CN201860505U - Combined two-sided PCB - Google Patents
Combined two-sided PCB Download PDFInfo
- Publication number
- CN201860505U CN201860505U CN2010205739483U CN201020573948U CN201860505U CN 201860505 U CN201860505 U CN 201860505U CN 2010205739483 U CN2010205739483 U CN 2010205739483U CN 201020573948 U CN201020573948 U CN 201020573948U CN 201860505 U CN201860505 U CN 201860505U
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- copper
- line layer
- flat conductor
- sided pcb
- combined double
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Abstract
The utility model provides a combined two-sided PCB (Printed Circuit Board), which comprises a first circuit layer and a second circuit layer, wherein the first circuit layer is formed by die cutting or etching a metal board; the second circuit layer is formed by parallelly arranging flat conducting wires; and the first circuit layer and the second circuit layer are fixedly adhered with each other via an adhesive insulating layer, so as to form the combined two-sided PCB. The combined two-sided PCB provided by the utility model has the advantages that the manufacture processes are simplified, the efficiency is improved, the thick copper material for manufacturing loaded lines with high flow is saved, the cost is greatly reduced, the pollutants emission is reduced or even eliminated, and the government's call for energy conservation and emission reduction is responded.
Description
Technical field
The utility model belongs to circuit-board industry, a kind of combined double-sided PCB is provided, one deck circuit of double-sided wiring board adopts etching or cross cutting to make, and another layer line road adopts juxtaposed flat conductor to make, with the bonding double-sided wiring board of making of two-layer circuit stack.And via is taked electrically conductive ink conducting or conducting resinl conducting or scolding tin conducting or welding conductors conducting or the conducting of soldered elements pin.
Background technology
The wiring board that some load requests are higher, usually all be to adopt thick copper to come the wiring board of processing and fabricating, and with traditional engraving method processing and fabricating or with method processing and fabricating that in " circuit board with cross cutting circuit " utility application of application on October 12nd, 2010, discloses before the inventor and the structure that forms thus, copper loss is lost all quite big, the cost height, uneconomical to one's profit, and all use the engraving method processing and fabricating, can produce a lot of industrial wastewater waste gas, and not environmental protection.
The method that lead is enclosed in traditional employing increases load current, and single being welded on one by one on each circuit board of plain conductor stringed together use, the method is time-consuming take artificial, inefficiency, and lead is in disorder not attractive in appearance.
In addition, the inventor all adopts flat and puts the wire producing double-sided wiring board at whole circuits of invention before, although have requirement circuit advantage fairly simple, simple for production and with low cost, but this whole employing is flat and put that lead forms line layer and the double-sided wiring board made can not satisfy complicated diversified line design, the application scenario is subjected to bigger restriction, so the scope of application is narrower.
The utility model has overcome above-mentioned defective, in circuit-board industry, a lot of higher wiring boards of load request, the positive circuit that pastes component side, the all less and complicated variation of circuit requirement of current loading, the current loading of another side power supply main line requires high and simple, the utility model is according to this requirement, adopt thin Copper Foil to make with etching or cross cutting in the circuit that pastes component side, another layer line road adopts juxtaposed flat conductor to make, with the bonding double-sided wiring board of making of two-layer circuit stack, this combined double-sided wiring board, satisfied the bearing capacity of high load currents and the demand of complicated diversified line design, and simple in structure, saved material, improved efficient, greatly reduce cost, reduce or even eliminated pollutant emission, responded the call of country for energy-saving and emission-reduction.
Summary of the invention
According to the utility model, a kind of combined double-sided wiring board is provided, comprising: first line layer that forms by cross cutting or etching metal plate; With second line layer that forms by juxtaposed flat conductor; Wherein, described first line layer and second line layer are bonded to each other by the adhesivity insulating barrier and are fixed together, and form combined double-sided wiring board.
According to one embodiment of the invention, its layer of combinations thereof type double-sided wiring board structure comprises successively: first solder mask; Described first line layer; The adhesivity insulating barrier; Described second line layer; With second solder mask.
According to another embodiment of the present invention, described first solder mask and second solder mask are formed by coverlay or welding resistance printing ink.
According to another embodiment of the present invention, on described first line layer and described adhesivity insulating barrier, need the position of conducting to be processed to form via and to make described first line layer and described second line layer form conductive communication, wherein, described via is through hole or bowl hole, and described conductive communication is to adopt conducting resinl to come conducting, perhaps adopts electrically conductive ink to come conducting, perhaps comes conducting with scolding tin, perhaps come conducting, perhaps come conducting with the soldered elements pin with welding conductors.
According to another embodiment of the present invention, be welded with pin type or surface labeling type electronic component on first line layer of described combined double-sided PCB.
According to another embodiment of the present invention, described circuit board is flexible PCB or rigid circuit board.
According to another embodiment of the present invention, described flat conductor is to prolong the flat conductor made from the circle line pressure, or the flat conductor that cuts into metal forming, metallic plate, metal tape branch, or the flat conductor of being made by the flattening of stranded conductor bundle.
According to another embodiment of the present invention, described flat conductor is copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire, steel tinned wire, copper cash bundle, copper cover aluminum wire harness, copper covered steel wire harness, the zinc-plated wire harness of copper, copper nickel plating gold thread bundle, the zinc-plated wire harness of iron or the zinc-plated wire harness of steel.
According to another embodiment of the present invention, the length of circuit board is greater than 1 meter or smaller or equal to 1 meter.
According to another embodiment of the present invention, described circuit board is used for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube or LED Christmas lamp.
In following description, will set forth one or more embodiments of the detail of the present utility model to the drawings and specific embodiments.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
Fig. 1 is the schematic diagram of metal forming or metallic plate 1a.
Fig. 2 keeps metal and connects support level 2a for optionally to cut away the unwanted part metals 4 of circuit with mould or cutting die, forms the schematic diagram of blank circuit 1b.
In Fig. 3, Fig. 3 (A) is the schematic diagram of the blank circuit 1b that is adhesively fixed with the insulating barrier 3 (A) of two sides band glue.Fig. 3 (B) is the decomposing schematic representation of Fig. 3 (A).
In Fig. 4, Fig. 4 (A) is the blank circuit 1b that is adhesively fixed with the insulating barrier 3a of two sides band glue, cuts the schematic diagram of metal connection support level 2a with mould.Fig. 4 (B) is the decomposing schematic representation of Fig. 4 (A).
Fig. 5 is the schematic diagram of the flat conductor of calendering making.
Fig. 6 for and put the schematic diagram of groove mould.
Fig. 7 for and put the cross-sectional view of groove mould.
Fig. 8 is for flat conductor and put wiring diagram.
Fig. 9 is for flat conductor and put and vacuumize air-breathing fixing schematic diagram when arranging.
Figure 10 is that juxtaposed flat conductor sticks to the schematic diagram on the polyimides coverlay (first solder mask) that has epoxy adhesive.
In Figure 11, Figure 11 (A) is that soldered elements face line layer (cross cutting circuit 1c), adhesivity insulating barrier (the insulating barrier 3b of two sides band glue), juxtaposed flat conductor layer 6, first solder mask (the polyimides coverlay 10 that has epoxy adhesive) fit together, and forms the schematic diagram of double-sided wiring board.Figure 11 (B) is the decomposing schematic representation of Figure 11 (A).
In Figure 12, Figure 12 (A) is the schematic diagram after the double-sided wiring board of cross cutting circuit and the combination of juxtaposed flat conductor sticks coverlay.Figure 12 (B) is the decomposing schematic representation of Figure 12 (A).
Figure 13 is the schematic diagram after the double-sided wiring board of cross cutting circuit and the combination of juxtaposed flat conductor stamps electrically conductive ink 12.
Figure 14 is the schematic diagram of single-side coated copper plate.
Figure 15 is the schematic diagram on the insulating barrier 13.2 that the heat curing-type glue 14 of liquid state is coated in single-side coated copper plate.
Figure 16 goes out schematic diagram behind the via 5 for the single-side coated copper plate that will scribble hot-setting adhesive with mould.
Among Figure 17, Figure 17 (A) aims at schematic diagram after being superimposed together for the one side that is coated with hot-setting adhesive 14a of substrate that will make with the flat conductor 6 on being fixed on coverlay 10.Figure 17 (B) is the decomposing schematic representation of Figure 17 (A).
Figure 18 is the schematic diagram that etches behind the circuit 13.1b.
