CN102340928B

CN102340928B - Single-sided circuit board made by arranging flat wires side by side and making method thereof

Info

Publication number: CN102340928B
Application number: CN 201010232487
Authority: CN
Inventors: 王定锋; 徐文红
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-07-20
Filing date: 2010-07-20
Publication date: 2013-09-11
Anticipated expiration: 2030-07-20
Also published as: WO2012009840A1; CN102340928A

Abstract

The invention relates to a single-sided circuit board made by arranging flat wires side by side and a making method thereof. Specifically, according to the invention, flat wires are arranged on an insulating material with a gluing property side by side through hot pressing, parts of the flat wires, which need to be disconnected are then cut off, soldering resisting ink is printed or a covering film which is previously provided with a solder pad window is hot-pressed and used as a soldering resisting layer, and bridging connection is realized through printing electricity conducting ink or soldering conductors. When a jack element needs to be arranged, soldering installation can be realized as long as a hole is directly drilled in a soldered spot or a hole is punched by a die. The circuit board can be made without etching. Compared with the traditional circuit board making technology, the novel technology has the advantages of excellent environment friendliness, energy saving and material saving.

Description

With flat conductor and put single face circuit board of arrange making and preparation method thereof

Technical field

The invention belongs to circuit-board industry, adopt flat conductor and put arrangement hot pressing to have on the insulating material of glueability, the flat conductor position that need are disconnected is cut processing and is made circuit board then.The invention enables and need not chemical etching and just can make circuit board.Therefore, the present invention compares with traditional making circuit board, is new technology a kind of ten minutes environmental protection, energy-conservation, material saving.

Background technology

Traditional circuit board lead all is to etch circuit with copper-clad plate usually, or takes laser and the unwanted copper of milling cutter cutting removal to go out circuit.But the former is high cost and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities.

The present invention directly takes juxtaposed flat conductor to make according to the characteristics of the big circuit board of the simple consumption of some circuits to produce circuit board, can be used for the LED field, and be widely used in various LED products.Low cost of manufacture, efficient height, and very environmental protection.

Summary of the invention

The present invention is a kind of with flat conductor and put and arrange hot pressing and have on the insulating material of glueability, excision needs the flat conductor position of disconnection then, printing welding resistance printing ink, perhaps hot pressing have the pad window in advance coverlay as solder mask, the gap bridge short circuit connect to adopt printing conductive inks or welding conductors to connect.The present invention need not etching just can make circuit board, compares with traditional making circuit board, so the single face circuit board that the present invention makes and very environmental protection of method of the present invention, energy-conservation and save material are representing a kind of brand-new novelty technology in this area.

According to the present invention, provide a kind of that adopt flat conductor and put and arrange and the direct compound method of making the single face circuit board of the insulating substrate with glueability, comprising:

Be provided as the single face circuit board line layer flat conductor and put arrangement;

With flat conductor and put and arrange direct heat and be depressed on the insulating substrate, and to excising processing and make described flat conductor and put the line layer that forms the single face circuit board in the position that flat conductor need disconnect, and described insulating substrate forms the insulating barrier of single face circuit board.

According to the present invention, provide a kind of that adopt flat conductor and put and arrange and the direct compound method of making the single face circuit board of the insulating substrate with glueability, comprising: be provided as the single face circuit board line layer flat conductor and put arrangement; With flat conductor and put and arrange direct heat and be depressed on the insulating substrate, make described flat conductor and put the line layer that forms the single face circuit board, described insulating substrate forms the insulating barrier of single face circuit board; At flat conductor and put arrangement and excise processing, thereby cut in the flat conductor position that needs disconnect; Have the coverlay of solder joint window in advance at described line layer printing welding resistance printing ink or hot pressing, and form solder mask.

According to an aspect of the present invention, on the line layer that is not covered by solder mask, adopt printing conductive inks or welding conductors to realize passing a bridge and connect; And, in bond pad locations electronic devices and components are installed.

According to an aspect of the present invention, when needs are installed the jack element, directly in bond pad locations boring or punching, thereby with in the component pins patchhole and be welded on the line layer.

According to a further aspect in the invention, described excision processing be selected from that mould is die-cut, boring, bore mill, laser ablation and wire cutting machine excision.

According to a further aspect in the invention, described excision processing is excised insulating substrate simultaneously in the position of cutting flat conductor.

According to a further aspect in the invention, described welding resistance printing ink is the welding resistance printing ink of using with conventional PCB, and described coverlay is the coverlay that FPC uses.

According to a further aspect in the invention, the single face circuit board of described method making is flexible PCB or rigid circuit board.

According to the present invention, also provide a kind of that adopt flat conductor and put and arrange and the direct compound and single face circuit board made of the insulating substrate with glueability, comprise: form the flat conductor of line layer and put arrangement, wherein, carried out excision processing in the flat conductor position that described line layer needs to disconnect; The insulating substrate that forms insulating barrier that is combined with each other with described line layer; Be formed at the solder mask on the described line layer.

According to an aspect of the present invention, described insulating substrate is to be selected from epoxy glass base material+hot-setting adhesive, phenolic aldehyde base material+hot-setting adhesive, polyimide base material+hot-setting adhesive, metal base+hot-setting adhesive and ceramic base material+hot-setting adhesive wherein a kind of.

According to a further aspect in the invention, described flat conductor is copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.

According to a further aspect in the invention, described single face circuit board is the surface attaching type circuit board, and its structure comprises: ground floor is insulating substrate 1, and the second layer is that 2, the three layers of line layers are that 3, the four layers of solder masks are element and short circuit

conductive layer

4,5,6,7.

According to a further aspect in the invention, described single face circuit board is the plug-in type circuit board, and its structure comprises: ground floor is element and short circuit

conductive layer

8,9,10, and the second layer is that 1, the three layer of insulating substrate is that line layer is solder mask 3 for 2, the four layers.

According to a further aspect in the invention, the bond pad locations at described plug-in type circuit board forms the element legs hole by the form that gets out or go out.

According to a further aspect in the invention, described flat conductor adopts the circle line pressure to prolong and makes, or the flat conductor that cuts into metal forming, metallic plate, metal tape branch.

A preferred embodiment of the invention, described and put that to arrange be to be arranged in parallel.

According to the present invention, described electrically conductive ink is electric conductive carbon printing, conductive silver oil or conductive copper wet goods conducting metal printing ink.

According to the present invention, described gap bridge welding conductors is surface attaching type welding conductors or plug-in type conductor.

According to the present invention, the single face circuit board that the method according to this invention is made is mainly used in making LED lamp band, LED products such as LED module, LED guardrail pipe, LED neon light, LED fluorescent tube, LED Christmas lamp.

According to the present invention, described single face circuit board is characterized in, the position base material that flat conductor cuts off is simultaneously also cut (as Fig. 9).

Flat conductor in the single face circuit board that the method according to this invention is made is made of non-etched mode.Perhaps, the flat conductor among the present invention prolongs and makes or cut into metal forming, metallic plate, metal tape branch with the circle line pressure.

According to the present invention, described single face circuit board is characterized in: the width of same flat conductor is the same.The width of different flat conductors can be identical, also can be inequality.All flat conductors all are and put layout.

The present invention also provides a kind of LED lamp band, comprises the single face circuit board of making according to the present invention and the LED that is installed on this single face circuit board.

The present invention need not etching just can make circuit board, compares with traditional making circuit board, be a kind of manufacturing process eliminate chemical contamination, very environmental protection, energy-conservation, save material and the more advanced new technology of technology.

Description of drawings

By reading this specification in conjunction with the following drawings, it is more apparent that features, objects and advantages of the invention will become, in the accompanying drawings:

Fig. 1 is planar structure and the cross-sectional structure figure of paster circuit board finished product.

Fig. 2 is planar structure and the cross-sectional structure figure of plug in circuit card finished product.

Fig. 3 is the schematic diagram of the flat conductor of cutting making.

Fig. 4 for and put the schematic diagram of groove mould.

Fig. 5 for and put the cross-sectional view of groove mould.

Fig. 6 is for flat conductor and put wiring diagram.

Fig. 7 is for flat conductor and put and vacuumize air-breathing fixing schematic diagram when arranging.

Fig. 8 for and put flat conductor and be transferred to schematic diagram on the insulated substrate.

Fig. 9 is the schematic diagram of flat conductor after the position gong that need disconnect disconnects.

Figure 10 is the schematic diagram behind the printing welding resistance printing ink.

Figure 11 is the schematic diagram behind the electric conductive carbon printing that prints.

The schematic diagram of Figure 12 after for rigidity wiring board welding LED and element thereof.

Figure 13 forms the schematic diagram in element legs hole by the form that gets out or go out for the bond pad locations of plug-in type circuit board.

The schematic diagram of Figure 14 after for Flexible Printed Circuit welding LED and element thereof.

The parts label

1 base material; 2 flat conductors; 3 solder masks (coverlay or welding resistance printing ink); 4, paster LED; 5, Chip-R; 6, paster gap bridge conductor; 4-6, be element and the short circuit conductive layer of surface patch type circuit board; 7, soldering; 8, plug-in unit resistance; 9, plug-in unit LED; 10, plug-in unit gap bridge conductor; 8-10, be element and the short circuit conductive layer of plug in circuit card; 11, parallel groove; 12, suction tube; 13 excision mouths; The electrically conductive ink of 14 printings; 15 element legs holes

Embodiment

In following description to the drawings and specific embodiments, will set forth one or more embodiments of the detail of the present invention.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present invention.

Below will to the present invention with flat conductor and some kinds of specific embodiments putting the method for arrange making the single face circuit board be described in more detail.

(1) making of rigid circuit board

1. the making of flat conductor 2: take the cutting of Copper Foil itemize to make or roll with the flat conductor calender flat conductor 2 (as shown in Figure 3) of copper cash or certain width and thickness.This operation is traditional handicraft, is not described in detail at this.

2. and put groove mould and make: the method that adopts for example etching or machining with minute surface stainless steel plate, process consistent with line width and put groove 11 (as shown in Figure 4), the thickness of the depth ratio flat conductor 2 of groove 11 more shallow (as shown in Figure 5), should and put groove can be parallel groove as required.

Flat conductor 2 and put layout: design and produce in advance and have consistent with the flat conductor width and put groove mould, flat conductor and put and arrange and to be fixed on (as shown in Figure 6) in the groove, wherein, this fixing for example can the employing vacuumizes air-breathing (by means of suction tube 12) fixing (as shown in Figure 7).

4. the compound inslation base material 1: adopt the FR4 epoxy glass substrate 1 post insulation hot-setting adhesive aluminium base or other metal substrate of insulation glued membrane (or post), with posting the side and the overlapping hot pressing 5-10 of the flat conductor side second that is furnished with the Die and mould plate of flat conductor 2 of insulation glued membrane 1, make and put flat conductor 2 to be transferred on the insulated substrate.Mould is taken away in cooling, is attached to flat conductor 2 surfaces with release film then, continues to press in 150 ℃ to 180 ℃ 30 to 120 minutes with the permanent PCB pressing machine that reaches, and realizes the curing bonding (as shown in Figure 8) of flat conductor, coverlay and base material.

5. go out groove with the gong machine at the position gong that flat conductor 2 needs to disconnect, and flat conductor is disconnected.Wherein, grasp the degree of depth, a gong copper cash is removed copper cash fully.As an other preferred version, also gong becomes hollow out 13 (as shown in Figure 9) entirely.

6. printing welding resistance printing ink and exposure imaging, curing (as shown in figure 10).

7. printing gap bridge short circuit electric conductive carbon printing solidifies 45 minutes to 90 minutes (as shown in figure 13) down at 120 ℃ to 160 ℃.

8. butt welding point is carried out the OSP processing.

9. weld LED and/or other element (as shown in figure 12).

10. external form is cut, and takes gong or V-CUT, finishes making.

(2) making of flexible PCB (FPC)

1. the making of flat conductor 2 takes the cutting of Copper Foil itemize to make or roll with the flat conductor calender flat conductor 2 (as shown in Figure 3) of copper cash or certain width and thickness.

2. and put groove mould and make: adopt the method for etching or machining with minute surface stainless steel plate, process consistent with line width and put groove 11 (as shown in Figure 4), gash depth is than flat conductor thickness more shallow (as shown in Figure 5).

3. paste and close insulating substrate

The polyimides coverlay that will have an epoxy adhesive is aimed at overlapping hot pressing 5-10 second with the flat conductor of the mould that is furnished with flat conductor one side (as shown in Figure 6), make and put that flat conductor is bonding to be transferred on the coverlay, separate and take mould away, the flat conductor circuit shifted and was fixed on the coverlay this moment, then circuit surface every on release film, continuation was 150 ℃ to 180 ℃ following hot pressing 90 seconds to 180 seconds, take out after fixedly securing the flat conductor circuit, in baking box, solidify 45 minutes to 90 minutes (as shown in Figure 8) down at 120 ℃ to 160 ℃.

4. the position that need disconnect with the die-cut flat conductor of mould for example can directly stay and excise mouthful 13 (as shown in Figure 9).These all are technology well known in the art, repeat no more.

5. hold coverlay successfully window in advance, contraposition is attached to the circuit surface of above wiring board, after 150 ℃ to 180 ℃ following hot pressing reach 90 seconds to 180 seconds time, fixedly secure circuit, take out, in baking box, solidify 45 minutes to 90 minutes (as shown in figure 10) down at 120 ℃ to 160 ℃.

6.OSP processing solder joint.These all are technology well known in the art, repeat no more.

7. welding electronic component and gap bridge bonding conductor (as Figure 14, Fig. 1, shown in Figure 2).These all are technology well known in the art, repeat no more.

8. next, for example adopt cutting die that monoblock flexible PCB branch is cut to required single products, for example paster circuit board finished product shown in Figure 1 and plug in circuit card finished product shown in Figure 2.(as depicted in figs. 1 and 2).

Below by reference to the accompanying drawings the method specific embodiment is described in detail the present invention.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present invention, especially the scope of claim does not have any restriction.

Claims

One kind that adopt flat conductor and put and arrange and the direct compound method of making for the single face circuit board of LED of the insulating substrate with glueability, comprising:

Be provided as the single face circuit board line layer flat conductor and put arrangement;

With flat conductor and put and arrange direct heat and be depressed on the insulating substrate, make described flat conductor and put the line layer that forms the single face circuit board;

At flat conductor and put arrangement and excise processing, thereby cut in the flat conductor position that needs disconnect;

Have the coverlay of solder joint window in advance at described line layer printing welding resistance printing ink or hot pressing, and form solder mask;

Wherein, described flat conductor adopts the circle line pressure to prolong and makes or cut into metal forming, metallic plate or metal tape branch, and makes of non-etched mode.
2. method according to claim 1 is characterized in that:

When needs are installed the jack element, directly in bond pad locations boring or punching, thereby with in the component pins patchhole and be welded on the line layer.
3. method according to claim 1 is characterized in that:

Described excision processing is selected from that mould is die-cut, boring, bore mill, laser ablation and wire cutting machine excision.
4. according to each described method among the claim 1-3, it is characterized in that:

Described excision processing is excised insulating substrate simultaneously in the position of cutting flat conductor.
5. according to each described method among the claim 1-3, it is characterized in that described welding resistance printing ink is the welding resistance printing ink of using with conventional PCB, described coverlay is the coverlay that FPC uses.
6. according to each described method among the claim 1-3, it is characterized in that the single face circuit board that described method is made is flexible PCB or rigid circuit board.
7. according to each described method among the claim 1-3, it is characterized in that described method also comprises:

Adopting printing conductive inks or welding conductors to realize passing a bridge connects; With

In bond pad locations welding electronic component is installed.
8. according to each described method among the claim 1-3, it is characterized in that, described and put that to arrange be to be arranged in parallel.
One kind that adopt flat conductor and put arrange with the insulating substrate with glueability directly compound and the single face circuit board that is used for LED made comprises:

Form the flat conductor of line layer and put arrangement, wherein, carried out excision processing in the flat conductor position that described line layer needs to disconnect;

The insulating substrate that is combined with each other with described line layer;

Be formed at the solder mask on the described line layer;

Wherein, described flat conductor is to adopt the circle line pressure to prolong the flat conductor of making, or the flat conductor that cuts into metal forming, metallic plate or metal tape branch.
10. single face circuit board according to claim 9, it is characterized in that, described insulating substrate is to be selected from epoxy glass base material+hot-setting adhesive, phenolic aldehyde base material+hot-setting adhesive, polyimide base material+hot-setting adhesive, metal base+hot-setting adhesive and ceramic base material+hot-setting adhesive wherein a kind of.
11., it is characterized in that described flat conductor is copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire according to each described single face circuit board among the claim 9-10.
12. according to each described single face circuit board among the claim 9-10, it is characterized in that, described single face circuit board is the surface attaching type circuit board, its structure comprises: ground floor is insulating substrate (1), the second layer is line layer (2), and the 3rd layer is solder mask (3), and the 4th layer is element and short circuit conductive layer (4,5,6).
13. according to each described single face circuit board among the claim 9-10, it is characterized in that, described single face circuit board is the plug-in type circuit board, its structure comprises: ground floor is element and short circuit conductive layer (8,9,10), the second layer is insulating substrate (1), the 3rd layer is line layer (2), and the 4th layer is solder mask (3).
14. the single face circuit board according to claim 12 is stated is characterized in that, in the form formation element legs hole (15) of bond pad locations by getting out or going out of described plug-in type circuit board.
15. require each described single face circuit board among the 9-10 according to aforesaid right, it is characterized in that, described and put that to arrange be to be arranged in parallel.
16. single face circuit board according to claim 15 is characterized in that, described single face circuit board is used for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube or LED Christmas lamp.