CN210093650U - Double-panel through hole layer and multi-layer LED flexible circuit board capable of being electrically connected at will - Google Patents

Abstract

The utility model discloses a double-sided board through hole layer and multilayer LED flexible circuit board that is connected with electricity wantonly, including switching on the base member and a plurality of connection protruding, each connection protruding sets up respectively on the side of switching on the base member, has seted up a plurality of recesses on the switching on the base member, and each connection protruding one-to-one inlays respectively in each recess; a plurality of conducting holes are formed in the conducting base body, and intervals are respectively arranged among the conducting holes; the conducting base body is further provided with a plurality of conducting hole groups, each conducting hole group is distributed on the conducting base body at equal intervals, each conducting hole group comprises two rows of conducting holes, connecting lines of the two rows of conducting holes are parallel to each other, and the conducting base body between the two rows of conducting holes is provided with a cut-off mark area. The utility model relates to a LED flexible circuit board that panel conduction hole layer and multilayer are connected wantonly electricity can conveniently be cuted through setting up two rows of electrically conductive holes and cutting the zone mark, realizes the effect of the no pressure drop of flexible circuit board, reduces the defective index of flexible circuit board, reduction in production cost.

Description

Double-panel through hole layer and multi-layer LED flexible circuit board capable of being electrically connected at will

Technical Field

The utility model relates to a flexible circuit board field especially relates to a LED flexible circuit board that double sided board conduction hole layer and multilayer are connected wantonly electrically.

Background

The traditional double-sided flexible circuit board is manufactured by the following steps: cutting → drilling → PTH → electroplating → pretreatment → dry film pasting → alignment → exposure → development → pattern electroplating → demoulding → pretreatment → dry film pasting → alignment exposure → development → etching → demoulding → surface treatment → pasting of covering film → pressing → solidification → nickel deposition → printing character → cutting → electric cutting → die cutting → final inspection → packaging → shipment.

However, in the process of producing and cutting the existing flexible circuit board, because the flexible circuit board is in a strip-shaped structure, when the flexible circuit board needs to be cut, the circuit connection structure of the flexible circuit board is easily damaged, so that the circuit connection is unstable; in addition, as a section of flexible circuit board needs to be cut, the flexible circuit board is easy to generate voltage drop, after the circuit is connected, unnecessary loss of the flexible circuit board is increased, and energy waste is increased; meanwhile, when the flexible circuit board is cut, the loss of two adjacent sections of flexible circuit boards is easily caused, the defective rate of the flexible circuit boards is increased, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the defects in the prior art, providing a panel through hole layer and a multilayer LED flexible circuit board which are connected with each other at will, which can be cut conveniently without damaging the circuit connection structure of the flexible circuit board, so that the circuit connection is unstable; moreover, the effect of no voltage drop of the flexible circuit board can be realized, after the circuit is accessed, the unnecessary loss of the flexible circuit board is reduced, and the waste of energy is reduced; meanwhile, when the flexible circuit board is cut, the loss of two adjacent sections of flexible circuit boards is avoided, the defective rate of the flexible circuit boards is reduced, and the production cost is reduced.

The purpose of the utility model is realized through the following technical scheme:

a dual panel via layer comprising: the conductive substrate is provided with a plurality of grooves, and the connecting bulges are embedded in the grooves in a one-to-one correspondence manner;

a plurality of conducting holes are formed in the conducting base body, and intervals are arranged among the conducting holes respectively;

the conducting base body is further provided with a plurality of conducting hole groups, the conducting hole groups are distributed on the conducting base body at equal intervals, each conducting hole group comprises two rows of conducting holes, connecting lines of the two rows of conducting holes are parallel to each other, a cut-off mark area is arranged on the conducting base body between the two rows of conducting holes, and the intervals between every two adjacent conducting holes are equal in the conducting holes.

In one embodiment, in the two rows of conductive vias, one of the conductive vias in one row is aligned with an adjacent conductive via in the other row.

In one embodiment, the conductive hole is a circular hole.

In one embodiment, the thickness of the conducting substrate is 15um to 100 um.

In one embodiment, the number of the connecting protrusions is three, the conducting base is provided with three grooves, and each connecting protrusion is embedded in one groove in a one-to-one correspondence manner.

The utility model also provides a LED flexible circuit board that multilayer arbitrary electricity is connected, including above arbitrary one the double sided board conduction hole layer, still include front circuit layer, back circuit subassembly, front cover film, back cover film and character layer, the character layer is attached to on the front cover film, front cover film is attached on the front circuit layer, front circuit layer set up in on one side of double sided board conduction hole layer, back circuit subassembly set up in the double sided board conduction hole layer keep away from on the another side of front circuit layer, back cover film is attached in on the back circuit subassembly;

the character layer is further provided with a plurality of cutting lines, the cutting lines are distributed on the character layer at equal intervals, and the cutting lines are located on the cutting mark area.

In one embodiment, a plurality of welding windows are formed in the front cover film, and a space is respectively arranged between the welding windows.

In one embodiment, the back surface circuit assembly includes a back surface circuit layer, a double-sided pure glue layer, a conductive layer and a copper foil layer, which are sequentially stacked, the back surface circuit layer is further disposed on the double-sided board via layer, and the copper foil layer is further disposed on the back surface cover film.

In one embodiment, the front cover film is provided with a plurality of front via rows, and a space is respectively arranged between the front via rows.

In one embodiment, the back cover film is provided with a plurality of back via rows, and a space is respectively arranged between the back via rows.

The utility model discloses compare in prior art's advantage and beneficial effect as follows:

the utility model relates to a LED flexible circuit board that panel conduction hole layer and multilayer are connected wantonly electrically, through setting up two rows of electrically conductive holes and cutting off the mark area, can conveniently cut, still be provided with front conducting hole row and back conducting hole row on the flexible circuit board simultaneously, further conveniently cut off, do not damage the circuit connection structure of flexible circuit board, make the circuit connection unstable; moreover, the effect of no voltage drop of the flexible circuit board can be realized, after the circuit is accessed, the unnecessary loss of the flexible circuit board is reduced, and the waste of energy is reduced; meanwhile, when the flexible circuit board is cut, the loss of two adjacent sections of flexible circuit boards is avoided, the defective rate of the flexible circuit boards is reduced, and the production cost is reduced. And, through setting up the electrically conductive hole after, can cut at will, can not influence the electrical property of LED lamp pearl, LED lamp pearl overflows and also can not appear failing, can also realize not having the pressure drop.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a double-sided board via layer according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a structure of a dual-plane via layer of another embodiment shown in FIG. 1;

fig. 3 is a schematic structural diagram of a multilayer LED flexible circuit board with arbitrary electrical connections according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a character layer of the LED flexible circuit board shown in FIG. 3;

fig. 5 is a schematic structural diagram of a front cover film of the LED flexible circuit board shown in fig. 3;

fig. 6 is a schematic structural diagram of a back cover film of the LED flexible circuit board shown in fig. 3.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, a dual-sided via layer includes: the conductive substrate 100 includes a conductive substrate 100 and a plurality of connecting protrusions 110, each connecting protrusion 110 is disposed on a side of the conductive substrate 100, the conductive substrate 100 is provided with a plurality of grooves 120, and each connecting protrusion 110 is embedded in each groove 120 in a one-to-one correspondence manner. The conductive substrate 100 is used to connect the front and back circuit layers; the connection protrusion 110 is used for conveniently inserting the flexible circuit board at the other end; the recess 120 is used to receive the coupling protrusion 110.

Referring to fig. 2, the conductive substrate 100 is provided with a plurality of via holes 130, and a space is respectively disposed between the via holes. The via 130 is used to connect the front and back circuit layers.

Referring to fig. 2, the conductive substrate 100 is further provided with a plurality of conductive hole groups 140, the conductive hole groups 140 are distributed on the conductive substrate 100 at equal intervals, each conductive hole group 140 includes two rows of conductive holes 141, connecting lines of the two rows of conductive holes 141 are parallel to each other, the conductive substrate 100 between the two rows of conductive holes 141 is provided with a truncation mark region 150, and in one row of conductive holes 141, intervals between every two adjacent conductive holes 141 are equal. It should be noted that the conductive hole group 140 is used for realizing truncation and facilitating shearing, and compared with a conventional one-strip flexible circuit board, the flexible circuit board can realize a no-voltage-drop effect, and meanwhile, due to the arrangement of the plurality of conductive hole groups 140, two adjacent segments of flexible circuit boards cannot be damaged. The conductive hole 141 is used for realizing shearing; the cutting mark zone 150 is used for marking cutting, and when the cutting is needed, the cutting can be directly carried out along the position of the cutting mark zone 150 by using scissors, so that the flexible circuit board can be conveniently and rapidly cut, the defective rate is reduced, and the production cost is reduced. And, through setting up the electrically conductive hole after, can cut at will, can not influence the electrical property of LED lamp pearl, LED lamp pearl overflows and also can not appear failing, can also realize not having the pressure drop.

It should be noted that, in the two rows of the conductive holes 141, one of the conductive holes 141 in one row is aligned with the adjacent conductive hole 141 in the other row. So, conveniently process through the electrically conductive hole 141 that sets up the alignment, improve machining efficiency.

It should be noted that the conductive hole is a circular hole. The thickness of the conducting substrate is 15 um-100 um. Therefore, the processing efficiency and the stability of the flexible circuit board can be improved.

It should be noted that three connecting protrusions are arranged, three grooves are formed in the conducting base body, and each connecting protrusion is embedded in one groove in a one-to-one correspondence mode. Therefore, the two sections of flexible circuit boards are conveniently connected.

Please refer to fig. 3, the present invention further provides a multi-layer LED flexible circuit board electrically connected at will, including the double-sided board via hole layer 100, the LED flexible circuit board further includes a front circuit layer 200, a back circuit assembly 300, a front cover film 400, a back cover film 500 and a character layer 600, the character layer 600 is attached to the front cover film 400, the front cover film 400 is attached to the front circuit layer 200, the front circuit layer 200 is disposed on a side of the double-sided board via hole layer 100, the back circuit assembly 300 is disposed on the other side of the double-sided board via hole layer 100 away from the front circuit layer 200, and the back cover film 500 is attached to the back circuit assembly 300. It should be noted that the front circuit layer 200 is used for electrically connecting each electronic component; the double-sided board through hole layer 100 is a solder resist protective layer; the back circuit component 300 is used for being electrically connected with the front circuit layer to realize the electric conduction of the LED flexible circuit board; the front cover film 400 is used for protecting the front lines of the flexible circuit board from being damaged and plays a role in insulation; the back cover film 500 is used for protecting the back of the flexible circuit board from being damaged; the character layer 600 is composed of a plurality of characters, so that the LED flexible circuit board has various types of marks.

Referring to fig. 4, the character layer 600 is further provided with a plurality of cut-off lines 610, each cut-off line is distributed on the character layer at equal intervals, and the cut-off line is located on the cut-off mark region. It should be noted that the cut line 610 is used for marking the front surface when cutting.

Referring to fig. 3, a plurality of welding windows are formed on the front cover film 400, and a space is respectively disposed between the welding windows. So, through setting up a plurality of welding windows, can conveniently weld electronic components and LED lamp.

Please refer to fig. 3 again, the back side circuit assembly 300 includes a back side circuit layer 310, a double-sided pure glue layer 320, a conductive layer 330 and a copper foil layer 340, which are sequentially stacked, the back side circuit layer is further disposed on the double-sided board via layer, and the copper foil layer is further disposed on the back side cover film. The back surface circuit layer 310 is used for electrical connection with the outside; the double-sided pure glue layer 320 is used for bonding the double-sided pure glue layer 320 and the conductive layer 330, so that the stability of the back circuit assembly is improved; the conductive layer 330 is used for realizing electric conduction, and the copper foil layer 340 is used for realizing the conduction function of the LED flexible circuit board.

Please refer to fig. 5, a plurality of front via hole rows 410 are disposed on the front cover film 400, and a space is disposed between each front via hole row 410. In one of the front via hole rows 410, the front via hole row 410 is provided with a plurality of front via holes 411. Thus, by providing the front via hole row 410 and the front via hole 411, shearing is further facilitated and no voltage drop is realized.

Please refer to fig. 6, a plurality of back via rows 510 are disposed on the back cover film 500, and a space is disposed between each back via row 510. In one rear via row 510, the rear via row 510 is provided with a plurality of rear vias 511. Thus, by providing the back via row 510 and the back via 511, the shearing is further facilitated and no voltage drop is realized.

Specifically, the production process comprises the following steps:

s1, cutting the pure copper foil into infinite-length straight strips;

s2, adhering and arranging a plurality of infinite-length straight-strip-shaped pure copper foils on the carrier of the pure adhesive layer, widening and thickening the pure copper foils according to the requirements of customers to form a whole roll of infinite-length pure copper foil layer on the back surface, and achieving the electrical performance required by the customers;

s3, attaching the first solder mask layer of the single solder mask windowing layer to the front surface of the single double-layer or multi-layer circuit board;

s4, attaching conductive adhesive or printing conductive solvent to the back (copper surface) of the double-layer or multi-layer circuit board to form a conduction point;

s5, laminating the double-layer or multi-layer circuit board pasted with the conductive adhesive or printed with the conductive points by using the conductive solvent and the pure rubber layer;

s6, cutting the double-sided board into two ends with conductive holes, and fixedly connecting each section of the double-sided board with the back pure copper foil;

s7, attaching the double-layer or multi-layer circuit board pasted with pure glue (the pure glue comprises double-sided pure glue with a carrier) to the whole roll of infinite-length pure copper foil layer with the carrier on the reverse side;

s8, rolling, heating and shaping the whole roll;

s9, laminating at high temperature to enable the double-layer or multi-layer circuit board to be conducted with the whole roll of infinite-length pure copper foil layer with the carrier on the reverse side, baking at high temperature and curing to form a complete multi-layer infinite-length LED flexible circuit board with the double-layer main line on the reverse side;

and S10, welding the electronic component on the surface of the double-layer or multi-layer circuit layer to form a multi-layer infinite-length LED flexible circuit board light-emitting belt body with a double-layer main line on the reverse side of the whole body.

And S11, if the electronic component is not welded on the surfaces of the double-layer or multi-layer circuit layers, forming a finished product of the multi-layer infinite-length LED flexible circuit board with the double-layer main line on the back surface of the whole.

Therefore, the whole roll of the infinitely-extending multi-layer LED flexible circuit board which is electrically connected at will can be cut into a low-voltage whole-roll multi-layer infinitely-long LED flexible circuit board with the length of 0.5 m, 1.0 m, 1.5 m or infinitely-long, so that the low-voltage infinitely-long LED flexible circuit board is realized, and the width and the thickness of the pure copper foil layer can be increased at will to ensure that the electrical performance of the product can achieve no voltage drop; the reliability of the electronic components welded on the surface of the LED flexible circuit board after the OSP or gold immersion or silver immersion or tin immersion treatment is higher; the interconnection of the electrical performance of the multilayer circuit is realized, the multilayer infinite-length LED flexible circuit board adopting the double-layer main line is softer and more flexible to mount, the blank that the electrical performance of the low-voltage circuit board in the field of LED lamp belts is transmitted in a long distance without voltage drop is filled, and the industrial standard is updated.

It should be further noted that the finished multilayer LED flexible circuit board with any electrical connection can be cut in the length direction. The double-layer or multi-layer circuit board is communicated with the infinite-length pure copper foil layer with the carrier on the reverse surface by using the conductive adhesive or the conductive solvent, and the infinite-length pure copper foil layer and the double-layer or multi-layer circuit board have better stability by laminating the pure adhesive and baking at high temperature. The production quality of the multilayer infinite-length LED flexible circuit board is improved; meanwhile, the characteristic of infinite extension of the whole roll can be realized; the LED flexible circuit board with the multiple layers connected with each other at will has smaller voltage drop when the circuit is connected, and the voltage drop of a main line is not influenced and the electrical property is more reliable when the 0.5-meter section of the product is cut off at will. The long-distance transmission electrical performance of the low-voltage circuit board is improved, the installation cost is reduced, and the production efficiency is improved. And, through setting up the electrically conductive hole after, can cut at will, can not influence the electrical property of LED lamp pearl, LED lamp pearl overflows and also can not appear failing, can also realize not having the pressure drop.

The utility model discloses compare in prior art's advantage and beneficial effect as follows:

the utility model relates to a LED flexible circuit board that panel conduction hole layer and multilayer are connected wantonly electrically, through setting up two rows of electrically conductive holes and cutting off the mark area, can conveniently cut, still be provided with front conducting hole row and back conducting hole row on the flexible circuit board simultaneously, further conveniently cut off, do not damage the circuit connection structure of flexible circuit board, make the circuit connection unstable; moreover, the effect of no voltage drop of the flexible circuit board can be realized, after the circuit is accessed, the unnecessary loss of the flexible circuit board is reduced, and the waste of energy is reduced; meanwhile, when the flexible circuit board is cut, the loss of two adjacent sections of flexible circuit boards is avoided, the defective rate of the flexible circuit boards is reduced, and the production cost is reduced. And, through setting up the electrically conductive hole after, can cut at will, can not influence the electrical property of LED lamp pearl, LED lamp pearl overflows and also can not appear failing, can also realize not having the pressure drop.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A dual panel via layer, comprising: the conductive substrate is provided with a plurality of grooves, and the connecting bulges are embedded in the grooves in a one-to-one correspondence manner;

a plurality of conducting holes are formed in the conducting base body, and intervals are arranged among the conducting holes respectively;

the conducting base body is further provided with a plurality of conducting hole groups, the conducting hole groups are distributed on the conducting base body at equal intervals, each conducting hole group comprises two rows of conducting holes, connecting lines of the two rows of conducting holes are parallel to each other, a cut-off mark area is arranged on the conducting base body between the two rows of conducting holes, and the intervals between every two adjacent conducting holes are equal in the conducting holes.

2. The double-sided board via layer of claim 1, wherein in two rows of the conductive vias, one of the conductive vias in one row is aligned with an adjacent conductive via in the other row.

3. The double-sided board via layer of claim 1, wherein the conductive vias are circular holes.

4. The double-sided board via layer of claim 1, wherein the thickness of the via substrate is 15um to 100 um.

5. The double-sided board via layer according to claim 1, wherein there are three connecting protrusions, three grooves are formed on the conductive substrate, and each connecting protrusion is embedded in one of the grooves in a one-to-one correspondence manner.

6. A multi-layer LED flexible circuit board which is connected with the double-sided board through hole layer at will is characterized by comprising the double-sided board through hole layer as claimed in any one of claims 1 to 5, and further comprising a front-side circuit layer, a back-side circuit component, a front-side cover film, a back-side cover film and a character layer, wherein the character layer is attached to the front-side cover film;

the character layer is further provided with a plurality of cutting lines, the cutting lines are distributed on the character layer at equal intervals, and the cutting lines are located on the cutting mark area.

7. The multilayer LED flexible circuit board capable of being electrically connected at will as claimed in claim 6, wherein a plurality of soldering windows are opened on the front cover film, and a space is respectively arranged between the soldering windows.

8. The multilayer LED flexible circuit board with any electrical connection, according to claim 6, wherein the back surface circuit assembly comprises a back surface circuit layer, a double-sided pure glue layer, a conductive layer and a copper foil layer which are sequentially stacked, the back surface circuit layer is further disposed on the double-sided board via layer, and the copper foil layer is further disposed on the back surface cover film.

9. The multilayer LED flexible circuit board capable of being electrically connected at will as claimed in claim 6, wherein a plurality of front via rows are formed on the front cover film, and a space is formed between each front via row.

10. The multilayer LED flexible circuit board with any electrical connection as claimed in claim 6, wherein a plurality of back via rows are formed on the back cover film, and a space is respectively formed between the back via rows.

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