CN103167724B - With the LED double-sided wiring board of four wire producings - Google Patents
With the LED double-sided wiring board of four wire producings Download PDFInfo
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- CN103167724B CN103167724B CN201110425526.0A CN201110425526A CN103167724B CN 103167724 B CN103167724 B CN 103167724B CN 201110425526 A CN201110425526 A CN 201110425526A CN 103167724 B CN103167724 B CN 103167724B
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Abstract
The present invention relates to the LED double-sided wiring board of a kind of use four wire producings, comprise: front line layer, comprise the first and second circuits longitudinally separated directly made by first, second plain conductor of two Alignments, the first and second circuits comprise first, second frontal line section separated by otch respectively; Reverse side line layer, reverse side line layer comprises the third and fourth circuit longitudinally separated directly formed by the 3rd, the 4th plain conductor of two articles of Alignments; Be arranged in the insulating barrier between front line layer and reverse side line layer; Cover the front cover on the line layer of front, be provided with multiple windowing thereon; This LED double-sided wiring board is provided with the interlayer conduction structure for the conductive communication between front line layer and reverse side line layer.This invention simplifies product structure and manufacture craft, reduce material cost and process costs, reduce environmental pollution and energy consumption, improve reliability and the yields of product.
Description
Technical field
The present invention relates to the field of LED circuit board, be specifically related to a kind of LED double-sided wiring board of use four wire producings of environment-friendly type.
Background technology
In the LED double-sided wiring board of prior art, general LED circuit board product does not have other independent conduction main line, and the conductive circuit layer of its main line inherently wiring board, is generally Copper Foil.
In actual applications, for the LED circuit board of this prior art, the LED of general employing such as about 3 is connected into one group, forms some LED series connection groups like this in LED circuit board.Typically, the head end of wiring board product and end all have positive-negative polarity (being namely arranged to both positive and negative polarity), when practical application, directly join end to end.
But, due to LED circuit board long time unavoidably there is resistance, therefore unsuitable long during series connection, otherwise excessive voltage attenuation can be caused.
And, if LED circuit board is long, LED series connection group in parallel is too much, the electric current that the main line of wiring board both sides needs load excessive, cause excessive heat, the heat that these heats work together with LED itself, not easily Quick diffusing falls, cause LED working temperature too high, and then affect the luminescent properties of LED and reliability and its useful life.
For this reason, the wiring board of prior art usually adopts wider and thicker copper foil circuit layer, and because the cost of Copper Foil is high, this inevitably causes higher material cost, and its final heat dispersion and functional reliability unsatisfactory.Such as, in actual applications, the total length after its connection is generally no more than 5 meters to the LED circuit board of this prior art, otherwise voltage attenuation is too much, be difficult to ensure all LED normal working voltages, and caloric value is excessive, radiating effect is bad, is difficult to be applied in the application scenario of high requirement.
Or, the wiring board of prior art also can adopt and be welded with wire to play the connection of enhancing conduction and to improve the heat dispersion of wiring board and the object of functional reliability, but, the extra wire that is welded with is set and needs extra technique, and the structure of wiring board can be made more complicated and expand, and this is all the segmental defect belonging to prior art.
In view of the above, in the urgent need to a kind of novel LED circuit board in this area, to alleviate or even to avoid above-mentioned defect, its cost of manufacture reduces, perfect heat-dissipating, reliability and the real work life-span of product improve all greatly, and its active length also can extend greatly, reduce environmental pollution and energy consumption.
Based on these problems of the prior art, and propose the present invention.
Summary of the invention
In view of the above, the present invention is proposed.The present invention is intended to solve the above technical problem with other.
According to the present invention, directly adopt four strip metal wires, preferably flat plain conductor, such as copper conductor, aluminum conductor, aluminium alloy conductor, copper alloy wire, nickel alclad wire, nickel iron clad wire etc., directly makes LED double-sided wiring board of the present invention.
Wherein, in this LED double-sided wiring board, multiple part of paths separated by otch that front line layer adopts the plain conductor of two Alignments to make are to serve as LED circuit, reverse side line layer then comprises the plain conductor of two other Alignment, these two wires are directly set to two and lead main line, and are communicated with front line layer by suitable mode.Like this, both the defect being welded with main traverse line had been avoided, and also overcome above-mentioned many defects of the prior art, such as need to carry out chemical etching (causing environmental pollution), wiring board can not be long, easily generates heat, reliability is low, and simplify the structure of wiring board, manufacture craft, reduce process costs and the cost of raw material, and reduce environmental pollution and energy consumption.And the LED double-faced flexible wiring board made like this can also improve product yields, improve the reliability of product.
