CN201928516U - Circuit board with etched pit - Google Patents
Circuit board with etched pit Download PDFInfo
- Publication number
- CN201928516U CN201928516U CN2010205032453U CN201020503245U CN201928516U CN 201928516 U CN201928516 U CN 201928516U CN 2010205032453 U CN2010205032453 U CN 2010205032453U CN 201020503245 U CN201020503245 U CN 201020503245U CN 201928516 U CN201928516 U CN 201928516U
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- circuit board
- pit
- welding
- smt
- utility
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Abstract
The utility model relates to a circuit board with an etched pit. A metal welding spot is etched with a pit at an SMT (Surface Mounting Technology) welding spot position of a circuit board in an etching way to form a circuit board with a pit; and then solder paste printing by using the SMT, surface mounting elements and reflow soldering are carried out, and tin solder forms a tin root in the welding spot pit of the circuit board so that the elements and the circuit board are welded and bonded more firmly without falling off. Compared with a circuit board of a surface mount type, the circuit board with the etched pit has the advantages that the welding and bonding strength of the elements and the circuit board is greatly enhanced, the reliability of the product improved and the maintenance on the product in the use process is greatly reduced.
Description
Technical field
The utility model belongs to field of circuit boards, is specifically related to circuit board SMT welding electronic component field.According to the utility model, can with etched mode the metal welding point be etched pit in circuit board SMT bond pad locations, formation has the circuit board of pit, and then SMT seal tin cream, surface mount elements, the Reflow Soldering welding, scolding tin forms " tin root " in circuit board solder joint pit, it is more firm that element and circuit board solder bond are got, difficult drop-off.
Background technology
Common flexible circuit board is behind welding (for example SMT welding) element, and for example, when flexible circuit board bent, element came off easily.
In addition, for example, especially out of doors use as LED lamp band application scenario, because the flexible circuit board of SMT soldered elements will stand harsh climatic environment, for example greatly the temperature difference, be exposed to the sun, adverse weather condition such as sleet, or the like, be easy to weaken the bond strength at SMT solder joint place or even cause the solder joint place to be thrown off, thereby cause the entire product fault or even lost efficacy.
Therefore, the soldered elements bond strength problem that how to solve flexible circuit board with and weatherability, be puzzlement flexible circuit board field technical barrier for many years always, this in addition limited circuit board particularly the flexible circuit panel products in the application of many outdoor occasions.
In order to address these problems, according to the utility model, can take for example the metal welding point to be etched pit with the chemical etching mode in the circuit board bond pad locations, make element SMT welding after, scolding tin forms the tin root, element is firmly buried insert solder bond in the circuit board.
The utility model content
According to the utility model, provide a kind of circuit board with pit.Can for example metal solder joint place be etched pit in circuit board SMT bond pad locations with etched mode, formation has the circuit board of pit, and then SMT seal tin cream, surface mount elements, the Reflow Soldering welding, scolding tin forms " tin root " in circuit board solder joint pit, it is more firm that element and circuit board solder bond are got, difficult drop-off.
According to the utility model, on the solder joint of circuit board SMT, produce pit with the chemical method for etching etching, form the circuit board of band pit.
More specifically, the utility model provides a kind of circuit board, has the solder joint that is formed on the circuit board, it is characterized in that, described circuit board also comprises: the one or more etch pit that form at the solder joint place of described circuit board; With the element on the pit that is welded on described solder joint place;
Wherein, when welding, scolding tin enters and forms the tin root architecture that strengthens solder bond intensity in the described etch pit.
According to one side of the present utility model, described circuit board is flexible circuit board or rigid circuit board, and described welding is the SMT welding.
According on the other hand of the present utility model, described circuit board is single face wiring board, double-sided wiring board or multilayer circuit board.
According on the other hand of the present utility model, described circuit board is used for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube or LED Christmas lamp.
According on the other hand of the present utility model, described tin root architecture buries and is inserted in the described etch pit.
The present invention also provides a kind of LED lamp band, comprises according to circuit board of the present utility model, and wherein, described element comprises LED.
According on the other hand of the present utility model, described pit, behind the SMT soldered elements, scolding tin enters pit and forms the tin root, makes the element welding more firm.
According on the other hand of the present utility model, described pit is complete etched pit.
According on the other hand of the present utility model, described pit is the pit that etches partially.
According on the other hand of the present utility model, on bond pad locations, one or more pits are arranged.
The utility model is compared with the flexible circuit board of common patch type, strengthened the solder bond intensity of element and wiring board widely, improved reliability of products and, significantly reduced product maintenance in use for example in the weatherability of various outdoor application.
Description of drawings
By reading this specification in conjunction with the following drawings, it is more apparent that feature of the present utility model, purpose and advantage will become, in the accompanying drawings:
Fig. 1 is the schematic diagram that does not form the circuit board of pit.
Fig. 2 uses chemical method for etching on the metal solder joint of circuit board SMT, the schematic diagram that etches partially pit that etching produces.
Fig. 3 uses chemical method for etching on the metal solder joint of circuit board SMT, the schematic diagram of the total eclipse pit that etching produces.
Fig. 4 is the print solder paste on the pit that etches partially at circuit board solder joint place, the cross-sectional structure schematic diagram behind the SMT paster soldered elements.
Fig. 5 is a print solder paste on the total eclipse pit at circuit board solder joint place, the cross-sectional structure schematic diagram behind the SMT paster soldered elements.
The parts label
1, circuit board; 2, surface mount elements; 3, scolding tin; 4, circuit board metal solder joint; 5, etch partially pit; 6, total eclipse pit;
Embodiment
To there be the specific embodiment of the circuit board of pit to be described in more detail to the utility model etching below.
But, it will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some preferred implementations, some other similarly or the execution mode that is equal to equally also can be used for implementing the utility model.
In the utility model, for example, " circuit board " can be the rigid circuit board (hardboard) of any kind or flexible circuit board (or claiming flexible PCB, flexible circuit board), single face circuit board for example, and double-sided PCB, multilayer circuit board, or the like.
" pit " in the utility model should be done the understanding of broad sense, its connotation comprises the recessed structure that helps to strengthen the bond strength between element and the circuit board applicable to the Any shape of inventive concept of the present utility model or structure, include but not limited to, pit, recess, groove, recess, or the like, these all are that those skilled in the art are thinkable after reading and having understood the utility model.
Describe the utility model in detail below in conjunction with embodiment.
The circuit board that embodiment one, etching method are made
Traditional flow process of making wiring board with chemical method for etching is: copper-clad plate → open material → boring or punching → heavy copper, copper facing → anti-etching figure of wire mark circuit or use dry film (exposure, develop) → solidify to check to repair plate → etch copper → go etchingresistant printing material, oven dry → wire mark welding resistance figure → wire mark character marking → open, short-circuit test → cleaning, oven dry → precoating to help the weldering antioxidant, this technology is traditional handicraft, does not carefully state at this.
1, when the anti-etching figure of wire mark circuit of above-mentioned traditional handicraft, just at the SMT of circuit board metal solder joint last wire mark pit etched figure of 4 (as shown in Figure 1), just one or morely etch partially pit 5 (as shown in Figure 2 during etch copper then with etching on the solder joint 4, be that this pit 5 does not penetrate line layer) or total eclipse pit 6 is (as shown in Figure 3, be that this pit 6 has penetrated line layer), finish the making of circuit board then according to above-mentioned conventional process.
2, etching has the local print solder paste of pit on circuit board, the SMT surface mount elements 2 then, cross the Reflow Soldering welding, and scolding tin 3 forms the tin root, insert solder bond on wiring board 1 thereby element 2 firmly can be buried, improved the solder bond intensity (shown in Fig. 4,5) of element so greatly.
The circuit board that embodiment two, non-etching method are made
For example, adopt juxtaposed flat conductor, with and the flat conductor of putting layout stick on the insulated base material layer of band glue, the via that position that the excision flat conductor need disconnect and odt circuit need conducting, printing welding resistance printing ink, perhaps the hot pressing coverlay is as solder mask, and via is taked electrically conductive ink or with soldered elements or welding conductors conducting, passed a bridge and adopt electrically conductive ink or welding conductors or soldered elements conducting.Finish and put the wiring board that the flat conductor method is made.The application people that this technology for example can be submitted to before this referring to the inventor is that July 20, application number in 2010 are that 201010232537.2 application for a patent for invention " is adopted the method for juxtaposed wire producing single face circuit board " for Wang Dingfeng, the applying date, or the like, carefully do not state at this.
1, the circuit board made from non-etching method (before OSP), at the SMT of circuit board metal solder joint last wire mark pit etched figure of 4 (as shown in Figure 1), solidify, etch copper will etch one or more pit 5 (as shown in Figure 2) or total eclipse pits 6 (as shown in Figure 3) of etching partially on the solder joint then.
2, butt welding point is carried out the OSP processing.This technology is traditional handicraft, does not carefully state at this.
3, etching has the local print solder paste of pit on circuit board, and the SMT surface mount elements 2 then, crosses the Reflow Soldering welding, and scolding tin 3 forms the tin roots and element 2 is firmly buried inserts solder bond on wiring board 1 (shown in Fig. 4,5).
Below in conjunction with the accompanying drawings the method specific embodiment is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present utility model, especially the scope of claim does not have any restriction.
Claims (7)
1. a circuit board has the solder joint that is formed on the circuit board, it is characterized in that, described circuit board also comprises:
The one or more etch pit that form at the solder joint place of described circuit board; With
Be welded on the element on the etch pit at described solder joint place;
Wherein, when welding, scolding tin enters and forms the tin root architecture that strengthens solder bond intensity in the described etch pit.
2. circuit board according to claim 1 is characterized in that, described circuit board is flexible circuit board or rigid circuit board, and described welding is the SMT welding.
3. circuit board according to claim 1 is characterized in that, described circuit board is single face wiring board, double-sided wiring board or multilayer circuit board.
4. circuit board according to claim 1 is characterized in that, described etch pit is complete etched pit.
5. circuit board according to claim 1 is characterized in that, described etch pit is the pit that etches partially.
6. circuit board according to claim 1 is characterized in that, described tin root architecture buries and is inserted in the described etch pit.
7. a LED lamp band comprises that wherein, described element comprises LED as each described circuit board among the claim 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205032453U CN201928516U (en) | 2010-08-24 | 2010-08-24 | Circuit board with etched pit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205032453U CN201928516U (en) | 2010-08-24 | 2010-08-24 | Circuit board with etched pit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201928516U true CN201928516U (en) | 2011-08-10 |
Family
ID=44432349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205032453U Expired - Lifetime CN201928516U (en) | 2010-08-24 | 2010-08-24 | Circuit board with etched pit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201928516U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192150A (en) * | 2013-03-29 | 2013-07-10 | 上海安费诺永亿通讯电子有限公司 | Electronic component welding method |
| CN104994680A (en) * | 2015-07-02 | 2015-10-21 | 常州鼎润电子科技有限公司 | Anti-disengagement circuit board |
| CN105025653A (en) * | 2015-08-20 | 2015-11-04 | 广东威创视讯科技股份有限公司 | Printed circuit board and preparation method thereof |
| CN105792514A (en) * | 2016-05-20 | 2016-07-20 | 柳梦洁 | Circuit board, transparent LED display screen and manufacturing process of circuit board |
| CN106793496A (en) * | 2016-12-29 | 2017-05-31 | 深圳蓝普科技有限公司 | Integrated circuit component and its PCB surface mount elements |
| US10852582B2 (en) | 2018-10-26 | 2020-12-01 | Apple Inc. | Electronic device display with a backlight |
-
2010
- 2010-08-24 CN CN2010205032453U patent/CN201928516U/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192150A (en) * | 2013-03-29 | 2013-07-10 | 上海安费诺永亿通讯电子有限公司 | Electronic component welding method |
| CN104994680A (en) * | 2015-07-02 | 2015-10-21 | 常州鼎润电子科技有限公司 | Anti-disengagement circuit board |
| CN104994680B (en) * | 2015-07-02 | 2019-01-08 | 常州纳捷机电科技有限公司 | Anti-dropout circuit board |
| CN105025653A (en) * | 2015-08-20 | 2015-11-04 | 广东威创视讯科技股份有限公司 | Printed circuit board and preparation method thereof |
| CN105025653B (en) * | 2015-08-20 | 2018-05-08 | 广东威创视讯科技股份有限公司 | Printed wiring board and preparation method thereof |
| CN105792514A (en) * | 2016-05-20 | 2016-07-20 | 柳梦洁 | Circuit board, transparent LED display screen and manufacturing process of circuit board |
| CN105792514B (en) * | 2016-05-20 | 2018-06-01 | 柳梦洁 | A kind of manufacture craft of wiring board, penetrating LED display and wiring board |
| CN106793496A (en) * | 2016-12-29 | 2017-05-31 | 深圳蓝普科技有限公司 | Integrated circuit component and its PCB surface mount elements |
| US10852582B2 (en) | 2018-10-26 | 2020-12-01 | Apple Inc. | Electronic device display with a backlight |
| US10866458B2 (en) | 2018-10-26 | 2020-12-15 | Apple Inc. | Electronic device display with a backlight and control circuitry that corrects pixel data to reduce transition artifacts |
| US11221513B2 (en) | 2018-10-26 | 2022-01-11 | Apple Inc. | Electronic device display with a backlight |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110810 |