punched insulating layer and the finished product processed by the milling machine are pressed together.
Compared with the prior art, the invention has the beneficial effects that:
the invention can directly skip the restriction of the heat conductivity coefficient of the insulating layer about 5W/(M K), directly increase the heat conductivity coefficient of copper to about 400W/(M K), and increase the heat conductivity coefficient of the whole circuit board from about 5W/(M K) to about 400W/(M K), thereby increasing the heat conductivity by about 80 times.
Drawings
FIG. 1 is a diagram of the heat conduction principle and the heat conduction capability of the production process for improving the thermoelectric separation heat conduction efficiency of a metal circuit board by a milling machine method according to the present invention;
FIG. 2 is a circuit diagram of a production process for improving the thermoelectric separation and heat conduction efficiency of a metal circuit board by a milling machine method according to the present invention;
FIG. 3 is a circuit diagram of a conventional design;
FIG. 4 is a circuit diagram of the copper foil remaining during etching in the process of the present invention for improving the efficiency of thermal and electrical separation and heat conduction of a metal circuit board by a milling machine;
FIG. 5 is a diagram of the punching of the insulation layer in the production process for improving the heat transfer efficiency of the thermoelectric separation of the metal circuit board by the milling machine method according to the present invention;
FIG. 6 is a schematic structural diagram of a copper-based plate produced by the process for improving the thermoelectric separation and heat conduction efficiency of a metal circuit board by a milling machine method according to the present invention;
FIG. 7 is a schematic structural diagram of a stamping die of the production process for improving the thermoelectric separation and heat conduction efficiency of a metal circuit board by a milling machine method according to the present invention;
fig. 8 is a diagram of a finished product with holes on an insulating layer of the production process for improving the thermoelectric separation and heat conduction efficiency of the metal circuit board by using the milling machine method.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example one
Referring to fig. 1-8, the production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by a milling machine method comprises the following steps:
s1, manufacturing a circuit diagram, an insulating layer PP diagram, a copper substrate three-dimensional diagram and a film diagram according to circuit requirements;
s2, pressing the copper foil and the insulating layer;
s3, etching a circuit;
s4, punching the insulating layer;
s5, machining the copper base material by using a milling machine;
s6, pressing the circuit layer, the insulating layer and the copper substrate;
s7, manufacturing a solder mask layer and a character layer;
and S8, drilling and forming.
The method comprises the following specific steps:
manufacturing a circuit diagram:
the invention is different from the traditional circuit diagram manufacturing, when an engineer designs the circuit diagram, the engineer only designs one layer of circuit by taking a horizontal plane as one layer of circuit design and only designs one layer of circuit for a single-layer metal substrate. Taking fig. 2 as an example, the conventional design is: all over-current wiring and heat-dissipating pads are left in the etching by the design file and the manufacturing process. As shown in fig. 3: the design of the invention is as follows: in the design file and manufacturing process, only the over-current circuit is etched to leave the copper foil, as shown in fig. 4.
According to the points, a circuit diagram and a film diagram are designed. In addition, the PP picture of the insulating layer is described in detail in the punching of the insulating layer; the three-dimensional drawing of the copper substrate is described in detail in the milling (CNC) processing of the copper substrate.
And (3) laminating the copper foil and the insulating layer: the copper foil and the insulating layer are laminated, and the stage is consistent with the traditional process, so that excessive description is not provided.
Circuit etching: it should be noted that when a film diagram or a silk screen diagram is manufactured, the heat dissipation pad is etched, and referring to the technical requirement points in the "manufacturing circuit diagram", the traditional circuit etching of the remaining process is consistent, and thus too much description is not provided.
Punching an insulating layer: the position of the radiating pad is taken as a coordinate, the size of the pad on the coordinate point is taken as a standard, holes are formed in the insulating layer, the manufacturing quantity is small, the manufacturing quantity can be manufactured by a laser cutting process, the manufacturing quantity is large, the manufacturing quantity is manufactured by a punch press process, and the purpose is to manufacture corresponding hole positions by taking the position and the size of the radiating pad as the standard. As shown in fig. 5:
and (3) copper substrate milling machine (CNC) processing, namely processing the copper substrate by a milling machine (CNC) processing technology, reserving the heat dissipation welding disc without processing, processing the part except the heat dissipation welding disc, and processing the height which is reserved by the heat dissipation welding disc to be the height value (A) reserved by the heat dissipation welding disc.
A = copper foil thickness + PP thickness
The copper foil means: copper foil for circuit layer
PP means: an insulating layer; as shown in fig. 6.
And pressing the circuit layer, the insulating layer and the copper substrate: the finished product is perforated with an insulating layer as shown in fig. 7.
And pressing the finished product with the punched insulating layer and the finished product processed by a milling machine (CNC) together, and finishing the process section by the pressed finished product, wherein the effect picture of the finished product is shown as figure 8.
Example two
The production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by a milling machine method comprises the following steps: manufacturing a circuit diagram, an insulating layer PP diagram, an aluminum substrate three-dimensional diagram and a film diagram according to the circuit requirement; pressing the copper foil and the insulating layer; etching a circuit; punching an insulating layer; milling (CNC) machining of the aluminum substrate; pressing the circuit layer, the insulating layer and the aluminum substrate; electroplating, sputtering or sputtering + electroplating; manufacturing a solder mask layer and a character layer; drilling and molding;
the method comprises the following specific steps:
the invention is different from the traditional circuit diagram manufacturing, when the circuit diagram is designed, a horizontal plane is used as a layer of circuit design, and only one layer of circuit design is made for a single-layer metal substrate.