According to an aspect of the present invention, disclose the LED double-sided wiring board of a kind of use four wire producings, it is characterized in that, comprise: front line layer, described front line layer comprises the longitudinal direction along described LED double-sided wiring board and isolated first and second circuits that are directly made by first, second plain conductor of two Alignments, and described first and second circuits comprise first, second frontal line section plural of being opened by slit space respectively; Reverse side line layer, described reverse side line layer comprises the longitudinal direction along described LED double-sided wiring board and isolated third and fourth circuit that are directly formed by the 3rd, the 4th plain conductor of two other Alignment; Be arranged in the insulating barrier between described front line layer and reverse side line layer; Front cover with covering on the front line layer of described LED double-sided wiring board, described front cover is provided with multiple windowing; Wherein, described LED double-sided wiring board is provided with the interlayer conduction structure for the conductive communication between front line layer and reverse side line layer.
According to a preferred embodiment of the invention, described third and fourth plain conductor is continuously the wire of uninterrupted length, and first, second plain conductor described is substantially parallel each other.
According to another preferred embodiment of the invention, reverse side coverlay or reverse side solder mask is provided with at the reverse side of described LED double-sided wiring board.
According to another preferred embodiment of the invention, described interlayer conduction structure comprises the via laid respectively on described front cover and windows, be positioned at the via of the relevant position on the first and second circuits of described front line layer, and be positioned at the interlayer conduction hole of the relevant position on described insulating barrier.
According to another preferred embodiment of the invention, the size that described via is windowed is greater than described via.
According to another preferred embodiment of the invention, be provided with reverse side coverlay or reverse side solder mask at the reverse side of described LED double-sided wiring board, and the third and fourth circuit of described reverse side line layer is used as the public main traverse line of described LED double-sided wiring board.
According to another preferred embodiment of the invention, described front cover can substitute with front solder mask.
According to another preferred embodiment of the invention, described front cover can substitute with front solder mask.
According to another preferred embodiment of the invention, multiple the windowing corresponding to a pair or multiple component pads well format on the position in a pair first and second frontal line sections comprising and being positioned on described front cover of windowing on described front cover.
According to another preferred embodiment of the invention, the width of described reverse side line layer is arranged to the width being greater than described front line layer, make described reverse side line layer on width, provide the reverse side expose portion exceeding described front line layer width, wherein, described interlayer conduction structure comprises the reverse side expose portion of described reverse side line layer.
According to another preferred embodiment of the invention, the width of described insulating barrier is greater than the width of described front line layer, and described interlayer conduction structure also comprises the line layer edge, front be arranged on described front cover windows, and be arranged on the insulating barrier interlayer conduction hole corresponding with the position windowed in line layer edge, described front on described insulating barrier.
According to another preferred embodiment of the invention, the width of described front line layer and described insulating barrier is arranged to substantially the same, and described interlayer conduction structure also comprises the line layer edge, front be arranged on described front cover windows.
According to another preferred embodiment of the invention, multiple on described front cover window and comprise windowing of pair of end well format near the end being positioned at described front cover.
According to another preferred embodiment of the invention, multiple windowing on described front cover comprises windowing of one or more soldering well format be positioned on described front cover, when the front line layer at described LED double-sided wiring board sticks described front cover, described one or more soldering hole each to be positioned on first, second frontal line section described and across first, second frontal line section described, to make to expose first, second frontal line section corresponding in each described soldering hole.
According to a preferred embodiment of the invention, described third and fourth plain conductor is continuously the wire of uninterrupted length.
According to another preferred embodiment of the invention, the plain conductor of described first, second, third, fourth Alignment is four strip metal wires parallel to each other.
According to another preferred embodiment of the invention, the otch on first, second frontal line section described is the otch of die-cut, cross cutting or laser cutting.
According to another preferred embodiment of the invention, described plain conductor is flat conductor or tinsel.
According to another preferred embodiment of the invention, described first and second front circuits are welded with LED, and described LED double-sided wiring board and the LED on it form the water-proof LED circuit board of embedding through encapsulating process.
According to another preferred embodiment of the invention, described plain conductor is selected from copper conductor, aluminum conductor, aluminium alloy conductor, copper alloy wire, nickel alclad wire or nickel iron clad wire.
According to another preferred embodiment of the invention, described reverse side coverlay also can arrange interlayer conduction structure.
According to another preferred embodiment of the invention, the uninterrupted length of described LED double-sided wiring board is 0.5-500 rice.
According to another preferred embodiment of the invention, described plain conductor is copper conductor.
