CN209234096U - A kind of copper-based wiring board of new-energy automobile - Google Patents
A kind of copper-based wiring board of new-energy automobile Download PDFInfo
- Publication number
- CN209234096U CN209234096U CN201821348853.4U CN201821348853U CN209234096U CN 209234096 U CN209234096 U CN 209234096U CN 201821348853 U CN201821348853 U CN 201821348853U CN 209234096 U CN209234096 U CN 209234096U
- Authority
- CN
- China
- Prior art keywords
- hole
- copper
- wiring board
- copper base
- interconnecting piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 239000010949 copper Substances 0.000 title claims abstract description 81
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 81
- 238000009413 insulation Methods 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 65
- 238000001465 metallisation Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 7
- 239000000047 product Substances 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- -1 prepreg Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a kind of copper-based wiring boards of new-energy automobile, the wiring board includes the first line layer for being from bottom to top sequentially overlapped setting, the first dielectric layer, core plate, the second dielectric layer and the second line layer, core plate includes copper base and insulation side, copper base side is equipped with interconnecting piece, interconnecting piece is vertical with copper base, copper base is equipped at least one through-hole A, and copper base is equipped at least one through-hole B；Wiring board is equipped with the through hole A for facing through-hole A and running through wiring board, wiring board is equipped with the through hole B for facing through-hole B and running through wiring board, through hole B is equipped with the annular interconnecting piece being connected with the first dielectric layer and the second dielectric layer, annular interconnecting piece is nested in through-hole B, certifiable high heat quickly disperses, and the logical high current of copper base will not burn plate, can save installation space, reduce planar design size.
Description
[technical field]
The utility model relates to wiring board art, especially a kind of copper-based wiring board of new-energy automobile.
[background technique]
With the large-scale popularization of new-energy automobile, metal base circuit board (especially copper base wiring board) is good due to having
Heat dissipation performance and be widely used；Traditional copper-based wiring board includes base copper, insulating medium layer and line layer, and base copper is main
For radiating, the heat of line layer is conducted by insulating medium layer to base copper.
Existing copper-based wiring board, there is following problem in fact in use process:
1. being limited by insulating medium layer, product used when use is on high-power new-energy automobile product
The high heat generated in journey is difficult to quickly disperse, and will directly affect the service life of line layer；
2. new-energy automobile product needs logical high current in use, conventional line layer is unbearable, is easy to appear
Burn plate phenomenon；
3. due to the needs of installation, the installation of plane formula needs bigger space, and increases the design of wiring board inner plane
Size, when installation space by limited time, be unable to reach demand.
The utility model is in view of the deficiencies of the prior art and a kind of thermal diffusivity of design is strong, can lead to high current, and easily
In the copper-based wiring board of installation.
[utility model content]
In order to solve the above technical problems, a kind of copper-based wiring board of new-energy automobile of the utility model, the wiring board include
From bottom to top it is sequentially overlapped first line layer, the first dielectric layer, core plate, the second dielectric layer and the second line layer of setting, institute
The core plate stated includes copper base and the insulation side equal with copper-based plate thickness, the lubrication groove of the outer profile of the copper base and side of insulating
Exterior feature coincide, and the copper base side is equipped with across the insulation outwardly directed interconnecting piece in side, and the interconnecting piece and copper base hang down
Directly, the copper base is equipped at least one through-hole A, and the copper base is equipped at least one through-hole B；The route
Plate is equipped with the through hole A for facing through-hole A and running through wiring board, and the diameter of the through-hole A is equal with the diameter of through hole A
And through-hole A and through hole A are concentric, the through hole A equipped with what is formed after hole metallization is used to that first line to be connected
The hole conductive layer A of layer, copper base and the second line layer, the wiring board, which is equipped with, faces through-hole B and through wiring board
Through hole B, the through-hole B and through hole B are concentric, and the diameter of the through-hole B is greater than the diameter of through hole B, described
Through hole B be equipped with the annular interconnecting piece being connected with the first dielectric layer and the second dielectric layer, the annular connection
Portion is nested in through-hole B, be additionally provided on the through hole B formed after hole metallization for first line layer and the to be connected
The outer surface of the hole conductive layer B of two line layers, the first line layer are equipped with solder mask A, the outer surface of second line layer
Equipped with solder mask B.
The diameter of a kind of copper-based wiring board of new-energy automobile as described above, the through-hole B is a, and the diameter of through hole B is
B, wherein a, b meet: 2mm≤a-b≤4mm.
A kind of copper-based wiring board of new-energy automobile as described above, first dielectric layer are after prepreg solidifies
It is formed, second dielectric layer is also to be formed after prepreg solidifies, and the annular interconnecting piece is by prepreg
It is filled in after thawing after solidifying in through-hole B using drilling formation.
A kind of copper-based wiring board of new-energy automobile as described above, the insulation side use and etch away covering for surface layers of copper
Copper sheet is made.
The width of a kind of copper-based wiring board of new-energy automobile as described above, the insulation side is d, 2mm≤d≤4mm.
Compared with prior art, the utility model has the advantages that
1, the copper-based wiring board of the utility model will need rapid cooling and the line layer of logical high current directly and copper base
It is connected, it is ensured that high heat quickly disperses, and the logical high current of copper base will not burn plate；Meanwhile the copper base side is equipped with
Across the insulation outwardly directed interconnecting piece in side, the interconnecting piece is vertical with copper base, and the interconnecting piece of stretching is used for and others
Electric elements connection, can save installation space, reduce planar design size.
[Detailed description of the invention]
Specific embodiment of the present utility model is described in further detail with reference to the accompanying drawing, in which:
Fig. 1 is the structural schematic diagram of wiring board in the utility model (route on copper foil is not drawn)；
Fig. 2 is the exploded view of wiring board in the utility model (route on copper foil is not drawn)；
Fig. 3 is the top view of wiring board in the utility model (route on copper foil is not drawn)；
Fig. 4 is the cross-sectional view in Fig. 3 along the direction A-A；
Fig. 5 is the enlarged drawing of the part B marked in Fig. 4；
Fig. 6 is the enlarged drawing of the C portion marked in Fig. 4；
Fig. 7 is the outline flowchart for the method that the utility model produces copper-based wiring board.
[specific embodiment]
It elaborates with reference to the accompanying drawing to the embodiments of the present invention.
As shown in Figures 1 to 6, the copper-based wiring board of a kind of new-energy automobile of the present embodiment, the wiring board 1 include by lower and
On be sequentially overlapped first line layer 11, the first dielectric layer 12, core plate 13, the second dielectric layer 14 and the second line layer of setting
15, the core plate 13 includes copper base 131 and the insulation side 132 equal with 131 thickness of copper base, the copper base 131
Outer profile and the Internal periphery on insulation side 132 coincide, and 131 side of copper base is equipped with outwardly directed across insulation side 132
Interconnecting piece 1311, the interconnecting piece 1311 is vertical with copper base 131, and the copper base 131 is equipped at least one through-hole
A1312, the copper base 131 are equipped at least one through-hole B1313；The wiring board 1 is equipped with and faces through-hole
A1312 and run through wiring board 1 through hole A101, the diameter of the through-hole A1312 it is equal with the diameter of through hole A101 and
Through-hole A1312 and through hole A101 are concentric, and the through hole A101 is used to be connected equipped with what is formed after hole metallization
The hole conductive layer A of first line layer 11, copper base 131 and the second line layer 15, the wiring board 1 are logical equipped with facing
Hole B1313 and the through-hole concentric, described through the through hole B102, the through-hole B1313 and through hole B102 of wiring board 1
The diameter of B1313 be greater than through hole B102 diameter, the through hole B102 be equipped with with the first dielectric layer 12 and second
The annular interconnecting piece 133 that dielectric layer 14 is connected, the annular interconnecting piece 133 are nested in through-hole B1313, and described passes through
It is conductive that the hole for first line layer 11 and the second line layer 15 to be connected formed after hole metallization is additionally provided on perforation B102
Layer B, the outer surface of the first line layer 11 are equipped with solder mask A, and the outer surface of second line layer 15 is equipped with solder mask B.
The copper-based wiring board of the utility model will need rapid cooling and the line layer of logical high current to be directly connected with copper base, it is ensured that
High heat quickly disperses, and the logical high current of copper base will not burn plate；Meanwhile the copper base side be equipped with across insulation side to
The interconnecting piece of outer stretching, the interconnecting piece is vertical with copper base, and the interconnecting piece of stretching is used to connect with other electric elements,
Installation space can be saved, planar design size is reduced.
In order to make annular interconnecting piece 133 that more reliably the first dielectric layer 12 and the second dielectric layer 14 be connected, together
When annular interconnecting piece 133 device to hole conductive layer B play good insulating effects, the diameter of through-hole B1313 is a, and through hole B102's is straight
Diameter is b, and wherein a, b meet: 2mm≤a-b≤4mm.
First dielectric layer 12 is to be formed after prepreg solidifies, and second dielectric layer 14 is also solid for prepreg
It is formed after changing, annular interconnecting piece 133 is filled in through-hole B1313 after solidification using drilling after being melted by prepreg
It is formed.
Insulation side 132 is made of the copper-clad plate for etching away surface layers of copper, and the width on insulation side 132 is d, and 2mm≤d≤
4mm。
As shown in Figures 1 to 7, the present embodiment additionally provides a kind of production method of copper-based wiring board of new-energy automobile, packet
Include following steps:
A) copper base 131 is made, fine copper plate is chosen as former material, goes out through-hole on fine copper plate first, in accordance with design requirement
A1312 and through-hole B1313, the outer profile of copper base 131 is milled out then according to design requirement, copper base 131 is obtained, then to copper
Substrate 131 carries out brownification processing, is finally wrapped interconnecting piece 1311 using high temperature resistant, corrosion resistant adhesive tape；
B) substrate is made, selection thickness is equal with copper base 131 and etches away the copper-clad plate of surface layers of copper as former material, presses
Mill out the through slot coincideing with 131 outer profile of copper base on substrate using CNC machine according to design requirement；
Because one whole copper-clad plate for etching away surface layers of copper is bigger, multiple and copper base usually is milled on a plate
131 one-to-one through slots, convenient for production substrate during benchmark confirmation；
C) core plate 13 is made, the copper base 131 made in step a is embedded in the through slot of substrate, and ensure copper base
131 outer profile and through slot coincide, and obtains core plate 13；
D) laminates press copper foil, prepreg, core plate, prepreg, copper foil according to sequence from bottom to top
It closes, obtains route boards half-finished product a；
E) drilling, hole metallization drill out through hole A101 and through hole B102, so according to design requirement on semi-finished product a
Hole metallization is carried out to through hole A101 and through hole B102 afterwards, obtains route boards half-finished product b；
F) outer layer makes, and carries out outer-layer circuit production to route boards half-finished product b first, then carries out at welding resistance and surface
Reason, obtains route boards half-finished product c, and the copper foil positioned at lower surface obtains first line layer 11, and the copper foil positioned at upper surface obtains the
Two line layers 15；
G) subsequent production successively carries out molding making, V-CUT production to route boards half-finished product c first, in accordance with design requirement,
Then the adhesive tape on 1311 surface of interconnecting piece of copper base 131 is removed, exposing need to stretch out interconnecting piece 1311, finally by interconnecting piece
1311 be bent into it is vertical with wiring board.
Prepreg is using no screen cloth prepreg in step d, and prepreg gel content >=95%, to ensure to press
During melt after prepreg fill the through-hole A1312 and through-hole B1313 of full copper base 131.
The first dielectric layer and the second dielectric layer of the wiring board processed using the above method pass through annular interconnecting piece 133
It is reliably connected, can ensure that the stability of route board finished product, reduce what wiring board was deformed by high current fever
Probability.
Claims (5)
1. a kind of copper-based wiring board of new-energy automobile, which is characterized in that the wiring board (1) includes from bottom to top being sequentially overlapped setting
First line layer (11), the first dielectric layer (12), core plate (13), the second dielectric layer (14) and the second line layer (15), institute
The core plate (13) stated includes copper base (131) and the insulation side (132) equal with copper base (131) thickness, the copper base
(131) Internal periphery of outer profile and insulation side (132) coincide, and copper base (131) side is equipped with across insulation side
(132) outwardly directed interconnecting piece (1311), the interconnecting piece (1311) copper base vertical with copper base (131), described
(131) it is equipped at least one through-hole A (1312), the copper base (131) is equipped at least one through-hole B (1313)；Institute
The wiring board (1) stated is equipped with the through hole A (101), the through-hole A for facing through-hole A (1312) and running through wiring board (1)
(1312) diameter is equal with the diameter of through hole A (101) and through-hole A (1312) and through hole A (101) is concentric, described
Through hole A (101) be equipped with formed after hole metallization for first line layer (11), copper base (131) and the to be connected
The hole conductive layer A of two line layers (15), the wiring board (1), which is equipped with, faces through-hole B (1313) and through wiring board (1)
Through hole B (102), through-hole B (1313) and the through hole B (102) is concentric, the diameter of the through-hole B (1313)
Greater than the diameter of (102) through hole B, the through hole B (102) is equipped with for by the first dielectric layer (12) and the second dielectric
The annular interconnecting piece (133) that layer (14) is connected, the annular interconnecting piece (133) is nested in through-hole B (1313), described
Through hole B (102) on be additionally provided with formed after hole metallization for first line layer (11) and the second line layer to be connected
(15) hole conductive layer B, the outer surface of the first line layer (11) are equipped with solder mask A, second line layer (15) it is outer
Surface is equipped with solder mask B.
2. the copper-based wiring board of a kind of new-energy automobile according to claim 1, it is characterised in that the through-hole B (1313)
Diameter is a, and the diameter of through hole B (102) is b, and wherein a, b meet: 2mm≤a-b≤4mm.
3. the copper-based wiring board of a kind of new-energy automobile according to claim 1, it is characterised in that first dielectric layer
(12) it is formed after solidifying for prepreg, what second dielectric layer (14) was formed after also solidifying for prepreg,
The annular interconnecting piece (133) is filled in through-hole B (1313) after solidification using drilling shape after being melted by prepreg
At.
4. the copper-based wiring board of a kind of new-energy automobile according to claim 1, it is characterised in that the insulation side (132)
It is made of the copper-clad plate for etching away surface layers of copper.
5. the copper-based wiring board of a kind of new-energy automobile according to claim 1, it is characterised in that the insulation side (132)
Width be d, 2mm≤d≤4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821348853.4U CN209234096U (en) | 2018-08-21 | 2018-08-21 | A kind of copper-based wiring board of new-energy automobile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821348853.4U CN209234096U (en) | 2018-08-21 | 2018-08-21 | A kind of copper-based wiring board of new-energy automobile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209234096U true CN209234096U (en) | 2019-08-09 |
Family
ID=67497914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821348853.4U Withdrawn - After Issue CN209234096U (en) | 2018-08-21 | 2018-08-21 | A kind of copper-based wiring board of new-energy automobile |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209234096U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770191A (en) * | 2018-08-21 | 2018-11-06 | 信丰福昌发电子有限公司 | A kind of copper-based wiring board of new-energy automobile and preparation method thereof |
-
2018
- 2018-08-21 CN CN201821348853.4U patent/CN209234096U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770191A (en) * | 2018-08-21 | 2018-11-06 | 信丰福昌发电子有限公司 | A kind of copper-based wiring board of new-energy automobile and preparation method thereof |
| CN108770191B (en) * | 2018-08-21 | 2024-02-23 | 信丰福昌发电子有限公司 | New energy automobile copper base line circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20190809 Effective date of abandoning: 20240223 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20190809 Effective date of abandoning: 20240223 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |