CN202048540U - LED (Light Emitting Diode) lamp circuit board made of three flat conducting wires - Google Patents

LED (Light Emitting Diode) lamp circuit board made of three flat conducting wires Download PDF

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Publication number
CN202048540U
CN202048540U CN2010202701342U CN201020270134U CN202048540U CN 202048540 U CN202048540 U CN 202048540U CN 2010202701342 U CN2010202701342 U CN 2010202701342U CN 201020270134 U CN201020270134 U CN 201020270134U CN 202048540 U CN202048540 U CN 202048540U
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led
lamp plate
led circuit
flat conductor
circuit board
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CN2010202701342U
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王定锋
徐文红
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Abstract

The utility model relates to an LED (Light Emitting Diode) lamp circuit board, in particular to an LED lamp circuit board made of three flat conducting wires. When the LED lamp circuit board is designed, three flat conducting wires are arranged in parallel and are adhered by using of tape insulating materials as insulating bearing layers, one of the three flat conducting wires is welded with an LED lamp and other elements, and the other two flat conducting wires are power source wires. The conduction of the power source and the LED lamp is realized among the two power source wires and the other conducting wire through the connection of printing conductive oil ink or welding conductors or welding elements. The LED lamp circuit board is designed by means of arrangement of periodic units, LED and other elements adopt two or more series connections in each periodic unit, and the periodic units are mutually connected in parallel. Shearable parts can be designed between the periodic units, so that any two periodic units can be sheared off to realize the use of single or a plurality of periodic units in a separated or combined manner. The circuit board has the advantages of simple structure without etching, low manufacture cost and high efficiency, therefore, the circuit board is a new technology which is environmental-friendly, energy-saving and material-saving.

Description

LED circuit for lamp plate with three flat conductors making
Technical field
The utility model belongs to circuit-board industry, relates to led circuit plate field, the LED circuit for lamp plate that is specifically related to have the LED circuit for lamp plate of rigid circuit board and has flexible PCB.
Background technology
Traditional circuit board lead all is that copper-clad plate etches circuit usually, or takes laser and the unwanted copper of milling cutter cutting removal to go out circuit.But the former is high cost and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities.
Summary of the invention
The utility model is directly to take three juxtaposed flat conductors to make according to the characteristics of the big circuit board of the simple consumption of some circuits to produce circuit board, can be used for the LED field, and be widely used in various LED products.Low cost of manufacture, efficient height, and very environmental protection.
The utility model adopts three flat conductors also to put arrangement, with the insulating substrate of the band glue flat conductor that is adhesively fixed, excises wherein position that flat conductor need disconnect in the one side of flat conductor, is made into circuit.Hold the film of window in advance successfully or do welding resistance in the another side usefulness of flat conductor, be made into the led circuit panel products with welding resistance printing ink.The installation design of its LED is:
LED lamp and other element all design and installation on the flattened medial lead.
Perhaps, LED lamp and element all design and installation on arbitrary flat conductor of flattened medial lead both sides.
Mode according to periodic arrangement designs, and the LED in each cycle and other element adopt and be connected in series, and adopts between the cycle to be connected in parallel, and constantly the cycle that repeats, reaches required random length.And design can be cut off the position between the cycle, can cut off between any period, realizes that single and a plurality of periodic units independently are used in combination.
LED in phase and resistance are that the LED of any amount and the resistance arrangement combined serial of any amount couple together weekly.
The welding of LED and other element is adopted SMT Reflow Soldering welding or is adopted the welding of plug-in unit wave-soldering.
The circuit board that the utility model is made need not etching, and simple in structure, and cost of manufacture is low, efficient is high, is new technology a kind of ten minutes environmental protection, energy-conservation, material saving.
According to the utility model, three flat conductors of a kind of usefulness are provided and have put the LED circuit for lamp plate of arranging making, comprise: three and put the flat conductor of arrangement, wherein on a flat conductor welding LED lamp and other components and parts element are installed, the two other flat conductor is a power line; The insulating materials of the band glue that bonding these three flat conductors are used, it is as the insulation bearing bed of LED circuit for lamp plate; Wherein, the connection between these two power lines and the other flat conductor takes printing conductive inks or welding conductors or soldered elements to connect, and realizes the conducting of power supply and LED lamp.
According to an embodiment of the present utility model, LED circuit for lamp plate is taked to design by the mode that periodic unit is arranged, wherein, LED and other element adopt two or more LED and other element to be connected in series in each periodic unit, then adopt to be connected in parallel between periodic unit.
According to another embodiment of the present utility model, design can be cut off the position between periodic unit, makes and can cut off between any two periodic units, thereby realize the independence of single or multiple periodic units or the use of combination.
According to another embodiment of the present utility model, described three and the flat conductor of putting arrangement are fixed with the insulating substrate of being with glue with one side, and the band glue insulation film or the welding resistance printing ink of window are held in the another side combination in advance successfully, and it has formed the solder mask of described LED circuit for lamp plate.
According to another embodiment of the present utility model, the structure of described LED circuit for lamp plate comprises following four layers successively: ground floor is the insulation bearing bed; The second layer is the flat conductor layer; The 3rd layer is solder mask, and it is provided with and holds the solder joint position of soldered elements with window in advance successfully; With the 4th layer be the element layer of LED lamp and other element.
According to another embodiment of the present utility model, described LED circuit for lamp plate is FPC or rigidity wiring board.
According to another embodiment of the present utility model, described solder joint position forms SMT paster solder joint or is formed for pin LED lamp or the pin holes of other pin element.
According to an embodiment of the present utility model, described LED lamp driver plate is soft wiring board, or the wiring board of rigidity.