According to another preferred embodiment of the invention, described copper conductor is the fine copper wire of T2 grade.
According to another preferred embodiment of the invention, also comprise and be arranged on LED in described LED circuit board and resistance, the model of wherein said LED comprise in 335,3528,5050 and 5060 one or more, the model of described resistance comprise in 0603,0805 and 0812 one or more.
According to another preferred embodiment of the invention, described LED double-sided wiring board is double-faced flexible wiring board.
According to another preferred embodiment of the invention, the width of described LED double-sided wiring board is 2-50 millimeter.
Following in the description of the drawings and specific embodiments, one or more embodiments of the detail of the present invention will be set forth.From these descriptions, accompanying drawing and claim, other features, objects and advantages of the present invention can be known.
LED double-sided wiring board cost of manufacture of the present invention reduces, and perfect heat-dissipating, reliability and the real work life-span of product improve all greatly, and its active length also extends greatly.
Accompanying drawing explanation
By reading this specification in conjunction with the following drawings, features, objects and advantages of the invention will become more apparent, in the accompanying drawings:
Fig. 1 is according to an embodiment of the invention by the front schematic view of the LED double-sided wiring board of four wire producings, shows the Facad structure of this double-sided wiring board.
Fig. 2 is according to an embodiment of the invention for covering the floor map of the front cover on the double-sided wiring board of LED shown in Fig. 1 front.
Fig. 3 is according to an embodiment of the invention for being arranged on the insulating barrier between the front line layer of LED double-sided wiring board of the present invention and reverse side line layer.
Fig. 4 is the floor map of the reverse side line layer of the double-sided wiring board of LED shown in Fig. 1.
Fig. 5 is according to an embodiment of the invention for covering the floor map of the reverse side coverlay on LED double-sided wiring board reverse side of the present invention.
Fig. 6 be according to one embodiment of the invention by the cross sectional representation of the LED double-sided wiring board of four wire producings, show schematically show the cross-sectional structure of this LED double-sided wiring board, the conducting structure especially between front, reverse side line layer.
Fig. 7 be according to another embodiment of the present invention by the cross sectional representation of the LED double-sided wiring board of four wire producings, show schematically show the cross-sectional structure of this LED double-sided wiring board, the conducting structure especially between front, reverse side line layer.
Embodiment
Term " double-sided wiring board " refers to and is all provided with circuit the two-sided of this wiring board.
Before describing the present invention in detail, those skilled in the art are to be understood that, " element " should do the understanding in the most wide in range connotation in this application, namely the element of all types of electronic component for circuit, electric component or other type is comprised, such as various resistance, the element of various surface mount (SMT) type, the element of support rack type, various high power device etc., comprise great power LED, etc.
In addition, term " wiring board " and " circuit board " can use interchangeably in the application.
Below in conjunction with drawings and Examples, the manufacturing process of LED circuit board of the present invention and structure are described in further detail.
The related materials of LED circuit board
The coiled material also referred to as copper-clad plate rolled up by the raw material of the two-sided flexible circuit board of tradition of prior art.In the structure of this LED circuit board, typical structure is five layers, namely, (modal be adopt Copper Foil to two-layer line layer, can be described as again copper clad layers or Copper Foil in the present embodiment, these terms use sometimes interchangeably), and be bonded in the insulating barrier between this two-layer line layer.Insulating barrier defines the basal layer of flexible circuit.Be respectively equipped with the cover layer that (mode of such as bonding, coating, coating or printing) plays protective action in the outside of this two-layer line layer, this cover layer such as can be made up of CVL.
Certainly, in fact, usually adhesive layer can be respectively equipped with respectively and between insulating barrier at two-layer line layer, for line layer and insulating barrier being glued together.Therefore, under a lot of situation, this LED circuit board structure of prior art is actually the complicated structure of seven layers.
The material of insulating barrier has many kinds, and wherein the most conventional is polytetrafluoroethylene, polyimides, polyester and PI (PI) material.Polyimide material has non-flammable, physical dimension is stablized, there is higher tensile strength, and there is the ability of bearing welding temperature, polyester, also referred to as PETG (being called for short PET), its physical property is similar to polyimides, have lower dielectric constant, the humidity of absorption is very little, but non-refractory.Polyester presents rigidity in cryogenic applications.These materials all can be used for forming insulating barrier.
Copper Foil is generally suitable for being used as line layer among flexible circuit, and it can adopt the mode of electro-deposition (ED), forging.Copper Foil is the material with compliance, can be made into be permitted multi-thickness and width.The Copper Foil of forging, except having pliability, also has the feature that hard is level and smooth, it be suitable for being applied in require Dynamic flexural occasion among.
