CN110739233B - Method for manufacturing flexible sensor - Google Patents
Method for manufacturing flexible sensor Download PDFInfo
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- CN110739233B CN110739233B CN201911021075.7A CN201911021075A CN110739233B CN 110739233 B CN110739233 B CN 110739233B CN 201911021075 A CN201911021075 A CN 201911021075A CN 110739233 B CN110739233 B CN 110739233B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Abstract
The present disclosure provides a method for manufacturing a flexible sensor, which directly uses an adhesive tape as a substrate of the sensor and transfers electrodes and a functional layer onto the adhesive tape through a roll-to-roll process, thereby manufacturing the flexible sensor in a large scale, a large area, high precision and high efficiency.
Description
Technical Field
The present disclosure relates to the field of flexible sensors, and more particularly, to a method of making a flexible sensor.
Background
Since flexible electronic devices are bendable, suitable for solution fabrication, and have high sensitivity characteristics, they have been widely studied for use in wearable sensors. Flexible sensors are typically composed of electrodes and semiconductor functional layers on a flexible substrate. The process of forming the electrode and the semiconductor functional layer on the flexible substrate separately is generally complicated.
There remains a need for improved methods of manufacturing flexible sensors on a large scale, large area, high precision, and high efficiency.
Disclosure of Invention
The present disclosure provides a method of making a flexible sensor, characterized in that the method comprises:
providing tape from a substrate unwind roll to a substrate wind-up roll in a roll-to-roll manner, the tape having a first viscoelastic surface;
providing a first electrode layer support layer from a first electrode layer support layer take-up roll to a first electrode layer support layer take-up roll in a roll-to-roll manner, said first electrode layer support layer exiting said first electrode layer support layer take-up roll having a first electrode layer thereon, wherein at a first electrode layer transfer counter roll, said first viscoelastic surface of said tape is brought into contact with said first electrode layer to transfer said first electrode layer from said first electrode layer support layer onto said first viscoelastic surface of said tape;
providing a semiconductor functional layer support layer from a semiconductor functional layer take-up roll to a semiconductor functional layer support layer take-up roll in a roll-to-roll manner, a semiconductor functional layer being supported on the semiconductor functional layer support layer exiting the semiconductor functional layer support layer take-up roll, wherein at a semiconductor functional layer transfer counter roll, the first viscoelastic surface of the tape is brought into contact with the semiconductor functional layer to transfer the semiconductor functional layer from the semiconductor functional layer support layer onto the first viscoelastic surface of the tape.
Optionally, the tape further has a second viscoelastic surface opposite the first viscoelastic surface.
Optionally, the tape is an optical clear tape.
Optionally, the first electrode layer is a patterned nano-silver film.
Optionally, the first viscoelastic surface is subjected to a plasma surface treatment prior to transfer through the first electrode layer transfer counter roller.
Optionally, the semiconductor functional layer is made of CdS or ZnO.
Optionally, the semiconductor functional layer is a patterned nanowire.
Optionally, the semiconductor functional layer is an electronic ink capsule block microarray.
Optionally, the method further comprises: providing a second electrode layer support layer from a second electrode layer support layer take-up roll to a second electrode layer support layer take-up roll in a roll-to-roll manner, holding a second electrode layer on the second electrode layer support layer exiting the second electrode layer support layer take-up roll, contacting the first viscoelastic surface of the tape with the second electrode layer at a second electrode layer transfer counter roll to transfer the second electrode layer from the second electrode layer support layer to the first viscoelastic surface of the tape.
Optionally, the method further comprises: providing a protective layer from a protective layer take-up roll to the substrate take-up roll in a roll-to-roll manner, wherein the protective layer is affixed to the first viscoelastic surface at a protective layer covering counter roll prior to the tape reaching the substrate take-up roll.
Drawings
Fig. 1 is a schematic illustration of one embodiment of the present disclosure.
Fig. 2 schematically illustrates a transferred electronic ink capsule piece microarray.
Fig. 3 is a schematic view of another embodiment of the present disclosure.
