CN201797655U - Double-side circuit board made of parallel flat leads - Google Patents
Double-side circuit board made of parallel flat leads Download PDFInfo
- Publication number
- CN201797655U CN201797655U CN2010205233611U CN201020523361U CN201797655U CN 201797655 U CN201797655 U CN 201797655U CN 2010205233611 U CN2010205233611 U CN 2010205233611U CN 201020523361 U CN201020523361 U CN 201020523361U CN 201797655 U CN201797655 U CN 201797655U
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- Prior art keywords
- double
- flat conductor
- sided pcb
- circuit
- layer
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Abstract
The utility model relates to a double-side circuit board made of parallel flat leads. In particular, two layers of parallel flat leads are stuck and hot-pressed on two layers of adhesive insulating substrates respectively; a position on which the circuit needs switching off and a conduction hole on which the double-layer circuit needs conducting are cut, and then laminated and hot-pressed together with an insulating layer which is provided with a conduction hole and is adhesive on two sides; the conduction hole is conducted through conductive oil ink or a welding element or a welding conductor; and a gap bridge is conducted by the conductive oil ink or the welding conductor or the welding element. When a jack element needs arranging, a hole is drilled directly at a welding point position or punched by a mold, so that welding and installation can be performed. The double-side circuit board is made by a new method and a new process which do not need etching, depositing copper or plating copper, and new technology which is very environmentally-friendly and saves energy and materials is provided.
Description
Technical field
The utility model belongs to circuit-board industry, is specifically related to use and put the double-sided wiring board that flat conductor is made.
According to one side of the present utility model, adopt two-layer and put flat conductor paste respectively and hot pressing on the insulating substrate of two-layer band glue, position that cut-off circuit need disconnect and odt circuit need the via of conducting, then with another held successfully via two sides band glue the superimposed hot pressing of insulating barrier contraposition together, via is taked electrically conductive ink or soldered elements or welding conductors conducting, passes a bridge and adopts electrically conductive ink or welding conductors or soldered elements conducting.
Making double-sided PCB by the utility model and need not etching, need not heavy copper, need not copper facing, is new technology a kind of ten minutes environmental protection, energy-conservation, material saving.
Background technology
Traditional circuit board lead all is that copper-clad plate etches circuit usually, or takes laser and the unwanted copper of milling cutter cutting removal to go out circuit.But the former is high cost and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities.
The utility model is with comparing with flat conductor and the single face circuit board of putting making that the inventor invents in front, and the position of its components and parts is more conducive to design and stops and put.Compare with traditional production circuit board, the utility model has adopted and a kind ofly need not etching, need not heavy copper, need not copper-plated new method, and new technology is a new technology a kind of ten minutes environmental protection, energy-conservation, material saving.
The utility model content
According to the utility model, can adopt two-layer and put flat conductor and paste hot pressing respectively on the insulating substrate of two-layer band glue, position that cut-off circuit need disconnect and odt circuit need the via of conducting, then with another held successfully via two sides band glue the superimposed hot pressing of insulating barrier contraposition together, via is taked electrically conductive ink or soldered elements or welding conductors conducting, pass a bridge and adopt electrically conductive ink or welding conductors or soldered elements conducting, when needs are installed the jack element, directly in bond pad locations boring or punching, thereby with in the component pins patchhole and be welded on the line layer.
The position of circuit board element of the present utility model is more conducive to design to stop put, and still nobody adopts and puts flat conductor and directly make double-sided PCB up to now in the prior art.
According to the utility model, a kind of double-sided PCB that adopts and put flat conductor to make is provided, comprise: paste hot pressing on the insulating substrate of the band glue that has window in advance first and put flat conductor, this first and put the front circuit that flat conductor forms described double-sided PCB, and this insulating substrate that has the band glue of window in advance forms solder mask; Paste hot pressing on the insulating substrate of another band glue second and put flat conductor, this is second and put the back side circuit that flat conductor forms described double-sided PCB years old; With the insulating barrier of the two sides band glue of holding via successfully, wherein, the contraposition respectively of described front circuit and described back side circuit, superimposed and hot pressing are on the tow sides of the band glue of this insulating barrier.
According to one side of the present utility model, described via is taked electrically conductive ink or soldered elements or welding conductors conducting, and employing electrically conductive ink or welding conductors or soldered elements are realized the gap bridge conducting between circuit.
According on the other hand of the present utility model, the insulating substrate of described band glue is: epoxy glass base material, phenolic aldehyde base material, polyimide base material, metal base, or ceramic base material.
According on the other hand of the present utility model, described flat conductor is: copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.
According on the other hand of the present utility model, in position that cut-off circuit need disconnect and odt circuit need conducting via the time, the simultaneously also cut excision mouth that falls an identical size of the insulating substrate of described surface band glue.
According on the other hand of the present utility model, described double-sided PCB is flexible PCB or rigid circuit board.
According on the other hand of the present utility model, described double-sided PCB comprises on interlayer structure successively:
Ground floor: the first insulation solder mask;
The second layer: first and put the front line layer that flat conductor forms;
The 3rd layer: the insulating barrier of two sides band glue;
The 4th layer: second and put the back side line layer that flat conductor forms;
Layer 5: the second insulation solder mask; With
According on the other hand of the present utility model, described double-sided PCB is used for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube or LED Christmas lamp.
According on the other hand of the present utility model, described flat conductor is to adopt the circle line pressure to prolong the flat conductor of making, or the flat conductor that cuts into metal forming, metallic plate or metal tape branch, or the flat conductor made from the flattening of stranded conductor bundle.
According on the other hand of the present utility model, when needs are installed the jack element, directly in bond pad locations boring or punching, thereby with in the component pins patchhole and be welded on the line layer.
According to one side of the present utility model, the length of described double-sided PCB is less than or equal to 100 meters, perhaps more than 100 meters.
According to one side of the present utility model, described flat conductor adopts the circle line pressure to prolong and makes or cut into metal forming, metallic plate, metal tape branch, or the flattening of stranded conductor bundle is made.
Description of drawings
By reading this specification in conjunction with the following drawings, it is more apparent that feature of the present utility model, purpose and advantage will become, in the accompanying drawings:
Fig. 1 is the planar structure and the cross-sectional structure figure of double circuit plate.
Fig. 2 is the schematic diagram of the flat conductor of calendering making.
Fig. 3 for and put the schematic diagram of groove mould.
Fig. 4 for and put the cross-sectional view of groove mould.
Fig. 5 is for flat conductor and put wiring diagram.
Fig. 6 is for flat conductor and put and vacuumize air-breathing fixing schematic diagram when arranging.
Fig. 7 for and put the flat wire heat pressure adhesive the band glue insulating substrate on schematic diagram.
Fig. 8 for and put the flat wire pressing and paste schematic diagram on the coverlay hold window successfully.
Fig. 9 is the schematic diagram that cuts away the via that position that flat conductor need disconnect and odt circuit need conducting.
Figure 10 is the schematic diagram of insulating barrier of holding the two sides band glue of via successfully.
Figure 11 is with the insulating barrier contraposition of back side circuit 2 and insulating substrate 1, front circuit 4 and insulating substrate 5 (welding resistance) and two sides band glue, superimposed, hot pressing schematic diagram together.
The schematic diagram of Figure 12 after for circuit board welding LED and element thereof.
The parts label
1, base material; 2, flat conductor (back side circuit); 3, the insulating barrier of two sides band glue; 4, flat conductor (front circuit); 5, solder mask (coverlay or welding resistance printing ink); 6, paster LED lamp; 7, Chip-R; 8, gap bridge conductor; 9 excision mouths; 10, power supply pad; 11, via (by the soldering conducting of soldered elements); 12, parallel groove; 13, vacuum-pumping tube; 14, Qie Chu via
Embodiment
Below will to the utility model with and put flat conductor and make the specific embodiment of the method for double-sided PCB and be described in more detail.
But, it will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some preferred implementations, some other similarly or the execution mode that is equal to equally also can be used for implementing the utility model.
1, flat conductor is made: take the cutting of Copper Foil itemize to make flat conductor 2 and 4, or become the flat conductor 2 and 4 (as shown in Figure 2) of certain width and thickness with flat conductor calender calendering copper cash.
2 and put groove mould and make: adopt the method for etching or machining with minute surface stainless steel plate, process consistent with line width and put groove 12 (as shown in Figure 3), gash depth can more shallow than the thickness of flat conductor 2 and 4 (as shown in Figure 4).
3, flat conductor (front circuit) and put layout: design and produce in advance and have consistent with flat conductor 4 width and put groove mould, flat conductor 4 and put and arrange and to be fixed on (as Fig. 5) in the groove, this fixing for example can the employing by vaccum suction tube 13 vacuumize air-breathing method and fix (as shown in Figure 6).With the insulating substrate coverlay 5 (solder mask 5) of the band glue that has element solder joint window in advance go up and juxtaposed flat conductor 4 (front circuit) to good position, with 120 ℃ to 150 ℃ precompressed 5 to 10 seconds, groove mould (as shown in Figure 8) is taken away and put to preliminary fixedly front circuit 4.
4, circuit processing: remove the via 14 that flat conductor 4 (front circuit) needs the position that disconnects and odt circuit to need conducting with mould is die-cut, the corresponding with it position of while coverlay is also punched falls an identical excision mouth 9 (as Fig. 9).
5, flat conductor 2 (back side circuit) and put layout: design and produce in advance and have consistent with flat conductor 2 width and put groove mould, flat conductor 2 and put and arrange and to be fixed on (as Fig. 5) in the groove, this fixing for example can the employing by vaccum suction tube 13 vacuumize air-breathing method and fix (as shown in Figure 6).To good position, with 120 ℃ to 150 ℃ precompressed 5 to 10 seconds, tentatively fixedly back side circuit 2, took away and put groove mould (as shown in Figure 7) with the band insulating substrate 1 of glue and juxtaposed flat conductor 2 (back side circuit).
6, on needing the position of via correspondence of conducting, double-sided circuit has the insulating barrier 3 of the two sides band glue of conducting window in advance with another, its tow sides respectively with back side circuit 2 (with insulating substrate 1) and front circuit 4 (with solder mask 5) to good position, with 120 ℃ to 150 ℃ precompressed 5 to 10 seconds, and superimposed forcing together, preliminary fixing, make on the bonding respectively tow sides that are pressed together on insulating barrier 3 of back side circuit 2 and front circuit 4.Then, be covered with release film again,, continued pressing, and fixedly secured this two- layer circuit 2 and 4 in 90 to 180 seconds with 150 ℃ to 180 ℃.Solidified 45 minutes to 90 minutes for 120 ℃ to 160 ℃ with baking box again, promptly realize the curing bonding (as Figure 11) of insulating barrier 3, back side circuit 2 and insulating substrate 1, front circuit 4 and the insulating substrate 5 (welding resistance) of two sides band glue.
7, printing word, this technology is traditional handicraft, does not carefully state at this.
8, butt welding point is carried out the OSP processing, and this technology is traditional handicraft, does not carefully state at this.
9, SMT soldered elements 6,7 and gap bridge bonding conductor 8 (as Figure 12), via 11 is by the soldering conducting of soldered elements, the application number that this technology can be applied on December 30th, 2009 referring to the inventor is 200910113662.9 patent of invention " double-sided PCB and the interconnection method thereof of band element ", and the full content of this patent application is incorporated among the application by reference.Source of welding current line used (as Fig. 1) when power supply pad 10 is the product application.These are technology well known in the art, repeat no more.
10, cut into required single products (as Fig. 1) with cutting die.
Below in conjunction with the accompanying drawings the method specific embodiment is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present utility model, especially the scope of claim does not have any restriction.
Claims (10)
1. double-sided PCB that adopts and put flat conductor to make comprises:
Paste hot pressing on the insulating substrate of the band glue that has window in advance first and put flat conductor, this first and put the front circuit that flat conductor forms described double-sided PCB, and this insulating substrate that has the band glue of window in advance forms solder mask;
Paste hot pressing on the insulating substrate of another band glue second and put flat conductor, this is second and put the back side circuit that flat conductor forms described double-sided PCB years old; With
Hold the insulating barrier of the two sides band glue of via successfully, wherein, the contraposition respectively of described front circuit and described back side circuit, superimposed and hot pressing are on the tow sides of the band glue of this insulating barrier.
