JP6796703B2 - Manufacturing method of ductile circuit - Google Patents

Description

The present invention belongs to the field of manufacturing ductile circuits, and specifically relates to manufacturing ductile circuits by a roll-to-roll method.

Dexterity electronic technology can be summarized as a new electronic technology for manufacturing organic / inorganic material electronic devices on ductile plastic or thin metal substrates, due to its unique advantages such as light weight, thin thickness, and expandability. In the fields of information, energy, medical care, national defense, etc., it has a wide range of applications prospects such as flexible electronic displays, organic light emitting diode OLEDs, printing RFIDs, thin film solar panel, bionic electronic skins, smart wearable devices, etc. .. Ductile electronic technology will bring about an electronic technology revolution, raise widespread interest around the world, and have the potential for rapid development. The US «Science» magazine cites the development of organic and electronic technology as one of the world's top ten scientific and technological achievements in 2000, and is important for human genome sketch, bio-cloning technology, etc. It is lined up with various discoveries.

Like conventional IC technology, manufacturing processes and equipment are the main drivers of the development of flexible / ductile electronic technology. The ductile circuit is based on the flexibility of the flexible circuit and further has ductile properties, but in the manufacturing process, the two are very different, mainly the former is more demanding on the material.

In the Chinese patent application of application number 20151063840.4.8, the photosensitive resin layer is formed on a removable auxiliary substrate, the photosensitive resin is selectively removed to form a specific groove, and the groove is filled with a conductive metal. A method for manufacturing a ductile circuit board, which forms a ductile circuit board in which a photosensitive resin is embedded after flattening the surface of the photosensitive resin and finally removing the substrate, is disclosed.

The Chinese patent application of application number 201310090363.4 writes a primary ripple pattern on a silicon plate by electrostatic spinning and then transfers it onto a pre-pulled elastic substrate to restore the elastic substrate to its natural state. After that, the manufacturing process of the interconnection structure of the ductile circuit that forms the pattern of the secondary ripple structure is disclosed.

Overall, the methods of manufacturing these flexible / ductile circuits are focused on improving circuit performance, and during mass production, all have major defects in terms of processing efficiency, and ductile circuits. It is not integrated and integrated for all processing processes that make the whole, further limiting in terms of efficiency.

Therefore, it is necessary to develop a new method for manufacturing a ductile circuit, and it is required to have a large processing efficiency at the time of mass production.

With respect to the above defects or improvement requirements of the prior art, the present invention aims to significantly improve the production efficiency of the ductile circuit by combining the manufacturing process of the ductile circuit with the roll-to-roll moving stage. Provided is a method for manufacturing a ductile circuit in which rolls are coupled.

In order to achieve the above object, a method for manufacturing a ductile circuit including the following steps is specifically provided by using a "roll-to-roll process" based on one aspect of the present invention. :
S1: conductive layer and by laminating the first auxiliary substrate layer to form a roll material, one end of the roll material as an end unwinding initial feed, to output winding,
S2: winding out has been subjected to patterning to roll material conductive layer, to produce a desired circuit structures, of which a method of performing patterning includes mechanical erasing Pearora, die cut, bio etching, chemical etching or laser patterning ,
S3: The first elastic layer on which the substrate is provided is used as a feed end and fed between the pair rollers, and the circuit structure is transferred to the surface of the first elastic layer by the difference in the press and adhesive force of the pair rollers, and then the first auxiliary substrate. Take up and remove the layer as scrap,
S4: The chip mounted by the second auxiliary substrate layer is sent to the corresponding position of the circuit structure, the chip and the circuit structure on the surface of the first elastic body are aligned, and the chip and the circuit structure are united by pressing the pair roller. Assemble, then wind up and remove the second auxiliary substrate layer as scrap to obtain a semi-finished ductile circuit layer,
S5: The second elastic body layer provided with the third auxiliary substrate layer is used as a feed end and fed between the corresponding pair rollers, and the second elastic body layer is a semi-finished product of the ductile circuit layer due to the difference in press and adhesive force of the pair rollers. Transferred to the surface, the second elastic layer is used as a semi-finished packaging layer of the ductile circuit layer, and after the packaging is completed, the third auxiliary substrate layer is wound up and removed as scrap to obtain a ductile circuit.

The above process is a typical most basic process flow, and a raw material unwinding and scrap winding process, a patterning process, a transfer process, etc. may be combined based on a specific structural requirement of a ductile circuit. In a combination such as series and parallel, for example, when manufacturing a multi-layer circuit layer, steps such as patterning a plurality of times, transferring an intermediate elastic layer between circuit layers, and transferring a circuit interlayer connecting conductor are performed. Is needed.

Further, the conductive layer is selected from a conductive metal thin film and a conductive thin film made of a non-metallic material, the conductive metal thin film includes a copper foil, an aluminum foil, a gold foil, a silver foil and an iron thin film, and the conductive thin film made of the non-metallic material is , Silicon thin film, conductive polymer thin film, conductive ceramics and conductive hydrogel. In principle, any material may be used as a conductor, and the thickness of the conductive thin film is preferably 20 μm or less.

Further, the first and second elastic layers may be silica gel, for example, general polydimethylsiloxane (PDMS) or a copolymer of butylene adipate and butylene terephthalate (ECOFLEX) and the like. It has advantages such as good expandability and tear elongation, and may be an elastic rubber such as thermoplastic polyurethane (TPU) or hydrogel, and the thickness of the elastic layer is manufactured. It may be determined according to the specific use of the ductile circuit.

Further, a single pressure-sensitive adhesive layer may be added to the surface of the auxiliary substrate layer in order to facilitate fixing of the mounted object and to satisfy the demand for a difference in adhesive strength in the transfer process.

In addition, to protect the chips and elastic bodies, the corresponding roll material chips to ensure performance reliability without being physically affected by collisions with other objects before entering the process. A single layer of protective layer may be added to the surface of the elastic body, that is, the roll material consists of three layers, an auxiliary substrate layer, a chip / elastic body, and a protective layer, one before entering the corresponding process. The protective layer may be removed by further adding a peeling device. Chips and elastic bodies are directly picked up and set on an auxiliary board by a method such as a robot arm, and then sent. As a result, it is possible to avoid entering the inside of the roll material and colliding with and being affected by the auxiliary substrate of the adjacent layer. Similarly, at the end of the process, one layer of similar protective layer may be added to the surface to protect the entire packaged ductile circuit and re-enter the take-up link, or a method such as a robot arm directly. You may pick it up in the finished product collection device and set it.

Further, the auxiliary substrate, the substrate or the protective layer may be a thin film such as polyethylene terephthalate plastic (PET), polycarbonate (PC), polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP) or the like. Substantially, it is not limited to the above-mentioned plastic thin film, and any thin film material that does not deform in practice may be used as long as it has a certain strength that allows the mounted object to be mounted.

Further, in step S4, the specific assembly method between the chip and the circuit is not limited, and for example, it may be connected by a conductive adhesive or a welding method, and a conductive adhesive or a conductive adhesive may be used at the chip mounting position of the circuit structure. Corresponding steps may be added during the process, such as pre-applying an auxiliary material such as solder paste.

Further including step S6 of post-processing the entire packaged ductile circuit and finally winding it up. The post-treatment in step S6 is a further enhancement of the entire ductile circuit, for example, to improve packaging reliability and circuit stability, and to directly secondary process the manufactured product by other operations. Also, for example, it is fixed to a two-dimensional surface or a three-dimensional surface of a desired target object.

In addition, heating or cooling devices are added to the appropriate steps of the entire process, such as lamination of the conductive and auxiliary substrate layers, execution of transfer, separation of the auxiliary substrate layers, chip assembly, stripping of the protective layer and lamination. It can assist in the smooth progress of the process.

From the above, the following beneficial effects can be obtained by comparing the above technical proposal as the concept of the present invention with the prior art.
The entire process of manufacturing a ductile circuit is a "roll-to-roll" design concept, such as setting the substrate layer, manufacturing the conductive layer, bonding the conductive layer and the substrate layer, mounting the chip, and collecting the product. It is integrated together to realize the automation of the ductile circuit manufacturing, and realizes the high efficiency of the ductile circuit manufacturing by fully utilizing the advantages of the roll-to-roll method.

It is a structural schematic diagram which completes unwinding and lamination of ductile circuit manufacturing by the method embodiment of this invention. It is a structural schematic diagram which adds a protective layer to the whole ductile circuit at the time of manufacturing a ductile circuit, and completes the final winding by the method embodiment of this invention. (A) and (b) are structural schematic diagrams of two different transfer methods according to the embodiment of the present invention. It is a schematic diagram of the whole flow at the time of completing the ductile circuit manufacturing by the method embodiment of this invention.

In all drawings, the markings in the same drawing represent the same member or structure. Here, 100 represents a feed roller, 200 represents a pair roller, 300 represents a receive roller, 400 represents an auxiliary roller, 500 represents a separation roller, 600 represents a patterning device, and a represents after patterning. Is a conductive layer, b is an elastic layer, c is a chip, d and e are first and second semi-finished products, respectively, and f is the entire packaged ductile circuit.

In order to further clarify the object, technical proposal and advantages of the present invention, the present invention will be described in more detail by combining the drawings and the embodiments below. It should be understood that the specific embodiments described herein are for the purpose of explaining the present invention and not for limiting the present invention. In addition, the technical features involved in each of the embodiments of the invention described below may be combined with each other as long as they do not collide with each other.

FIG. 1 is a schematic structural diagram for completing unwinding and lamination of ductile circuit manufacturing according to the method embodiment of the present invention. Here, the two feed rollers 100 feed the conductive layer and the auxiliary substrate layer, respectively, and the pair roller 200 completes the lamination of both.

FIG. 2 shows a method of adding a protective layer to the entire ductile circuit during manufacturing of the ductile circuit and completing the final winding according to the method embodiment of the present invention, that is, obtaining the entire packaged ductile circuit sent. The method is as follows: First, a pair roller 200 is used to add a layer of surface protective layer to it to ensure that it is not affected by other substrates after winding, and then winding the finished roll material. I do.

(A) and (b) of FIG. 3 are structural schematic views of two different transfer methods according to the embodiment of the present invention. In both of the two methods, transfer is realized by a pair roller mechanism, but FIG. 3 (a) shows that a change has occurred in the main substrate before and after transfer, and FIG. 3 (b) shows before and after transfer. , Representing that no change occurs in the main substrate, both of the two methods collect the auxiliary substrate, and as shown in FIG. 3, the receive roller 300 is used to collect the auxiliary substrate.

In the actual implementation of the process, based on the specific requirements for the transcription effect, the contact length may be adjusted from the start of contact between the object to be transferred and the transcription receptor until the transfer is completed and the two are separated. Alternatively, a pair roller can be added in the middle to enhance the transfer effect. As shown in FIG. 3A, the contact length is from the pair roller 200 to the separation roller 500, and FIG. 3B is in contact only with the pair roller 200 and is in contact with the pair roller 200 of FIG. 3A and the separation roller. A pair of rollers may be added during the 500 to assist the transfer.

Combining the above winding, unwinding and transfer methods, the method of the present invention provides a complete flow schematic for roll-to-roll ductile circuit fabrication as shown in FIG. 4, including the following steps. ..
S1: The conductive layer and the first auxiliary substrate layer formed on the roll material are each unwound by two feed rollers 100 and laminated by the lamination mechanism 200.
S2: The conductive layer is patterned. That is, a pattern is selectively produced on the conductive layer by a patterning method such as mechanical erasing of a pair roller, die cutting, chemical etching, bio-etching, or laser to obtain a desired conductive layer a.
S3: The manufactured conductive layer a is transferred onto the first elastic layer b with a substrate. That is, the first elastic layer b mounted by the substrate layer is unwound by the feed roller 100, the conductive layer a is transferred to the surface of the first elastic layer b due to the difference in adhesive strength, and the first semi-finished product d is produced. The first auxiliary substrate layer is then scrapped and wound up by the receive roller 300.
S4: Assembling the circuit chip, that is, using the feed roller 100, the chip c mounted by the second auxiliary substrate layer is sent to the vicinity of the position corresponding to the conductive layer a on the surface of the first elastic body layer b, and then mechanical visual observation is performed. The second semi-finished product e is obtained by aligning and assembling by a method such as, and then the second auxiliary substrate layer is taken up as scrap by a receive roller 300.
S5: Packaging of the ductile circuit, that is, feeding to the second elastic body layer b mounted by the third auxiliary substrate layer using the feed roller 100, and again by the transfer method, the chip attaches the second elastic body layer b. As the surface layer of the assembled ductile circuit semi-finished product, packaging is completed to obtain the entire ductile circuit f, and then the third auxiliary substrate layer is taken up as scrap by the receive roller 300.
S6: The entire packaged ductile circuit f is post-processed and other operations are performed, and finally the final winding is performed by the receive roller 300.

The above process is a typical and most basic flow, and is only for explaining how to perform the process connection of the methods of FIGS. 1 to 3.

In the actual implementation of the process, the raw material unwinding and scrap winding processes, the patterning process, the transfer process, etc. may be combined based on the specific structural requirements of the ductile circuit, and the combination of the circuits in series and in parallel, etc. Similar, for example, when trying to manufacture a multi-layered circuit layer, steps such as multiple patterning, transfer of an intermediate elastic layer between circuit layers, and transfer of a connecting conductor between circuit layers are required.

FIG. 4 also omits some equipment required for the actual roll-to-roll process, such as guide rollers, correction structures, tension measurement and control.

Further, in step S4, the specific assembly method between the chip and the circuit is not limited, and for example, a connection method or a welding method may be used depending on the conductive adhesive, and the conductive adhesive may be placed at the chip mounting position of the circuit structure. Corresponding steps may be added during the process, such as pre-applying ancillary materials such as or solder paste.

Further, the post-treatment of step S6 may be a further enhancement of the entire ductile circuit, for example, to enhance the reliability of the packaging and the stability of the circuit, and to directly produce the finished product produced by other operations. Secondary processing may be performed, for example, fixing to a two-dimensional surface or a three-dimensional surface of a desired target object.

Specifically, the conductive layer is selected from a conductive metal thin film and a conductive thin film made of a non-metallic material, and the conductive metal thin film includes a copper foil, an aluminum foil, a gold foil, a silver foil and an iron thin film, and is made of the non-metallic material. Conductive thin films include silicon thin films, conductive polymer thin films, conductive ceramics and conductive hydrogels. In principle, any material can be used as a conductor, and the thickness of the conductive thin film is preferably 20 μm or less. In principle, any material that can be used as a conductor will do.

The elastic layer may be silica gel, and has, for example, general polydimethylsiloxane (PDMS) or a copolymer of butylene adipate and butylene terephthalate (ECOFLEX), and has good expandability and tear elongation. It may be an elastic rubber such as thermoplastic polyurethane (TPU) or hydrogel, which has advantages such as properties, and the thickness of the elastic layer is determined by the specific use of the ductile circuit to be manufactured. Good.

The auxiliary substrate / substrate / protective layer may be a thin film such as polyethylene terephthalate plastic (PET), polycarbonate (PC), polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP), and is substantially. In addition, it is not limited to the above-mentioned plastic thin film, as long as it has a certain strength for mounting an object to be mounted, and practically, it may be a thin film material that does not deform, and has insulating properties against a material that comes into contact with a conductive layer. Need more.

In the present invention, it mainly realizes a process in which a target object is transferred from one object surface to another by transfer. In transfer, when one target object comes into contact with two objects at the same time and then separates, there is a difference in the amount of adhesive force between the target object and the objects on both sides, so the transfer is performed on the object with the larger adhesive force. It is a kind of process that tends to stick. In the method of the present invention, an adhesive layer having a specific size of adhesive force is provided on the surface of the auxiliary substrate layer in order to facilitate fixing of the object to be mounted and to satisfy the demand for a difference in adhesive force in different transfer processes. May be added.

In the present invention, in order to protect chips and elastic bodies, the corresponding roll material is to ensure the reliability of performance without being physically affected by collisions with other objects before entering the process. A further protective layer may be added to the surface of the chip or elastic body, that is, the roll material is composed of three layers of an auxiliary substrate layer, a chip / elastic body, and a protective layer. Before entering the corresponding process, one additional stripping device is added to remove the protective layer. Avoid directly picking up, setting, and sending chips and elastic bodies on the auxiliary board by a method such as a robot arm, entering the inside of the roll material, and colliding with and being affected by the auxiliary board of the adjacent layer. May be good. Similarly, at the end of the process, a similar layer of protective layer may be added to the surface to re-enter the take-up link to protect the entire packaged ductile circuit, to the feed roller 100 of FIG. As there is, a layer of protection is provided to protect the final circuit, or it is picked up and set directly on the finished product collection device by a method such as a robot arm.

In the present invention, a heating or cooling device is added at an appropriate position in the entire process such as lamination between the conductive layer and the auxiliary substrate layer, execution of transfer, separation of the auxiliary substrate layer, chip assembly, peeling of the protective layer and lamination. It can assist in the smooth progress of the process.

The "roll-to-roll moving stage" of the present invention includes a plurality of pairs of active rollers and passive rollers, or includes a plurality of pairs of pair rollers, and the English name of the roll-to-roll is Roll to Roll, which is generally R2R in Japan. It is a processing device mainly for thin film materials, and realizes a high efficiency and low cost processing method for materials by active rotation and passive rotation of rollers. A scholar (Sukang Bee, Hyeongken Kim, Youngbin Lee, et al. Roll-to-roll product of 30-inch graphene films for Nature Nanotechnology, 10N. A scholar (Krebs FC, Govergyan SA, Alstrup J. A roll-to-roll process to flexibul polimer solar cells: model studios: model studios) Materials Chemistry, 2009, 19 (30): 5442-5451.) Are used to manufacture solar cells.

Those skilled in the art can easily understand that the above is only a preferred embodiment of the invention and not to limit the invention, and any amendments, equivalent substitutions, modifications, etc. made within the spirit and principles of the invention Both are included within the scope of protection of the present invention.

Claims (6)

A method of manufacturing a ductile circuit using a "roll-to-roll" process and specifically including the following steps.
S1: by laminating the conductive layer and the first auxiliary substrate layer to form a roll material, one end of the roll material as an end unwinding initial feed, and exit wound,
S2: winding out has been subjected to patterning to roll material conductive layer, to produce a desired circuit structure, a method of performing patterning includes mechanical erasing Pearora, die cut, bio etching, chemical etching or laser patterning,
S3: The first elastic layer on which the substrate is provided is used as a feed end and fed between the pair rollers, and the circuit structure is transferred to the surface of the first elastic layer by the difference in the press and adhesive force of the pair rollers, and then the first auxiliary substrate. Take up and remove the layer as scrap,
S4: The chip mounted by the second auxiliary substrate layer is sent to the corresponding position of the circuit structure, the chip and the circuit structure on the surface of the first elastic body are aligned, and the chip and the circuit structure are united by pressing the pair roller. Assembled, then the second auxiliary substrate layer was wound up and removed as scrap to obtain a semi-finished ductile circuit layer.
S5: The second elastic body layer provided with the third auxiliary substrate layer is used as a feed end and fed between the corresponding pair rollers, and the second elastic body layer is a semi-finished product of the ductile circuit layer due to the difference in press and adhesive force of the pair rollers. Transferred to the surface, the second elastic layer is used as a semi-finished packaging layer of the ductile circuit layer, and after the packaging is completed, the third auxiliary substrate layer is wound up and removed as scrap to obtain a ductile circuit.
A method for manufacturing a ductile circuit. The conductive layer is selected from a conductive metal thin film and a non-metal conductive thin film.
The conductive metal thin film includes copper foil, aluminum foil, gold leaf, silver foil and iron thin film.
The method for manufacturing a ductile circuit according to claim 1, wherein the conductive thin film made of a non-metallic material includes a silicon thin film, a conductive polymer thin film, conductive ceramics, and a conductive hydrogel. The method for producing a ductile circuit according to claim 2, wherein the material of the first and second elastic layers is selected from silica gel, thermoplastic polyurethane, and hydrogel. The ductile circuit according to claim 3, wherein the first, second, and third auxiliary substrates and the materials of the substrates are all selected from polyethylene terephthalates plastic, polycarbonate, polyethylene, polyvinyl chloride, and polypropylene. Production method. The method for manufacturing a ductile circuit according to claim 4, wherein in step S4, a conductive adhesive or a solder paste used to firmly bond the circuit structure and the chip is provided on the circuit structure. The method of manufacturing a ductile circuit according to claim 1, further comprising step S6 of post-processing the entire packaged ductile circuit and finally winding it up.

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