Detailed Description
In order to solve the aforementioned problems, the present disclosure provides a method of manufacturing a flexible sensor, characterized in that the method includes:
providing tape from a substrate unwind roll to a substrate wind-up roll in a roll-to-roll manner, the tape having a first viscoelastic surface;
providing a first electrode layer support layer from a first electrode layer support layer take-up roll to a first electrode layer support layer take-up roll in a roll-to-roll manner, said first electrode layer support layer exiting said first electrode layer support layer take-up roll having a first electrode layer thereon, wherein at a first electrode layer transfer counter roll, said first viscoelastic surface of said tape is brought into contact with said first electrode layer to transfer said first electrode layer from said first electrode layer support layer onto said first viscoelastic surface of said tape;
providing a semiconductor functional layer support layer from a semiconductor functional layer take-up roll to a semiconductor functional layer support layer take-up roll in a roll-to-roll manner, a semiconductor functional layer being supported on the semiconductor functional layer support layer exiting the semiconductor functional layer support layer take-up roll, wherein at a semiconductor functional layer transfer counter roll, the first viscoelastic surface of the tape is brought into contact with the semiconductor functional layer to transfer the semiconductor functional layer from the semiconductor functional layer support layer onto the first viscoelastic surface of the tape.
The fabrication of the flexible sensor is performed using a roll-to-roll approach of the present disclosure. The reel-to-reel approach may provide the capability for large-scale, large-area, high-precision, high-efficiency production.
Flexible sensors typically include an electrode layer on a flexible substrate and a semiconductor functional layer in contact with the electrode layer.
Currently, in a conventional roll-to-roll process for manufacturing a flexible device, a specific device structure is formed by continuously forming a film on a substrate through unwinding, coating, curing, imprinting, compositing, rolling and other modules. Wherein the curing step is used to ensure a strong bond between the various layer structures in the device.
The method disclosed by the invention can ensure the stability of the layer structure without using a curing step, thereby greatly improving the preparation efficiency. To achieve this, the method of the present disclosure uses adhesive tape as the flexible sensor substrate.
The adhesive tape is a film having adhesiveness on the surface. More specifically, the adhesive tape in the present disclosure has a first viscoelastic surface. For example, the adhesive tape may have a pressure-sensitive adhesive layer on one surface as the first viscoelastic surface.
First, a first electrode layer of a sensor is bonded by a transfer process on a first viscoelastic surface of an adhesive tape as a flexible substrate. Specifically, a first electrode layer support layer is supplied in a roll-to-roll manner from a first electrode layer support layer take-up roll to a first electrode layer support layer take-up roll, a first electrode layer is held on the first electrode layer support layer away from the first electrode layer support layer take-up roll, wherein at a first electrode layer transfer counter-roll, the first viscoelastic surface of the adhesive tape is brought into contact with the first electrode layer to transfer the first electrode layer from the first electrode layer support layer onto the first viscoelastic surface of the adhesive tape. In other words, the first electrode layer is first formed on the first electrode layer support layer. The first electrode layer may be patterned, i.e. have the required pattern for the first electrode in the flexible sensor. The first electrode layer support layer is used for supporting the first electrode layer and keeping the first electrode layer in a space shape. Here, the first electrode layer is bonded to the first electrode layer support layer with an appropriate bonding force, and the two can be physically and completely separated by an external force. The first electrode layer support layer is flexible and thus can be supplied in a roll-to-roll manner from the take-up roll to the take-up roll. The first electrode layer is supported on the first electrode layer supporting layer wound on the unwinding roller and moves from the unwinding roller to the winding roller along with the first electrode supporting layer. At the same time, the aforementioned tape is supplied from the substrate take-up roll to the substrate take-up roll in a roll-to-roll manner. The tape and the first electrode layer supporting layer are both passed through the first electrode layer transfer counter roller, and the transfer of the first electrode layer is completed there. A thin film material such as PET may be used as the first electrode support layer. The material of the first electrode supporting layer may be used for a semiconductor functional layer supporting layer and a second electrode supporting layer which will be described later. The first electrode layer is bonded to the first electrode supporting layer not by adhesion but by spin coating or spray coating. Therefore, although the first electrode layer is fixed on the first electrode support layer, the surface energy of the electrode support layer is not high and is lower than the surface energy of the viscoelastic surface. Thus, during the transfer process, the first electrode layer may be transferred from the first electrode support layer to the first viscoelastic surface.
The transfer counter roller is a pair of rollers or two opposing rollers, and is configured to allow an initial film layer and a target film layer supporting a layer to be transferred to pass therebetween with the layer to be transferred being located therebetween. The gap between the transfer pair rollers is set so that the layer to be transferred is in contact with the target film layer when the initial film layer and the target film layer pass therethrough. When the bonding force or adhesion force of the target film layer to the layer to be transferred is greater than the bonding force of the layer to be transferred to the initial film layer, the layer to be transferred will be separated from the initial film layer and bonded to the target film layer due to the above contact, thereby being "transferred" from the initial film layer to the target film layer after the initial film layer and the target film layer leave the transfer roller.
Specifically, at a first electrode layer transfer counter roller, the first viscoelastic surface of the adhesive tape is brought into contact with the first electrode layer to transfer the first electrode layer from the first electrode layer supporting layer onto the first viscoelastic surface of the adhesive tape. The pressure at the counter roller during transfer printing can be 1-10kg/cm2Preferably 4 to 5kg/cm2。
In this way, the first electrode layer can be transferred from the first electrode layer supporting layer to the tape, i.e., the substrate, in a roll-to-roll manner.
It should be noted that due to the different nature of the substrates, it is difficult to form the patterned first electrode layer directly on the tape substrate by means of, for example, spin coating or spray coating, while it is convenient and easy to form the patterned first electrode layer on the first electrode layer support layer. Therefore, it is convenient to separately complete the patterning of the first electrode layer and the bonding of the first electrode layer to the flexible substrate and perform the assembly of the sensor by roll-to-roll transfer and roll-to-roll transfer.
In order to ensure that the transfer printing can be achieved, the bonding force between the first viscoelastic surface of the adhesive tape and the first electrode layer must be sufficiently greater than the bonding force between the first electrode layer support layer and the first electrode layer. Examples of the first viscoelastic surface of the adhesive tape include polydimethylsiloxane, a copolymer of butylene oxalate and butylene terephthalate, acrylic resin, epoxy resin, silicone gel, optical gel, hydrogel, and uv-curable gel, examples of the first electrode layer include nano silver wires, carbon nanotubes, polyethylenedioxythiophene, graphene, and the like, and examples of the lower electrode support layer include PET and the like. Further, the tape may have a substrate, i.e. the first viscoelastic surface may be a first viscoelastic layer on the substrate.
The first electrode layer referred to in this disclosure is an electrode layer formed on an adhesive tape before forming a semiconductor functional layer. The first electrode layer may be a cathode or an anode in the sensor, or may be a part of the first electrode layer as a cathode and another part of the first electrode layer as an anode. For this, the circuit pattern of the first electrode layer may be designed as a cathode and an anode spaced apart from each other, and then the semiconductor functional layer is bridged between the cathode and the anode, thereby forming the sensor. Alternatively, only the first electrode layer may be used as a cathode or an anode, and the counter electrode may be formed after the semiconductor function layer is formed.
In the method of the present disclosure, a semiconductor functional layer support layer is supplied in a roll-to-roll manner from a semiconductor functional layer take-up roll to a semiconductor functional layer support layer take-up roll, a semiconductor functional layer is supported on the semiconductor functional layer support layer which is separated from the semiconductor functional layer support layer take-up roll, wherein at a semiconductor functional layer transfer counter roll, the first viscoelastic surface of the adhesive tape is brought into contact with the semiconductor functional layer to transfer the semiconductor functional layer from the semiconductor functional layer support layer onto the first viscoelastic surface of the adhesive tape. The function of the semiconductor functional layer support layer is similar to that of the first electrode support layer, but is for supporting the semiconductor functional layer.
The semiconductor functional layer is a conventional semiconductor functional layer in a sensor. The semiconductor functional layers are assembled in the method of the present disclosure also in roll-to-roll transport and roll-to-roll transfer. It should be understood that the first electrode layer does not completely cover the first viscoelastic surface, and that the patterned first electrode layer leaves a portion of the first viscoelastic surface exposed. The semiconductor functional layer is bonded to at least a portion of the exposed first viscoelastic surface, thereby bonding to the flexible substrate. In addition, the semiconductor function layer is also in contact with the first electrode layer to enable assembly of the sensor.
When the first electrode layer comprises both cathode and anode patterns as described above, the first electrode layer in combination with the first viscoelastic surface of the flexible substrate and the semiconductor functional layer constitute the sensor. By adopting the method disclosed by the invention, the flexible sensor can be prepared in a large scale, a large area, high precision and high efficiency.
It should be understood that the first electrode layer may be transferred first, or the semiconductor functional layer may be transferred first, on the first viscoelastic layer. In general, in order to better maintain the pattern of the first electrode layer, the first electrode layer is transferred before the semiconductor function layer is transferred.
In one embodiment, the tape further has a second viscoelastic surface opposite the first viscoelastic surface. That is, both sides of the tape each have a viscoelastic surface. The two viscoelastic surfaces may be of the same or different materials. The purpose of the second viscoelastic surface is to allow the flexible sensor to be affixed to the surface of any object, thereby facilitating the positioning of the sensor.
Alternatively, the second viscoelastic surface may be a pressure sensitive adhesive layer and the flexible sensor may be placed in the desired location by pressing. The material of the optional second viscoelastic surface may be the same as the material of the optional first viscoelastic surface.
In one embodiment, the tape is an optical clear tape. The optical scotch tape is suitable for preparing a light detector. The optical transparent adhesive tape may use a conventional optical transparent adhesive material, for example, a transparent adhesive that can be cured by ultraviolet light.
In one embodiment, the first electrode layer is a patterned nano-silver film. The nano silver film has good conductivity, low thickness and easy patterning, and is particularly suitable for transfer printing.
In one embodiment, the first viscoelastic surface is plasma surface treated prior to transfer through the first electrode layer to a counter roller. Methyl on the first viscoelastic surface subjected to plasma surface treatment is converted into hydroxyl, so that the surface hydrophilicity is increased, and the adhesion of a first electrode layer such as a nano silver film is facilitated. Examples of the plasma atmosphere may be an air atmosphere or an oxygen atmosphere.
In one embodiment, the semiconducting functional layer is made of CdS or ZnO. Both semiconductor materials are suitable for the preparation of, for example, self-driven photodetectors and photosensors.
In one embodiment, the semiconductor functional layer is a patterned nanowire. The semiconductor functional layer in the form of nanowires may still expose the first viscoelastic surface for the formation of subsequent layers, such as a protective layer.
In one embodiment, the semiconducting functional layer is an electronic ink capsule block microarray. And scraping the electronic ink capsules into the patterned template, and heating and curing to form patterned capsule blocks in the template. Subsequently, the capsule mass is transferred to the viscoelastic material by the viscosity of the surface of the viscoelastic material.
In one embodiment, the method further comprises: providing a second electrode layer support layer from a second electrode layer support layer take-up roll to a second electrode layer support layer take-up roll in a roll-to-roll manner, holding a second electrode layer on the second electrode layer support layer exiting the second electrode layer support layer take-up roll, contacting the first viscoelastic surface of the tape with the second electrode layer at a second electrode layer transfer counter roll to transfer the second electrode layer from the second electrode layer support layer to the first viscoelastic surface of the tape. The material of the second electrode layer and the second electrode layer support layer may be the same as the material of the first electrode layer and the first electrode layer support layer.
As described above, according to different circuit designs, when the first electrode layer serves as only one of the cathode or the anode, the second electrode layer may be formed again as the counter electrode.
In one embodiment, the method further comprises: providing a protective layer from a protective layer take-up roll to the substrate take-up roll in a roll-to-roll manner, wherein the protective layer is affixed to the first viscoelastic surface at a protective layer covering counter roll prior to the tape reaching the substrate take-up roll. In this way, the protective layer may be attached in a roll-to-roll manner to encapsulate the sensor film. The protective layer material can be single silicon release film, polyester release film, Teflon release film, composite release film, high temperature resistant release film, polyphenyl ether release film, polytetrafluoroethylene isolation film, polyethylene release film, composite release film.
The invention is further illustrated by the following figures and examples.
Fig. 1 is a schematic illustration of one embodiment of the present disclosure.
101-103 are tape unwinding devices. 201-204 are transfer devices for adhesive tape and electrodes. 301-304 are transfer devices for the tape and the semiconductor functional layer. 401 and 404 are protection and winding devices of the transfer-finished adhesive tape.
101-103 rollers are used for unwinding the adhesive tape. The adhesive tape with the release film starts from the substrate unwinding roller 101, the adhesive tape is pulled by the substrate winding roller 404, the release film is pulled by the release film winding roller 103, and the release film is removed at the turning roller 102.
