CN210519030U

CN210519030U - Aluminum copper plating substrate structure

Info

Publication number: CN210519030U
Application number: CN201920754980.2U
Authority: CN
Inventors: 万海平
Original assignee: Shanghai Wlcp Electrical & Technology Co ltd
Current assignee: Shanghai Wlcp Electrical & Technology Co ltd
Priority date: 2019-05-24
Filing date: 2019-05-24
Publication date: 2020-05-12
Anticipated expiration: 2029-05-24

Abstract

An aluminum copper plating substrate structure, the structure comprising: the aluminum-plated copper-based material, the polypropylene layer and the copper foil layer structure are sequentially connected from bottom to top. Wherein, copper foil layer structure includes: copper foil layer, wire circuit, printing ink layer and copper foil layer fretwork hole. Compared with the prior art, the utility model, adopt the copper facing base plate of aluminium to replace pure copper base plate as the metal base heat-conducting layer through the design, have high heat conductivility, satisfy the heat conduction demand, the copper facing base plate of aluminium preparation is convenient simultaneously, low in production cost has reduced metal resource's consumption.

Description

Aluminum copper plating substrate structure

Technical Field

The utility model relates to the field of electronic technology, concretely relates to aluminium copper facing base plate structure.

Background

With the current technology of LED lamps becoming mature and the application of LED lamps becoming popular, the current heat dissipation technology is not only based on the packaging structure and materials, but also based on the energy transfer process. The recent trend points to the overall demand of the through heat dissipation copper-based circuit board for high brightness along with the overall demand of the vehicle lamp, the heat conduction demand is higher and higher, the demand of the through heat dissipation copper-based circuit board is gradually increased, the manufacturing process of the through heat dissipation copper-based circuit board takes pure copper as a metal-based heat conduction layer and takes a thicker copper plate as a heat conductor, and the through heat dissipation copper-based circuit board is hardly accepted by the market under the premise of higher and higher competition in the future from the cost or the manufacturing process.

In order to solve the above problems, we have made a series of improvements.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an aluminium copper facing base plate structure to overcome the above-mentioned shortcoming and not enough that prior art exists.

An aluminum-copper-plated substrate structure, comprising: the aluminum copper-plated substrate layer, the polypropylene layer and the copper foil layer structure are sequentially connected from bottom to top;

wherein the copper foil layer structure comprises: copper foil layer, wire circuit, printing ink layer and copper foil layer fretwork hole, wire circuit and copper foil layer upper surface are connected, the printing ink layer covers in the upper surface of copper foil layer, the printing ink layer does not contact with the wire circuit, copper foil layer fretwork hole cup joints with the boss of aluminium copper facing substrate layer.

Further, be equipped with a plurality of structure hole and boss on the aluminium copper facing substrate layer, the structure hole runs through polypropylene layer and copper foil layer structure from supreme one side down, the boss is located on the aluminium copper facing substrate layer.

Furthermore, polypropylene hollowed-out holes are formed in the polypropylene layer and are in sleeve joint with the bosses.

The utility model has the advantages that:

compared with the prior art, the utility model, adopt the copper facing base plate of aluminium to replace pure copper base plate as the metal base heat-conducting layer through the design, have high heat conductivility, satisfy the heat conduction demand, the copper facing base plate of aluminium preparation is convenient simultaneously, low in production cost has reduced metal resource's consumption.

Description of the drawings:

fig. 1 is a schematic structural diagram of the aluminum copper-plated substrate of the present invention.

Fig. 2 is the structural schematic diagram of the boss of the aluminum copper-plated substrate of the utility model.

Fig. 3 is a schematic structural diagram of the polypropylene layer of the present invention.

Fig. 4 is a schematic structural diagram of the copper foil layer of the present invention.

Fig. 5 is a schematic view of the whole structure of the present invention.

Reference numerals:

an aluminized copper-based material 100, a structural hole 110 and a boss 120.

A polypropylene layer 200 and polypropylene voids 210.

The copper foil layer structure 300, the copper foil layer 310, the conductive line 320, the ink layer 330 and the copper foil layer hollow hole 340.

Detailed Description

The present invention will be further described with reference to the following examples. It should be understood that the following examples are illustrative only and are not intended to limit the scope of the present invention.

