CN102340928A

CN102340928A - Single-sided circuit board made by arranging flat wires side by side and making method thereof

Info

Publication number: CN102340928A
Application number: CN2010102324878A
Authority: CN
Inventors: 王定锋; 徐文红
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-07-20
Filing date: 2010-07-20
Publication date: 2012-02-01
Anticipated expiration: 2030-07-20
Also published as: CN102340928B; WO2012009840A1

Abstract

The invention relates to a single-sided circuit board made by arranging flat wires side by side and a making method thereof. Specifically, according to the invention, flat wires are arranged on an insulating material with a gluing property side by side through hot pressing, parts of the flat wires, which need to be disconnected are then cut off, soldering resisting ink is printed or a covering film which is previously provided with a solder pad window is hot-pressed and used as a soldering resisting layer, and bridging connection is realized through printing electricity conducting ink or soldering conductors. When a jack element needs to be arranged, soldering installation can be realized as long as a hole is directly drilled in a soldered spot or a hole is punched by a die. The circuit board can be made without etching. Compared with the traditional circuit board making technology, the novel technology has the advantages of excellent environment friendliness, energy saving and material saving.

Description

With flat conductor and put single face circuit board of arrange making and preparation method thereof

Technical field

The invention belongs to circuit-board industry, adopt flat conductor and put arrangement hot pressing to have on the insulating material of glueability, the flat conductor position of then need being broken off is cut processing and is come circuit board manufacturing.The invention enables and need not just ability circuit board manufacturing of chemical etching.Therefore, the present invention compares with traditional circuit board manufacturing, is new technology a kind of ten minutes environmental protection, energy-conservation, material saving.

Background technology

Traditional circuit board lead all is to etch circuit with copper-clad plate usually, or takes laser and the unwanted copper of milling cutter cutting removal to go out circuit.But the former is high cost and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities.

The present invention is the flat conductor making production circuit board of directly taking and putting according to the characteristics of the big circuit board of the simple consumption of some circuits, can be used for the LED field, and be widely used in various LED products.Low cost of manufacture, efficient height, and very environmental protection.

Summary of the invention

The present invention is a kind of with flat conductor and put and arrange hot pressing and have on the insulating material of glueability; Excision needs the flat conductor position of disconnection then; Printing resistance solder paste China ink; Perhaps hot pressing have the pad window in advance coverlay as solder mask, the gap bridge short circuit connect to adopt printing conductive inks or welding conductors to connect.The present invention need not etching just can circuit board manufacturing, compares with traditional circuit board manufacturing, so single face circuit board that the present invention makes and very environmental protection of method of the present invention, energy-conservation and save material are representing a kind of brand-new novelty in this area technological.

According to the present invention, provide a kind of that adopt flat conductor and put and arrange and the direct compound method of making the single face circuit board of the insulating substrate with glueability, comprising:

Provide as the flat conductor of the line layer of single face circuit board and put arrangement;

With flat conductor and put and arrange direct heat and be depressed on the insulating substrate; And to excising processing and make said flat conductor and put the line layer that forms the single face circuit board in the position that flat conductor need break off, and said insulating substrate forms the insulating barrier of single face circuit board.

According to the present invention, provide a kind of that adopt flat conductor and put and arrange and the direct compound method of making the single face circuit board of the insulating substrate with glueability, comprising: provide as the flat conductor of the line layer of single face circuit board and put arrangement; With flat conductor and put and arrange direct heat and be depressed on the insulating substrate, make said flat conductor and put the line layer that forms the single face circuit board, said insulating substrate forms the insulating barrier of single face circuit board; At flat conductor and put and excise processing in the arrangement, thereby cut in the flat conductor position that needs break off; Printing resistance solder paste China ink or hot pressing have the coverlay of solder joint window in advance on said line layer, and form solder mask.

According to an aspect of the present invention, on the line layer that is not covered, adopt printing conductive inks or welding conductors to realize passing a bridge and connect by solder mask; And, in the bond pad locations mounting electronic.

According to an aspect of the present invention, when needs are installed the jack element, directly in bond pad locations boring or punching, thereby with in the component pins patchhole and be welded on the line layer.

According to a further aspect in the invention, said excision processing be selected from that mould is die-cut, boring, bore mill, laser ablation and wire cutting machine excision.

According to a further aspect in the invention, said excision is processed in the position of cutting flat conductor and excises insulating substrate simultaneously.

According to a further aspect in the invention, said resistance solder paste China ink is the resistance solder paste China ink of using with conventional PCB, and said coverlay is the coverlay that FPC uses.

According to a further aspect in the invention, the single face circuit board of said method making is flexible PCB or rigid circuit board.

According to the present invention; Also provide a kind of that adopt flat conductor and put and arrange directly compound and single face circuit board that make with insulating substrate with glueability; Comprise: form the flat conductor of line layer and put arrangement; Wherein, on said line layer, need the flat conductor position of disconnection to carry out excision processing; The insulating substrate that forms insulating barrier that is combined with each other with said line layer; Be formed at the solder mask on the said line layer.

According to an aspect of the present invention, said insulating substrate is to be selected from epoxy glass base material+hot-setting adhesive, phenolic aldehyde base material+hot-setting adhesive, polyimide base material+hot-setting adhesive, metal base+hot-setting adhesive and ceramic base material+hot-setting adhesive wherein a kind of.

According to a further aspect in the invention, said flat conductor is copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.

According to a further aspect in the invention, said single face circuit board is the surface attaching type circuit board, and its structure comprises: ground floor is an insulating substrate 1, and the second layer is that 2, the three layers of line layers are that 3, the four layers of solder masks are element and short circuit

conductive layer

4,5,6,7.

According to a further aspect in the invention, said single face circuit board is the plug-in type circuit board, and its structure comprises: ground floor is element and short circuit

conductive layer

8,9,10, and the second layer is that 1, the three layer of insulating substrate is that line layer is a solder mask 3 for 2, the four layers.

According to a further aspect in the invention, the bond pad locations at said plug-in type circuit board forms the element legs hole through the form that gets out or go out.

According to a further aspect in the invention, said flat conductor adopts the circle line pressure to prolong and processes, or the flat conductor that cuts into metal forming, metallic plate, metal tape branch.

A preferred embodiment of the invention, said and put that to arrange be to be arranged in parallel.

According to the present invention, described electrically conductive ink is electric conductive carbon printing, conductive silver oil or conductive copper wet goods conducting metal printing ink.

According to the present invention, described gap bridge welding conductors is surface attaching type welding conductors or plug-in type conductor.

According to the present invention, the single face circuit board of making according to the method for the invention is mainly used in makes LED lamp band, LED products such as LED module, LED guardrail pipe, LED neon light, LED fluorescent tube, LED Christmas lamp.

According to the present invention, described single face circuit board is characterized in, the position base material that flat conductor cuts off has also been excised (like Fig. 9) simultaneously.

Flat conductor in the single face circuit board of making is according to the method for the invention made with non-etched mode.Perhaps, the flat conductor among the present invention prolongs and processes or cut into metal forming, metallic plate, metal tape branch with the circle line pressure.

According to the present invention, said single face circuit board is characterized in: the width of same flat conductor is the same.The width of different flat conductors can be identical, also can be inequality.All flat conductors all are and put layout.

The present invention also provides a kind of LED lamp band, comprises the single face circuit board of making according to the present invention and is installed on the LED on this single face circuit board.

The present invention need not etching just can circuit board manufacturing, compares with traditional circuit board manufacturing, be a kind of manufacturing process eliminate chemical contamination, very environmental protection, energy-conservation, save material and the more advanced new technology of technology.

Description of drawings

Through combining following this specification of advantages, it is more obvious that characteristic of the present invention, purpose and advantage will become, in the accompanying drawings:

Fig. 1 is the planar structure and the cross-sectional structure figure of paster circuit board finished product.

Fig. 2 is the planar structure and the cross-sectional structure figure of plug in circuit card finished product.

Fig. 3 is the sketch map of the flat conductor of cutting making.

Fig. 4 for and put the sketch map of groove mould.

Fig. 5 for and put the cross-sectional view of groove mould.

Fig. 6 is for flat conductor and put wiring diagram.

Fig. 7 is for flat conductor and put and vacuumize air-breathing fixing sketch map when arranging.

Fig. 8 for and put flat conductor and be transferred to the sketch map on the insulated substrate.

Fig. 9 is the sketch map of flat conductor after the position gong that need break off breaks off.

Figure 10 is the sketch map behind the printing resistance solder paste China ink.

Figure 11 is the sketch map behind the electric conductive carbon printing that prints.

The sketch map of Figure 12 after for rigidity wiring board welding LED and element thereof.

Figure 13 forms the sketch map in element legs hole through the form that gets out or go out for the bond pad locations of plug-in type circuit board.

The sketch map of Figure 14 after for FPC welding LED and element thereof.

The parts label

1 base material; 2 flat conductors; 3 solder masks (coverlay or resistance solder paste China ink); 4, paster LED; 5, Chip-R; 6, paster gap bridge conductor; 4-6, be the element and the short circuit conductive layer of surface patch type circuit board; 7, soldering; 8, plug-in unit resistance; 9, plug-in unit LED; 10, plug-in unit gap bridge conductor; 8-10, be the element and the short circuit conductive layer of plug in circuit card; 11, parallel groove; 12, suction tube; 13 excision mouths; The electrically conductive ink of 14 printings; 15 element legs holes

Embodiment

In following description, with the details of setting forth one or more embodiment of the present invention to accompanying drawing and embodiment.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present invention.

Below will to the present invention with flat conductor and some kinds of specific embodiments putting the method for arrange making the single face circuit board be described in more detail.

(1) making of rigid circuit board

1. the making of flat conductor 2: take Copper Foil itemize cutting to make or roll the flat conductor 2 (as shown in Figure 3) of copper cash or certain width and thickness with the flat conductor calender.This operation is a traditional handicraft, does not describe in detail at this.

2. and put groove mould and make: the method that adopts for example etching or machining with minute surface stainless steel plate; Process consistent with line width and put groove 11 (as shown in Figure 4); The thickness of the depth ratio flat conductor 2 of groove 11 more shallow (as shown in Figure 5), should and put groove can be parallel groove as required.

Flat conductor 2 and put layout: design and produce in advance and have consistent with the flat conductor width and put groove mould; Flat conductor and put and arrange and to be fixed on (as shown in Figure 6) in the groove; Wherein, this fixing for example can the employing vacuumizes air-breathing (by means of suction tube 12) fixing (as shown in Figure 7).

4. the compound inslation base material 1: adopt the FR4 epoxy glass substrate 1 post insulation hot-setting adhesive aluminium base or other metal substrate of insulation glued membrane (or post); In the overlapping hot pressing 5-10 of that one side of that one side and the flat conductor of the Die and mould plate that is furnished with flat conductor 2 second with posting insulation glued membrane 1, make and put flat conductor 2 to be transferred on the insulated substrate.Mould is taken away in cooling, is attached to flat conductor 2 surfaces with mould release membrance then, continues to press in 150 ℃ to 180 ℃ 30 to 120 minutes with the permanent PCB pressing machine that reaches, and realizes the curing bonding (as shown in Figure 8) of flat conductor, coverlay and base material.

5. go out groove with the gong machine at the position gong that flat conductor 2 needs to break off, and flat conductor is broken off.Wherein, grasp the degree of depth, a gong copper cash is removed copper cash fully.As an other preferred version, also gong becomes hollow out 13 (as shown in Figure 9) entirely.

6. printing resistance solder paste China ink and exposure imaging, curing (shown in figure 10).

7. printing gap bridge short circuit electric conductive carbon printing solidifies 45 minutes to 90 minutes (shown in figure 13) down at 120 ℃ to 160 ℃.

8. butt welding point is carried out the OSP processing.

9. weld LED and/or other element (shown in figure 12).

10. external form is cut, and takes gong or V-CUT, accomplishes and makes.

(2) making of flexible PCB (FPC)

1. the making of flat conductor 2 takes Copper Foil itemize cutting to make or roll with the flat conductor calender flat conductor 2 (as shown in Figure 3) of copper cash or certain width and thickness.

2. and put groove mould and make: with the method for employing etching of minute surface stainless steel plate or machining, process consistent with line width and put groove 11 (as shown in Figure 4), gash depth is than flat conductor thickness more shallow (as shown in Figure 5).

3. paste and close insulating substrate

The polyimides coverlay that will have an epoxy adhesive is aimed at overlapping hot pressing 5-10 second with the flat conductor of the mould that is furnished with flat conductor one side (as shown in Figure 6); Make and put that flat conductor is bonding to be transferred on the coverlay; Separate and take mould away; The flat conductor circuit shifted and was fixed on the coverlay this moment, and mould release membrance on circuit surface is separated continues 150 ℃ to 180 ℃ following hot pressing 90 seconds to 180 seconds then; Take out after fixedly securing the flat conductor circuit, in baking box, solidify 45 minutes to 90 minutes (as shown in Figure 8) down at 120 ℃ to 160 ℃.

4. the position that need break off with the die-cut flat conductor of mould for example can directly stay excision mouthful 13 (as shown in Figure 9).These all are technology well known in the art, repeat no more.

5. hold coverlay successfully window in advance; Contraposition is attached to the circuit surface of above wiring board, after 150 ℃ to 180 ℃ following hot pressing reach 90 seconds to 180 seconds time, fixedly secure circuit; Take out, in baking box, solidify 45 minutes to 90 minutes (shown in figure 10) down at 120 ℃ to 160 ℃.

6.OSP processing solder joint.These all are technology well known in the art, repeat no more.

7. welding electronic component and gap bridge bonding conductor (like Figure 14, Fig. 1, shown in Figure 2).These all are technology well known in the art, repeat no more.

8. next, for example adopt cutting die that monoblock flexible PCB branch is cut to required single products, paster circuit board finished product for example shown in Figure 1 and plug in circuit card finished product shown in Figure 2.(as depicted in figs. 1 and 2).

More than combine accompanying drawing that the method specific embodiment has been carried out detailed description to the present invention.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present invention, especially the scope of claim does not have any restriction.

Claims

One kind that adopt flat conductor and put and arrange and the direct compound method of making the single face circuit board of the insulating substrate with glueability, comprising:

Provide as the flat conductor of the line layer of single face circuit board and put arrangement;

With flat conductor and put and arrange direct heat and be depressed on the insulating substrate, make said flat conductor and put the line layer that forms the single face circuit board;

At flat conductor and put and excise processing in the arrangement, thereby cut in the flat conductor position that needs break off;

Printing resistance solder paste China ink or hot pressing have the coverlay of solder joint window in advance on said line layer, and form solder mask.
2. method according to claim 1 is characterized in that:

When needs are installed the jack element, directly in bond pad locations boring or punching, thereby with in the component pins patchhole and be welded on the line layer.
3. each described method in requiring according to aforesaid right is characterized in that:

Said excision processing is selected from that mould is die-cut, boring, bore mill, laser ablation and wire cutting machine excision.
4. each described method in requiring according to aforesaid right is characterized in that:

Said excision is processed in the position of cutting flat conductor and excises insulating substrate simultaneously.
5. each described method in requiring according to aforesaid right is characterized in that said resistance solder paste China ink is the resistance solder paste China ink of using with conventional PCB, and said coverlay is the coverlay that FPC uses.
6. each described method in requiring according to aforesaid right is characterized in that the single face circuit board that said method is made is flexible PCB or rigid circuit board.
7. each described method in requiring according to aforesaid right is characterized in that said method also comprises:

Adopting printing conductive inks or welding conductors to realize passing a bridge connects; With

In bond pad locations welding electronic component is installed.
One kind that adopt flat conductor and put and arrange directly compound and single face circuit board that make comprises with insulating substrate with glueability:

Form the flat conductor of line layer and put arrangement, wherein, excision processing has been carried out in the flat conductor position that on said line layer, needs to break off;

The insulating substrate that is combined with each other with said line layer;

Be formed at the solder mask on the said line layer.
9. single face circuit board according to claim 8; It is characterized in that; Said insulating substrate is to be selected from epoxy glass base material+hot-setting adhesive, phenolic aldehyde base material+hot-setting adhesive, polyimide base material+hot-setting adhesive, metal base+hot-setting adhesive and ceramic base material+hot-setting adhesive wherein a kind of.
10. each described single face circuit board in requiring according to aforesaid right is characterized in that said flat conductor is copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.
11., it is characterized in that said single face circuit board is the surface attaching type circuit board according to each described single face circuit board in the aforesaid right requirement; Its structure comprises: ground floor is insulating substrate (1); The second layer is line layer (2), and the 3rd layer is solder mask (3), and the 4th layer is element and short circuit conductive layer (4; 5,6).
12., it is characterized in that said single face circuit board is the plug-in type circuit board according to each described single face circuit board in the aforesaid right requirement; Its structure comprises: ground floor is element and short circuit conductive layer (8; 9,10), the second layer is insulating substrate (1); The 3rd layer is line layer (2), and the 4th layer is solder mask (3).
13. the single face circuit board according to claim 12 is stated is characterized in that, in the form formation element legs hole (15) of bond pad locations through getting out or going out of said plug-in type circuit board.
14. each described single face circuit board in requiring according to aforesaid right is characterized in that said flat conductor adopts the circle line pressure to prolong and processes, or the flat conductor that cuts into metal forming, metallic plate, metal tape branch.
15. require each described single face circuit board among the 8-14 according to each described method in the claim 11 or according to aforesaid right, it is characterized in that, said and put that to arrange be to be arranged in parallel.
16. single face circuit board according to claim 15 is characterized in that, said single face circuit board is used for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube or LED Christmas lamp.
17. method according to claim 1 is characterized in that, said flat conductor adopts the circle line pressure to prolong and processes or cut into metal forming, metallic plate, metal tape branch, and makes with non-etched mode.
18. one kind is that adopt flat conductor and put and arrange and the direct compound method of making the single face circuit board of the insulating substrate with glueability, comprising:

Provide as the flat conductor of the line layer of single face circuit board and put arrangement;

With flat conductor and put and arrange direct heat and be depressed on the insulating substrate, and flat conductor processed and make said flat conductor and put the line layer that forms the single face circuit board, and said insulating substrate forms the insulating barrier of single face circuit board.