201 and 204 rollers are used to transfer the first electrode layer to the tape. The first electrode layer supporting the first electrode layer moves from the first electrode layer supporting layer take-up roll 203 to the first electrode layer supporting layer take-up roll 204, and passes through the first electrode layer transfer counter rolls 201 and 202 together with the adhesive tape. There, the first electrode layer on the first electrode layer supporting layer is brought into contact with an adhesive tape and transferred onto the adhesive tape.
301-304 rollers are used to transfer the semiconductor functional layer to the tape. The semiconductor functional layer support layer holding the semiconductor functional layer moves from the semiconductor functional layer support layer take-up roll 303 to the semiconductor functional layer support layer take-up roll 304, and passes together with the adhesive tape carrying the first electrode layer at the semiconductor functional layer transfer counter rolls 301, 302. There, the semiconductor functional layer on the semiconductor functional layer support layer is brought into contact with and transferred onto the adhesive tape, and is electrically contacted with the first electrode layer, assembling to form the sensor.
The 401-404 roller is a protection and winding device of the transfer-finished adhesive tape. And 403 is a protective layer unwinding roller. The protective film is pressed against the transferred adhesive tape at the position where the protective film covers the pair rollers 401, 402. Substrate take-up roll 404 roll also acts as a protective layer take-up roll.
Fig. 1 is merely exemplary. For example, the transfer section for the semiconductor functional layer may precede the transfer section for the first electrode layer. Furthermore, a second electrode layer transfer section may also be present. Other protective film peeling rollers similar to the release layer peeling mechanisms 102, 103 may also be provided.
Fig. 2 shows how an e-ink capsule piece microarray is transferred. The top view shows a heat-cured electronic ink capsule mass formed within a stencil, which itself is a flexible material that can be transported roll-to-roll. As described in the above figures, the top of the capsule mass is formed slightly lower than the surface of the stencil with a gap. The lower diagram shows the case at the time of transfer. Both the tape and the stencil are moved to the right at a speed v. Under the pressure of the upper transfer roller, the adhesive tape is slightly recessed into the above-mentioned gap, and due to the presence of the viscoelastic surface, the capsule mass is transferred onto the adhesive tape when the roller presses the capsule mass surface.
On the basis of fig. 1, it is also possible to provide rollers 501, 502 and 503 for the second electrode layer as shown in fig. 3 to form a photodetector having the second electrode layer.
The invention is further illustrated by the following examples.
Example 1
The process shown in fig. 1 is adopted, an optical transparent adhesive tape roll is placed on a roller 101, and is subjected to film uncovering and transmission through rollers 102 and 103, a roller 204 is a patterned nano silver film roll which is borne on a supporting layer and has low surface energy after being subjected to plasma treatment, and nano silver is transferred onto the optical transparent adhesive tape through the pressing of a roller 201 and a roller 202 to form a patterned electrode layer. The 304 roller is a coil of patterned CdS nano-wire and ZnO nano-wire, on the basis, the patterned electrode layer on the optical transparent adhesive tape transfers the semiconductor function layer to the optical transparent adhesive tape through the pressing of the 301 roller and the 302 roller. And finishing the preparation of the light detector. The roll 403 is a roll with a release film, and the prepared optical detector adhesive tape is pressed by the roll 401 and the roll 402 to attach the protective layer release film on the prepared device. And finally, finishing winding by 404 rollers.
Wherein, the width of optics scotch tape coiled material is 20cm, and thickness is 50um, and the material of viscoelastic layer is PDMS. The surface of the tape was plasma-treated at a power of 30w for 240s under an air atmosphere. The nano silver film coiled material is formed by spin coating on PET. The coiled material of the CdS/ZnO nanowire is formed by depositing cadmium sulfide and zinc oxide nanowires on PET. The protective layer release film is made of PET release film.
The running speed of the roll-to-roll process was 0.7 m/min. The gap and pressure between the transfer pair rollers were 5kg/cm2。
Thus, the photodetector was manufactured by roll-to-roll transfer.
Example 2
The optical transparent adhesive tape coiled material is placed on a roller 101, and is subjected to film uncovering and transmission through rollers 102 and 103, a roller 204 is a well-patterned nano silver film coiled material which is subjected to plasma treatment and has low surface energy, and nano silver is transferred onto the optical transparent adhesive tape through the pressing of a roller 201 and a roller 202 to form a patterned electrode layer. The roll 304 is a patterned roll of electronic ink capsules, and on the basis, the patterned electrode layer on the optically transparent adhesive tape transfers the patterned electronic capsule blocks onto the optically transparent adhesive tape through the pressing of the roll 301 and the roll 302 as shown in fig. 2, and the transfer of the capsule layer is completed. Then, the transfer printing of the nano silver electrode is repeated by using the roller 501-504 of the second electrode layer transfer printing section, and an upper electrode is prepared. The roll 403 is a coiled material with a release film, the prepared electronic paper structure is pressed by a roll 401 and a roll 402 to attach the protective layer release film on the prepared device, and finally, the roll 404 is used for finishing rolling.
Wherein, the width of the optical transparent adhesive tape coiled material is 20cm, the thickness is 75um, and the material of the viscoelastic layer is hydrogel. The surface of the tape was plasma-treated for 200 seconds at a power of 40w in an air atmosphere. The nano silver film coiled material is formed by spraying nano silver solution on PET. The web supporting the e-ink capsule block microarray is formed by draw coating e-ink capsules in patterned depressions of a flexible substrate and heat curing. The protective layer release film is made of a single-silicon release film.
The running speed of the roll-to-roll process was 0.5 m/min. The gap and pressure between the transfer pair rollers were 4kg/cm2。
Thus, an electronic paper sensor having two electrode layers was manufactured in a roll-to-roll transfer method.
The method disclosed by the invention directly utilizes the adhesive tape as the base material of the sensor, and transfers the electrode and the functional layer onto the adhesive tape through a roll-to-roll process, so that the flexible sensor can be prepared in a large scale, a large area, high precision and high efficiency.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the disclosure without departing from the spirit and scope of the disclosure. Thus, if such modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such modifications and variations as well.
Claims (10)
1. A method of making a flexible sensor, the method comprising:
providing tape from a substrate unwind roll to a substrate wind-up roll in a roll-to-roll manner, the tape having a first viscoelastic surface;
providing a first electrode layer support layer from a first electrode layer support layer take-up roll to a first electrode layer support layer take-up roll in a roll-to-roll manner, said first electrode layer support layer exiting said first electrode layer support layer take-up roll having a first electrode layer thereon, wherein at a first electrode layer transfer counter roll, said first viscoelastic surface of said tape is brought into contact with said first electrode layer to transfer said first electrode layer from said first electrode layer support layer onto said first viscoelastic surface of said tape;
providing a semiconductor functional layer support layer from a semiconductor functional layer take-up roll to a semiconductor functional layer support layer take-up roll in a roll-to-roll manner, a semiconductor functional layer being supported on the semiconductor functional layer support layer exiting the semiconductor functional layer support layer take-up roll, wherein at a semiconductor functional layer transfer counter roll, the first viscoelastic surface of the tape is brought into contact with the semiconductor functional layer to transfer the semiconductor functional layer from the semiconductor functional layer support layer onto the first viscoelastic surface of the tape.
2. The method of claim 1, wherein the tape further comprises a second viscoelastic surface opposite the first viscoelastic surface.
3. The method of claim 1, wherein the tape is an optical clear tape.
4. The method of claim 1, wherein the first electrode layer is a patterned nano-silver film.
5. The method according to claim 1, wherein the first viscoelastic surface is subjected to a plasma surface treatment before passing through the first electrode layer transfer counter roller.
6. The method of claim 1, wherein the semiconductor functional layer is made of CdS or ZnO.
7. The method of claim 1, wherein the semiconductor functional layer is patterned nanowires.
8. The method of claim 1, wherein the semiconductor functional layer is an electronic ink capsule block microarray.
9. The method of claim 1, further comprising: providing a second electrode layer support layer from a second electrode layer support layer take-up roll to a second electrode layer support layer take-up roll in a roll-to-roll manner, holding a second electrode layer on the second electrode layer support layer exiting the second electrode layer support layer take-up roll, contacting the first viscoelastic surface of the tape with the second electrode layer at a second electrode layer transfer counter roll to transfer the second electrode layer from the second electrode layer support layer to the first viscoelastic surface of the tape.
10. The method of claim 1, further comprising: providing a protective layer from a protective layer take-up roll to the substrate take-up roll in a roll-to-roll manner, wherein the protective layer is affixed to the first viscoelastic surface at a protective layer covering counter roll prior to the tape reaching the substrate take-up roll.
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| CN207976854U (en) * | 2017-12-11 | 2018-10-16 | 宸鸿科技(厦门)有限公司 | Touch sensing and its touch panel |
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