CN205793644U - A kind of novel elargol perforation plate - Google Patents
A kind of novel elargol perforation plate Download PDFInfo
- Publication number
- CN205793644U CN205793644U CN201620586345.4U CN201620586345U CN205793644U CN 205793644 U CN205793644 U CN 205793644U CN 201620586345 U CN201620586345 U CN 201620586345U CN 205793644 U CN205793644 U CN 205793644U
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- CN
- China
- Prior art keywords
- elargol
- substrate
- layer
- copper foil
- perforation plate
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Abstract
The utility model discloses a kind of novel elargol perforation plate, including substrate, substrate is provided with electronic component, the front and back of substrate is equipped with copper foil layer, and the Facad structure of substrate and structure setting symmetrical above and below, substrate is machined with some through holes, each through hole inwall is processed a circle elargol film, and form conductive through hole, the two ends of elargol film all extend on the copper foil layer of substrate front side and back position setting, the welding resisting layer sealing against connection also it is machined with at copper foil layer side, peripheral cladding layer protective layer at elargol film, welding resisting layer that one end that is connected with Copper Foil is set to step structure, protective layer coincide with the step structure of welding resisting layer and is connected；This utility model elargol perforation plate is without copper-plated double-clad board, and this elargol perforation plate low cost, three-waste free pollution, saves the resource such as water power, and the weight of printed board is frivolous, with short production cycle, and production technology is simple, and can accomplish the effect of internal heat dissipating.
Description
Technical field
This utility model relates to a kind of novel elargol perforation plate.
Background technology
Light, thin, short, littleization is progressively required so that printed board is towards high accuracy, graph thinning, high density along with electronic product
SMT kludge meet the direction of environmental requirement and develop, printed board can be divided into reverse side, two-sided and multilamellar etc., the most two-sided and many
Layer has a common ground, it is simply that both need conductor to connect its aspect, for carrying out the common process of interconnection of conductors between aspect, just
Being each specified point elder generation punching in printed board or boring, then formation conductor layer around hole wall, this conductor layer will be
Manufacture electrical contact between each layer and form loop.
The method forming interconnection in prior art is a lot, and such as lead-in wire welding, rivet, Direct Electroplating etc. is by conductive species
It is plated in hole wall first-class, but the maximum shortcoming of these methods is exactly that manufacturing cost is expensive and the production cycle is long, and can produce more
" three wastes " pollute, and process the environmental issue of three-waste pollution, and the weight of printed board can be increased so that printed board is inadequate
Frivolous.
Utility model content
For the problem of above-mentioned existence, this utility model aims to provide a kind of novel elargol perforation plate, this elargol perforation plate
It is without copper-plated double-clad board, and this elargol perforation plate low cost, three-waste free pollution, saves the resources such as water power, printed board
Weight frivolous, with short production cycle, production technology is simple, and can accomplish the effect of internal heat dissipating.
To achieve these goals, the technical scheme that this utility model is used is as follows:
A kind of novel elargol perforation plate, including substrate, described substrate is provided with electronic component, the front of described substrate and the back of the body
Face is equipped with copper foil layer, and the Facad structure of described substrate and structure setting symmetrical above and below, processes on the substrate
There are some through holes, each described through hole inwall processed a circle elargol film, and forms conductive through hole, described elargol film
Two ends all extend to, on the described copper foil layer of described substrate front side and back position setting, also be machined with at described copper foil layer side
Seal against the welding resisting layer of connection, be all coated with layer protective layer in the periphery at the described upper and lower two ends of elargol film, described welding resisting layer with
Described copper foil layer that one end that is connected is set to step structure, and described protective layer coincide even with the step structure of described welding resisting layer
Connect.
Further, described substrate is additionally provided with louvre.
Further, the through described substrate of described louvre, substrate front side structure and substrate back structure.
Further, the upper and lower opening of described louvre is disposed as bowl structure.
Further, the thickness of described elargol film is 0.3-0.4mm.
Further, the thickness of described copper foil layer is 9-18 μm, and the thickness of described substrate is 30-100 μm.
The beneficial effects of the utility model are: compared with prior art, this utility model by existing rivet or
Being conductively connected of realizing of mode of person's plating is improved to through being conductively connected of elargol, this elargol perforation with low cost, conduction
Effective, persistently, stablize, and change existing radiating mode, louvre is set in the inside of substrate, the upper and lower side of louvre
Opening is all not configured to bowl structure, and so heat radiation bore increases, and the effect of heat radiation strengthens, and this louvre is provided in leading
The vicinity of electric through-hole, improves the radiating effect within substrate.
Accompanying drawing explanation
Fig. 1 is the piece cutting structure schematic diagram of this utility model elargol perforation plate.
Wherein: 1-substrate, 2-copper foil layer, 3-elargol film, 4-welding resisting layer, 5-protective layer, 6-louvre.
Detailed description of the invention
In order to make those of ordinary skill in the art be better understood on the technical solution of the utility model, below in conjunction with attached
The technical solution of the utility model is further described by figure and embodiment.
One novel elargol perforation plate shown in 1 referring to the drawings, including substrate 1, the phenolic aldehyde of the material selection FR-1 of substrate 1
Paper substrate, light weight, described substrate 1 is provided with electronic component, and the front and back of described substrate 1 is equipped with copper foil layer 2, and described
The Facad structure of substrate 1 and structure setting symmetrical above and below, the thickness of described copper foil layer 2 is 9-18 μm, the thickness of described substrate 1
Degree is 30-100 μm, is machined with some through holes on described substrate 1, processes a circle elargol on each described through hole inwall
Film 3, and form conductive through hole, the thickness of described elargol film 3 is 0.3-0.4mm, and the two ends of described elargol film 3 all extend to described
On the described copper foil layer 2 that substrate 1 front and back position is arranged, also it is machined with at described copper foil layer 2 side and seals against connection
Welding resisting layer 4, be all coated with layer protective layer 5 in the periphery at described elargol film about 3 two ends, described welding resisting layer 4 and described Copper Foil
Layer 2 that one end that is connected is set to step structure, and described protective layer 5 coincide to be connected with the step structure of described welding resisting layer 4 and leads to
Cross this stair-stepping shape so that welding resisting layer 4 and protective layer 5 preferably combine, and stair-stepping structure due to
There is bending path, it is possible to achieve preferably sealing effectiveness, humidity resistance is good, protects preferably to the end of elargol film 3, this practicality
The slurry position of passing through of novel elargol film 3 is all to extend between protective layer and copper foil layer 2, by protective layer 5, copper foil layer 2 and
Its end is carried out sealing protection by welding resisting layer 4, and this utility model is by leading that the mode of existing rivet or plating realizes
Electrical connection is improved to being conductively connected of elargol perforation, this elargol perforation with low cost, and conductive effect is good, persistently, stable.
In this utility model, described substrate 1 is additionally provided with louvre 6, the through described substrate 1 of described louvre 6, substrate
1 Facad structure and substrate 1 structure, the upper and lower opening of described louvre 6 is disposed as bowl structure, because of of the present utility model
Structure is double-decker, therefore a blind area of the always heat radiation of heat produced by the conductive path between bilayer, therefore the present invention
The louvre 6 through by arranging one, is outwards shed the heat of conductive path adnexa by louvre 6, improves heat radiation effect
Really, extend the service life of part in printed board, and thermovent is all provided with being set to bowl structure, can increase area of dissipation, will
Heat quickly distributes.
Claims (6)
1. a novel elargol perforation plate, including substrate, described substrate is provided with electronic component, it is characterised in that: described substrate
Front and back be equipped with copper foil layer, and the Facad structure of described substrate and structure setting symmetrical above and below, described
It is machined with some through holes on substrate, each described through hole inwall is processed a circle elargol film, and forms conductive through hole, institute
The two ends stating elargol film all extend on the described copper foil layer of described substrate front side and back position setting, in described copper foil layer side
Limit is also machined with the welding resisting layer sealing against connection, is all coated with layer protective layer, institute in the periphery at the described upper and lower two ends of elargol film
Stating welding resisting layer that one end that is connected with described copper foil layer and be set to step structure, described protective layer is stepped with described welding resisting layer
Structure is coincide and is connected.
One the most according to claim 1 novel elargol perforation plate, it is characterised in that: it is additionally provided with heat radiation on described substrate
Hole.
One the most according to claim 2 novel elargol perforation plate, it is characterised in that: the through described base of described louvre
Plate, substrate front side structure and substrate back structure.
One the most according to claim 3 novel elargol perforation plate, it is characterised in that: the upper and lower opening of described louvre is equal
It is set to bowl structure.
5. according to the one novel elargol perforation plate described in any one of claim 1-4, it is characterised in that: the thickness of described elargol film
Degree is 0.3-0.4mm.
One the most according to claim 5 novel elargol perforation plate, it is characterised in that: the thickness of described copper foil layer is 9-18
μm, the thickness of described substrate is 30-100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620586345.4U CN205793644U (en) | 2016-06-15 | 2016-06-15 | A kind of novel elargol perforation plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620586345.4U CN205793644U (en) | 2016-06-15 | 2016-06-15 | A kind of novel elargol perforation plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205793644U true CN205793644U (en) | 2016-12-07 |
Family
ID=58131806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620586345.4U Active CN205793644U (en) | 2016-06-15 | 2016-06-15 | A kind of novel elargol perforation plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205793644U (en) |
-
2016
- 2016-06-15 CN CN201620586345.4U patent/CN205793644U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |