CN102724810A - LED circuit board with circuits flexible to be detached and LED module - Google Patents
LED circuit board with circuits flexible to be detached and LED module Download PDFInfo
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- CN102724810A CN102724810A CN2012102024798A CN201210202479A CN102724810A CN 102724810 A CN102724810 A CN 102724810A CN 2012102024798 A CN2012102024798 A CN 2012102024798A CN 201210202479 A CN201210202479 A CN 201210202479A CN 102724810 A CN102724810 A CN 102724810A
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- led
- solder joint
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- thin metal
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Abstract
The invention relates to an LED circuit board with circuits flexible to be detached. The LED circuit board comprises more than two slender metal conductor bars (1), an insulation substrate (2) and a solder mask layer (3). The slender metal conductor bars (1) are arranged parallelly and are spaced along the transverse direction and extend in the longitudinal direction, and the transverse direction is perpendicular to the longitudinal direction. The slender metal conductor bars are adhered on the insulation substrate (2). The solder mask layer (3) is covered on the slender metal conductor bars (1) and provided with soldering point pairs in multiple rows in an exposed manner. Each row of soldering points are distributed on the two corresponding parallelly-arranged slender metal conductor bars (1) along the longitudinal direction, and the two soldering points in each soldering point pair are arranged on the two corresponding slender metal conductor bars (1). LEDs are installed on some soldering point pairs to obtain an LED module. Operating circuits of the LEDs can be flexibly detached, and the LED circuit board is simple in structure, high in efficiency, low in manufacturing cost and free of etching and is a novel environment-friendly energy-saving technology.
Description
Technical field
The invention belongs to the application of circuit-board industry and LED, be specifically related to have the led circuit plate and the led circuit plate with flexible PCB, LED module of rigid circuit board.
Background technology
The circuit of traditional circuit-board all is that copper-clad plate etches circuit usually, or takes laser and the unwanted copper of milling cutter cutting removal to go out circuit.But the former is high cost and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities.
The present invention a series ofly compares with flat conductor and single face circuit board and the two-sided circuit of putting making with what the inventor invented in front; Behind welding LED lamp and other element; Can carry out flexible combination according to the needs of design splits; Split into the full series connection that needs, or the led circuit module that combines of full parallel connection or series and parallel, increased application flexibility.The present invention is simple in structure, and efficient is high, and cost of manufacture is low, need not etching, is a kind of new technology of environmental protection and energy saving.
Summary of the invention
According to the present invention; Disclosed a kind of led circuit plate that can split circuit flexibly; Comprise: more than two be arranged side by side and each other along spaced long and thin metal conductor, wherein the bearing of trend of long and thin metal conductor be vertically, said laterally perpendicular to said vertical; Insulating substrate, the long and thin metal conductor is bonded on the insulating substrate; Cover on the long and thin metal conductor and expose the right solder mask of multiple row solder joint; Wherein, Each row solder joint is to longitudinally being arranged on corresponding two long and thin metal conductors that are arranged side by side, and two solder joints of each solder joint centering lay respectively on corresponding two long and thin metal conductors.Some solder joints obtain LED module of the present invention to last installation LED therein.The present invention can split the LED operating circuit flexibly, and is simple in structure, and efficient is high, and cost of manufacture is low, need not etching, is a kind of new technology of environmental protection and energy saving.
The present invention can form various parallel connections, series connection, or the circuit board that combines of parallel connection series connection, and folding is divided into independent led circuit module as required.According to the design of LED module, can split along the combination that limit, the slit vertical direction between conductor or parallel direction or vertical direction and parallel direction all have, split and help series connection, complete parallelly connected or led circuit module that series and parallel combines.
According to one embodiment of the invention, said solder mask is a coverlay, on said coverlay corresponding to the right position of said multiple row solder joint, have the solder joint window; Perhaps said solder mask is a resistance solder paste China ink.
According to one embodiment of the invention, the said long and thin metal conductor segment distance that is arranged parallel to each other and is spaced apart from each other.
According to one embodiment of the invention, it is right on per two the long and thin metal conductors that are arranged side by side, all to be provided with along a row solder joint of said vertical layout.
According to one embodiment of the invention, said long and thin metal conductor is a flat conductor.
According to one embodiment of the invention, each row solder joint is said vertically on same straight line to the edge; And said multiple row solder joint makes said each row solder joint transversely along said laterally on same straight line to along lateral alignment.
According to one embodiment of the invention, said solder joint on be coated with tin cream.
The present invention also provides a kind of LED module that can split circuit flexibly, and said LED module comprises led circuit plate of the present invention, and is installed in one of them a little said solder joint last comprised LED at least at interior components and parts.
According to one embodiment of the invention, each said solder joint on components and parts are installed.
According to one embodiment of the invention, each said solder joint on LED is installed.
According to one embodiment of the invention, said LED module is along the vertically said of said long and thin metal conductor (1) and/or laterally split out the LED submodule group with parallel connection and/or series circuit.
According to one embodiment of present invention, on the both sides, slit that two strip metal conductors form, metal is as the both positive and negative polarity firing point.
According to one embodiment of present invention, said LED is adopting surface mounted LED lamp, direct insertion LED lamp or Piranha formula LED lamp, and LED is welded on the both positive and negative polarity firing point.
According to one embodiment of present invention, said LED directly is encapsulated in the LED that obtains on the both positive and negative polarity firing point with led chip.
According to one embodiment of present invention, other components and parts are welded on the both positive and negative polarity firing point.
According to one embodiment of present invention, its circuit board external form limit metal level is concordant with insulating barrier, wiring board side exposed metal/bare metal.
According to one embodiment of present invention, described circuit board is flexible PCB or rigid circuit board.
According to one embodiment of present invention, when needs are installed the jack element, directly boring or punching in positive and negative firing point position, thereby with in the component pins patchhole and be welded on the wire line.
According to one embodiment of present invention, said led circuit plate is to be used for LED lamp band, the led circuit plate of LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube, LED daylight lamp panel, LED Christmas lamp, LED sign module etc.
In following description, with the details of setting forth one or more embodiment of the present invention to accompanying drawing and embodiment.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present invention.
Description of drawings
Through combining following this specification of advantages, it is more obvious that characteristic of the present invention, purpose and advantage will become, in the accompanying drawings:
Fig. 1 for and put the sketch map of the metallic conductor of arranging.
Fig. 2 sticks on and puts the sketch map on the metallic conductor of arranging for the insulating substrate contraposition of band glue.
Fig. 3 is for have the sketch map of the coverlay of solder joint window in advance.
The sketch map of Fig. 4 for metallic conductor and the coverlay contraposition of holding window in advance successfully shown in Figure 3 are fit together.
Fig. 5 is the sketch map after the circuit board SMT of led circuit welds the LED lamp.
Fig. 6 is for splitting the sketch map of the LED module of helping series connection.
Fig. 7 is for splitting the sketch map of the LED module of helping parallel connection.
Fig. 8 is for splitting the sketch map of a kind of LED module of helping the series and parallel combination.
Fig. 9 is the sketch map that splits into the another kind of LED module that series and parallel combines.
Figure 10 is the schematic cross-section of wiring board and led circuit module.
Embodiment
Below with reference to accompanying drawings the present invention is carried out detailed description without etching making led circuit plate and LED module.
But, it will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some preferred implementations, some other similarly or the execution mode that is equal to equally also can be used for embodiment of the present invention.
Before describing the present invention in detail, it will be appreciated by those skilled in the art that " element " should do the understanding on the most wide in range connotation in this application; Promptly comprise all types of elements that are used for electronic component, electric component or other type of circuit; For example various resistance, the element of various surface mount (SMT) type, the element of support rack type, various high power devices or the like; Comprise great power LED, or the like.
Term " wiring board " and " circuit board " can use in the application with exchanging.
The making of LED wiring board:
According to the data of line design, the Copper Foil of predetermined thickness is cut into the metallic conductor 1 of preset width, and with metallic conductor 1 and put and be arranged in the mould that designs and produces in advance, as shown in Figure 1.Then; The one side contraposition that glue is arranged with the insulating substrate 2 of being with glue is attached on the metallic conductor 1 that is arranged in the mould shown in Figure 1; With bonder hot pressing 5 to 10 seconds under 90 ℃ to 150 ℃ temperature, from mould, take out, metallic conductor 1 promptly tentatively is fixed on (as shown in Figure 2) on the insulating substrate 2.
Conversely by the metallic conductor 1 of being with glue insulating substrate 2 to fix, stick the coverlay 3 (as shown in Figure 3) that snaps a window 4 in the another side contraposition of metallic conductor 1, fixed in 5 to 10 seconds with bonder hot pressing under 90 ℃ to 150 ℃ temperature.Coverlay 3 will become the solder mask of circuit board.Be covered with mould release membrance again, under 150 ℃ to 180 ℃, 90 to 180 seconds, the parameter of 12MPa, continue heat pressure adhesive, make insulating substrate 4, metallic conductor 1, coverlay 3 strong bonded with the pressing machine.Then, solidified 45 minutes to 90 minutes for 120 ℃ to 160 ℃ with baking box again, obtain circuit board as shown in Figure 4.
Printing word carries out OSP to each solder joint and handles.
Above printing word and OSP are the traditional handicrafts of circuit board, repeat no more at this.
The SMT soldered elements:
SMT with traditional mounts welding procedure; Pad locations with steel mesh contraposition wiring board; Print solder paste; LED lamp 5 is mounted on the metal solder joint on both sides, adjacent metal foils gap in the circuit board, reflow machine is fused into scolding tin 6 to tin cream LED lamp 5 lamps is welded (like Fig. 5, shown in Figure 10) in the circuit board excessively.These all are technology well known in the art, repeat no more.
Cut and split into the LED module:
According to the LED module of design, use the cutting die that designs and produces along limit, the slit vertical direction of 1 of conductor, the wiring board that has welded the LED lamp is cut fractionation, split the led circuit module product (as shown in Figure 6) of helping series connection.
According to the LED module of design, use the cutting die that designs and produces along limit, the slit parallel direction of 1 of conductor, the wiring board that has welded the LED lamp is cut fractionation, split the led circuit module product (as shown in Figure 7) of helping parallel connection.
LED module according to design; Be made into cutting die and use the cutting die that the edge of a knife is all arranged along limit, the slit vertical direction and the parallel direction of 1 of conductor; The wiring board that has welded the LED lamp is placed on cuts fractionation on the cutting die; The led circuit module product (like Fig. 8, shown in Figure 9) that series and parallel combines is helped in fractionation.
Shown in figure 10, cut the led circuit module after the fractionation, the metallic conductor 1 on its circuit board external form limit is concordant with coverlay solder mask 3 with insulating substrate 2, and wiring board side metallic conductor 1 is exposed.
More than combine accompanying drawing that the present invention has been carried out detailed description.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present invention, especially the scope of claim does not have any restriction.
Claims (10)
1. the led circuit plate that can split circuit flexibly is characterized in that, comprising:
Article two, more than be arranged side by side and each other along spaced long and thin metal conductor (1), wherein, the bearing of trend of said long and thin metal conductor (1) be vertically, said laterally perpendicular to said vertical;
Insulating substrate (2), said long and thin metal conductor (1) are bonded on the said insulating substrate (2);
Covering said long and thin metal conductor (1) goes up and exposes the right solder mask of multiple row solder joint (3); Wherein, Each row solder joint is to said vertically being arranged on corresponding two long and thin metal conductors (1) that are arranged side by side in edge, and two solder joints of each solder joint centering lay respectively on corresponding two long and thin metal conductors (1);
Wherein, said led circuit plate can be along the said vertical and/or said LED sub-circuit board with parallel connection and/or series circuit that laterally splits out of said long and thin metal conductor (1).
2. led circuit plate according to claim 1 is characterized in that, said solder mask (3) is a coverlay, on said coverlay corresponding to the right position of said multiple row solder joint, have the solder joint window; Perhaps
Said solder mask (3) is a resistance solder paste China ink.
3. led circuit plate according to claim 1 is characterized in that, said long and thin metal conductor (1) segment distance that is arranged parallel to each other and is spaced apart from each other.
4. led circuit plate according to claim 1 is characterized in that, it is right on per two the long and thin metal conductors (1) that are arranged side by side, all to be provided with along a row solder joint of said vertical layout.
5. according to each described led circuit plate among the claim 1-4, it is characterized in that said long and thin metal conductor (1) is a flat conductor.
6. according to each described led circuit plate among the claim 1-4, it is characterized in that:
Each row solder joint is said vertically on same straight line to the edge; And
Said multiple row solder joint makes said each row solder joint transversely along said laterally on same straight line to along lateral alignment.
7. according to each described led circuit plate among the claim 1-4, it is characterized in that, said solder joint on be coated with tin cream.
8. the LED module that can split circuit flexibly is characterized in that, said LED module comprises according to each described led circuit plate in the aforesaid right requirement, and is installed in said solder joint last comprised LED at least at interior components and parts.
9. LED module according to claim 8 is characterized in that, each said solder joint on said components and parts are installed.
10. according to Claim 8 or 9 described LED modules, it is characterized in that said LED module is along the vertically said of said long and thin metal conductor (1) and/or laterally split out the LED submodule group with parallel connection and/or series circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102024798A CN102724810A (en) | 2012-06-08 | 2012-06-08 | LED circuit board with circuits flexible to be detached and LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102024798A CN102724810A (en) | 2012-06-08 | 2012-06-08 | LED circuit board with circuits flexible to be detached and LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102724810A true CN102724810A (en) | 2012-10-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102024798A Pending CN102724810A (en) | 2012-06-08 | 2012-06-08 | LED circuit board with circuits flexible to be detached and LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102724810A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105590994A (en) * | 2014-10-22 | 2016-05-18 | 泉州市金太阳照明科技有限公司 | LED light source substrate and manufacturing method thereof |
| CN106871078A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated substrates of surface-adhered type RGB LED and its manufacture method |
| CN109246928A (en) * | 2018-09-27 | 2019-01-18 | 常州市武进三维电子有限公司 | The production technology of the flexible wires wiring board of new-energy automobile |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100937136B1 (en) * | 2007-12-24 | 2010-01-18 | (주)루미브라이트 | A light-emitting diode module with a lead frame comprising packages |
| KR20110060046A (en) * | 2009-11-30 | 2011-06-08 | 뉴콘전자(주) | Method for manufacturing jumper for surface mount devices and the jumper manufactured by the method |
| CN201910973U (en) * | 2010-09-01 | 2011-07-27 | 王定锋 | Full-series LED (Light-Emitting Diode) circuit board made of flat leads |
| CN202206656U (en) * | 2011-08-03 | 2012-04-25 | 王定锋 | LED (light-emitting diode) circuit board |
-
2012
- 2012-06-08 CN CN2012102024798A patent/CN102724810A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100937136B1 (en) * | 2007-12-24 | 2010-01-18 | (주)루미브라이트 | A light-emitting diode module with a lead frame comprising packages |
| KR20110060046A (en) * | 2009-11-30 | 2011-06-08 | 뉴콘전자(주) | Method for manufacturing jumper for surface mount devices and the jumper manufactured by the method |
| CN201910973U (en) * | 2010-09-01 | 2011-07-27 | 王定锋 | Full-series LED (Light-Emitting Diode) circuit board made of flat leads |
| CN202206656U (en) * | 2011-08-03 | 2012-04-25 | 王定锋 | LED (light-emitting diode) circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105590994A (en) * | 2014-10-22 | 2016-05-18 | 泉州市金太阳照明科技有限公司 | LED light source substrate and manufacturing method thereof |
| CN106871078A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated substrates of surface-adhered type RGB LED and its manufacture method |
| CN109246928A (en) * | 2018-09-27 | 2019-01-18 | 常州市武进三维电子有限公司 | The production technology of the flexible wires wiring board of new-energy automobile |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121010 |