2. double-sided PCB according to claim 1 is characterized in that, described via is taked electrically conductive ink or soldered elements or welding conductors conducting, and employing electrically conductive ink or welding conductors or soldered elements are realized the gap bridge conducting between circuit.
3. double-sided PCB according to claim 1 is characterized in that, the insulating substrate of described band glue is: epoxy glass base material, phenolic aldehyde base material, polyimide base material, metal base, or ceramic base material.
4. double-sided PCB according to claim 1 is characterized in that, described flat conductor is: copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.
5. double-sided PCB according to claim 2 is characterized in that, in position that cut-off circuit need disconnect and odt circuit need conducting via the time, the simultaneously also cut excision mouth that falls an identical size of the insulating substrate of described surface band glue.
6. double-sided PCB according to claim 1 is characterized in that, described double-sided PCB is flexible PCB or rigid circuit board.
7. double-sided PCB according to claim 1 is characterized in that, described double-sided PCB comprises on interlayer structure successively:
Ground floor: the first insulation solder mask;
The second layer: first and put the front line layer that flat conductor forms;
The 3rd layer: the insulating barrier of two sides band glue;
The 4th layer: second and put the back side line layer that flat conductor forms;
Layer 5: the second insulation solder mask; With
Layer 6 is: element and gap bridge conductive layer.
8. double-sided PCB according to claim 1 is characterized in that, described double-sided PCB is used for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube or LED Christmas lamp.
9. double-sided PCB according to claim 1, it is characterized in that, described flat conductor is to adopt the circle line pressure to prolong the flat conductor of making, or the flat conductor that cuts into metal forming, metallic plate or metal tape branch, or the flat conductor made from the flattening of stranded conductor bundle.
10. double-sided PCB according to claim 1 is characterized in that:
When needs are installed the jack element, directly in bond pad locations boring or punching, thereby with in the component pins patchhole and be welded on the line layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205233611U CN201797655U (en) | 2010-08-24 | 2010-08-24 | Double-side circuit board made of parallel flat leads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205233611U CN201797655U (en) | 2010-08-24 | 2010-08-24 | Double-side circuit board made of parallel flat leads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201797655U true CN201797655U (en) | 2011-04-13 |
Family
ID=43852551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205233611U Expired - Lifetime CN201797655U (en) | 2010-08-24 | 2010-08-24 | Double-side circuit board made of parallel flat leads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201797655U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103167724A (en) * | 2011-12-16 | 2013-06-19 | 田茂福 | Light-emitting diode (LED) double-sided circuit board made by four wires |
| CN104501013A (en) * | 2014-12-24 | 2015-04-08 | 付斌 | Led lamp |
| CN104953011A (en) * | 2015-06-26 | 2015-09-30 | 深圳市峻泽科技有限公司 | Substrate provided with metal layer and manufacturing method of substrate |
| WO2021057312A1 (en) * | 2019-09-27 | 2021-04-01 | 王定锋 | Led light strip capable of multi-directional turning installation and manufacturing method therefor |
-
2010
- 2010-08-24 CN CN2010205233611U patent/CN201797655U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103167724A (en) * | 2011-12-16 | 2013-06-19 | 田茂福 | Light-emitting diode (LED) double-sided circuit board made by four wires |
| CN103167724B (en) * | 2011-12-16 | 2016-04-20 | 田茂福 | With the LED double-sided wiring board of four wire producings |
| CN104501013A (en) * | 2014-12-24 | 2015-04-08 | 付斌 | Led lamp |
| CN104953011A (en) * | 2015-06-26 | 2015-09-30 | 深圳市峻泽科技有限公司 | Substrate provided with metal layer and manufacturing method of substrate |
| WO2021057312A1 (en) * | 2019-09-27 | 2021-04-01 | 王定锋 | Led light strip capable of multi-directional turning installation and manufacturing method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110413 |
|
| CX01 | Expiry of patent term |