CN107222974A - A kind of ductility circuit fabrication method - Google Patents
A kind of ductility circuit fabrication method Download PDFInfo
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- CN107222974A CN107222974A CN201710528331.6A CN201710528331A CN107222974A CN 107222974 A CN107222974 A CN 107222974A CN 201710528331 A CN201710528331 A CN 201710528331A CN 107222974 A CN107222974 A CN 107222974A
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- layer
- circuit
- ductility
- auxiliary substrate
- conductive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0531—Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of ductility circuit fabrication method, using " volume to volume " formula technique, including：Conductive layer and the first auxiliary substrate are closed to be formed layer by layer by S1 is made coiled material after one, end is unreeled using one end of the coiled material as initial charge, expansion setting length after unreeling, S2 is patterned on the coiled material conductive layer of expansion setting length, circuit structure needed for preparing, S3 regard the first elastomer layer for being provided with substrate as feed end, feeding is to roller, circuit structure is transferred to the first elastomer layer surface, the first auxiliary substrate layer is removed again, S4 is using poor to roll press and viscous force, chip is fitted together with circuit structure, obtain ductility circuit layer semi-finished product, S5 is by the second elastomeric transfer to ductility circuit layer surface of semi-finished, second elastomer layer is used for the encapsulated layer of ductility circuit layer semi-finished product.The production efficiency of ductility circuit is greatly improved by the way that the technique for making ductility circuit is combined with volume to volume motion platform in the inventive method.
Description
Technical field
The invention belongs to the making field of ductility circuit, and in particular to ductility circuit is made of volume to volume method.
Background technology
Ductility electronics can be summarized as being that organic/inorganic materials electronic device is produced on into Drawability plastics or thin metal matrix plate
On new electronic technology, the features such as with its unique light weight, thickness of thin, with ductility, in information, the energy, medical treatment, state
The field such as anti-has wide application prospect, such as flexible electronic displays, Organic Light Emitting Diode OLED, printing RFID, film too
Positive energy cell panel, bionic skin, intelligent wearable device etc..Ductility electronic technology is possible to bring an electronic technology leather
Life, causes global extensive concern and is developed rapidly.The U.S.《Science》Organic electronic technical progress is classified as by magazine
One of big scientific and technological achievement in the world ten in 2000, with human genome sketch, biological cloning technology etc. it is great find it is arranged side by side.
As traditional IC technology, manufacturing process and the main drive that equipment is also flexibility/ductility electronic technology development.
Ductility circuit is on the basis of flexible circuit is flexible, to be further added by extendable characteristic, but in manufacture craft, both have
Very big difference, mainly the former requirement to material is higher.
The Chinese patent application of Application No. 201510638404.8 discloses a kind of making side for making ductility circuit board
Method, it is by the way that first by photosensitive resin layer formation in removable auxiliary substrate, selectivity removes photosensitive resin and forms specific
Groove, conducting metal concordant photosensitive resin surface is then filled in groove, finally removes and embedded photosensitive resin is formed after substrate
Ductility circuit board.
The Chinese patent application of Application No. 201310090363.4 discloses a kind of ductility circuit interconnection architecture of making
Technique, it is that direct write goes out one-level wave pattern on silicon chip first with electrostatic spinning, is then transferred to the elastic substrate of pre-stretching
On, elastic substrate is recovered after nature, forms the pattern of secondary wave line structure.
On the whole, these methods for making flexibility/ductility circuit all lay particular emphasis on the improvement to circuit performance, when in face of big
When scale makes, all there is larger defect, and the whole overall not to making ductility circuit in processing efficiency this respect
Processing technology be more limited in terms of integrated and integration, efficiency.
Accordingly, it would be desirable to develop a kind of new ductility circuit fabrication method, it is desirable to which it can have in extensive make
Larger processing efficiency.
The content of the invention
For the disadvantages described above or Improvement requirement of prior art, the invention provides a kind of manufacture ductility of combination volume to volume
The method of circuit, it is intended that by the way that the technique for making ductility circuit is combined with volume to volume motion platform, prolonging production
The efficiency of property circuit is greatly improved.
