CN114745858A - Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by stamping method - Google Patents
Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by stamping method Download PDFInfo
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- CN114745858A CN114745858A CN202210401849.4A CN202210401849A CN114745858A CN 114745858 A CN114745858 A CN 114745858A CN 202210401849 A CN202210401849 A CN 202210401849A CN 114745858 A CN114745858 A CN 114745858A
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- insulating layer
- stamping
- circuit
- heat
- layer
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 title claims abstract description 22
- 238000000926 separation method Methods 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 49
- 230000017525 heat dissipation Effects 0.000 claims abstract description 33
- 238000010586 diagram Methods 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 239000011889 copper foil Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000010030 laminating Methods 0.000 claims abstract description 14
- 238000004080 punching Methods 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 4
- 238000003698 laser cutting Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 56
- 238000003466 welding Methods 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013502 data validation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to the field of circuit board production, in particular to a production process for improving the thermoelectric separation heat conduction efficiency of a metal circuit board by a stamping method, aiming at the problem that the existing good heat conduction on a heating power element cannot be completed, the following scheme is proposed, which comprises the following steps: s1, manufacturing a circuit diagram, an insulating layer PP diagram, a copper substrate three-dimensional diagram and a film diagram according to circuit requirements; s2, laminating the copper foil and the insulating layer: laminating the copper foil and the insulating layer; s3, etching a circuit; s4, punching the insulating layer: by taking the position of the heat dissipation pad as a coordinate, the invention can directly skip the limitation of the heat conductivity coefficient of the insulating layer about 5W/(M K), and directly increase the heat conductivity coefficient of the copper to about 400W/(M K), and the heat conductivity coefficient of the whole circuit board is increased from about 5W/(M K) to about 400W/(M K), and the heat conductivity is increased by about 80 times.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a production process for improving the thermoelectric separation heat conduction efficiency of a metal circuit board by a stamping method.
Background
Electronic components of the type that generates heat need go out heat-conduction, and the life-span of components and parts just can promote, so have the requirement to the heat conduction of circuit board, and the heat conduction route is that the power original paper of the type that generates heat gives out the heat, and heat conduction is to the circuit layer, and the insulating layer is given in the circuit layer conduction, and the insulating layer conduction is given the heat dissipation layer, and the heat dissipation layer combines with the radiator, accomplishes one set of heat conduction route of dispelling the heat (cooling) at last.
The thermal conductivity of copper is about 400W/(M × K), and the thermal conductivity of the metal substrate insulating layer is only about 5W/(M × K). Therefore, the thermal conductivity of such copper-based circuit boards is only about 5W/(M × K). Good heat transfer to the heating power element cannot be accomplished.
Disclosure of Invention
The invention aims to solve the defect that good heat transfer of a heating power element cannot be completed in the prior art, and provides a production process for improving the thermoelectric separation heat transfer efficiency of a metal circuit board by a stamping method.
In order to achieve the purpose, the invention adopts the following technical scheme:
the production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by the stamping method comprises the following steps:
s1, manufacturing a circuit diagram, an insulating layer PP diagram, a copper substrate three-dimensional diagram and a film diagram according to circuit requirements;
s2, laminating the copper foil and the insulating layer: laminating the copper foil and the insulating layer;
s3, etching a circuit;
s4, punching an insulating layer: taking the position of the heat dissipation pad as a coordinate, taking the size of the pad on the coordinate point as a standard, and forming a hole on the insulating layer;
s5, stamping a copper substrate: stamping the copper substrate through a stamping process;
s6, laminating the circuit layer, the insulating layer and the copper substrate: pressing the finished product with the punched insulating layer and the punched finished product together;
s7, manufacturing a solder mask layer and a character layer;
and S8, drilling and forming.
Preferably, in S1, when designing the circuit layer, the heat dissipation pad is not designed in the film file of the circuit layer, and the heat dissipation pad is designed on the copper substrate, that is, on the heat dissipation layer.
Preferably, in S3, the heat-dissipating pad is etched away when the film pattern or the screen pattern is formed.
Preferably, in S4, the holes can be formed by a laser cutting process when the number of the holes is small, and the holes can be formed by a punching process when the number of the holes is large.
Preferably, in S5, the heat dissipation pad is protected by the design of the stamping die, and the stamping is performed at a position other than the heat dissipation pad, where the stamping height is the remaining height value of the heat dissipation pad: A.
preferably, a = copper foil thickness + PP thickness.
Preferably, the copper foil refers to: circuit layer copper foil, PP means: an insulating layer.
Compared with the prior art, the invention has the beneficial effects that:
the invention can directly skip the restriction of the heat conductivity coefficient of the insulating layer about 5W/(M K), directly increase the heat conductivity coefficient of copper to about 400W/(M K), and increase the heat conductivity coefficient of the whole circuit board from about 5W/(M K) to about 400W/(M K), thereby increasing the heat conductivity by about 80 times.
Drawings
FIG. 1 is a diagram of the heat conduction principle and the heat conduction capability of the production process for improving the thermoelectric separation heat conduction efficiency of a metal circuit board by a stamping method according to the present invention;
FIG. 2 is a circuit diagram of a production process for improving the heat transfer efficiency of the thermoelectric separation of the metal circuit board by a stamping method according to the present invention;
FIG. 3 is a circuit diagram of a conventional design;
FIG. 4 is a circuit diagram of the copper foils remained in etching in the process of the present invention for improving the efficiency of thermoelectric separation and heat conduction of a metal circuit board by stamping;
FIG. 5 is a diagram of a punched hole of an insulating layer of a process for improving the heat transfer efficiency of the thermoelectric separation of a metal circuit board by a punching method according to the present invention;
FIG. 6 is a schematic structural diagram of a copper-based plate produced by a process for improving the heat transfer efficiency of the thermoelectric separation of the metal circuit board by stamping according to the present invention;
FIG. 7 is a schematic structural diagram of a stamping die of the production process for improving the thermoelectric separation and heat conduction efficiency of a metal circuit board by a stamping method according to the present invention;
fig. 8 is a diagram of a punched finished product of an insulating layer of the production process for improving the thermoelectric separation and heat conduction efficiency of the metal circuit board by a stamping method.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example one
Referring to fig. 1-8, the production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by a stamping method comprises the following steps:
s1, manufacturing a circuit diagram, an insulating layer PP diagram, a copper substrate three-dimensional diagram and a film diagram according to circuit requirements, wherein when the circuit layer is designed, a heat dissipation welding disc is not designed in a film file of the circuit layer, and is designed on the copper substrate, namely the heat dissipation layer is designed;
s2, laminating the copper foil and the insulating layer: laminating the copper foil and the insulating layer;
s3, circuit etching: etching away the heat dissipation pad when making a film graph or a silk screen graph;
s4, punching an insulating layer: the position of the radiating pad is taken as a coordinate, the size of the pad on the coordinate point is taken as a standard, holes are formed in the insulating layer, the manufacturing quantity is small, holes can be formed by a laser cutting process, and the manufacturing quantity is large, and holes are formed by a punching process;
s5, stamping a copper substrate: the copper substrate is stamped through a stamping process, the heat dissipation welding disc is protected through the design of a stamping die, stamping is carried out on places except the heat dissipation welding disc, and the stamped height is the height value reserved by the heat dissipation welding disc: a, a = copper foil thickness + PP thickness, copper foil means: circuit layer copper foil, PP means: an insulating layer;
s6, laminating the circuit layer, the insulating layer and the copper substrate: pressing the finished product with the punched insulating layer and the punched finished product together;
s7, manufacturing a solder mask layer and a character layer;
and S8, drilling and forming.
Example two
The production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by a stamping method comprises the following steps:
s1, making a circuit diagram: the difference between the present invention and the traditional circuit diagram is illustrated by comparing the circuit board in the following figure. When an engineer makes a circuit diagram design, a horizontal plane is used as a layer of circuit design, and only one layer of circuit design is made for a single-layer metal substrate. When the circuit layer is designed, the heat dissipation welding disk is not designed in a film file of the circuit layer, and is designed on the aluminum substrate, namely the heat dissipation welding disk is designed on the heat dissipation layer;
s2, laminating the copper foil and the insulating layer: laminating the copper foil and the insulating layer;
s3, circuit etching: it should be noted that when making a film or screen pattern, the heat-dissipating pads are etched away;
s4, punching the insulating layer: and taking the position of the heat dissipation pad as a coordinate, and taking the size of the pad on the coordinate point as a standard to open a hole on the insulating layer. The manufacturing quantity is small, the laser cutting process can be used for manufacturing, and the punching process is used for manufacturing the large-quantity product. Aiming at making corresponding hole sites by taking the position and the size of the heat dissipation disc as standards;
s5, stamping the aluminum substrate through a stamping process, protecting the heat dissipation pad through the design of a stamping die, stamping the aluminum substrate except the heat dissipation pad, wherein the stamped height is the reserved height value (A) of the heat dissipation pad, A = the thickness of copper foil + PP thickness, and the copper foil refers to: circuit layer copper foil, PP means: an insulating layer;
s6, laminating the circuit layer, the insulating layer and the aluminum substrate: pressing the finished product with the punched insulating layer and the punched finished product together;
s7, electroplating, sputtering or sputtering + electroplating: electroplating or sputtering and electroplating are carried out on the heat dissipation welding disc on the pressed circuit board; a material having good soldering property, for example, a metal material such as gold, silver, copper, or the like is plated or sputtered. Selecting a material with a melting point above 500 ℃; a tin-philic type of material is chosen. All the purposes are favorable for carrying out good welding on components and a circuit board by using tin paste, and the process selection of adopting an electroplating process, adopting a sputtering process or firstly sputtering and then electroplating is carried out according to requirements. The ultimate goal is to have a strong adhesive bond of the weldable metal material with aluminum; the solder paste is beneficial to welding in the future; is beneficial to heat dissipation. The data validation results are: firstly, sputtering for the first time by adopting a sputtering process, and then electroplating for the first time to obtain the best effect;
s8, manufacturing a solder mask layer and a character layer;
and S9, drilling and forming.
Copper and aluminum are metals having relatively high ductility, and the thickness of the copper plate other than the heat dissipation pad is reduced and the area of the copper plate after pressing is increased in the pressing process. Since the metal plate is extruded while the shape or area is changed, the metal density is not changed, and the area of extension can be calculated by calculation, so that the estimated size can be obtained by estimating the size of the copper plate to be used after extrusion. Therefore, two stamping dies are required, one for stamping the size of the heat dissipation pad and one for shaping the shape of the heat dissipation pad.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. The production process for improving the thermoelectric separation heat conduction efficiency of the metal circuit board by the stamping method is characterized by comprising the following steps of:
s1, manufacturing a circuit diagram, an insulating layer PP diagram, a copper substrate three-dimensional diagram and a film diagram according to circuit requirements;
s2, laminating the copper foil and the insulating layer: laminating the copper foil and the insulating layer;
s3, etching a circuit;
s4, punching the insulating layer: taking the position of the heat dissipation pad as a coordinate, taking the size of the pad on the coordinate point as a standard, and forming a hole on the insulating layer;
s5, stamping a copper substrate: stamping the copper substrate through a stamping process;
s6, laminating the circuit layer, the insulating layer and the copper substrate: pressing the finished product with the punched insulating layer and the punched finished product together;
s7, manufacturing a solder mask layer and a character layer;
and S8, drilling and forming.
2. The process of claim 1, wherein in step S1, it is required to design the heat dissipation pad on the copper substrate, that is, on the heat dissipation layer, instead of designing the heat dissipation pad in the film document of the circuit layer during the designing of the circuit layer.
3. The process of claim 1, wherein in step S3, the heat-dissipating pads are etched away during the film or silk screen process.
4. The process of claim 1, wherein in step S4, the holes can be formed by laser cutting process when the number of holes is small, and the holes can be formed by punching process when the number of holes is large.
5. The process of claim 1, wherein in step S5, the heat-dissipating pad is protected by the design of the stamping die, and the stamping is performed at a position except for the heat-dissipating pad, and the stamping height is the remaining height of the heat-dissipating pad: A.
6. the production process for improving the thermoelectric separation and heat conduction efficiency of the metal circuit board by the stamping method as claimed in claim 5, wherein A = thickness of copper foil + PP.
7. The process of claim 6, wherein the copper foil is selected from the group consisting of: circuit layer copper foil, PP means: an insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210401849.4A CN114745858A (en) | 2022-04-18 | 2022-04-18 | Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by stamping method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210401849.4A CN114745858A (en) | 2022-04-18 | 2022-04-18 | Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by stamping method |
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| Publication Number | Publication Date |
|---|---|
| CN114745858A true CN114745858A (en) | 2022-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210401849.4A Pending CN114745858A (en) | 2022-04-18 | 2022-04-18 | Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board by stamping method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115497892A (en) * | 2022-10-10 | 2022-12-20 | 上海捷氢科技股份有限公司 | Heat radiation structure of power module for fuel cell DC converter and heat radiation method thereof |
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| KR20080053048A (en) * | 2006-12-08 | 2008-06-12 | 엘지마이크론 주식회사 | Radiant heat circuit substrate and method for manufacturing thereof |
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| CN102404933A (en) * | 2011-11-12 | 2012-04-04 | 葛豫卿 | Printed circuit board applying metal substrate to penetrate heat path and method for making printed circuit board |
| CN107278030A (en) * | 2017-06-26 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | The preparation method that a kind of thermoelectricity separates LED board |
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| CN114269068A (en) * | 2021-11-29 | 2022-04-01 | 珠海和进兆丰电子科技有限公司 | Method for manufacturing thermoelectric separation copper substrate |
-
2022
- 2022-04-18 CN CN202210401849.4A patent/CN114745858A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080053048A (en) * | 2006-12-08 | 2008-06-12 | 엘지마이크론 주식회사 | Radiant heat circuit substrate and method for manufacturing thereof |
| CN101888740A (en) * | 2010-06-02 | 2010-11-17 | 苏州科医世凯半导体技术有限责任公司 | Convex metal printed circuit board and manufacturing method thereof |
| CN102404933A (en) * | 2011-11-12 | 2012-04-04 | 葛豫卿 | Printed circuit board applying metal substrate to penetrate heat path and method for making printed circuit board |
| CN107278030A (en) * | 2017-06-26 | 2017-10-20 | 胜宏科技（惠州）股份有限公司 | The preparation method that a kind of thermoelectricity separates LED board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115497892A (en) * | 2022-10-10 | 2022-12-20 | 上海捷氢科技股份有限公司 | Heat radiation structure of power module for fuel cell DC converter and heat radiation method thereof |
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