Plain conductor of the present invention obviously can adopt Copper Foil, but is not limited to Copper Foil.Such as, thicker copper sheet or sheet metal can also be adopted, or other flat metal wire, etc.Or, can also metallic cable etc. be adopted.
According to one embodiment of the invention, adoptable material is fine copper or copper alloy aborning at present, such as zinc yellow copper, and the thickness of Copper Foil is more than 1 ounce.If employing fine copper, then the General Requirements of fine copper is T2 copper.The requirement of copper alloy is generally Tp2 or copper content more than 20%, and remaining composition can be zinc (Zn) or other trace additives.But the present invention is not limited to these copper or copper alloy.
The wiring of LED circuit board product and windowing
According to different application scenarios, the wiring and the different pads that design LED Double-side line panel products of the present invention are windowed, to meet different products and the requirement of purposes.These all belong to scope of the present invention, and therefore the present invention is not limited to disclosed the drawings and specific embodiments, and scope of the present invention is limited by claim.
The technological process of the LED circuit board product of prior art
The manufacturing process of the dual surface LED wiring board of prior art generally comprises main technological process and auxiliary process flow process.
Main flow: sawing sheet (opens base material, base material is two-sided 1OZ base material, base material herein refer to by the PI of two-layer 10Z Copper Foil, the glue of two-layer 25 microns and one deck 25 microns totally 5 layers form)-boring (brill base material)-heavy copper-copper facing-exposure-development-etch-paste epiphragma (obverse and reverse coverlay pastes on wiring board after the etching simultaneously)-pressing-baking-silk-screen-electrical measurement-anti-oxidation-profile-FQC-packaging-shipment.
Secondary flow journey: sawing sheet (obverse and reverse coverlay)-boring (bore obverse and reverse coverlay)-proceed to pastes epiphragma operation.
What traditional LED circuit board of prior art needed to use aborning is sulfuric acid, the highly basic acidic materials such as hydrochloric acid, nitric acid, NaOH, sodium carbonate is used for heavy copper and circuit etching, and this kind of manufacturing process not only manufacturing cost is high but also can bring severe contamination to environment.
The typical process of LED circuit board product of the present invention
Fig. 1 be one embodiment of the invention by the floor map of the LED double-sided wiring board of four wire producings, show the Facad structure of this double-sided wiring board.
Exemplary but do not have restrictive execution mode according to one, a kind of embodiment of the manufacture craft of such as LED double-sided wiring board as shown in Figure 1 of the present invention is as follows.
Main technique (a): provide two Alignments (preferred substantially parallel arrangement) but the plain conductor 1 be spaced along the longitudinal each other, 2 (are preferably flat metal wire, but be not limited to this), as shown in Figure 1, Fig. 1 is according to an embodiment of the invention by the front schematic view of the LED double-sided wiring board of four wire producings, shows the Facad structure of this double-sided wiring board.
By the front line layer of this two strip metals wire 1,2 as LED double-sided wiring board of the present invention, this front line layer comprises first line and the second circuit.To this plain conductor 1,2 carry out cross cutting or die-cut or laser cutting, thus respectively at plain conductor 1, multiple otch 3 (as shown in Figure 1) is formed on 2, thus make first line and the second circuit 1,2 each self-formings, by the isolated multiple part of path of respective cut 3, thus at each first line and the second circuit 1, define the disconnection of circuit between the adjacent lines section in 2.Like this, by such as between adjacent part of path by burn-on in respective pad position LED and/or other components and parts, and/or direct scolding tin conducting pad, just can form the coupled in series of the circuit of multiple part of path.
There is provided front cover 4 (as shown in Figure 2), Fig. 2 is according to an embodiment of the invention for covering the floor map of the front cover 4 on the double-sided wiring board of LED shown in Fig. 1 front.As required, front cover 4 provides multiple and correspond to windowing of the open-cellular form of pad locations, certainly, it will be appreciated by those skilled in the art that, the form of windowing, except circular hole, can also be the form of any appropriate, such as slotted eye, square opening, rectangular opening, groove, etc.
Third and fourth wire 9 of two other Alignment, 10 reverse side circuit 9,10 (such as shown in Figure 4) be layer by layer used as in this embodiment, such as to serve as front line layer 1, the public main traverse line of 2, is mainly used for the operating current that operationally load is a large amount of.Fig. 4 is the floor map of the reverse side line layer of the double-sided wiring board of LED shown in Fig. 1.