To achieve the above object, according to one aspect of the present invention there is provided a kind of ductility circuit fabrication method, use
" volume to volume " technique, specifically includes following steps：
S1：Conductive layer and the first auxiliary substrate are closed to be formed layer by layer coiled material are made after one, using one end of the coiled material as
Initial charge unreels end, expansion setting length after unreeling,
S2：Patterned on the coiled material conductive layer of expansion setting length, the circuit structure needed for preparing carries out pattern
The method of change includes machinery to roller erasing, cross cutting, biological etching, chemical etching or laser patterning,
S3：Using the first elastomer layer for being provided with substrate as feed end, send into roller, by roll press and viscous force
Difference, the first elastomer layer surface is transferred to by circuit structure, then is removed the first auxiliary substrate layer as waste material winding,
S4：The corresponding position of circuit structure will be transported to the chip of the second auxiliary substrate layer carrying, and make chip and the
The circuit structure alignment of one surface of elastomer, using to roll press, chip is fitted together with circuit structure, then auxiliary by second
Help basalis to wind as waste material to remove, obtain ductility circuit layer semi-finished product,
S5：Using the second elastomer layer for being provided with the 3rd auxiliary substrate as feed end, send between mutually reply roller, by right
Roll press and viscous force are poor, and the second elastomer layer is transferred into ductility circuit layer surface of semi-finished, and the second elastomer layer is used for ductility
The encapsulated layer of circuit layer semi-finished product, is completed after encapsulation, then winds removal using the 3rd auxiliary substrate as waste material, obtains ductility electricity
Road.
Said process is a kind of typical most basic technological process, can be with according to specific ductility circuit structure demand
Raw material is unreeled and is combined with waste material wrapup procedure, patterning process, transfer process etc., similar to the series connection and parallel connection of circuit
Deng combination, such as to make multilayer circuit layer, then need repeatedly to be patterned, the intermediate elastomeric layer of circuit interlayer turns
The steps such as print, the transfer of circuit interlayer connection conductor.
Further, the conductive layer is selected from the conductive film of conductive metal film and non-metallic material, the conductive gold
Belonging to film includes copper foil, aluminium foil, goldleaf, silver foil and iron thin film, the conductive film of the non-metallic material include silicon material film,
Conducting polymer thin film, conductivity ceramics and conductive hydrogel.As long as in principle can as conductor material, conductive thin
The thickness of film is less than 20 microns more excellent.
Further, first, second elastomer layer can be silica gel, such as common are dimethyl silicone polymer
(PDMS) or tetramethylene adipate and the copolymer of mutual-phenenyl two acid bromide two alcohol ester (ECOFLEX) etc., it has preferable
The features such as ductility, extension at break or thermoplastic polyurethane (TPU) or hydrogel etc. elastomer rubber, it is described
The thickness of elastomer layer is then determined according to the particular use of made ductility circuit.
Further, the surface of the auxiliary substrate layer can increase by one layer of glue line, and this is for the ease of fixed quilt
Carrier and meet transfer process viscous force difference demand.
Further, in order to protect chip and elastomer enter the process before not by the physics shadow such as collision of other objects
Ring and ensure performance reliability, layer protective layer can also be further added by the chip or surface of elastomer of respective web, i.e. the volume
Material is further added by a stripping off device by auxiliary substrate layer, chip/elastomer, protective layer up of three layers before corresponding process is entered
Protective layer is removed；Chip or elastomer can also directly be picked up by modes such as mechanical arms to be placed into auxiliary substrate and transmitted
Come over, so as to avoid enter into inside coiled material and collide influence by the auxiliary substrate of adjacent layer.Similarly, it is last in technique, for protection
Packaged ductility circuit is overall, and one layer of similar protective layer can also be added to enter back into winding link on its surface, or directly
Finished product collection device is picked and placed into by modes such as mechanical arms.
Further, the auxiliary substrate, substrate or protective layer can be poly terephthalic acid class plastics (PET), gather
The films such as carbonic ester (PC), polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP).Substantially, above-mentioned plastics are also not necessarily limited to
Film, as long as with certain intensity, can carry carried thing, the thin-film material not deformed in real work is i.e.
Can.
Further, in the step S4, the specific assembling mode between chip and circuit is not limited, such as using conduction
Then increase corresponding steps in gemel connection or welding manner, technique, such as on the chip mounting location of circuit structure in advance
Apply the auxiliary substance such as conducting resinl or soldering paste.
Further, in addition to step S6, step S6 are：Packaged ductility circuit is integrally post-processed, finally
Winding.Post processing in the step S6 can to the overall further reinforcing of ductility circuit, such as improve the reliable of encapsulation
Property and circuit stability, other operation can be directly by the finished product made carry out secondary operation, such as be fixed in
The two-dimensional surface or three-dimensional surface of required target object.
Further, in the appropriate step of whole technique, laminated, transfer the progress of such as conductive layer and auxiliary substrate layer,
The separation of auxiliary substrate layer, the assembling of chip, the stripping of protective layer and laminated etc., can add heating or cooling device with auxiliary
Assistant engineer skill is smoothed out.
In general, by the contemplated above technical scheme of the present invention compared with prior art, it can obtain down and show
Beneficial effect：
By placement, the making of conductive layer, conductive layer and the basalis of whole techniques of ductility circuit production, including basalis
The processing step such as bonding, the installation of chip, the collection of finished product integrated using the design concept of " volume to volume ", realize
The automation of ductility circuit production, and the advantage of volume to volume mode is made full use of, realize the high efficiency of ductility circuit production.
Brief description of the drawings
Fig. 1 is to complete unreeling and laminated structural representation for ductility circuit production according to the inventive method embodiment；
Fig. 2 be according to the inventive method embodiment complete ductility circuit production when ductility circuit is integrally added protective layer and
The structural representation finally wound；
Fig. 3 (a), (b) is two kinds of different transfer modes structural representations in the embodiment of the present invention；
Fig. 4 is the schematic flow sheet according to complete set during the inventive method embodiment completion ductility circuit production.
In all of the figs, identical reference is used for representing identical element or structure, wherein：
100 represent emptying roller, and 200 represent to roller, and 300 represent material receiving roller, and 400 represent help roll, and 500 represent separate roller,
600 represent patterning apparatus；A is the conductive layer after patterning, and b is elastomer layer, and c is chip, and d, e are respectively first, second
Semi-finished product, f is overall for packaged ductility circuit.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in each embodiment of invention described below
Not constituting conflict each other can just be mutually combined.
Fig. 1 is to complete unreeling and laminated structural representation for ductility circuit production according to the inventive method embodiment, its
In：Two emptying rollers 100 carry out blowing to conductive layer and auxiliary substrate layer respectively, and the laminated of the two is completed to roller 200.
Fig. 2 be according to the inventive method embodiment complete ductility circuit production when ductility circuit is integrally added protective layer and
The structural representation finally wound, that is, the packaged ductility circuit global approach conveyed, adds first with to roller 200 to it
The protective layer of layer of surface, it is ensured that it can not be influenceed after winding by other substrates, carry out the winding of finished product coiled material again afterwards.
Fig. 3 (a), (b) is two kinds of different transfer modes structural representations in the embodiment of the present invention, and both of which is
Realize and transfer with twin rollers structure, but in Fig. 3 before and after (a) figure representative transfer, the substrate of main body changes, (b) figure in Fig. 3
Represent before and after transfer, the substrate of main body does not change, and both of which is all reclaimed to auxiliary substrate, rewinding in such as Fig. 3
Roller 300 is used to reclaim auxiliary substrate.
In Practical Project practice, it can be opened according to the demand of specific transferring effect from the acceptor of transferred object and transfer
Beginning touches transfer and terminates the separation of the two, can adjust this section of contact length or increase to roller to improve transfer in centre
Effect.As contact length is to roller 200 to separate roller 500, in Fig. 3 in (b) figure then only to roller 200 in (a) figure in Fig. 3
Contact, can also be in figure 3 in (a) figure to being further added by aiding in roller transfer between roller 200 and separate roller 500.
With reference to above retractable volume and transfer modes, the inventive method proposes that one kind realizes ductility circuit system using volume to volume
The entire flow schematic diagram of work is as shown in figure 4, it comprises the following steps：
S1：The conductive layer and the first auxiliary substrate layer that make coiled material are unreeled by two emptying rollers 100 respectively, and
Carried out by laminated mechanism 200 laminated；
S2：Conductive layer is patterned, i.e., by the method for patterning, such as machinery loses to roller erasing, cross cutting, chemistry
The modes such as quarter, biological etching, laser obtain required conductive layer a to conductive layer optionally pattern-making；
S3：The conductive layer a made is transferred on the first elastomer layer b with substrate, i.e., first with emptying roller 100
The the first elastomer layer b carried with basalis is unreeled, it is poor by viscous force, conductive layer a is transferred to the first elastomer layer b
Surface, obtains the first semi-finished product d, then the first auxiliary substrate layer is wound as waste material by material receiving roller 300；
S4：The assembling of circuit chip, i.e., convey first with 100 couples of chip c with the layer carrying of the second auxiliary substrate of emptying roller
To near the conductive layer a on the first elastomer layer b surfaces relevant position, then it is aided with for example mode such as machine vision and carries out alignment group
Dress, obtains the second semi-finished product e, then the second auxiliary substrate layer is wound as waste material by material receiving roller 300；
S5：The encapsulation of ductility circuit, i.e., first with 100 pairs of second elastomers with the layer carrying of the 3rd auxiliary substrate of emptying roller
Layer b carries out blowing, again by the mode of transfer, regard the second elastomer layer b as the ductility circuit semi-finished product for installing chip
Top layer, complete encapsulation, obtain ductility circuit entirety f, then the 3rd auxiliary substrate layer is received as waste material by material receiving roller 300
Volume；
S6：Packaged ductility circuit entirety f is post-processed and other operations, carried out finally by material receiving roller 300
Final winding.
Said process is a kind of typical most basic flow, simply to illustrate that how to carry out Fig. 1-Fig. 3 mode
Technique is connected.
In Practical Project practice, raw material can be unreeled according to specific ductility circuit structure demand and be wound with waste material
Journey, patterning process, transfer process etc. are combined, and are combined similar to series connection and parallel connection of circuit etc., such as many to make
Layer circuit layer, then need multiple patterning, the transfer of the intermediate elastomeric layer of circuit interlayer, the transfer of circuit interlayer connection conductor
Etc. step.
In addition, also omit some such as actual volume to volume such as carry-over pinch rolls, error-correction structure, tonometry and control in Fig. 4
Necessary device in technique.
Further, in the step S4, the specific assembling mode between chip and circuit is not limited, such as using conduction
Then increase corresponding steps in gemel connection or welding manner, technique, such as on the chip mounting location of circuit structure in advance
Apply the auxiliary substance such as conducting resinl or soldering paste.
Further, the post processing in the step S6 can to the overall further reinforcing of ductility circuit, such as be carried
The reliability of height encapsulation and the stability of circuit, other operations can be that the finished product made directly is carried out into secondary operation, than
The two-dimensional surface or three-dimensional surface of target object needed for being such as fixed in.
Specifically, the conductive layer is selected from the conductive film of conductive metal film and non-metallic material, the conducting metal
Film includes copper foil, aluminium foil, goldleaf, silver foil and iron thin film, and the conductive film of the non-metallic material includes silicon material film, led
Electric polymer film, conductivity ceramics and conductive hydrogel.As long as in principle can as conductor material, conductive film
Thickness for less than 20 microns it is more excellent.As long as in principle can as conductor material.
The elastomer layer can be silica gel, such as common are dimethyl silicone polymer (PDMS) or adipic acid fourth two
Alcohol ester and the copolymer of mutual-phenenyl two acid bromide two alcohol ester (ECOFLEX) etc., with spies such as preferable ductility, extension at breaks
The elastomer rubber such as point or thermoplastic polyurethane (TPU) or hydrogel, the thickness of the elastomer layer is then according to institute
The particular use for making ductility circuit is determined；
Auxiliary substrate/substrate/the protective layer can be poly terephthalic acid class plastics (PET), makrolon (PC), gather
The films such as ethene (PE), polyvinyl chloride (PVC), polypropylene (PP), substantially, are also not necessarily limited to above-mentioned plastic sheeting, as long as tool
Have certain intensity, carried thing can be carried, the thin-film material not deformed in real work, for and it is conductive
What layer was contacted has also needed to insulation characterisitic.
In the present invention, mainly use transfer to realize that target object is transferred to another object table from a body surface
The process in face.Transfer is when a target object is contacted when separating again with two objects simultaneously, due to target object and both sides thing
Viscous force size between body has differences, and can be inclined to a kind of technique adhered on the larger side object of viscous force.In the inventive method,
For the ease of fixing carried thing and meeting the demand of viscous force difference in different transfer process, the surface of the auxiliary substrate layer can
To increase the glue line with particular size viscous force.
In the present invention, in order to protect chip and elastomer entering before the process not by the physics shadow such as collision of other objects
Ring and ensure performance reliability, layer protective layer can be further added by the chip or surface of elastomer of respective web, i.e. the coiled material
By auxiliary substrate layer, chip/elastomer, protective layer up of three layers.A stripping off device is further added by before corresponding process is entered will
Protective layer removes.Chip or elastomer can also directly be picked up by modes such as mechanical arms to be placed into auxiliary substrate and upload and passed through
Come, so as to avoid enter into inside coiled material and collide influence by the auxiliary substrate of adjacent layer.Similarly, it is last in technique, it is tamper seal
The ductility circuit installed is overall, and one layer of similar protective layer can also be added to enter back into putting in winding link, such as Fig. 2 on its surface
Material roller 100 is to provide layer protective layer to protect final circuit, or directly picks up and place by modes such as mechanical arms
To finished product collection device.
In the present invention, in the appropriate location of whole technique, laminated, transfer the progress of such as conductive layer and auxiliary substrate layer,
The separation of auxiliary substrate layer, the assembling of chip, the stripping of protective layer and laminated etc., can add heating or cooling device with auxiliary
Assistant engineer skill is smoothed out.
" volume to volume motion platform " in the present invention includes multipair active or passive roller, in other words including multipair right
Roller, volume to volume English name is Roll to Roll, domestic general abbreviation R2R, the device processed primarily directed to film-like materials,
By the actively or passively rotation of roller, to realize a kind of processing mode efficiently, inexpensive to material.There is scholar
(Sukang Bae,Hyeongkeun Kim,Youngbin Lee,et al.Roll-to-roll production of 30-
inch graphene films for transparent electrodes[J].Nature Nanotechnology,2010,
5:5574-578.) Graphene electrodes are made by means of which, some scholars (Krebs F C, Gevorgyan S A,
Alstrup J.A roll-to-roll process to flexible polymer solar cells:model
studies,manufacture and operational stability studies[J].Journal of Materials
Chemistry,2009,19(30):5442-5451.) be used for making solar cell.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, it is not used to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the invention etc., it all should include
Within protection scope of the present invention.
Claims (6)
1. a kind of ductility circuit fabrication method, it is characterised in that use " volume to volume " technique, specifically include following steps：
S1：Conductive layer and the first auxiliary substrate are closed to be formed layer by layer coiled material is made after one, using one end of the coiled material as initial
Charging unreels end, expansion setting length after unreeling,
S2：Patterned on the coiled material conductive layer of expansion setting length, the circuit structure needed for preparing is patterned
Method includes machinery to roller erasing, cross cutting, biological etching, chemical etching or laser patterning,
S3：The first elastomer layer of substrate will be provided with as feed end, feeding is roller, by poor to roll press and viscous force,
Circuit structure is transferred to the first elastomer layer surface, then removed the first auxiliary substrate layer as waste material winding,
S4：The corresponding position of circuit structure will be transported to the chip of the second auxiliary substrate layer carrying, makes chip and the first bullet
The circuit structure alignment of elastomeric surface, using to roll press, chip is fitted together with circuit structure, then aid in base by second
Bottom winds as waste material and removed, and obtains ductility circuit layer semi-finished product,
S5：Using the second elastomer layer for being provided with the 3rd auxiliary substrate as feed end, send between mutually reply roller, by roll-in
Close and viscous force is poor, the second elastomer layer is transferred to ductility circuit layer surface of semi-finished, the second elastomer layer is used for ductility circuit
The encapsulated layer of layer semi-finished product, is completed after encapsulation, then winds removal using the 3rd auxiliary substrate as waste material, obtains ductility circuit.
2. ductility circuit fabrication method as claimed in claim 1, it is characterised in that the conductive layer is selected from conductive metal film
With the conductive film of non-metallic material,
The conductive metal film includes copper foil, aluminium foil, goldleaf, silver foil and iron thin film,
The conductive film of the non-metallic material includes silicon material film, conducting polymer thin film, conductivity ceramics and conductive water-setting
Glue.
3. ductility circuit fabrication method as claimed in claim 2, it is characterised in that the first, second elastomer layer material
Selected from silica gel, thermoplastic polyurethane and hydrogel.
4. ductility circuit fabrication method as claimed in claim 3, it is characterised in that the first, second, third auxiliary base
Bottom, the substrate material are selected from poly terephthalic acid class plastics, makrolon, polyethylene, polyvinyl chloride and polypropylene.
5. ductility circuit fabrication method as claimed in claim 4, it is characterised in that in step S4, is set on circuit structure
Conducting resinl or soldering paste, for making circuit structure and chip strong bonded.
6. ductility circuit fabrication method as claimed in claim 1, it is characterised in that also including step S6：Packaged is prolonged
Property circuit is integrally post-processed, and is finally wound.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710528331.6A CN107222974B (en) | 2017-07-01 | 2017-07-01 | A kind of ductility circuit fabrication method |
| PCT/CN2017/112770 WO2019006962A1 (en) | 2017-07-01 | 2017-11-24 | Method for manufacturing ductile circuit |
| JP2019501694A JP6796703B2 (en) | 2017-07-01 | 2017-11-24 | Manufacturing method of ductile circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710528331.6A CN107222974B (en) | 2017-07-01 | 2017-07-01 | A kind of ductility circuit fabrication method |
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| Publication Number | Publication Date |
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| CN107222974A true CN107222974A (en) | 2017-09-29 |
| CN107222974B CN107222974B (en) | 2019-04-12 |
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| CN201710528331.6A Active CN107222974B (en) | 2017-07-01 | 2017-07-01 | A kind of ductility circuit fabrication method |
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| JP (1) | JP6796703B2 (en) |
| CN (1) | CN107222974B (en) |
| WO (1) | WO2019006962A1 (en) |
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| CN108323025A (en) * | 2018-02-01 | 2018-07-24 | 北京启创驿讯科技有限公司 | A kind of preparation method and processing copper foil of printed circuit board |
| WO2019006962A1 (en) * | 2017-07-01 | 2019-01-10 | 华中科技大学 | Method for manufacturing ductile circuit |
| CN110739233A (en) * | 2019-10-24 | 2020-01-31 | 京东方科技集团股份有限公司 | Method for manufacturing flexible sensor |
| CN112203432A (en) * | 2020-10-13 | 2021-01-08 | 中山市立体光电科技有限公司 | Method for manufacturing flat wire mesh circuit board |
| CN112275564A (en) * | 2020-10-10 | 2021-01-29 | 山东华冠智能卡有限公司 | Processing device based on graphene RFID antenna |
| CN112888185A (en) * | 2020-12-30 | 2021-06-01 | 江苏新澄瑞材料科技有限公司 | Preparation method, product and application of flexible circuit |
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| CN111885841B (en) * | 2020-07-31 | 2023-04-07 | 西安工程大学 | Preparation method of flexible stretchable conductive circuit |
| CN115709582B (en) * | 2022-11-16 | 2024-05-28 | 中南大学 | Roll-to-roll integrated high-efficiency manufacturing system of microfluidic chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1399507A (en) * | 2001-07-25 | 2003-02-26 | 日东电工株式会社 | Circuit board making process |
| CN1460069A (en) * | 2000-10-12 | 2003-12-03 | 阿梅代奥·坎多雷 | Heat lamination of dry photoresist film onto board for printed circuit |
| KR100824067B1 (en) * | 2007-01-19 | 2008-04-21 | 한국과학기술원 | Printed circuit board manufacturing apparatus using friction electrification |
| CN104244585A (en) * | 2013-07-04 | 2014-12-24 | 漳州市福世通电子有限公司 | Process method for bonding between roll type FPC line base material and sheet type cover film |
| CN106851999A (en) * | 2015-10-30 | 2017-06-13 | 印可得株式会社 | Flexible printed circuit board manufacture method and its manufacture device |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0668722A (en) * | 1992-08-24 | 1994-03-11 | Mitsubishi Cable Ind Ltd | Manufacture of flat wiring body |
| JP3495211B2 (en) * | 1996-12-16 | 2004-02-09 | 京セラ株式会社 | Transfer sheet for forming wiring board, method for manufacturing the same, and method for manufacturing wiring board |
| FR2760209B1 (en) * | 1997-03-03 | 1999-05-21 | Ier | METHOD AND SYSTEM FOR ISSUING IDENTIFICATION TAGS |
| JP2002352206A (en) * | 2001-05-30 | 2002-12-06 | Toppan Forms Co Ltd | Method for manufacturing data transmitting/receiving body |
| DE102004006457A1 (en) * | 2004-02-04 | 2005-08-25 | Bielomatik Leuze Gmbh + Co Kg | Method and device for the continuous production of electronic film components |
| US9053401B2 (en) * | 2004-07-30 | 2015-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Laminating system, IC sheet, scroll of IC sheet, and method for manufacturing IC chip |
| DE102006044525B3 (en) * | 2006-09-21 | 2008-01-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for production of integrated circuit, involves continuous making of flexible substrate having conductive strip structure, where flexible integrated circuit is connected with conductive strip structure of flexible substrate |
| CN101308953A (en) * | 2008-07-04 | 2008-11-19 | 汤献维 | Special membrane and method for manufacturing radio-frequency label antenna |
| US8361840B2 (en) * | 2008-09-24 | 2013-01-29 | Eastman Kodak Company | Thermal barrier layer for integrated circuit manufacture |
| JP5351789B2 (en) * | 2010-01-29 | 2013-11-27 | サトーホールディングス株式会社 | RFID label and method of processing RFID label |
| EP2355144A1 (en) * | 2010-02-09 | 2011-08-10 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Component placement on flexible and/or stretchable substrates |
| KR101147988B1 (en) * | 2010-07-13 | 2012-05-24 | 포항공과대학교 산학협력단 | Method of manufacturing flexible electronic device using physical peel-off method, flexible electronic device and flexible substrate |
| JP2014075253A (en) * | 2012-10-04 | 2014-04-24 | Nitto Denko Corp | Method for manufacturing organic electroluminescent device |
| CN107222974B (en) * | 2017-07-01 | 2019-04-12 | 华中科技大学 | A kind of ductility circuit fabrication method |
-
2017
- 2017-07-01 CN CN201710528331.6A patent/CN107222974B/en active Active
- 2017-11-24 WO PCT/CN2017/112770 patent/WO2019006962A1/en active Application Filing
- 2017-11-24 JP JP2019501694A patent/JP6796703B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1460069A (en) * | 2000-10-12 | 2003-12-03 | 阿梅代奥·坎多雷 | Heat lamination of dry photoresist film onto board for printed circuit |
| CN1399507A (en) * | 2001-07-25 | 2003-02-26 | 日东电工株式会社 | Circuit board making process |
| KR100824067B1 (en) * | 2007-01-19 | 2008-04-21 | 한국과학기술원 | Printed circuit board manufacturing apparatus using friction electrification |
| CN104244585A (en) * | 2013-07-04 | 2014-12-24 | 漳州市福世通电子有限公司 | Process method for bonding between roll type FPC line base material and sheet type cover film |
| CN106851999A (en) * | 2015-10-30 | 2017-06-13 | 印可得株式会社 | Flexible printed circuit board manufacture method and its manufacture device |
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|---|---|---|---|---|
| WO2019006962A1 (en) * | 2017-07-01 | 2019-01-10 | 华中科技大学 | Method for manufacturing ductile circuit |
| CN108323025A (en) * | 2018-02-01 | 2018-07-24 | 北京启创驿讯科技有限公司 | A kind of preparation method and processing copper foil of printed circuit board |
| CN108323025B (en) * | 2018-02-01 | 2020-01-14 | 北京启创驿讯科技有限公司 | Preparation method of printed circuit board and copper foil for processing |
| CN110739233A (en) * | 2019-10-24 | 2020-01-31 | 京东方科技集团股份有限公司 | Method for manufacturing flexible sensor |
| CN110739233B (en) * | 2019-10-24 | 2021-08-24 | 京东方科技集团股份有限公司 | Method for manufacturing flexible sensor |
| CN112275564A (en) * | 2020-10-10 | 2021-01-29 | 山东华冠智能卡有限公司 | Processing device based on graphene RFID antenna |
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| CN112203432A (en) * | 2020-10-13 | 2021-01-08 | 中山市立体光电科技有限公司 | Method for manufacturing flat wire mesh circuit board |
| CN112888185A (en) * | 2020-12-30 | 2021-06-01 | 江苏新澄瑞材料科技有限公司 | Preparation method, product and application of flexible circuit |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6796703B2 (en) | 2020-12-09 |
| CN107222974B (en) | 2019-04-12 |
| JP2019525466A (en) | 2019-09-05 |
| WO2019006962A1 (en) | 2019-01-10 |
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