Example 1

Fig. 1 is a schematic structural diagram of the aluminum copper-plated substrate of the present invention. Fig. 2 is the structural schematic diagram of the boss of the aluminum copper-plated substrate of the utility model. Fig. 3 is a schematic structural diagram of the polypropylene layer of the present invention. Fig. 4 is a schematic structural diagram of the copper foil layer of the present invention. Fig. 5 is a schematic structural diagram of the present invention.

As shown in fig. 1, the aluminum-copper-plated substrate 100 is used as a main material for heat conduction of the LED, and the aluminum-copper-plated substrate 100 is manufactured by performing surface treatment on an aluminum plate, then performing chemical nickel plating on the aluminum plate, then performing chemical plating on a layer of thin copper on the nickel layer, and performing surface thickening copper plating on the surface of the aluminum plate on which the chemical copper is formed by using an electrolytic copper plating method. Finally, as shown in fig. 2, a resist ink is applied to the surface of the al-cu substrate 100, and the bumps 120 to be soldered with the LED are formed by image transfer and chemical etching. Meanwhile, as shown in fig. 3 and 4, the corresponding "position of the LED boss" and the corresponding copper foil are punched out by using a punching and laser cutting method on the polypropylene layer 200 and the copper foil layer structure 300, respectively, to form the corresponding polypropylene hollow hole 210 and the corresponding copper foil layer hollow hole 340. Then, the aluminum copper-plated substrate 100, the polypropylene layer 200 and the copper foil layer structure 300 are sequentially combined, and the polypropylene hollow-out hole 210 and the copper foil layer hollow-out hole 340 are sleeved with the boss 120.

After combination, the three are combined into a whole in a heating and pressurizing mode, and the combined product uses the middle polypropylene layer 200 as an insulating layer to separate the LED boss position from the surface circuit copper foil layer 310, so that a structure of direct independent heat dissipation and lead circuit 320 separation is realized. The surface of the copper foil layer 310 is adhered with a corrosion-resistant ink, and the conductive line 320 is manufactured by an image transfer method and a chemical etching method. As shown in fig. 5, an ink layer 330 is printed on the copper foil layer 310 at a position where soldering is not required, and the soldering position is fixed, so that the substrate is protected from being connected with tin or other defects during soldering. And finally, the structural hole 110 and the appearance are manufactured in a punching mode in sequence, the structural hole is used for installation and connection, surface treatment is carried out simultaneously, the welding copper surface is prevented from being exposed in the air and oxidized to influence welding, and the welding quality is improved.

The utility model discloses a design adopts the aluminium copper facing base plate to replace pure copper base plate as metal base heat-conducting layer, has high thermal conductivity, satisfies the heat conduction demand, and aluminium copper facing base plate preparation is convenient simultaneously, and low in production cost has reduced metal resource's consumption.

The above description has been made of the embodiments of the present invention, but the present invention is not limited thereto, and various changes may be made without departing from the spirit of the present invention.

Claims

1. An aluminum-copper-plated substrate structure, comprising: the copper-clad aluminum plate comprises an aluminum copper-clad substrate layer (100), a polypropylene layer (200) and a copper foil layer structure (300), wherein the aluminum copper-clad substrate layer (100), the polypropylene layer (200) and the copper foil layer structure (300) are sequentially connected from bottom to top;

wherein the copper foil layer structure (300) comprises: copper foil layer (310), wire circuit (320), printing ink layer (330) and copper foil layer fretwork hole (340), wire circuit (320) and copper foil layer (310) upper surface connection, printing ink layer (330) covers in the upper surface of copper foil layer (310), printing ink layer (330) and wire circuit (320) contactless, copper foil layer fretwork hole (340) cup joints with the boss of aluminium copper facing substrate layer (100).

2. The aluminum-plated copper substrate structure according to claim 1, wherein the aluminum-plated copper substrate layer (100) is provided with a plurality of structural holes (110) and bosses (120), the structural holes (110) penetrate through the polypropylene layer (200) and the copper foil layer structure (300) from bottom to top, and the bosses (120) are arranged on the aluminum-plated copper substrate layer (100).

3. The structure of the aluminum-plated copper substrate as recited in claim 1, wherein the polypropylene layer (200) is provided with polypropylene through holes (210), and the polypropylene through holes (210) are sleeved with the bosses (120).