CN112203432A

CN112203432A - Method for manufacturing flat wire mesh circuit board

Info

Publication number: CN112203432A
Application number: CN202011089120.5A
Authority: CN
Inventors: 程胜鹏; 程鹏; 钟涛; 邵雪江
Original assignee: Zhongshan Liti Lighting Technology Co ltd
Current assignee: ZHONGSHAN MLS ELECTRONIC Co.,Ltd.
Priority date: 2020-10-13
Filing date: 2020-10-13
Publication date: 2021-01-08

Abstract

The application provides a manufacturing method of a flat wire mesh circuit board, which comprises the following steps: pressing the flat wire mesh on the bottom insulating film; cutting and breaking the flat wire mesh at a designated position on the bottom insulating film; and spreading ink on the bottom insulating film laminated with the flat wire mesh to form a solder mask and forming a solder mask pad window at a preset position. According to the manufacturing method of the flat wire mesh circuit board, the flat wire mesh is pressed on the bottom layer insulating film, and then the wires are cut to form the circuit, so that the manufacturing method is simple in process, low in cost, environment-friendly and pollution-free; and the coiled material can be made into coils, has unlimited length and effectively improves the production efficiency.

Description

Method for manufacturing flat wire mesh circuit board

[ technical field ] A method for producing a semiconductor device

The application relates to the technical field of LED circuit board manufacturing, in particular to a manufacturing method of a flat wire mesh circuit board.

[ background of the invention ]

The current LED circuit board mainly uses a PCB circuit board. The process is relatively complex, the production efficiency is low, and the circuit processing needs chemical etching, via hole electroplating and the like, so that the environmental pollution is great.

[ summary of the invention ]

The circuit board aims at solving the problems that the existing circuit board is complex in process, low in production efficiency and not environment-friendly in manufacturing. The manufacturing method of the flat wire mesh circuit board is simple in structure, high in production efficiency, environment-friendly and pollution-free in manufacturing and high in production efficiency. The application is realized by the following technical scheme:

the manufacturing method of the flat wire mesh circuit board comprises the following steps:

s1, pressing the flat wire mesh on the bottom insulating film;

s2, cutting and breaking the flat wire mesh at the appointed position on the bottom insulating film;

and S3, spreading the ink on the bottom insulating film pressed with the flat wire mesh to form a solder mask and forming a solder mask pad window at a preset position.

In the method for manufacturing the flat wire mesh circuit board as described above, in step S1, the flat wire mesh 1 is pressed on the underlying insulating film by the rolling wheels.

In the manufacturing method of the flat wire mesh circuit board, the rolling wheel comprises a hot-pressing roller.

In the method for manufacturing the flat wire mesh circuit board, the adhesive coating is provided on the bottom insulating film.

In the method of manufacturing the flat wire mesh circuit board, in step S2, the flat wire mesh is cut and disconnected by a laser cutting method or a die stamping method.

In the method for manufacturing the flat wire mesh circuit board, in step S3, ink is spread on the underlying insulating film to which the flat wire mesh is bonded by printing or spraying.

The manufacturing method of the flat wire mesh circuit board comprises the steps that the flat wire mesh comprises a plurality of strip wires which are arranged in parallel and a plurality of connecting wires which are arranged between two adjacent strip wires and used for connecting and conducting the two adjacent strip wires, and the connecting wires are distributed at intervals between the two adjacent strip wires along the length direction of the two adjacent strip wires.

In the method for manufacturing the flat wire mesh circuit board, the connecting wires are perpendicular to two adjacent long wires.

Compared with the prior art, the method has the following advantages:

according to the manufacturing method of the flat wire mesh circuit board, the flat wire mesh is pressed on the bottom layer insulating film, and then the wires are cut to form the circuit, so that the manufacturing method is simple in process, low in cost, environment-friendly and pollution-free; and the coiled material can be made into coils, has unlimited length and effectively improves the production efficiency.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.

FIG. 1 is a schematic view of a flat wire mesh laminated to an underlying insulating film;

FIG. 2 is a schematic view of a flat wire mesh cut away after being pressed on an underlying insulating film;

FIG. 3 is a schematic illustration of ink application;

fig. 4 is a schematic view of forming a solder resist layer;

fig. 5 is a schematic view of soldering electronic components.

[ detailed description ] embodiments

In order to make the technical problems, technical solutions and advantageous effects solved by the present application more clear and obvious, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

When the embodiments of the present application refer to ordinal numbers such as "first", "second", etc., it should be understood that the terms are used for distinguishing only when the context clearly indicates that the order is changed.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The method for manufacturing the flat wire mesh circuit board shown in fig. 1 to 5 comprises the following steps:

s1, the flat wire net 1 is pressed on the bottom insulating film 2.

In this step, as shown in fig. 1, the flat wire net 1 is pressed on the underlying insulating film 2 by the rolling wheels 3, and the rolling wheels 3 can level and press the flat wire net 1 on the underlying insulating film 2, so as to precisely press the flat wire net 1 on the underlying insulating film 2. Specifically, the rolling wheel 3 includes a hot-pressing roller 31, and the flat wire mesh can be firmly pressed on the bottom insulating film 2 by means of hot pressing, and in order to further improve the pressing stability, an adhesive coating is provided on the bottom insulating film 2.

In order to satisfy the user demand, flat wire net 1 includes many parallel arrangement's rectangular wire 11 and locates and be used for connecting between two adjacent rectangular wires 11 and lead a plurality of connecting wire 12 of two adjacent rectangular wires 11, and a plurality of connecting wire 12 are along the length direction interval distribution of two adjacent rectangular wires 11 between two adjacent rectangular wires 11, connecting wire 12 is perpendicular to two adjacent rectangular wires 11.

S2, cutting and breaking the flat wire mesh 1 at the designated position on the underlying insulating film 2.

In this step, the flat wire mesh 1 is cut off by means of laser cutting or die stamping. Fig. 2 shows the cut portion 13 of the flat wire mesh 1 after cutting.

And S3, spreading the ink on the bottom insulating film 2 pressed with the flat wire mesh 1 to form the solder mask layer 4 and forming the solder mask layer 4 pad window at the preset position.

In this step, ink is applied to the underlying insulating film 2 to which the flat wire mesh 1 is bonded by printing or spraying as shown in fig. 3. A wiring board with solder resist layer 4 pads windowed as shown in fig. 4 is formed. Next, the electronic component 5 is soldered on the wiring board, and the wiring board to which the electronic component 5 is soldered as shown in fig. 5 can be formed.

According to the manufacturing method of the flat wire mesh circuit board, the flat wire mesh is pressed on the bottom insulating film, and then the wires are cut to form the circuit, so that the manufacturing method is simple in process, low in cost, environment-friendly and pollution-free; and the coiled material can be made into coils, has unlimited length and effectively improves the production efficiency.

The foregoing is illustrative of the various embodiments provided in connection with the detailed description and the specific implementations of the application are not intended to be limited to the illustrations. Similar or identical methods, structures, etc. as used herein, or several technical deductions or substitutions made on the premise of the idea of the present application, should be considered as the protection scope of the present application.

Claims

1. The manufacturing method of the flat wire mesh circuit board is characterized by comprising the following steps:

s1, pressing the flat wire mesh (1) on the bottom layer insulating film (2);

s2, cutting and breaking the flat wire mesh (1) at the appointed position on the bottom layer insulating film (2);

and S3, spreading the ink on the bottom insulating film (2) pressed with the flat wire mesh (1) to form a solder mask layer (4) and forming a solder pad window of the solder mask layer (4) at a preset position.

2. The method of manufacturing a flat wire mesh circuit board according to claim 1, wherein in step S1, the flat wire mesh (1) is pressed on the underlying insulating film (2) by a rolling wheel (3).

3. The method of manufacturing a flat wire mesh circuit board according to claim 2, wherein the rolling wheel (3) comprises a hot-press roller (31).

4. The method of manufacturing a flat wire mesh circuit board according to claim 1, wherein the underlying insulating film (2) is provided with an adhesive coating.

5. The method of manufacturing a flat wire mesh circuit board according to claim 1, wherein in step S2, the flat wire mesh (1) is cut and broken by means of laser cutting or die stamping.

6. The method of manufacturing a flat wire mesh circuit board according to claim 1, wherein in step S3, ink is applied by printing or spraying on the underlying insulating film (2) to which the flat wire mesh (1) is press-fitted.

7. The method for manufacturing a flat wire mesh circuit board according to claim 1, wherein the flat wire mesh (1) comprises a plurality of parallel elongated wires (11) and a plurality of connecting wires (12) arranged between two adjacent elongated wires (11) for connecting and conducting the two adjacent elongated wires (11), and the plurality of connecting wires (12) are distributed at intervals along the length direction of the two adjacent elongated wires (11) between the two adjacent elongated wires (11).

8. The method of manufacturing a flat wire mesh circuit board according to claim 7, wherein the connecting wires (12) are perpendicular to two adjacent elongated wires (11).