According to an embodiment of the present utility model, described and put that to arrange be to be arranged in parallel.
According to an embodiment of the present utility model, described solder joint is a SMT paster solder joint, is used for soldering surface mounted LED and other surface mount elements.Perhaps, be used for the pin holes of pin LED lamp and pin element in boring of solder joint place or punching.
According to an embodiment of the present utility model, described insulation bearing bed material is epoxy glass base material or phenolic aldehyde base material or polyimide base material or metal base, or ceramic base material.
According to an embodiment of the present utility model, described solder mask is the welding resistance printing ink that PCB uses, or the coverlay that FPC uses is made solder mask.
According to an embodiment of the present utility model, described flat conductor is selected from copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.
According to an embodiment of the present utility model, described LED circuit for lamp plate is characterized in that the length of described LED circuit for lamp plate is less than or equal to 100 meters, perhaps more than 100 meters.
In following description, will set forth one or more embodiments of the detail of the present utility model to the drawings and specific embodiments.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
By reading this specification in conjunction with the following drawings, it is more apparent that feature of the present utility model, purpose and advantage will become, in the accompanying drawings:
Fig. 1 is LED lamp and other element cross section and the plane structure chart of the product of design and installation on the flattened medial lead, comprises Figure 1A, 1B, and wherein Figure 1A is a cross sectional view, and Figure 1B is a plan view.
Fig. 2 is LED lamp and the element cross section and the plane structure chart of the product of design and installation on arbitrary the flat conductor in both sides, comprises Fig. 2 A, 2B, and wherein Fig. 2 A is a cross sectional view, and Fig. 2 B is a plan view.
Fig. 3 is the schematic diagram of parallel slot mould.
Fig. 4 is the schematic diagram of the cross section of parallel slot mould.
Fig. 5 is the schematic diagram of flat conductor parallel wiring, comprises Fig. 5 A, 5B, and Fig. 5 B is that flat conductor is fixed on the wiring diagram in the groove, and Fig. 5 A is the zoomed-in view of the wiring of flat conductor shown in Fig. 5 B.
Fig. 6 vacuumizes air-breathing fixing schematic diagram when being arranged in parallel for flat conductor.
Fig. 7 comprises Fig. 7 A, 7B for flat conductor is fixed on schematic diagram on the coverlay of bottom surface, and wherein, Fig. 7 A is that flat conductor is fixed on the schematic diagram on the coverlay of bottom surface, and Fig. 7 B is the zoomed-in view of structure shown in Fig. 7 A.
Fig. 8 is the figure that cuts away behind the position that flat conductor need disconnect, and comprises Fig. 8 A, 8B, and wherein Fig. 8 A is the schematic diagram that cuts away behind the position that flat conductor need disconnect, and Fig. 8 B is the zoomed-in view of Fig. 8 A structure.
Fig. 9 sticks the figure behind the coverlay of holding window in advance successfully for flat conductor, comprise Fig. 9 A, 9B, wherein Fig. 9 A is the schematic diagram after flat conductor sticks the coverlay of holding window in advance successfully, and the decomposing schematic representation that Fig. 9 B is a flat conductor when sticking the coverlay of holding window in advance successfully.
Figure 10 forms the schematic diagram in element legs hole by the form that gets out or go out in bond pad locations for the plug-in type circuit board.
The figure of Figure 11 after for SMT welding LED lamp and other element.
Figure 12 is the figure that cuts into behind the single periodic unit.
The parts label:
1 base material (bottom surface coverlay); 2 flat conductors; 3 solder masks (end face coverlay or welding resistance printing ink); 4 Chip-Rs; 5 paster LED lamps; 6 tin creams; 7 paster gap bridge conductors; 8 power supply pads; 9 parallel grooves; 10 vacuum-pumping tubes; 11 excision breach; 12 element legs holes.
The specific embodiment
Being made as embodiment with flexible LED circuit board and LED lamp decoration below with reference to accompanying drawings is described in detail the utility model.
But, it will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some preferred implementations, some other similarly or the embodiment that is equal to equally also can be used for implementing the utility model.
The making of flexible LED circuit board and LED lamp decoration is described below.
According to designing and producing the wiring mould:
Etch or the mould (as shown in Figure 3) of the parallel slot 9 that machining is consistent with juxtaposed (a kind of optimal way is parallel) flat conductor 2 width with for example mirror face stainless steel, the degree of depth of the parallel slot 9 of mould is determined according to the thickness of flat conductor 2, than the gauge slightly more shallow (as shown in Figure 4) of flat conductor 2.Obviously, it will be appreciated by those skilled in the art that parallel slot 9 is not necessarily strict parallel in actual production, also can be arranged side by side or claim juxtaposed.
Wiring:
With 2 while of one group of flat conductor cloth in the groove 9 of mould (shown in Fig. 4-5), vacuumize (shown in the arrow of Fig. 6) by means of vacuum-pumping tube 10, and flat conductor 2 is fixed in the groove 9, as shown in Figure 6.
Paste the bottom surface coverlay:
Coverlay 1 contraposition in bottom surface is attached on the flat conductor 2 of mould, clung in 5 to 10 seconds 180 ℃ of following hot pressing.From mould, take out, realize that like this circuit (being flat conductor 2) is fixed (as shown in Figure 7).Wherein, flat conductor 2 becomes the line layer blank of circuit board, and bottom surface coverlay 1 will become the insulation bearing bed (base material) 1 of circuit board, as shown in Figure 7.Fig. 7 comprises Fig. 7 A, 7B for flat conductor is fixed on schematic diagram on the coverlay of bottom surface, and wherein, Fig. 7 A is that flat conductor is fixed on the schematic diagram on the coverlay of bottom surface, and Fig. 7 B is the zoomed-in view of structure shown in Fig. 7 A.
The excision flat conductor need disconnect the position:
With the position that the die-cut flat conductor of mould need disconnect, breaking part stays excision mouth 11, and flat conductor is made into circuit (as shown in Figure 8).Fig. 8 is the figure that cuts away behind the position that flat conductor need disconnect, and comprises Fig. 8 A, 8B, and wherein Fig. 8 A is the schematic diagram that cuts away behind the position that flat conductor need disconnect, and Fig. 8 B is the zoomed-in view of Fig. 8 A structure.
Paste the end face coverlay:
The circuit that has been fixed by bottom surface coverlay 1, another side conversely, the coverlay 3 that snaps a window and fixing 180 ℃ of following hot pressing 5 to 10 seconds is sticked in contraposition.
Continuation with the pressure hot pressing of 150kg 120 seconds, makes two sides coverlay (being bottom surface coverlay 1 and end face coverlay 3) and flat conductor 2 strong bonded under 180 ℃.Next, the flat conductor that is combined with the two sides coverlay 150 ℃ of following baking-curings 60 minutes, is obtained structure as shown in Figure 9.Wherein, flat conductor 2 becomes the line layer 2 of circuit board, and bottom surface coverlay 1 becomes the insulating substrate 1 of circuit board, and end face coverlay 3 becomes the solder mask 3 of circuit board.Wherein, Fig. 9 sticks the figure behind the coverlay of holding window in advance successfully for flat conductor, comprise Fig. 9 A, 9B, wherein Fig. 9 A is the schematic diagram after flat conductor sticks the coverlay of holding window in advance successfully, and the decomposing schematic representation that Fig. 9 B is a flat conductor when sticking the coverlay of holding window in advance successfully.
Printing word:
Next printing word, the printing word technology of the method for printing word and traditional circuit-board is identical, repeats no more.
Weld the pin element if desired, then for example use die punching in bond pad locations, the aperture of the pin holes of being gone out 12 and the diameter of component pins coupling, but the aperture in this hole is preferably less than the window size (as shown in figure 10) of end face coverlay.
Each solder joint is carried out OSP handle, can be identical with traditional circuit-board technology, repeat no more.
Soldered elements:
For the circuit board of SMT type, can promptly finish the element welding with reflow machine welding behind the Yamaha automatic chip mounting.For the pin type circuit board, can promptly finish the element welding with crossing the crest welder welding behind the artificial plug-in unit.Here, element is meant the required any electronic component of circuit board that comprises LED.
Like this, just can obtain structure for example shown in Figure 1, the used diagram of present embodiment all is weekly the phase unit with 3 paster LED lamps (5), 1 Chip-R (4) and the diagram of 1 paster gap bridge conductor (7) design and installation on the flattened medial lead.Fig. 1 is LED lamp and other element cross section and the plane structure chart of the product of design and installation on the flattened medial lead, comprises Figure 1A, 1B, and wherein Figure 1A is a cross sectional view, and Figure 1B is a plan view.As an other embodiment, LED lamp and element can design and installation on arbitrary the flat conductor in both sides, as shown in Figure 2.Fig. 2 is LED lamp and the element cross section and the plane structure chart of the product of design and installation on arbitrary the flat conductor in both sides, comprises Fig. 2 A, 2B, and wherein Fig. 2 A is a cross sectional view, and Fig. 2 B is a plan view.
Cut itemize:
For example, can on punch press, cut, form wall scroll LED lamp decoration product (as shown in figure 12) with cutting die.
Below in conjunction with the accompanying drawings the utility model is described in detail.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some specific embodiment, to scope of the present utility model, especially the scope of claim does not have any restriction.

Claims (10)

1. one kind with three flat conductors and put the LED circuit for lamp plate of arrange making, and it is characterized in that described LED circuit for lamp plate comprises:
And put the flat conductor of arrangement article three,, wherein on a flat conductor welding LED lamp and other element are installed, the two other flat conductor is a power line;
The insulating materials of the band glue that bonding these three flat conductors are used, it is as the insulation bearing bed of LED circuit for lamp plate;
Wherein, the connection between these two power lines and the other flat conductor takes printing conductive inks or welding conductors or soldered elements to connect, and realizes the conducting of power supply and LED lamp.
2. LED circuit for lamp plate according to claim 1, it is characterized in that, LED circuit for lamp plate is taked to design by the mode that periodic unit is arranged, wherein, LED and other element adopt two or more LED and other element to be connected in series in each periodic unit, then adopt to be connected in parallel between periodic unit.
3. LED circuit for lamp plate according to claim 2 is characterized in that, design can be cut off the position between periodic unit.
4. LED circuit for lamp plate according to claim 1, it is characterized in that, described three and the flat conductor of putting arrangement are simultaneously fixed with the insulating substrate of band glue, and another side is in conjunction with band glue insulation film or the welding resistance printing ink of holding window in advance successfully, and it has formed the solder mask of described LED circuit for lamp plate.
5. LED circuit for lamp plate according to claim 1 is characterized in that, the structure of described LED circuit for lamp plate comprises following four layers successively:
Ground floor is the insulation bearing bed;
The second layer is the flat conductor layer;
The 3rd layer is solder mask, and it is provided with and holds the solder joint position of soldered elements with window in advance successfully; With
The 4th layer is the element layer of LED lamp and other element.
6. LED circuit for lamp plate according to claim 1 is characterized in that, described LED circuit for lamp plate is FPC or rigidity wiring board.
7. LED circuit for lamp plate according to claim 5 is characterized in that, described solder joint position forms SMT paster solder joint or is formed for the pin holes of pin LED lamp.
8. LED circuit for lamp plate according to claim 5 is characterized in that, described insulation bearing bed material is epoxy glass base material or phenolic aldehyde base material or polyimide base material or metal base, or ceramic base material.
9. LED circuit for lamp plate according to claim 1 is characterized in that, described flat conductor is selected from copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.
10. LED circuit for lamp plate according to claim 1 is characterized in that the length of described LED circuit for lamp plate is less than or equal to 100 meters, perhaps more than 100 meters.
CN2010202701342U 2010-07-23 2010-07-23 LED (Light Emitting Diode) lamp circuit board made of three flat conducting wires Ceased CN202048540U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202701342U CN202048540U (en) 2010-07-23 2010-07-23 LED (Light Emitting Diode) lamp circuit board made of three flat conducting wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202701342U CN202048540U (en) 2010-07-23 2010-07-23 LED (Light Emitting Diode) lamp circuit board made of three flat conducting wires

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CN202048540U true CN202048540U (en) 2011-11-23

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ID=44988847

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102522342A (en) * 2011-12-27 2012-06-27 日月光半导体制造股份有限公司 Semiconductor structure and method for manufacturing same
CN103167744A (en) * 2011-12-08 2013-06-19 王定锋 Light-emitting diode (LED) strip printed circuit board with element and manufacture method thereof
CN103731975A (en) * 2013-11-29 2014-04-16 鹤山丽得电子实业有限公司 Foldable flexible circuit board, manufacturing method thereof and flexile LED strip-shaped lamp provided with same
CN103822130A (en) * 2014-01-27 2014-05-28 东莞市田津电子科技有限公司 Smooth LED flexible light bar and device and method for manufacturing same
CN103826388A (en) * 2014-02-22 2014-05-28 鹤山丽得电子实业有限公司 Novel folding flexible circuit board and flexible LED bar lamp with two light-emitting faces and novel folding flexible circuit board
CN103826382A (en) * 2014-02-20 2014-05-28 鹤山市银雨照明有限公司 Bent flexible circuit board and LED strip lamp with same
CN103974525A (en) * 2014-04-28 2014-08-06 鹤山丽得电子实业有限公司 Flexible circuit board, flexible LED lamp bar and manufacturing method of flexible LED lamp bar
CN104470208A (en) * 2014-09-17 2015-03-25 肖立峰 LED punching circuit board and manufacturing method and device
CN104565962A (en) * 2013-10-25 2015-04-29 鹤山丽得电子实业有限公司 Flexible LED (light emitting diode) strip light with single conductive layer and double-side light emission
CN105101654A (en) * 2014-05-20 2015-11-25 广东德豪润达电气股份有限公司 Manufacturing methods of single-sided and double-sided flexible circuit boards and single-sided and double-sided flexible circuit boards
CN105318296A (en) * 2014-08-01 2016-02-10 鹤山丽得电子实业有限公司 LED (Light-Emitting Diode) lamp circuit board and manufacturing method thereof
WO2019115800A3 (en) * 2017-12-14 2019-09-19 Siteco Beleuchtungstechnik Gmbh Led component and method for producing the same
CN114352956A (en) * 2021-12-07 2022-04-15 东莞市欧思科光电科技有限公司 Manufacturing method of LED lamp strip

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103167744A (en) * 2011-12-08 2013-06-19 王定锋 Light-emitting diode (LED) strip printed circuit board with element and manufacture method thereof
CN103167744B (en) * 2011-12-08 2016-03-02 王定锋 LED wiring board with element and preparation method thereof
CN102522342A (en) * 2011-12-27 2012-06-27 日月光半导体制造股份有限公司 Semiconductor structure and method for manufacturing same
CN104565962A (en) * 2013-10-25 2015-04-29 鹤山丽得电子实业有限公司 Flexible LED (light emitting diode) strip light with single conductive layer and double-side light emission
CN103731975A (en) * 2013-11-29 2014-04-16 鹤山丽得电子实业有限公司 Foldable flexible circuit board, manufacturing method thereof and flexile LED strip-shaped lamp provided with same
CN103822130A (en) * 2014-01-27 2014-05-28 东莞市田津电子科技有限公司 Smooth LED flexible light bar and device and method for manufacturing same
CN103826382A (en) * 2014-02-20 2014-05-28 鹤山市银雨照明有限公司 Bent flexible circuit board and LED strip lamp with same
CN103826388A (en) * 2014-02-22 2014-05-28 鹤山丽得电子实业有限公司 Novel folding flexible circuit board and flexible LED bar lamp with two light-emitting faces and novel folding flexible circuit board
CN103974525A (en) * 2014-04-28 2014-08-06 鹤山丽得电子实业有限公司 Flexible circuit board, flexible LED lamp bar and manufacturing method of flexible LED lamp bar
CN105101654A (en) * 2014-05-20 2015-11-25 广东德豪润达电气股份有限公司 Manufacturing methods of single-sided and double-sided flexible circuit boards and single-sided and double-sided flexible circuit boards
CN105101654B (en) * 2014-05-20 2018-02-27 广东德豪润达电气股份有限公司 The preparation method and single, double surface flexible PCB of single, double surface flexible PCB
CN105318296A (en) * 2014-08-01 2016-02-10 鹤山丽得电子实业有限公司 LED (Light-Emitting Diode) lamp circuit board and manufacturing method thereof
CN104470208A (en) * 2014-09-17 2015-03-25 肖立峰 LED punching circuit board and manufacturing method and device
WO2019115800A3 (en) * 2017-12-14 2019-09-19 Siteco Beleuchtungstechnik Gmbh Led component and method for producing the same
CN114352956A (en) * 2021-12-07 2022-04-15 东莞市欧思科光电科技有限公司 Manufacturing method of LED lamp strip
CN114352956B (en) * 2021-12-07 2022-09-30 东莞市欧思科光电科技有限公司 Manufacturing method of LED lamp strip

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C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Huizhou State Fair Electronics Co., Ltd.

Assignor: Wang Dingfeng

Contract record no.: 2013440020327

Denomination of utility model: LED (Light Emitting Diode) lamp circuit board made of three flat conducting wires

Granted publication date: 20111123

License type: Exclusive License

Record date: 20131120

LICC Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model
C32 Full or partial invalidation of patent right
IW01 Full invalidation of patent right

Decision date of declaring invalidation: 20141118

Decision number of declaring invalidation: 24358

Granted publication date: 20111123