Among Figure 19, Figure 19 (A) is the schematic diagram after the double-sided wiring board of circuit etching and the combination of juxtaposed flat conductor sticks coverlay.Figure 19 (B) is the decomposing schematic representation of Figure 19 (A).
Figure 20 is the schematic diagram after the double-sided wiring board of circuit etching and the combination of juxtaposed flat conductor stamps electrically conductive ink 12.
Embodiment
To the specific embodiment of the combined double-sided PCB of the utility model be described in more detail below.But these specific embodiments only play and specify and demonstrate effect of the present invention, and scope of the present invention is not had any restriction.Protection scope of the present invention is only limited by claims.
Embodiment one
One, the making on soldered elements upper thread road
1, cross cutting is made the blank circuit
With metallic plate (or being called metal forming), for example preferred copper coin (or being called Copper Foil) 1a (as shown in Figure 1), if for example copper plate thickness is 0.1～5mm, available pre-designed mould optionally cuts away the unwanted part metals 4 of circuit; When for example if thickness is 0.05～0.2mm, available pre-designed cutting die optionally cuts away the unwanted part metals 4 of circuit, keeps metal and connects support level 2a, and the copper coin circuit is not scattered, and is unshift, is made into blank circuit 1b (as shown in Figure 2).
2, cross cutting is made circuit
With the insulating barrier 3a of two sides band glue tear the release liners of one side and the blank circuit 1b that is made into to good position, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds, the blank that is adhesively fixed circuit 1b (as shown in Figure 3).Go out via 5 with mould then and be connected support level 2a with excision disconnection metal, become the circuit 1c that excision mouthful 2b is arranged, the insulating barrier 3a of two sides band glue and metal connect that the corresponding position of support level 2a is also punched to be fallen the excision window 2b.1 of an identical size and become the insulating barrier 3b (as shown in Figure 4) of the two sides band glue that the excision mouth is arranged simultaneously.
Two, the making of juxtaposed flat conductor
1. flat conductor is made: take the cutting of Copper Foil itemize to make or become with flat conductor calender calendering copper cash the flat conductor 6 (as shown in Figure 5) of certain width and thickness.
2. and put groove mould and make: adopt the method for etching or machining with minute surface stainless steel plate, process consistent with line width and put groove 7 (as shown in Figure 6), gash depth is than the thickness of flat conductor 5 more shallow (as shown in Figure 7).
3, flat conductor and put layout: design and produce in advance and have consistent with the flat conductor width and put groove mould, flat conductor and put and arrange and to be fixed on (as shown in Figure 8) in the groove, the fixing employing by vaccum suction tube 8 vacuumizes air-breathing method and fixes (as shown in Figure 9).The polyimides coverlay 10 that will have an epoxy adhesive and the flat conductor of the mould that is furnished with flat conductor are simultaneously aimed at overlapping hot pressing 5-20 second, make that juxtaposed flat conductor is bonding to be transferred on the coverlay, separate and take mould away, the flat conductor circuit shifted and was fixed on (as shown in figure 10) on the coverlay this moment.
Three, the making of combined double-sided wiring board
1, the release liners of tearing the insulating barrier 3b another side of two sides band glue is aimed at the position and is superimposed together with the flat conductor 6 on being fixed on coverlay 10, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds, front line layer (cross cutting circuit 1c), adhesivity insulating barrier (the insulating barrier 3b of two sides band glue), juxtaposed flat conductor layer 6, first solder mask (the polyimides coverlay 10 that has epoxy adhesive) are fit together, form double-sided wiring board (as shown in figure 11).
2, the coverlay 11 (second solder mask) that has element solder joint window in advance is superimposed together with front line layer (cross cutting circuit 1c) contraposition, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds, then at the coverlay 11 that has element solder joint window in advance (second solder mask) with have on the polyimides coverlay 10 (first solder mask) of epoxy adhesive and be covered with release film respectively, continuation was 150 ℃ to 180 ℃ following hot pressing 90 seconds to 180 seconds, each layer taken out after fixedly securing, in baking box, solidified 45 minutes to 90 minutes down, make the double-sided wiring board of combination solidify bonding (as shown in figure 12) with 120 ℃ to 160 ℃.
3, printing word, this technology is traditional handicraft, does not carefully state at this.
4, at the via 5 filled conductive printing ink 12 (as shown in figure 13) of double-sided wiring board, with 120 ℃ to 160 ℃ following baking-curings 15 minutes to 30 minutes, perhaps when the SMT of postorder surface mount elements, stamp tin cream for the via 5 of double-sided wiring board, cross the two-sided line layer of Reflow Soldering welding conducting.
5, butt welding point is carried out the OSP processing, and this technology is traditional handicraft, does not carefully state at this.Finish the making of combined double-sided wiring board.
Embodiment two
One, the making of substrate and via
Single-sided flexible copper-clad plate (insulating material 13.2 of being worn glue by Copper Foil 13.1 and is formed) with as shown in figure 14 rolling, adopt coating oven dry production equipment, the heat curing-type glue 14 of liquid state is coated on the single-side coated copper plate insulating barrier 13.2 of (insulating material 13.2 of being worn glue by Copper Foil 13.1 and is formed) (as shown in figure 15).Use 25 tons of punch presses of Ningbo Ou Tai CH1-25 type then,, upwards carry out punching with copper face by the through hole mould of engineering department according to the line design data make.Obtain passing Copper Foil 13.1a that top layer Copper Foil 13.1 is formed with through hole 5, pass the coating hot-setting adhesive 14a (as shown in figure 16) that hot-setting adhesive 14 that an insulating material 13.2 of wearing glue is formed with the insulating material 13.2a of through hole 5 and passes coating forms through holes 5 as shown in figure 16.
Two, the making of juxtaposed flat conductor
1. flat conductor is made: take the cutting of Copper Foil itemize to make or become with flat conductor calender calendering copper cash the flat conductor 6 (as shown in Figure 5) of certain width and thickness.
2. and put groove mould and make: adopt the method for etching or machining with minute surface stainless steel plate, process consistent with line width and put groove 7 (as shown in Figure 6), gash depth is than the thickness of flat conductor 5 more shallow (as shown in Figure 7).
3, flat conductor and put layout: design and produce in advance and have consistent with the flat conductor width and put groove mould, flat conductor and put and arrange and to be fixed on (as shown in Figure 8) in the groove, the fixing employing by vaccum suction tube 8 vacuumizes air-breathing method and fixes (as shown in Figure 9).The polyimides coverlay 10 that will have an epoxy adhesive and the flat conductor of the mould that is furnished with flat conductor are simultaneously aimed at overlapping hot pressing 5-20 second, make that juxtaposed flat conductor is bonding to be transferred on the coverlay, separate and take mould away, the flat conductor circuit shifted and was fixed on (as shown in figure 10) on the coverlay this moment.
Three, the making of combined double-sided wiring board
1, the one side that is coated with hot-setting adhesive 14a of the substrate made being aimed at the position with the flat conductor 6 on being fixed on coverlay 10 is superimposed together, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds, then at Copper Foil 13.1a with have on the polyimides coverlay 10 of epoxy adhesive and be covered with release film respectively, continuation was 150 ℃ to 180 ℃ following hot pressing 90 seconds to 180 seconds, each layer taken out after fixedly securing, in baking box, solidified 45 minutes to 90 minutes down, make each layer curing that is superimposed together bonding (as shown in figure 17) with 120 ℃ to 160 ℃.
2, then according to the single sided board manufacture craft, only copper-clad surface 13.1a is pressed dry film, figure transfer, exposure is developed, and etching obtains soldered elements upper thread road 13.1b as shown in figure 18.
3, the coverlay 11 (second solder mask) that will have element solder joint window in advance is superimposed together with the 13.1b contraposition of soldered elements upper thread road, with 120 ℃ to 150 ℃ false pressures 5 to 20 seconds, then at coverlay 11 with have on the polyimides coverlay 10 of epoxy adhesive and be covered with release film respectively, continuation was 150 ℃ to 180 ℃ following hot pressing 90 seconds to 180 seconds, solidified 45 minutes to 90 minutes down at 120 ℃ to 160 ℃ with baking box, solidify bonding coverlay 11 (as shown in figure 19).
4, printing word, this technology is traditional handicraft, does not carefully state at this.
5, at the via 5 filled conductive printing ink 12 (as shown in figure 20) of double-sided wiring board, with 120 ℃ to 160 ℃ following baking-curings 15 minutes to 30 minutes, perhaps when the SMT of postorder surface mount elements, stamp tin cream for the via 5 of double-sided wiring board, cross the two-sided line layer of Reflow Soldering welding conducting.
6, butt welding point is carried out the OSP processing, and this technology is traditional handicraft, does not carefully state at this.Finish the making of combined double-sided wiring board.
Below in conjunction with the accompanying drawings the specific embodiment of combined double-sided wiring board is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present utility model, especially the scope of claim does not have any restriction.
Claims (10)
1. combined double-sided wiring board is characterized in that it comprises:
First line layer that forms by cross cutting or etching metal plate; With
Second line layer that forms by juxtaposed flat conductor;
Wherein, described first line layer and second line layer are bonded to each other by the adhesivity insulating barrier and are fixed together, and form combined double-sided wiring board.
2. combined double-sided PCB according to claim 1, its layer structure comprises successively:
First solder mask;
Described first line layer;
The adhesivity insulating barrier;
Described second line layer; With
Second solder mask.
3. combined circuit board according to claim 2 is characterized in that, described first solder mask and second solder mask are formed by coverlay or welding resistance printing ink.
4. combined double-sided PCB according to claim 1, it is characterized in that, on described first line layer and described adhesivity insulating barrier, need the position of conducting to be processed to form via and to make described first line layer and described second line layer form conductive communication, wherein, described via is through hole or bowl hole, and described conductive communication is to adopt conducting resinl to come conducting, perhaps adopt electrically conductive ink to come conducting, perhaps come conducting with scolding tin, perhaps come conducting, perhaps come conducting with the soldered elements pin with welding conductors.
5. combined double-sided PCB according to claim 1 is characterized in that, is welded with pin type or surface labeling type electronic component on first line layer of described combined double-sided PCB.
6. according to each described combined double-sided PCB among the claim 1-5, it is characterized in that described circuit board is flexible PCB or rigid circuit board.
7. according to each described combined double-sided PCB among the claim 1-5, it is characterized in that, described flat conductor is to prolong the flat conductor made from the circle line pressure, or the flat conductor that cuts into metal forming, metallic plate, metal tape branch, or flatten the flat conductor of making by the stranded conductor bundle.
8. according to each described combined double-sided PCB among the claim 1-5, it is characterized in that described flat conductor is copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire, steel tinned wire, copper cash bundle, copper cover aluminum wire harness, copper covered steel wire harness, the zinc-plated wire harness of copper, copper nickel plating gold thread bundle, the zinc-plated wire harness of iron or the zinc-plated wire harness of steel.
9. according to each described circuit board among the claim 1-5, it is characterized in that the length of described circuit board is greater than 1 meter or smaller or equal to 1 meter.
10. according to each described combined double-sided PCB among the claim 1-5, it is characterized in that described circuit board is used for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube or LED Christmas lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205739483U CN201860505U (en) | 2010-10-21 | 2010-10-21 | Combined two-sided PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205739483U CN201860505U (en) | 2010-10-21 | 2010-10-21 | Combined two-sided PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201860505U true CN201860505U (en) | 2011-06-08 |
Family
ID=44106300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205739483U Expired - Lifetime CN201860505U (en) | 2010-10-21 | 2010-10-21 | Combined two-sided PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201860505U (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103826389A (en) * | 2014-03-21 | 2014-05-28 | 广州市竟国电子有限公司 | Environment-friendly LED (Light Emitting Diode) circuit board |
| CN105898995A (en) * | 2016-06-28 | 2016-08-24 | 广东顺德施瑞科技有限公司 | Preparation method for double-layer LED high-voltage circuit board |
| CN106804092A (en) * | 2017-03-25 | 2017-06-06 | 广东永创鑫电子有限公司 | A kind of FPC and preparation method thereof |
| CN106927698A (en) * | 2016-09-18 | 2017-07-07 | 深圳市致竑光电有限公司 | The manufacture method and LED transparent luminescent glass of LED transparent luminescent glass |
| CN107990167A (en) * | 2016-08-23 | 2018-05-04 | 奥斯兰姆施尔凡尼亚公司 | Flexible light engine with busbar and connectors |
| CN109152199A (en) * | 2018-09-30 | 2019-01-04 | 惠州市鹏程电子科技有限公司 | The flexible circuit board and its die-cutting production method of single-layer or multi-layer cross cutting |
| CN109548322A (en) * | 2017-09-21 | 2019-03-29 | 鹤山市得润电子科技有限公司 | A kind of manufacturing method and production equipment of multi-layer soft circuit board |
| CN109548323A (en) * | 2017-09-21 | 2019-03-29 | 鹤山市得润电子科技有限公司 | A kind of manufacturing method and production equipment of multi-layer soft circuit board |
| WO2019086015A1 (en) * | 2017-11-04 | 2019-05-09 | 王定锋 | Circuit board of composite metal circuit, and production method for circuit board of composite metal circuit |
| CN109757032A (en) * | 2017-11-04 | 2019-05-14 | 王定锋 | A kind of method of metal-foil circuits and wire circuit produced with combination circuit board |
| CN113207218A (en) * | 2021-04-16 | 2021-08-03 | 深圳市国盈光电有限公司 | Laser engraving circuit board and production method thereof |
| WO2023082173A1 (en) * | 2021-11-12 | 2023-05-19 | 深圳市华鼎星科技有限公司 | Double-layer conductive circuit and manufacturing method therefor, and display module |
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2010
- 2010-10-21 CN CN2010205739483U patent/CN201860505U/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103826389B (en) * | 2014-03-21 | 2017-10-10 | 广州市竟国电子有限公司 | Environment-friendly type LED wiring board |
| CN103826389A (en) * | 2014-03-21 | 2014-05-28 | 广州市竟国电子有限公司 | Environment-friendly LED (Light Emitting Diode) circuit board |
| CN105898995A (en) * | 2016-06-28 | 2016-08-24 | 广东顺德施瑞科技有限公司 | Preparation method for double-layer LED high-voltage circuit board |
| CN107990167A (en) * | 2016-08-23 | 2018-05-04 | 奥斯兰姆施尔凡尼亚公司 | Flexible light engine with busbar and connectors |
| CN106927698A (en) * | 2016-09-18 | 2017-07-07 | 深圳市致竑光电有限公司 | The manufacture method and LED transparent luminescent glass of LED transparent luminescent glass |
| CN106804092A (en) * | 2017-03-25 | 2017-06-06 | 广东永创鑫电子有限公司 | A kind of FPC and preparation method thereof |
| CN109548323A (en) * | 2017-09-21 | 2019-03-29 | 鹤山市得润电子科技有限公司 | A kind of manufacturing method and production equipment of multi-layer soft circuit board |
| CN109548322A (en) * | 2017-09-21 | 2019-03-29 | 鹤山市得润电子科技有限公司 | A kind of manufacturing method and production equipment of multi-layer soft circuit board |
| WO2019086015A1 (en) * | 2017-11-04 | 2019-05-09 | 王定锋 | Circuit board of composite metal circuit, and production method for circuit board of composite metal circuit |
| CN109757039A (en) * | 2017-11-04 | 2019-05-14 | 王定锋 | A kind of circuit board and preparation method thereof of composition metal circuit |
| CN109757032A (en) * | 2017-11-04 | 2019-05-14 | 王定锋 | A kind of method of metal-foil circuits and wire circuit produced with combination circuit board |
| CN109757039B (en) * | 2017-11-04 | 2023-12-26 | 王定锋 | Circuit board of composite metal circuit and manufacturing method thereof |
| CN109152199A (en) * | 2018-09-30 | 2019-01-04 | 惠州市鹏程电子科技有限公司 | The flexible circuit board and its die-cutting production method of single-layer or multi-layer cross cutting |
| CN113207218A (en) * | 2021-04-16 | 2021-08-03 | 深圳市国盈光电有限公司 | Laser engraving circuit board and production method thereof |
| WO2023082173A1 (en) * | 2021-11-12 | 2023-05-19 | 深圳市华鼎星科技有限公司 | Double-layer conductive circuit and manufacturing method therefor, and display module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| IP01 | Partial invalidation of patent right |
Commission number: 5W113894 Conclusion of examination: The utility model patent 201020573948.3 is declared partially invalid, and the patent is maintained on the basis of the patentee's claim 1-6 amended by the oral Court on March 19, 2018. Decision date of declaring invalidation: 20180416 Decision number of declaring invalidation: 35551 Denomination of utility model: Combined two-sided PCB Granted publication date: 20110608 Patentee: Wang Dingfeng |
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| IP01 | Partial invalidation of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110608 |
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| CX01 | Expiry of patent term |