CN205670881U - A kind of novel carbon film wiring board - Google Patents
A kind of novel carbon film wiring board Download PDFInfo
- Publication number
- CN205670881U CN205670881U CN201620586857.0U CN201620586857U CN205670881U CN 205670881 U CN205670881 U CN 205670881U CN 201620586857 U CN201620586857 U CN 201620586857U CN 205670881 U CN205670881 U CN 205670881U
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- layer
- substrate
- louvre
- wiring board
- copper foil
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Abstract
The utility model discloses a kind of novel carbon film wiring board, including substrate, substrate is provided with electronic component, the front and back of substrate is equipped with copper foil layer, the Facad structure of substrate and structure setting symmetrical above and below, some through holes it are machined with on substrate, a circle double-layer carbon serous coat is processed on each through hole inwall, double-layer carbon serous coat includes inner membrance and external mold, copper foil layer side is also machined with the welding resisting layer sealing against connection, the periphery of double-layer carbon serous coat is all coated with layer protective layer, welding resisting layer that one end that is connected with copper foil layer is set to step structure, protective layer coincide with the step structure of welding resisting layer and is connected, substrate is provided with conducting louvre；This carbon film wiring board low cost, electric conductivity strengthens, and three-waste free pollution, saves the resource such as water power, and the weight of printed board is frivolous, with short production cycle, and production technology is simple, good heat dissipation effect.
Description
Technical field
This utility model relates to a kind of novel carbon film wiring board.
Background technology
Light, thin, short, littleization is progressively required so that printed board is towards high accuracy, graph thinning, high density along with electronic product
SMT kludge meet the direction of environmental requirement and develop, printed board can be divided into reverse side, two-sided and multilamellar etc., the most two-sided and many
Layer has a common ground, it is simply that both need conductor to connect its aspect, for carrying out the common process of interconnection of conductors between aspect, just
Being each specified point elder generation punching in printed board or boring, then formation conductor layer around hole wall, this conductor layer will be
Manufacture electrical contact between each layer and form loop.
The method forming interconnection in prior art is a lot, and such as lead-in wire welding, rivet, Direct Electroplating etc. is by conductive species
It is plated in hole wall first-class, but the maximum shortcoming of these methods is exactly that manufacturing cost is expensive and the production cycle is long, and can produce more
" three wastes " pollute, and process the environmental issue of three-waste pollution, and the weight of printed board can be increased so that printed board is inadequate
Frivolous, and the electric conductivity of conductive path is poor.
Additionally, conventionally, as the conductive path between bilayer or multiple structure can be in the mistake of inner conductive
Journey produces heat, and inside existing two-sided or multiple structure, there is no rational heat abstractor to be capable of preferably to dispel the heat effect
Really, the service life causing electronic component is shorter.
Utility model content
For the problem of above-mentioned existence, this utility model aims to provide a kind of novel carbon film wiring board, this carbon film wiring board
It is without copper-plated double-clad board, and this carbon film wiring board low cost, electric conductivity strengthens, three-waste free pollution, saving water power
Etc. resource, the weight of printed board is frivolous, with short production cycle, and production technology is simple, and the most close by conducting louvre
Heat produced by conductive path position, it is possible to accomplish internal preferably radiating effect.
To achieve these goals, the technical scheme that this utility model is used is as follows:
A kind of novel carbon film wiring board, including substrate, described substrate is provided with electronic component, the front of described substrate and the back of the body
Face is equipped with copper foil layer, and the Facad structure of described substrate and structure setting symmetrical above and below, processes on the substrate
Having some through holes, process a circle double-layer carbon serous coat on each described through hole inwall, described double-layer carbon serous coat includes inner membrance
And external mold, and forming conductive through hole, it is described that the two ends of described inner membrance all extend to described substrate front side and back position is arranged
On copper foil layer, also it is machined with the welding resisting layer sealing against connection at described copper foil layer side, at described double-layer carbon serous coat upper and lower two
The periphery of end is all coated with layer protective layer, and described welding resisting layer that one end that is connected with described copper foil layer is set to step structure, institute
Stating the step structure of protective layer and described welding resisting layer to coincide and be connected, described substrate is provided with conducting louvre.
Further, described conducting louvre by vertically turning on louvre and horizontal drain louvre forms, described vertically
Louvre is through with described horizontal drain louvre is connected in conducting.
Further, the described vertical conducting through described substrate of louvre, substrate front side structure and substrate back knot
Structure.
Further, the upper and lower opening of described vertical conducting louvre is disposed as bowl structure.
Further, the thickness of described double-layer carbon serous coat is 0.3-0.4mm.
Further, the thickness of described copper foil layer is 9-18 μm, and the thickness of described substrate is 30-100 μm.
The beneficial effects of the utility model are: compared with prior art, this utility model by existing rivet or
Being conductively connected of realizing of mode of person's plating is improved to carbon and starches through being conductively connected, this carbon slurry wiring board with low cost, leads
Electricity is effective, persistently, stablizes, and changes existing radiating mode, arranges conducting louvre, conducting heat radiation in the inside of substrate
Hole, by vertically turning on louvre and horizontal drain louvre forms, is formed by vertical conducting louvre and horizontal drain louvre
Bending structure, because the setting of horizontal drain louvre makes the end of louvre be more nearly conductive path, it is possible to will more preferably
Heat transmission in horizontal drain louvre, and then outwards dispelled the heat by vertical conducting louvre, conducting louvre upper and lower
End opening is all not configured to bowl structure, and so heat radiation bore increases, and the effect of heat radiation strengthens, and this louvre is provided in
The vicinity of conductive through hole, improves the radiating effect within substrate；It addition, the conduction of wiring board can be improved by double-layer carbon serous coat
Performance.
Accompanying drawing explanation
Fig. 1 is the piece cutting structure schematic diagram of this utility model carbon film wiring board.
Wherein: 1-substrate, 2-copper foil layer, 3-double-layer carbon serous coat, 31-inner membrance, 32-external mold, 4-welding resisting layer, 5-protective layer,
6-louvre, 61-vertically turns on louvre, 62-horizontal drain louvre.
Detailed description of the invention
In order to make those of ordinary skill in the art be better understood on the technical solution of the utility model, below in conjunction with attached
The technical solution of the utility model is further described by figure and embodiment.
One novel carbon film wiring board shown in 1 referring to the drawings, including substrate 1, the phenolic aldehyde of the material selection FR-1 of substrate 1
Paper substrate, light weight, described substrate 1 is provided with electronic component, and the front and back of described substrate 1 is equipped with copper foil layer 2, and described
The Facad structure of substrate 1 and structure setting symmetrical above and below, the thickness of described copper foil layer 2 is 9-18 μm, the thickness of described substrate 1
Degree is 30-100 μm, is machined with some through holes on described substrate 1, processes a circle bilayer on each described through hole inwall
Carbon serous coat 3, described double-layer carbon serous coat 3 includes inner membrance 31 and external mold 32, and inner membrance 31 is combined closely with substrate 1, external mold 32 and inner membrance
31 combine closely, and the thickness of external mold 32 is the 1/3-1/2 of inner membrance 31 thickness, and form conductive through hole, described double-layer carbon serous coat 3
Thickness is 0.3-0.4mm, and described inner membrance 31 two ends all extend to the described copper foil layer that described substrate 1 front and back position is arranged
On 2, also it is machined with the welding resisting layer 4 sealing against connection at described copper foil layer 2 side, at described double-layer carbon serous coat about 3 two ends
Periphery be all coated with layer protective layer 5, described welding resisting layer 4 that one end that is connected with described copper foil layer is set to step structure, institute
State the step structure of protective layer 5 and described welding resisting layer 4 coincide connect through this stair-stepping shape so that welding resisting layer 4 and
Protective layer 5 preferably combines, and stair-stepping structure is owing to existing bending path, it is possible to achieve preferably seal effect
Really, the good end to double-layer carbon serous coat 3 of humidity resistance is protected preferably, double-layer carbon serous coat 3 of the present utility model to pass through slurry position equal
It is to extend between protective layer and copper foil layer 2, carries out sealing guarantor to its end by protective layer 5, copper foil layer 2 and welding resisting layer 4
Protecting, what the mode of existing rivet or plating was realized by this utility model is conductively connected the conduction being improved to carbon slurry perforation
Connecting, this carbon starches the with low cost of perforation, and conductive effect is good, persistently, stablizes.
In this utility model, described substrate 1 being additionally provided with louvre 6, louvre 6 is by vertically turning on louvre 61 and horizontal stroke
Forming to drain louvre 62, described vertical conducting louvre 61 is through with described horizontal drain louvre 62 to be connected, and laterally draws
Wandering hot hole 62 arranges three, and three horizontal drain louvres about 62 be arranged in parallel, lay respectively at the position, upper, middle and lower of substrate 1
Putting, and every is all connected with vertical conducting louvre 61 bending, the upper and lower opening of described vertical conducting louvre 61 is respectively provided with
For bowl structure, because structure of the present utility model is double-decker, therefore heat produced by the conductive path between bilayer is always
It is a blind area of heat radiation, therefore the louvre 6 that the present invention is through by arranging one, by the heat of conductive path adnexa by horizontal stroke
Transmit to vertical conducting louvre 61 to drain louvre 62, improve radiating effect, extend the service life of part in printed board,
And thermovent is all provided with being set to bowl structure, area of dissipation can be increased, heat is quickly distributed.
Claims (6)
1. a novel carbon film wiring board, including substrate, described substrate is provided with electronic component, it is characterised in that: described substrate
Front and back be equipped with copper foil layer, and the Facad structure of described substrate and structure setting symmetrical above and below, described
Being machined with some through holes on substrate, process a circle double-layer carbon serous coat on each described through hole inwall, described double-layer carbon is starched
Film includes inner membrance and external mold, and forms conductive through hole, and the two ends of described inner membrance all extend to described substrate front side and back position
On the described copper foil layer arranged, also it is machined with the welding resisting layer sealing against connection at described copper foil layer side, in described double-layer carbon
The periphery at the upper and lower two ends of serous coat is all coated with layer protective layer, and described welding resisting layer that one end that is connected with described copper foil layer is set to ladder
Shape structure, described protective layer coincide with the step structure of described welding resisting layer and is connected, and described substrate is provided with conducting louvre.
One the most according to claim 1 novel carbon film wiring board, it is characterised in that: described conducting louvre is by vertically leading
Logical louvre and horizontal drain louvre composition, described vertical conducting louvre is through with described horizontal drain louvre to be connected.
One the most according to claim 2 novel carbon film wiring board, it is characterised in that: described vertically vertically turn on louvre
Through described substrate, substrate front side structure and substrate back structure.
One the most according to claim 3 novel carbon film wiring board, it is characterised in that: described vertical conducting louvre upper
Under shed is disposed as bowl structure.
5. according to the one novel carbon film wiring board described in any one of claim 1-4, it is characterised in that: described double-layer carbon serous coat
Thickness be 0.3-0.4mm.
One the most according to claim 5 novel carbon film wiring board, it is characterised in that: the thickness of described copper foil layer is 9-18
μm, the thickness of described substrate is 30-100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620586857.0U CN205670881U (en) | 2016-06-15 | 2016-06-15 | A kind of novel carbon film wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620586857.0U CN205670881U (en) | 2016-06-15 | 2016-06-15 | A kind of novel carbon film wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205670881U true CN205670881U (en) | 2016-11-02 |
Family
ID=57192047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620586857.0U Active CN205670881U (en) | 2016-06-15 | 2016-06-15 | A kind of novel carbon film wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205670881U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113038695A (en) * | 2021-03-02 | 2021-06-25 | 广德新三联电子有限公司 | Carbon paste through hole circuit board and preparation method thereof |
| CN113115522A (en) * | 2021-03-29 | 2021-07-13 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and hole plugging method thereof |
-
2016
- 2016-06-15 CN CN201620586857.0U patent/CN205670881U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113038695A (en) * | 2021-03-02 | 2021-06-25 | 广德新三联电子有限公司 | Carbon paste through hole circuit board and preparation method thereof |
| CN113115522A (en) * | 2021-03-29 | 2021-07-13 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and hole plugging method thereof |
| CN113115522B (en) * | 2021-03-29 | 2022-03-15 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and hole plugging method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |