CN201928519U - Double-sided circuit board manufactured by adhering juxtaposed flat leads with thermosetting adhesive film - Google Patents
Double-sided circuit board manufactured by adhering juxtaposed flat leads with thermosetting adhesive film Download PDFInfo
- Publication number
- CN201928519U CN201928519U CN2010205032222U CN201020503222U CN201928519U CN 201928519 U CN201928519 U CN 201928519U CN 2010205032222 U CN2010205032222 U CN 2010205032222U CN 201020503222 U CN201020503222 U CN 201020503222U CN 201928519 U CN201928519 U CN 201928519U
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- double
- flat conductor
- layer
- sided pcb
- glue
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- Expired - Lifetime
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Abstract
The utility model relates to a double-sided circuit board manufactured by adhering juxtaposed flat leads with a thermosetting adhesive film. Juxtaposed flat leads are adhered on the thermosetting adhesive film; positions needed to be disconnected on the flat leads and via holes needed to be conducted in a double-layer circuit are cut off; then, the juxtaposed flat leads are aligned and attached on the adhesive-free face of an adhesive insulating base material adhered and fixed with the other layer of juxtaposed flat leads; printing solder resist ink or thermal pressing adhering layer is used as a solder mask (a pad window can be prearranged in the adhering layer as required); the via holes are conducted by adopting conductive printing ink, or a welding element or a welding conductor; and a gap bridge is conducted by adopting a conductive printing ink, or a welding conductor or a welding element. When a jack element is needed to be installed, a welding spot position is directly drilled or punched by using a die, thus welding and installing can be performed. The double-sided circuit board is manufactured without etching, copper depositing or copper plating, and an extremely environment-friendly, energy-saving and material-saving new technology is provided.
Description
Technical field
The utility model belongs to circuit-board industry.According to one side of the present utility model, adopt the thermosetting glued membrane to adhere to flat and put the double-sided wiring board of wire producing.And the flat conductor of putting layout sticks on the thermosetting glued membrane, the via that position that the excision flat conductor need disconnect and odt circuit need conducting, then, contraposition be fitted in and be adhered fixed another layer and put on the band glue insulating substrate of flat conductor of layout not with the one side of glue, printing welding resistance printing ink, perhaps the hot pressing coverlay is as solder mask (coverlay can be held the pad window in advance successfully as required), via is taked electrically conductive ink, perhaps use soldered elements, perhaps welding conductors conducting is passed a bridge and is adopted electrically conductive ink, perhaps welding conductors, perhaps soldered elements conducting.When needs are installed the jack element, just directly on bond pad locations, hole or use die punching, but with regard to welded and installed.
Background technology
Traditional circuit board lead all is that copper-clad plate etches circuit usually, or takes laser and the unwanted copper of milling cutter cutting removal to go out circuit.But the former is high cost and pollution is very serious, and latter's efficient is too low, can't produce in enormous quantities.
The utility model is with comparing with flat conductor and the single face circuit board of putting making that the inventor invents in front, and the position of its components and parts is more conducive to design and puts.Compare with traditional production circuit board, the utility model is to need not etching, need not heavy copper, need not copper facing and the double-sided PCB made, is new technology a kind of ten minutes environmental protection, energy-conservation, material saving.
The utility model content
According to the utility model, adopt the thermosetting glued membrane to adhere to and put the double-sided wiring board of flat conductor making.And the flat conductor of putting layout sticks on the thermosetting glued membrane, the via that position that the excision flat conductor need disconnect and odt circuit need conducting, then, contraposition be fitted in and be adhered fixed another layer and put on the band glue insulating substrate of flat conductor of layout not with the one side of glue, printing welding resistance printing ink, perhaps the hot pressing coverlay is as solder mask (coverlay can be held the pad window in advance successfully as required), via is taked electrically conductive ink, perhaps use soldered elements, perhaps welding conductors conducting is passed a bridge and is adopted electrically conductive ink, perhaps welding conductors, perhaps soldered elements conducting.When needs are installed the jack element, just directly on bond pad locations, hole or use die punching, but with regard to welded and installed.
The position of circuit board element of the present utility model is more conducive to design and puts, and still unmanned up to now employing thermosetting glued membrane adheres to and puts flat conductor and directly make double-sided PCB in the prior art.
The utility model is to need not etching, need not heavy copper, need not copper facing and the double-sided PCB made, be new technology a kind of ten minutes environmental protection, energy-conservation, material saving more specifically, according to the utility model, provide a kind of and adopted the thermosetting glued membrane to adhere to flat and put the double-sided wiring board of wire producing.Stick to flat conductor on the thermosetting glued membrane and that put layout, the via that position that the excision flat conductor need disconnect and odt circuit need conducting forms the front line layer; Another layer and the flat conductor of putting layout are bonded in the one side of insulating substrate band glue, form back side line layer.Front circuit and back side link tester are crossed thermosetting glued membrane and and are worn the insulating substrate of glue and paste and to press together, and form two-sided circuit; Front circuit and back side circuit adopt printing welding resistance printing ink, and perhaps thermocompression bonded crossed belt glue has insulating substrate coverlay (coverlay can be held the pad window in advance successfully as required), forms solder mask.
According to one side of the present utility model, the insulating substrate of described band glue is epoxy glass base material, phenolic aldehyde base material, polyimide base material, metal base, or ceramic base material.
According to one side of the present utility model, described flat conductor is copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.
According to one side of the present utility model, in the excision flat conductor position that need disconnect, the also cut excision mouth that falls an identical size of thermosetting glue-line, the insulating barrier that insulation solder mask and is worn glue does not all sustain damage.
According to one side of the present utility model, the single face circuit board that described method is made is flexible PCB or rigid circuit board.
According to one side of the present utility model, its interlayer structure of described double-sided PCB is:
Ground floor: the first insulation solder mask;
The second layer: first and put the back side line layer that flat conductor forms;
The 3rd layer: the thermosetting glue-line;
The 4th layer: one wears the insulating barrier of glue;
Layer 5: second and put the front line layer that flat conductor forms;
Layer 6: the second insulation solder mask; With
According to one side of the present utility model, described excision processing is selected from that mould is die-cut, boring, bore mill, laser ablation and wire cutting machine excision.
According to one side of the present utility model, described single face circuit board is used for LED lamp band, LED illuminating module, LED guardrail pipe, LED neon light, LED fluorescent tube or LED Christmas lamp etc.
According to one side of the present utility model, the length of described circuit board is less than or equal to 100 meters, perhaps more than 100 meters.
According to one side of the present utility model, described flat conductor adopts the circle line pressure to prolong and makes or cut into metal forming, metallic plate, metal tape branch, or the flattening of stranded conductor bundle is made.
According to one side of the present utility model, described double-sided PCB, when needs are installed the jack element, directly in bond pad locations boring or punching, thereby with in the component pins patchhole and be welded on the line layer.
Description of drawings
By reading this specification in conjunction with the following drawings, it is more apparent that feature of the present utility model, purpose and advantage will become, in the accompanying drawings:
Fig. 1 is the planar structure and the cross-sectional structure figure of double circuit plate.
Fig. 2 is the schematic diagram of the flat conductor of calendering making.
Fig. 3 for and put the schematic diagram of groove mould.
Fig. 4 for and put the cross-sectional view of groove mould.
Fig. 5 is for flat conductor and put wiring diagram.
Fig. 6 is for flat conductor and put and vacuumize air-breathing fixing schematic diagram when arranging.
Fig. 7 is be adhesively fixed schematic diagram on the thermosetting glued membrane of juxtaposed flat conductor.
Fig. 8 sticks on the thermosetting glued membrane for juxtaposed flat conductor, cuts away the schematic diagram of the via that position that flat conductor need disconnect and odt circuit need conducting.
Fig. 9 is the schematic diagram that the insulating barrier of wearing glue cuts away via.
The schematic diagram that Figure 10 is adhesively fixed and wears on the sticky surface of insulating barrier of glue one for back side flat conductor.
Figure 11 be bonded with the front circuit the thermosetting glued membrane another side and be bonded with back side circuit one and wear the insulating barrier of glue and have or not glue to face position, superimposed and schematic diagram that hot pressing is fixed together.
Figure 12 is the schematic diagram of the insulating substrate of the band glue that has element solder joint window in advance
Figure 13 is insulating substrate 5 (solder mask); Front circuit 4; Thermosetting glued membrane 15; One wears the insulating barrier 3 of glue; Back side circuit 2; The superimposed hot pressing of insulating substrate 1 contraposition schematic diagram together.
The schematic diagram of Figure 14 after for circuit board welding LED and element thereof.
The parts label
1, base material; 2, flat conductor (back side circuit); 3, the insulating barrier of two sides band glue; 4, flat conductor (front circuit); 5, solder mask (coverlay or welding resistance printing ink); 6, paster LED lamp; 7, Chip-R; 8, gap bridge conductor; 9 excision mouths; 10, power supply pad; 11, via (by the soldering conducting of soldered elements); 12, parallel groove; 13, vacuum-pumping tube; 14, Qie Chu via; 15, hot-setting adhesive
Embodiment
To adopt the thermosetting glued membrane to adhere to and the specific embodiment of putting the method for the double-sided wiring board that flat conductor makes is described in more detail to the utility model below.
But, it will be appreciated by those skilled in the art that the following stated only is to illustrate and describe some preferred implementations, some other similarly or the execution mode that is equal to equally also can be used for implementing the utility model.
1. flat conductor is made: take the cutting of Copper Foil itemize to make or become with flat conductor calender calendering copper cash the flat conductor 2 and 4 (as shown in Figure 2) of certain width and thickness.
2. and put groove mould and make: adopt the method for etching or machining with minute surface stainless steel plate, process consistent with line width and put groove 12 (as shown in Figure 3), gash depth is than the thickness of flat conductor 2 and 4 more shallow (as shown in Figure 4).
3, flat conductor (front circuit) and put layout: design and produce in advance and have consistent with the flat conductor width and put groove mould, flat conductor and put and arrange and to be fixed on (as shown in Figure 5) in the groove, the fixing employing by vaccum suction tube 13 vacuumizes air-breathing method and fixes (as shown in Figure 6).With thermosetting glued membrane 15 be fixed on and put flat conductor in the groove mould groove to good position, be superimposed together, use 120 ℃ to 150 ℃ precompressed 5 to 10 seconds again, tentatively fixedly groove mould is taken away and put to the front circuit.(as shown in Figure 7).
4, need the position 9 of disconnection and the via 14 that odt circuit needs conducting with the die-cut flat conductor (front circuit) 4 of removing of mould, form front line layer (as shown in Figure 8).
5, flat conductor (back side circuit) and put layout: design and produce in advance and have consistent with the flat conductor width and put groove mould, flat conductor and put and arrange and to be fixed on (as Fig. 5) in the groove, the fixing employing by vaccum suction tube 13 vacuumizes air-breathing method and fixes (as shown in Figure 6).With in advance two-sided circuit need the corresponding position of conducting have one of via wear glue insulating substrate 3 (as shown in Figure 9) sticky surface be fixed on and put flat conductor in the groove mould groove to good position, be superimposed together, with 120 ℃ to 150 ℃ precompressed 5 to 10 seconds, groove mould (as shown in figure 10) is taken away and put to preliminary fixedly back side circuit.
6, will be fixed with the thermosetting glued membrane 15 of front circuit 4 and be fixed with one of back side circuit 2 wear glue insulating substrate 3 no glue in the face of the position, be superimposed together, with 120 ℃ to 150 ℃ precompressed 5 to 10 seconds, be covered with release film then, continue with 150 ℃ to 180 ℃, pressing in 90 to 180 seconds, fixedly secure front circuit 4 and back side circuit 2 (as shown in figure 11), finished the making of the two-sided circuit that does not have welding resistance.
7, face good position with the front circuit 4 of 5 (as shown in figure 12) of insulating substrate (coverlay solder mask) that have the band glue of element solder joint window in advance and two-sided circuit, again with the insulating substrate 1 of being with glue 2 pairs of good positions of back side circuit with two-sided circuit, with 120 ℃ to 150 ℃ precompressed 5 to 10 seconds, be covered with release film then, continue with 150 ℃ to 180 ℃, pressing in 90 to 180 seconds, solidified 45 minutes to 90 minutes for 120 ℃ to 160 ℃ with baking box again, promptly realize the curing bonding (as shown in figure 13) of two-layer insulation solder mask 1,5 and circuit board.
8, printing word, this technology is traditional handicraft, does not carefully state at this.
9, butt welding point is carried out the OSP processing, and this technology is traditional handicraft, does not carefully state at this.
10, SMT soldered elements 6,7 and gap bridge bonding conductor 8 (as Figure 14), via 11 is by the soldering conducting of soldered elements, and the patent No. that this technology can be applied on December 30th, 2009 referring to the applicant is 200920215983.5 utility model patent " double-sided PCB of band element ".Source of welding current line was used (as Fig. 1) when power supply pad 10 was the product application.These all are technology well known in the art, repeat no more.
11, cut into required single products (as Fig. 1) with cutting die.
Below in conjunction with the accompanying drawings the method specific embodiment is described in detail the utility model.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present utility model, especially the scope of claim does not have any restriction.
Claims (9)
1. one kind is adopted the adhesion of thermosetting glued membrane and puts the double-sided wiring board that flat conductor is made, and comprising:
Stick to one deck flat conductor on the thermosetting glued membrane and that put layout, the position that needs to disconnect on this flat conductor is formed with excision mouthful, and is provided with and is used for the required via of odt circuit conducting, thereby forms the front line layer;
Another layer and the flat conductor of putting layout are bonded in the one side of insulating substrate band glue, form back side line layer;
Wherein, described front line layer presses together by not pasting with the reverse side of glue of described thermosetting glued membrane and described insulating substrate, thereby forms two-sided circuit;
Wherein, on described front line layer and back side line layer, print the insulating substrate coverlay of band glue on welding resistance printing ink or the heat pressure adhesive, and form solder mask.
2. double-sided PCB according to claim 1 is characterized in that, described via is taked electrically conductive ink or soldered elements or welding conductors conducting, and employing electrically conductive ink or welding conductors or soldered elements are realized the gap bridge conducting between circuit.
3. double-sided PCB according to claim 1 is characterized in that, the insulating substrate of described band glue is: epoxy glass base material, phenolic aldehyde base material, polyimide base material, metal base, or ceramic base material.
4. double-sided PCB according to claim 1 is characterized in that, described flat conductor is: copper cash, copper-clad aluminum conductor, copper covered steel wire, copper tinned wire, copper nickel plating gold thread, iron tinned wire or steel tinned wire.
5. double-sided PCB according to claim 1 is characterized in that, described double-sided PCB is flexible PCB or rigid circuit board.
6. double-sided PCB according to claim 1 is characterized in that, described double-sided PCB comprises on interlayer structure successively:
Ground floor: the first insulation solder mask;
The second layer: first and put the back side line layer that flat conductor forms;
The 3rd layer: the thermosetting glue-line;
The 4th layer: one wears the insulating barrier of glue;
Layer 5: second and put the front line layer that flat conductor forms;
Layer 6: the second insulation solder mask; With
Layer 7 is: element and gap bridge conductive layer.
7. double-sided PCB according to claim 1 is characterized in that, in the position that the excision flat conductor need disconnect, and the excision mouth of the also cut correspondence of described thermosetting glued membrane, described excision mouth does not damage the insulating substrate that described solder mask and described is worn glue.
8. double-sided PCB according to claim 1, it is characterized in that, described flat conductor is to adopt the circle line pressure to prolong the flat conductor of making, or the flat conductor that cuts into metal forming, metallic plate or metal tape branch, or the flat conductor made from the flattening of stranded conductor bundle.
9. double-sided PCB according to claim 1 is characterized in that:
Described double-sided PCB is the double-sided PCB that the jack element is installed, and wherein, is provided with the hole that gets out or go out in the bond pad locations of described double-sided PCB, is used for inserting component pins in the described hole and being welded on line layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205032222U CN201928519U (en) | 2010-08-24 | 2010-08-24 | Double-sided circuit board manufactured by adhering juxtaposed flat leads with thermosetting adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205032222U CN201928519U (en) | 2010-08-24 | 2010-08-24 | Double-sided circuit board manufactured by adhering juxtaposed flat leads with thermosetting adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201928519U true CN201928519U (en) | 2011-08-10 |
Family
ID=44432352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205032222U Expired - Lifetime CN201928519U (en) | 2010-08-24 | 2010-08-24 | Double-sided circuit board manufactured by adhering juxtaposed flat leads with thermosetting adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201928519U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711371A (en) * | 2012-06-08 | 2012-10-03 | 王定锋 | Double-sided lead wire circuit board with mutually-crossed lead wire circuits on two sides |
| CN103966603A (en) * | 2013-02-04 | 2014-08-06 | 苏州市吴中区伟良电子有限公司 | Staged total etching technology |
| CN108916667A (en) * | 2018-05-22 | 2018-11-30 | 东莞市闻誉实业有限公司 | Headlamp |
| CN115042504A (en) * | 2022-05-20 | 2022-09-13 | 东莞市湘华建强光电科技有限公司 | Manufacturing process of double-layer metal damping plate for vehicle |
-
2010
- 2010-08-24 CN CN2010205032222U patent/CN201928519U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711371A (en) * | 2012-06-08 | 2012-10-03 | 王定锋 | Double-sided lead wire circuit board with mutually-crossed lead wire circuits on two sides |
| CN103966603A (en) * | 2013-02-04 | 2014-08-06 | 苏州市吴中区伟良电子有限公司 | Staged total etching technology |
| CN108916667A (en) * | 2018-05-22 | 2018-11-30 | 东莞市闻誉实业有限公司 | Headlamp |
| CN108916667B (en) * | 2018-05-22 | 2020-03-24 | 东莞市闻誉实业有限公司 | Lighting lamp |
| CN115042504A (en) * | 2022-05-20 | 2022-09-13 | 东莞市湘华建强光电科技有限公司 | Manufacturing process of double-layer metal damping plate for vehicle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110810 |
|
| CX01 | Expiry of patent term |