At front line layer 1,2 with reverse side line layer 9, (preferred pressing) is set between 10 and has insulating barrier, be preferably dielectric film 11, such as shown in Figure 3, Fig. 3 is according to an embodiment of the invention for being arranged on the insulating barrier 11 between the front line layer of the double-sided wiring board of LED shown in Fig. 1 and reverse side line layer.
Fig. 6 is the cross sectional representation of LED double-sided wiring board according to Fig. 1 of one embodiment of the invention, show schematically show the cross-sectional structure of this LED double-sided wiring board, especially front line layer 1,2 with reverse side line layer 9, the conducting structure between 10.In this embodiment, the first line 1 and the second circuit 2 in front all have one or more via 8 ", and correspondence position on front cover 4 provides corresponding via and window 8.As shown in Figure 6, via is windowed and 8 is preferably arranged to dimensionally be greater than via 8 " so that be such as easier to soldering conducting.But, it will be understood by those skilled in the art that via window 8 can be arranged to substantially with via 8 " size is identical.Further, shown in Fig. 3, the correspondence position of dielectric film 11 also provides corresponding interlayer conduction hole 8 ', as shown in Figure 3 and Figure 6.Like this, as Fig. 6 clearly illustrates, just provide front line layer 1,2 and reverse side line layer 9, the approach of conductive communication between 10.Like this, when welding, such as, during SMT soldering, just can window at pad 8 position, such as adopt the mode of such as soldering (or fill with tin cream+soldering), by the corresponding line conductive communication of front line layer 1,2 with reverse side line layer 9,10.
According to a preferred embodiment, although not shown in Fig. 6, but, it will be understood by those skilled in the art that and can utilize corresponding mould, by reverse side line layer 9,10 upwards to push up in the position in interlayer conduction hole 8 ' to front line layer 1,2 is concordant or substantially concordant, the welding conducting after being so just more convenient for carrying out, such as soldering conducting technique.
As to a kind of alternative of conducting structure shown in Fig. 6 or the embodiment as a kind of additional conducting on its basis, conducting structure as shown in Figure 7 can also be provided.
Fig. 7 is the cross sectional representation of another kind of conducting structure, as shown in Figure 7, can by reverse side line layer 9, the width of 10 is arranged to than front line layer 1,2 and insulating barrier 11 wider, therefore on the width of reverse side line layer 9,10, reverse side expose portion (as shown in the dashed circle base section in Fig. 7) of knowing clearly is formed.And, due to front line layer 1,2 can be arranged to substantially identical with the width of both insulating barriers 11 and all be less than reverse side line layer 9, the width of 10, therefore in order to form interlayer conduction, line layer edge, front can be set window (not shown) in precalculated position on front cover 4 (this position corresponds to the outward flange of front line layer 1,2), just obtain cross-sectional structure as shown in Figure 7.
Such benefit is, without the need to going out insulating barrier interlayer conduction hole with position corresponding to position of windowing, line layer edge, front again on insulating barrier 11, just can directly be windowed by the line layer edge, front on front cover 4 and by the edge of front line layer) and adjacent reverse side line layer position directly come out, thus can by means of the mode of such as soldering or printing conductive inks by reverse side line layer 9,10 with the direct conducting of front line layer 1,2.And because reverse side line layer 9,10 can serve as the public main traverse line of load current, therefore front line layer 1, the width of 2 can make narrow as far as possible, thus reduces the material cost of front line layer 1,2.Such as, manufacture a finished product as the LED double-sided wiring board of about 28 millimeters, the width of the main line of reverse side line layer can be about 2.3 millimeters, the width of front line layer then can be narrow many.
In this conducting structure, due to reverse side line layer 9, the width of 10 is arranged to than front line layer 1,2 wider (window at edge position or on whole wiring board), and therefore expose reverse side line layer 9,10, so just can obtain conducting welding position as shown in the dashed circle in Fig. 7 (namely, belong to interlayer conduction structure), can by adopting the mode of such as soldering or printing conductive inks (or filling tin cream+soldering) in this position, by the corresponding line conductive communication of front line layer 1,2 with reverse side line layer 9,10.Certainly, it will be understood by those skilled in the art that can only by the mode of print solder paste by the conducting of obverse and reverse line layer.
As to another kind of alternate embodiments embodiment illustrated in fig. 7 or supplementary features, except by front line layer 1, the width of 2 is arranged to be less than reverse side line layer 9, beyond the width of 10, position corresponding to position can also be windowed by such as punching or hole and form insulating barrier interlayer conduction hole (not shown) with line layer edge, front on insulating barrier 11, thus also expose the mode of reverse side line layer 9,10 Copper Foil, the means of interlayer conduction are provided.Here, the copper of obverse and reverse line layer will be exposed in position of windowing at this line layer edge, front, insulating barrier interlayer conduction hole, can be formed the line conduction of front line layer 1,2 and reverse side line layer 9,10 here by the mode of such as soldering.
In above this mode, front line layer 1,2 is not necessarily substantially identical with the width of both insulating barriers 11, can be different yet, and the width of such as insulating barrier 11 can be greater than the width of front line layer 1,2.
Therefore, as mentioned above, according to different application requirements, the via arranged by difference, front working line 1,2 can be connected in series to (positive and negative electrode) wire 9 of reverse side line layer, on 10, also can be parallel to the wire 9 of this reverse side line layer, on 10.As other embodiment, also can be the wire 9 that the partial line section of front working line 1,2 is parallel to this reverse side line layer, on 10, or the partial line section of front working line 1,2 be connected in series to the wire 9 of this reverse side line layer, on 10.As another embodiment, these frontal line sections 1,2 can in parallel, the wire 9 that is connected in series to this reverse side line layer in an alternating fashion, on 10.The wire 9,10 of this reverse side line layer can be used as negative or positive electrode main traverse line interchangeably.All these belongs to scope of the present invention.
As mentioned above, those skilled in the art are obviously appreciated that, the wire 9 of this reverse side line layer, the main traverse line that 10 its effects are not limited in as load current, such as also there is other useful technique effect, such as, can improve heat radiation, improve reliability, extend the active length of LED circuit board, etc.
Preferably do not carry out any cutting processing to the wire 9,10 of this reverse side line layer, therefore they can be continuous continual random lengths.
Front cover 4 is covered the front working line 1,2 of the LED circuit board shown in Fig. 1.Fig. 2 is according to an embodiment of the invention for covering the floor map with various front cover 4 of windowing on the double-sided wiring board of LED shown in Fig. 1 front.Certainly, it will be understood by those skilled in the art that the needs according to application, setting, position, quantity that various on front cover 4 are windowed all can change, and do not have any restriction.
In one embodiment, a pair stomidium 5 can be provided on front cover 4, windowing of 5 forms, when sticking this front cover 4 on the wiring board of Fig. 1, this is to stomidium 5, and 5 lay respectively at the frontal line section 1 near the end of line layer, on 2, can so that be formed with other LED circuit board and be electrically connected, the form such as connected by soldering or metal connecting piece realizes this electrical connection.Certainly, in another embodiment, such as, can also provide two or more, such as 3 (shown in Fig. 1), one of them stomidium 5 can also be used for the adjacent lines section coupled in series with same circuit, or with adjacent circuit coupled in series, as shown in Figure 1.
In another embodiment, on front cover 4 correspond to frontal line section 1, the position of 2 also can provide a pair component pads hole 6, windowing of 6 forms, wherein this lays respectively at this frontal line section 1 to component pads hole 6,6, on 2, so that by welding electronic component, such as LED, resistance, electric capacity etc. realize being connected in series such as by this frontal line section 1,2 and these electronic devices and components.It will be understood by those skilled in the art that can frontal line section 1 on front cover 4, arranges windowing of one or more pairs of such component pads hole 6,6 form on 2.
In another embodiment, the position corresponding to the only about half of width of line layer on front cover 4, can arrange windowing of soldering hole 7 form.This windows across a pair frontal line section 1, the interval along wiring board longitudinal direction between 2, and will expose on circuit board finished product simultaneously corresponding this to the part circuit in frontal line section 1,2, to provide soldering dish 7.This soldering hole 7 be arranged so that needs in directly can realize this to frontal line section 1, being directly electrically connected in series between 2 by the mode of such as this pad 7 of soldering.It will be understood by those skilled in the art that as required, can frontal line section 1 on front cover 4, windowing of one or more such soldering hole 7 form is set on 2.
As mentioned above, one or more via 8 can be all had in the first line 1 in the front shown in Fig. 1 and the second circuit 2 " (such as Fig. 6 shown in), and correspondence position on front cover 4 provides corresponding via and to window 8 (such as shown in Fig. 1).Further, shown in Fig. 3, the correspondence position of dielectric film 11 also provides corresponding interlayer conduction hole 8 ' (such as shown in Fig. 6), which provides the interlayer conductive communication structure between front line layer and reverse side line layer.
According to application needs, can to attach at the reverse side of wiring board shown in Fig. 1, reverse side coverlay 12 in pressing, as shown in Figure 5.
According to another preferably but not there is restrictive embodiment, can also between the position providing layer of the stomidium 5 of front cover conducting structure, namely, at front line layer 1, 2, insulating barrier 11, reverse side line layer 9, 10 and reverse side coverlay 12 on correspond to the position of front cover stomidium 5, all through hole is set and defines interlayer conduction structure, thus make it possible to conveniently by with between an other same LED circuit board arranged via this interlayer conduction structure to form electrical connection, the mode of soldering or connection metal connecting piece of such as carrying out in this interlayer conduction structure is to realize this electrical connection.
Secondary flow journey (b): as required, carries out conventional baking-silk-screen-electrical measurement-anti-oxidation-profile-FQC-packaging-shipment etc. operation, completes the LED double-sided wiring board of use four wire producings of this embodiment of the present invention.
As mentioned above, those skilled in the art obviously can know, this manufacture craft does not relate to the technique of heavy copper, copper facing, exposure, development, etching etc. the contaminated environment of prior art at all, therefore very environmental protection.Moreover, its manufacture craft simplifies greatly, has deleted the processing step of many prior aries, so the whole manufacture craft of LED circuit board not only has unrivaled superiority in environmental protection, and the cost of its manufacture craft also reduces greatly.
As mentioned above, this area designer be appreciated that, in addition, because LED double-sided wiring board of the present invention can adopt two public main traverse lines of the two strip metal wire producings being directly set to reverse side line layer to conduct electricity, therefore be no matter width or its thickness of the Copper Foil in wiring board, compared with the LED circuit board of prior art, can be designed to less.Like this, just greatly material cost can be reduced.
Such as, the thickness of the conducting wire layer material (such as Copper Foil) of wiring board can be reduced to 0.01 millimeter, certainly, also can be designed so that its thickness is more than 0.01 millimeter.
Be suitable for the LED installed in the circuit board and can comprise various types of LED, such as model is the monochromatic or RGB three-color LED lights such as 335,3528,5050, etc.The model of resistance can be 0603,0805,0812, etc.
Obviously, this area designer is appreciated that according to different application scenarios and customer requirement completely, and LED circuit board of the present invention can comprise other various types of LED, resistance and other components and parts etc.
For public main traverse line 9,10, can be made up of any conductive metal or alloy material.It can be made up of conductive metal materials such as copper, aluminium, copper alloy, aluminium alloys.
In addition, as another preferred version, public main traverse line 9,10 also can be wrapped through coil winding machine by some fine rules and form, and namely forms twisted wire.The line diameter of this some fine rule is minimum can be 0.01 millimeter.
The thickness of public main traverse line 9,10 is determined according to the length of the LED circuit board that will connect (light bar).Theoretically, LED circuit board assembly according to the present invention can adopt public main traverse line 9,10 in parallel, series connection (or simultaneously there is in parallel and series connection) is connected the LED circuit of many single hops, makes the length of finished product LED can arrive continuous continual indefinite length.Therefore, public main traverse line 9,10 can be unlimited continuous print length.
Front of the present invention LED circuit 1,2 and main traverse line 9,10 through encapsulating process, can become the water-proof LED circuit board of embedding, wherein, the main traverse line of front LED circuit and reverse side line layer all can by while casting glue get up with the mode embedding of waterproof sealing.
As mentioned above, one of design production decision of existing LED circuit board thickeies by the metal (Copper Foil) of product, to increase the ability of product by electric current.
But, according to the present invention, main traverse line 9 can be increased neatly, the rugosity (thickness and/or width) of 10, and then improve the ability of main traverse line 9,10 loaded current.
In sum, according to the present invention, the processing condition and method of environmental protection LED circuit board can be adopted to produce wiring board, reduce the thickness in front line layer (being generally Copper Foil).
Describe specific embodiments of the invention above.But should be appreciated that under the premise without departing from the spirit and scope of the present invention, can various amendment be carried out.Therefore, other embodiment also all belongs to the protection range of claim of the present invention.
Claims (9)
1., with a LED double-sided wiring board for four wire producings, it is characterized in that, comprising:
Front line layer, described front line layer comprises the longitudinal direction along described LED double-sided wiring board and isolated first and second circuits that are directly made by first, second plain conductor of two Alignments, and described first and second circuits comprise first, second frontal line section plural of being opened by slit space respectively;
Reverse side line layer, described reverse side line layer comprises the longitudinal direction along described LED double-sided wiring board and isolated third and fourth circuit that are directly formed by the 3rd, the 4th plain conductor of two other Alignment;
Be arranged in the insulating barrier between described front line layer and reverse side line layer; With
Cover the front cover on the front line layer of described LED double-sided wiring board, described front cover is provided with multiple windowing;
Wherein, described LED double-sided wiring board is provided with the interlayer conduction structure for the conductive communication between front line layer and reverse side line layer; And
Wherein, the width of described reverse side line layer is arranged to the width being greater than described front line layer, make described reverse side line layer on width, provide the reverse side expose portion exceeding described front line layer width, wherein, described interlayer conduction structure comprises the reverse side expose portion of described reverse side line layer.
2. LED double-sided wiring board according to claim 1, is characterized in that, described third and fourth plain conductor is continuously the wire of uninterrupted length, and first, second plain conductor described is parallel to each other.
3. LED double-sided wiring board according to claim 1, it is characterized in that, be provided with reverse side coverlay or reverse side solder mask at the reverse side of described LED double-sided wiring board, and the third and fourth circuit of described reverse side line layer is used as the public main traverse line of described LED double-sided wiring board.
4. LED double-sided wiring board according to claim 1, it is characterized in that, described interlayer conduction structure comprises the via laid respectively on described front cover and windows, be positioned at the via of the relevant position on the first and second circuits of described front line layer, and be positioned at the interlayer conduction hole of the relevant position on described insulating barrier.
5. LED double-sided wiring board according to claim 1, it is characterized in that, multiple the windowing corresponding to a pair or multiple component pads well format on the position in a pair first and second frontal line sections comprising and being positioned on described front cover of windowing on described front cover.
6. LED double-sided wiring board according to claim 1, it is characterized in that, the width of described insulating barrier is greater than the width of described front line layer, and described interlayer conduction structure also comprises the line layer edge, front be arranged on described front cover windows, and be arranged on the insulating barrier interlayer conduction hole corresponding with the position windowed in line layer edge, described front on described insulating barrier.
7. LED double-sided wiring board according to claim 1, is characterized in that, the width of described front line layer and described insulating barrier is arranged to identical, and described interlayer conduction structure also comprises the line layer edge, front be arranged on described front cover windows.
8. LED double-sided wiring board according to claim 1, is characterized in that, multiple on described front cover window and comprise windowing of pair of end well format near the end being positioned at described front cover.
9. LED double-sided wiring board according to claim 1, it is characterized in that, multiple windowing on described front cover comprises windowing of one or more soldering well format be positioned on described front cover, when the front line layer at described LED double-sided wiring board sticks described front cover, described one or more soldering hole each to be positioned on first, second frontal line section described and across first, second frontal line section described, to make to expose first, second frontal line section corresponding in each described soldering hole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110425526.0A CN103167724B (en) | 2011-12-16 | 2011-12-16 | With the LED double-sided wiring board of four wire producings |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110425526.0A CN103167724B (en) | 2011-12-16 | 2011-12-16 | With the LED double-sided wiring board of four wire producings |
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| CN103167724A CN103167724A (en) | 2013-06-19 |
| CN103167724B true CN103167724B (en) | 2016-04-20 |
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| CN104411087B (en) * | 2014-11-28 | 2017-10-17 | 江门市宏丰电子科技有限公司 | A kind of pcb board with stepped hole |
| CN106132112B (en) * | 2016-06-28 | 2018-12-04 | 广东顺德施瑞科技有限公司 | A kind of preparation method of bilayer high-pressure lamp band |
| CN107940288A (en) * | 2017-12-07 | 2018-04-20 | 江门黑氪光电科技有限公司 | A kind of water-proof LED lamp belt using multilayer circuit board |
| CN107864562A (en) * | 2017-12-20 | 2018-03-30 | 惠州市串联电子科技有限公司 | A kind of LED circuit board and preparation method thereof |
| CN110112126A (en) * | 2019-05-16 | 2019-08-09 | 深圳市兆驰节能照明股份有限公司 | Display device and display module and its manufacturing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201797655U (en) * | 2010-08-24 | 2011-04-13 | 张�林 | Double-side circuit board made of parallel flat leads |
| CN202535630U (en) * | 2011-12-16 | 2012-11-14 | 田茂福 | A LED double-sided circuit board produced by four wires |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6653572B2 (en) * | 2001-02-07 | 2003-11-25 | The Furukawa Electric Co., Ltd. | Multilayer circuit board |
| JP2009088337A (en) * | 2007-10-01 | 2009-04-23 | Nippon Mektron Ltd | Printed circuit board and its manufacturing method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201797655U (en) * | 2010-08-24 | 2011-04-13 | 张�林 | Double-side circuit board made of parallel flat leads |
| CN202535630U (en) * | 2011-12-16 | 2012-11-14 | 田茂福 | A LED double-sided circuit board produced by four wires |
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