The traditional design is as follows: all over-current wiring and heat-dissipating pads are left in the etching by the design file and the manufacturing process.
The design of the invention is as follows: in the design document and the manufacturing process, only the overcurrent circuit is etched to leave the copper foil.
According to the points, a circuit diagram and a film diagram are designed. In addition, the PP picture of the insulating layer is described in detail in the punching of the insulating layer; the three-dimensional view of the aluminum substrate is described in detail in aluminum substrate milling machine (CNC) machining.
And (3) laminating the copper foil and the insulating layer: the copper foil and the insulating layer are laminated, and the stage is consistent with the traditional process, so that excessive description is not provided.
Circuit etching: it should be noted that when a film diagram or a silk screen diagram is manufactured, the heat dissipation pad is etched, and referring to the technical requirement points in the "manufacturing circuit diagram", the traditional circuit etching of the remaining process is consistent, and thus too much description is not provided.
Punching an insulating layer: and taking the position of the heat dissipation pad as a coordinate, and taking the size of the pad on the coordinate point as a standard to open a hole on the insulating layer. The manufacturing quantity is small, the laser cutting process can be used for manufacturing, and the punching process is used for manufacturing the large-quantity product. The purpose is to make corresponding hole sites by taking the position and the size of the heat dissipation plate as standards.
And (3) aluminum base material milling machine (CNC) processing, namely processing the aluminum base plate by a milling machine (CNC) processing technology, reserving the heat dissipation welding disc without processing, processing the part except the heat dissipation welding disc, wherein the processed height is the reserved height value (A) of the heat dissipation welding disc.
A = copper foil thickness + PP thickness
The copper foil means: copper foil for circuit layer
PP means: insulating layer
Laminating the circuit layer, the insulating layer and the aluminum substrate:
and pressing the finished product with the punched insulating layer and the finished product processed by a milling machine (CNC) together. The finished product after pressing completes the process section.
Electroplating, sputtering or sputtering + electroplating: electroplating or sputtering and electroplating are carried out on the heat dissipation pad on the pressed circuit board,
a material having good soldering properties, such as a metal material of gold, silver, copper, etc., is plated or sputtered. Selecting a material with a melting point above 500 ℃; a tin-philic type of material is chosen. All the purposes are to facilitate the good soldering of the components and the circuit board by using the solder paste.
According to the requirements, the electroplating process, the sputtering process or the process of sputtering once and then electroplating once is adopted for selection. The ultimate goal is to have a strong adhesive bond of the weldable metal material with aluminum; the solder paste is beneficial to welding in the future; is beneficial to heat dissipation.
The data validation results are: the sputtering process is firstly adopted for carrying out the first sputtering, and then the electroplating is carried out for the first time, so that the effect is optimal.
In this embodiment, the limitation of the thermal conductivity of the insulating layer about 5W/(M × K) can be directly skipped, and the thermal conductivity of the entire circuit board is increased from about 5W/(M × K) to about 230W/(M × K), which results in about 40 times of improvement of the thermal conductivity.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. The production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by a milling machine method is characterized by comprising the following steps of:
s1, manufacturing a circuit diagram, an insulating layer PP diagram, a copper substrate three-dimensional diagram and a film diagram according to circuit requirements;
s2, pressing the copper foil and the insulating layer;
s3, etching a circuit;
s4, punching the insulating layer;
s5, machining the copper base material by using a milling machine;
s6, pressing the circuit layer, the insulating layer and the copper substrate;
s7, manufacturing a solder mask layer and a character layer;
and S8, drilling and molding.
2. The process of claim 1, wherein in step S1, a horizontal plane is used as a layer of circuit design, only one layer of circuit design is performed for a single-layer metal substrate, and a heat-dissipating pad is not designed in a film document of a circuit layer, i.e. a heat-dissipating layer is designed on a copper substrate.
3. The process of claim 1, wherein in step S2, the copper foil and the insulating layer are laminated by a laminating machine.
4. The process of claim 1, wherein in step S3, the pads for heat dissipation are etched away during the film or silk screen process.
5. The process of claim 1, wherein in step S4, the position of the heat dissipation pad is used as a coordinate, the size of the pad at the coordinate point is used as a standard, the insulating layer is perforated, the number of the holes can be reduced by laser cutting, the number of the holes can be increased by punching, and the position and size of the heat dissipation pad are used as a standard.
6. The process of claim 1, wherein in step S5, the copper substrate is machined by a milling machine to leave the heat-dissipating pad without machining, and the machined height is the height a of the heat-dissipating pad.
7. The production process for improving the thermoelectric separation and heat conduction efficiency of a metal circuit board by the milling machine method according to claim 1, wherein A = copper foil thickness + PP thickness; the copper foil means: a circuit layer copper foil; PP means: an insulating layer.
8. The process of claim 1, wherein in step S6, the finished product with holes on the insulating layer and the finished product processed by the milling machine are pressed together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210560814.5A CN114867210A (en) | 2022-05-23 | 2022-05-23 | Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by milling machine method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210560814.5A CN114867210A (en) | 2022-05-23 | 2022-05-23 | Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by milling machine method |
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| CN114867210A true CN114867210A (en) | 2022-08-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117915555A (en) * | 2024-02-06 | 2024-04-19 | 珠海精路电子有限公司 | Metal base laminated plate with three-dimensional structure and processing technology thereof |
-
2022
- 2022-05-23 CN CN202210560814.5A patent/CN114867210A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117915555A (en) * | 2024-02-06 | 2024-04-19 | 珠海精路电子有限公司 | Metal base laminated plate with three-dimensional structure and processing technology thereof |
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