CN106132112B - A kind of preparation method of bilayer high-pressure lamp band - Google Patents
A kind of preparation method of bilayer high-pressure lamp band Download PDFInfo
- Publication number
- CN106132112B CN106132112B CN201610507815.8A CN201610507815A CN106132112B CN 106132112 B CN106132112 B CN 106132112B CN 201610507815 A CN201610507815 A CN 201610507815A CN 106132112 B CN106132112 B CN 106132112B
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- Prior art keywords
- wiring board
- preparation
- overlay film
- lamp band
- pressure lamp
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Abstract
The invention discloses a kind of preparation methods of double-deck high-pressure lamp band, include the following steps: S1, prepare bottom overlay film wiring board；S2, preparation middle layer overlay film wiring board；S3, dual-layer metal line wiring board is prepared；S4, blade coating tin cream；S5, patch, Reflow Soldering, correction squeeze out encapsulated, final finished product light bar after repairing lamp.Two of conventional high-tension light bar main lines in parallel are integrated into the route of same layer by the present invention, reduce the process of artificial plug lamp, are conducive to automated production, and without splicing, monovolume length up to 250m, can continuous production, it is unrestricted.Secondly, improve existing wireless light bar since route is narrow, the excessive problem of pressure drop.Meanwhile the good heat dissipation effect of lower layer's copper can slow down the light decay of LED lamp, prolong the service life.
Description
Technical field
The present invention relates to LED high-voltage light bar more particularly to a kind of preparation methods of the double-deck high-pressure lamp band.
Background technique
LED high-voltage light bar refers to LED lamp bead is welded on flexible circuitry substrate by welding, reconnects outer
Core wire access electric current is connect, band-like FPCB (Flexible Printed Circuit Board flexible print circuit board) is made to be powered
It shines, because its shape of product is as a band, arbitrarily can bend to any shape and gain the name.Its component part mainly have FPCB,
SMD lamp bead, resistance, common use condition are 110V/220V.High-pressure lamp band can be directly connected to standard household AC electrical and use (America and Europe
National household voltage is 110V), it can reach 50~100m usually using length.
Traditional LED high-voltage light bar will first post the flexible circuit board (FPC) of lamp bead and resistance, first half and half meters (or one
One meter of rice) strip is connected with tin by hand, then drawn in the rubber for having core wire in advance through manually filling in wiring board, it welds in parallel main
It carries out drawing glue to squeeze out second after line.Its defect is quite obvious, needs manually to splice, and all there are vacancy, core wires for each meter of section
Artificial bracing wire is needed, working efficiency is low, takes very much manually, secondly, the circuit line width 1.8mm of traditional LED high-voltage light bar, due to line
Road is narrow to cause pressure drop big, and service life is short, in addition, flexible poor, bending angle is limited, and easy fold, and texture is low, and condition is poor.
Existing flexible circuitry substrate either single sided board or dual platen are mostly that etching technique is used to lose in copper-clad plate
Carve route, etching technique relative maturity can etch complicated route, but the technical costs is high, pollution is big and thick
The substrate of degree more is more difficult to etch, in addition, material can only be etched as unit of half meter, actually be made when producing in enormous quantities
Used time needs to realize the connection of two pieces of circuit boards by the welding of junction, is easy to appear rosin joint phenomenon, seriously affects efficiency
With increase cost.
In order to overcome the defect of etching technique, application No. is 201010232537.2 Chinese patents " to be led using juxtaposed
The method of line production single-sided circuit board " a kind of method using juxtaposed flat conductor production single-sided circuit board is disclosed, directly
After the cover film and juxtaposed flat conductor heat pressure adhesive for being provided with pad openings, the position that excision flat conductor needs to disconnect,
Then it is pressed together on together on the board substrate with adhesivity, connection of passing a bridge is using printing electrically conductive ink or welding conductors
To connect.As can be seen that the patent be a plurality of flat conductor in parallel side by side after hot pressing cover film, adjacent two parallel circuits it
Between can only be connected by connecting bridge, so cannot be used for complicated circuit design, especially turning connects more circuit design,
And connecting bridge is more, is realized by welding, it is difficult to ensure the permanent stability of pad is easy to influence because of rosin joint
It uses, in addition, the patent complex process, needs to cut off the position of disconnection, then press to circuit board again after flat conductor hot pressing
On substrate, it is then welded to connect bridge again, once technique is complicated, and production capacity is with regard to low, and to may be only available for route simple for this method
In the case of, it is not suitable for complicated circuit design, it can not wide popularization and application.
Summary of the invention
In view of the drawbacks of the prior art, the present invention provides one kind and can continuously produce automatically, without splicing, high-efficient, service life
The preparation method of the long double-deck high-pressure lamp band.
The present invention is achieved by the following technical programs:
A kind of preparation method of bilayer high-pressure lamp band, includes the following steps:
S1, it prepares bottom overlay film wiring board: the edge of a knife of cutter is arranged to shape corresponding with route, then to passing through
The first metal base that thermosetting film is pasted in advance with the first insulating substrate is punched out, and controls the punching depth and the first gold medal of cutter
The consistency of thickness for belonging to substrate, waste material is removed after punching can form bottom overlay film wiring board；
S2, preparation middle layer overlay film wiring board: by the second metal base be attached in advance it is two-sided it is pre- coat thermosetting film second absolutely
On edge substrate, then by the edge of a knife of cutter be arranged to preset route shape, different punching depths is controlled, at certain
A little specific positions do hemisection or cut entirely, and waste material, that is, plastic middle layer overlay film wiring board is removed after punching；In high pressure lamp belt circuit board
Upper layer circuit in, it is also necessary in addition one copper foil is cut through row together with insulating substrate in specific position (each rice) by mold
It removes, copper under excision position is exposed after MULTILAYER COMPOSITE, the position is referred to as mouth in parallel.
S3, prepare dual-layer metal line wiring board: by the edge of a knife of cutter be arranged to preset route shape, will cover
Film is cut into corresponding pad opening in component placement position, then in step S1, S2 bottom overlay film wiring board and
Middle layer overlay film wiring board is to good position, and then hot-press solidifying, realizes cover film, bottom overlay film wiring board and middle layer overlay film wiring board
Bonding；
S4, blade coating tin cream: by tin cream blade coating at upper and lower lead to the hole site, the conducting of route up and down is realized；
S5, patch, Reflow Soldering, correction squeeze out encapsulated, final finished product light bar after repairing lamp.
Two of conventional high-tension light bar main lines in parallel are integrated into the route of same layer by the present invention, reduce artificial plug lamp
Process, is conducive to automated production, and without splicing, monovolume length up to 250m, can continuous production, it is unrestricted.Secondly, this
Invention is different from conventional high-tension light bar and wireless light bar, and two main lines are creatively integrated into the lower layer position of wiring board, single
Line width 3.75mm, not only solves conventional lights band plug lamp and takes artificial obstacle, also improve existing wireless light bar due to route
It is narrow, the excessive problem of pressure drop.Meanwhile the good heat dissipation effect of lower layer's copper can slow down the light decay of LED lamp, prolong the service life.
In addition, bottom of the invention/middle layer overlay film wiring board is 110V/220V generic disk, it only need to be by welding different pad positions
Realize the light switching of 110V and 220V, wherein 220V is one meter of one unit, and 110V is then half meter of one unit.
Wherein, in step S5 specifically: select corresponding steel mesh, paint tin cream in cover film windowing hole location correspondence, then pass through
The components such as resistance lamp bead are placed on wiring board by patch device.It may be noted that every meter of place's plug pad of wiring board needs accordingly
Tu tin cream is scraped, locates upper tin cream for every meter and realizes parallel connection, it is main to replace the operation that connection is manually packed in traditional handicraft, to ensure finished product lamp
Band every meter of position realize it is in parallel under copper wire to guarantee the input voltage of every meter of 220V.After the completion of patch need that component will be posted
Carry out heating melting, melting process is that wiring board is steadily delivered to Reflow Soldering, and tin cream can generate molten during crossing Reflow Soldering
Melt, component is fixed on wiring board.After high temperature reflux welding by Reflow Soldering, to there is deflection in solder reflow process
Component is corrected finishing, lights and semi-finished product light bar bare board is made after test passes through, then carry out squeezing out it is encapsulated, it is final to be made
Finished product light bar.The present invention is reduced route fever, is prolonged the service life using the route design gone here and there entirely, every meter of 60 lamp, 30 resistance.
Preferably, the cutter are dise knife.When cutter are flat cutter, the flat cutter edge of a knife is arranged to shape corresponding with route
Shape, it is once a cycle that flat cutter, which moves up and down, each period is one-step punching, and when cutter are dise knife, it sets on dise knife
For the corresponding shape of route or the shape of multiple same lines, it is once a cycle that dise knife, which rolls, i.e. dise knife rotation is primary, i.e.,
One or more routes can be punched, and flat cutter has back the movement of knife after punching, and dise knife does not need, so the time is saved,
In addition, designing the shape of multiple same lines on dise knife, rolling can once be punched multiple routes, largely improve efficiency.
Further, step S1, the pre- patch temperature in S2 is 90~110 DEG C.Thermosetting film of the invention is laminate polyester.
Laminate polyester is easier control viscosity, and more stable.And epoxy glue glues dead copper due to can gradually react at normal temperature
Foil, if again copper foil is difficult to adhere under low temperature, thus this pre- patch temperature is difficult to hold for epoxy glue.
Wherein, the consistency of thickness of the punching depth for being partly cut to cutter in step S2 and the second metal base, do not cut and
Second insulating substrate；It is cut to the second metal base of cutting and the second insulating substrate entirely.Cover film is first torn before contraposition in step S3
Fall release paper.
The temperature of hot pressing is 130~150 DEG C in step S3, and condition of cure solidifies 30~60 minutes at a temperature of being 130 DEG C.Gu
Changing the time is mainly to guarantee that glue-line has time enough to react and improves cohesive strength, may cause glue if the time is inadequate
Layer cohesive strength be not high and leads to the decline of heat resistance.
Preferably, the insulating substrate is heat resist modification PET film, and the metal base is copper foil.Conventionally employed is
PI film and epoxy glue, due to the property of PI film and epoxy glue, the traditional circuit plate being prepared can only store under cryogenic,
And the service life is short.PET film can not do patch since temperature tolerance is poor, and tilting, epoxy glue initial adhesive strength can be generally shunk at 220 DEG C
Greatly, it can store under normal temperature conditions, but same temperature tolerance is poor, and the present invention uses heat resist modification PET film pre- for early period
Draw ratio horizontal in treatment process/vertical is 2.5~2.8, and lesser draw ratio reduces PET film in the ratio of later period heat shrinkable
Rate.In addition, thermosetting glue-line viscosity is big, high temperature resistant PET film is clung under the conditions of high temperature, reduces high temperature resistant PET film heat shrinkable
Trend, so that reducing high temperature resistant PET film shrinks the possibility tilted, therefore the combination of heat resist modification PET film and epoxy glue can be with
Overcome the problems, such as temperature tolerance and shrinks the problem of tilting.In addition, heat resist modification PET film flame retardant rating V0, greatly improves using peace
Overall coefficient.In conjunction with upper layer and lower layer copper, tensile strength is much larger than traditional high-voltage radio wiring board.
Further, tin cream described in step S3 is middle low temperature tin cream.The peak temperature of Reflow Soldering described in step S4: 210 DEG C
~220 DEG C.The temperature tolerance of PET only has 150 DEG C, and modified PET can be 210 ° of heatproof, will cause membrane material more than this temperature and shrinks
Deformation, so low temperature tin cream in can only being selected when selecting tin cream.The peak temperature of Reflow Soldering determines by selected tin cream, usual tin
Cream, which produces house, can provide the oven temperature profile of tin cream, and control oven temperature profile adjusts each warm area temperature of Reflow Soldering.
Compared with prior art, beneficial effects of the present invention are as follows:
(1) without splicing: continuous production is not necessarily to fishplate bar.Monovolume length can up to double-deck high-pressure lamp band prepared by 250m
Endless, property stabilization can store under normal temperature conditions, and the service life is long；
(2) two panel construction, bottom integrate main line, are conducive to heat dissipation: two main lines being creatively integrated into wiring board
Lower layer position, single line width 3.75mm not only solve conventional lights band plug lamp and take artificial obstacle, also improve existing wireless lamp
Band is since route is narrow, the excessive problem of pressure drop.Meanwhile the good heat dissipation effect of lower layer's copper can slow down the light decay of LED lamp, extend
Service life；
(3) 110V/220V generic disk is used, only need to can be realized 110V's and 220V by welding different pad positions
Easily switching；
(4) heat resist modification PET film flame retardant rating V0, greatly improves using safety coefficient.In conjunction with upper layer and lower layer copper, tension
Intensity is much larger than traditional high-voltage radio wiring board；
(5) line optimization designs: using the route design gone here and there entirely, every meter of 60 lamp, 30 resistance reduces route fever, and extension makes
Use the service life.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention；
Wherein, the 1, first insulating substrate；2, the first metal base；3, the second metal base；4, cover film；5, hot-setting adhesive
Film；6, tin cream；7, the second insulating substrate.
Specific embodiment
The present invention is made with specific embodiment with reference to the accompanying drawings of the specification and further being elaborated, but embodiment is simultaneously
The present invention is not limited in any form.
Embodiment 1
A kind of preparation method of bilayer high-pressure lamp band, includes the following steps:
S1, it prepares bottom overlay film wiring board: the edge of a knife of dise knife is arranged to shape corresponding with route, then to passing through heat
The first metal base 2 that solid glue film 5 pastes in advance with the first insulating substrate 1 is punched out, and controls the punching depth and the first gold medal of dise knife
The consistency of thickness for belonging to substrate 1, waste material is removed after punching can form bottom overlay film wiring board；
S2, preparation middle layer overlay film wiring board: the second metal base 3 is attached in advance and two-sided pre- coats the second of thermosetting film 5
On insulating substrate 7, then by the edge of a knife of dise knife be arranged to preset route shape, control different punching depths,
Certain specific positions do hemisection or cut entirely, and waste material, that is, plastic middle layer overlay film wiring board is removed after punching；
S3, prepare dual-layer metal line wiring board: by the edge of a knife of dise knife be arranged to preset route shape, by cover film
4 are cut into corresponding pad opening in component placement position, tear release paper then and step S1, S2 in bottom overlay film
Wiring board and middle layer overlay film wiring board are to good position, and then hot pressing under the conditions of temperature is 130 DEG C is solid under the conditions of 130 DEG C of temperature
Change 30 minutes, realizes the bonding of cover film, bottom overlay film wiring board and middle layer overlay film wiring board；
S4, blade coating tin cream: by the blade coating of tin cream 6 at upper and lower lead to the hole site, the conducting of route up and down is realized；
S5, patch, Reflow Soldering, correction, which are repaired, to be squeezed out after lamp encapsulated, and final finished product light bar: selecting corresponding steel mesh, is covering
Epiphragma windowing hole location correspondence paints tin cream 6, then the components such as resistance lamp bead are placed on wiring board by patch device.Route
Every meter of place's plug pad of plate need to accordingly scrape Tu tin cream, locate upper tin cream for every meter and realize parallel connection.After the completion of patch need that first device will be posted
The carry out heating melting of part, melting process are that wiring board is steadily delivered to Reflow Soldering, and tin cream can generate during crossing Reflow Soldering
Melting, is fixed on wiring board for component, after the welding of high temperature reflux by Reflow Soldering, to there is deflection in solder reflow process
Component be corrected finishing, light and semi-finished product light bar bare board be made after test passes through, then carry out squeezing out it is encapsulated, it is final to make
Obtain finished product light bar.The present invention is using the route design gone here and there entirely, every meter of 60 lamp, 30 resistance, the peak temperature of the Reflow Soldering: 210 DEG C
~220 DEG C.
Further, step S1, the pre- patch temperature in S2 is 90 DEG C.
Wherein, the consistency of thickness of the punching depth for being partly cut to cutter in step S2 and the second metal base, do not cut and
Second insulating substrate；It is cut to the second metal base of cutting and the second insulating substrate entirely.
The insulating substrate is heat resist modification PET film, and the metal base is copper foil.Thermosetting film is laminate polyester.
Embodiment 2
Other than hot pressing temperature is 130 DEG C in step S2, other are the same as embodiment 1；
Embodiment 3
In addition in step S2 curing time be 60 minutes other than, other are the same as embodiment 1；
Embodiment 4
Other than the pre- patch temperature in step S1, S2 is 110 DEG C, other are the same as embodiment 1.
Claims (8)
1. a kind of preparation method of bilayer high-pressure lamp band, which comprises the steps of:
S1, it prepares bottom overlay film wiring board: the edge of a knife of cutter is arranged to shape corresponding with route, then to passing through thermosetting
The first metal base that glue film pastes in advance with the first insulating substrate is punched out, and controls the punching depth and the first Metal Substrate of cutter
The consistency of thickness of material, waste material is removed after punching can form bottom overlay film wiring board；
S2, preparation middle layer overlay film wiring board: the second metal base is attached to two-sided pre- the second insulation base for coating thermosetting film in advance
On material, the edge of a knife of cutter is then arranged to shape corresponding with preset route, controls different punching depths,
Certain specific positions do hemisection or cut entirely, and waste material, that is, plastic middle layer overlay film wiring board is removed after punching；
S3, it prepares dual-layer metal line wiring board: the edge of a knife of cutter being arranged to shape corresponding with preset route, will be covered
Epiphragma is cut into corresponding pad opening in component placement position, then with the bottom overlay film wiring board in step S1, S2
With middle layer overlay film wiring board to good position, then hot-press solidifying, realizes cover film, bottom overlay film wiring board and middle layer overlay film wiring board
Bonding；
S4, blade coating tin cream: by tin cream blade coating at upper and lower lead to the hole site, the conducting of route up and down is realized；
S5, patch, Reflow Soldering, correction squeeze out encapsulated, final finished product light bar after repairing lamp
Wherein, the consistency of thickness of the punching depth for being partly cut to cutter in step S2 and the second metal base, does not cut and second
Insulating substrate；It is cut to the second metal base of cutting and the second insulating substrate entirely.
2. the preparation method of the double-deck high-pressure lamp band according to claim 1, which is characterized in that the cutter are dise knife.
3. the preparation method of the double-deck high-pressure lamp band according to claim 1, which is characterized in that step S1, the pre- patch in S2
Temperature is 90~110 DEG C.
4. the preparation method of the double-deck high-pressure lamp band according to claim 1, which is characterized in that the temperature of hot pressing is in step S3
130~150 DEG C, condition of cure solidifies 30~60 minutes at a temperature of being 130 DEG C.
5. the preparation method of the double-deck high-pressure lamp band according to claim 1, which is characterized in that cover film is aligning in step S3
It is preceding first to tear release paper.
6. the preparation method of the double-deck high-pressure lamp band according to claim 1, which is characterized in that the insulating substrate is high temperature resistant
Modified PET film, the metal base are copper foil, and the thermosetting film is laminate polyester.
7. the preparation method of the double-deck high-pressure lamp band according to claim 1, which is characterized in that tin cream described in step S4 be in it is low
Warm tin cream.
8. the preparation method of the double-deck high-pressure lamp band according to claim 1, which is characterized in that the peak of Reflow Soldering described in step S5
Value temperature: 210 DEG C~220 DEG C.
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| CN201610507815.8A CN106132112B (en) | 2016-06-28 | 2016-06-28 | A kind of preparation method of bilayer high-pressure lamp band |
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| CN201610507815.8A CN106132112B (en) | 2016-06-28 | 2016-06-28 | A kind of preparation method of bilayer high-pressure lamp band |
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| CN106132112B true CN106132112B (en) | 2018-12-04 |
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| CN107645841A (en) * | 2017-11-02 | 2018-01-30 | 惠州市特创电子科技有限公司 | Micro carving machine and its cutting method |
| CN109251694A (en) * | 2018-08-07 | 2019-01-22 | 江门新时代胶粘科技有限公司 | A kind of fpc film and preparation method thereof for LED light strip |
| CN110113877B (en) * | 2019-06-06 | 2021-11-05 | 景旺电子科技(龙川)有限公司 | Method for manufacturing metal-based circuit board by laser cutting method |
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| CN102065648A (en) * | 2009-11-17 | 2011-05-18 | 张�林 | Double-sided circuit board and interconnection conduction method thereof |
| CN102340930A (en) * | 2010-07-20 | 2012-02-01 | 王定锋 | Single-sided circuit board made by gluing flat wires arranged side by side with thermosetting adhesive film |
| CN102340931A (en) * | 2010-07-20 | 2012-02-01 | 王定锋 | Method for making single-sided circuit board with flat wires arranged side by side |
| CN103167724A (en) * | 2011-12-16 | 2013-06-19 | 田茂福 | Light-emitting diode (LED) double-sided circuit board made by four wires |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20080220548A1 (en) * | 2007-03-08 | 2008-09-11 | Tsung-Wen Chan | Multi-chip surface mounted led structure and a method for manufacturing the same |
| US20080220547A1 (en) * | 2007-03-09 | 2008-09-11 | Tsung-Wen Chan | Single-chip surface mounted led structure and a method for manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102065648A (en) * | 2009-11-17 | 2011-05-18 | 张�林 | Double-sided circuit board and interconnection conduction method thereof |
| CN102340930A (en) * | 2010-07-20 | 2012-02-01 | 王定锋 | Single-sided circuit board made by gluing flat wires arranged side by side with thermosetting adhesive film |
| CN102340931A (en) * | 2010-07-20 | 2012-02-01 | 王定锋 | Method for making single-sided circuit board with flat wires arranged side by side |
| CN103167724A (en) * | 2011-12-16 | 2013-06-19 | 田茂福 | Light-emitting diode (LED) double-sided circuit board made by four wires |
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Address after: 528329 Guangdong 1 Foshan town Shunde District, Longtan Village, Qi Long Road, Da she 9, No. 1 Applicant after: Guangdong Shunde Siry Technology Co., Ltd. Address before: 528329 Guangdong province Foshan Shunde District Xing Tan Town, Bai An Road North water industry area. Applicant before: Guangdong Shunde Siry Technology Co., Ltd. |
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