CN103966603A - Staged total etching technology - Google Patents

Staged total etching technology Download PDF

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Publication number
CN103966603A
CN103966603A CN201310042224.4A CN201310042224A CN103966603A CN 103966603 A CN103966603 A CN 103966603A CN 201310042224 A CN201310042224 A CN 201310042224A CN 103966603 A CN103966603 A CN 103966603A
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CN
China
Prior art keywords
substrate
face
carving technology
stage total
total eclipse
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Granted
Application number
CN201310042224.4A
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Chinese (zh)
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CN103966603B (en
Inventor
周雪良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuzhong District Suzhou City Wei Liang Electronics Co Ltd
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Wuzhong District Suzhou City Wei Liang Electronics Co Ltd
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Application filed by Wuzhong District Suzhou City Wei Liang Electronics Co Ltd filed Critical Wuzhong District Suzhou City Wei Liang Electronics Co Ltd
Priority to CN201310042224.4A priority Critical patent/CN103966603B/en
Publication of CN103966603A publication Critical patent/CN103966603A/en
Application granted granted Critical
Publication of CN103966603B publication Critical patent/CN103966603B/en
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Abstract

The invention discloses a staged total etching technology. The technology is characterized in that the technology comprises an ink coating and exposing stage of double surfaces of a substrate, a primary etching stage of one surface of the substrate, and a secondary etching stage of the other surface of the substrate. The technology has the advantages of reasonable process step design, simple preparation process, easy operation, low center of gravity, stable operation and unlikely product damage; etched products produced by adopting the technology have no connection points, are beautiful and have good use functions; and a sticky membrane is used as a carrier, so products are not scattered after the total etching is completed, and are still tidily arranged on the sticky membrane, and subsequent product processing or use is convenient.

Description

Stage total eclipse carving technology
Technical field
The present invention relates to a kind of etch process, be specifically related to a kind of stage total eclipse carving technology.
Background technology
Use existing etch process production etching products, for preventing coming off in product circular flow, or facilitate the processing of back segment product surface, conventionally can be at product design edge partial design tie point.Yet, the existence of this tie point has not only affected the attractive in appearance of product, and the product that can cause damage of product to be in contact with it, finally cause product function bad, so, in order to guarantee the attractive in appearance of product and to there is good use function, need to use additional process to remove the tie point on product, this just makes the cost of product increase.
Summary of the invention
For solving the deficiencies in the prior art, the object of the present invention is to provide a kind of stage total eclipse carving technology that makes the etching products connectionless point produced and proper alignment facilitate following process.
In order to realize above-mentioned target, the present invention adopts following technical scheme:
A stage total eclipse carving technology, is characterized in that, comprises the following steps:
(1), the A of substrate, B two sides are printed and gone up welding resistance ink uniformly, and be dried;
(2), exposed in the A of aforesaid base plate, B two sides;
(3), at the A of aforesaid base plate face, paste adhesive film, B face is carried out to etching, etch depth does not penetrate substrate;
(4), remove the welding resistance ink of B face;
(5), the B face of aforesaid base plate is pasted to adhesive film, A face is carried out to etching, etch depth penetrates substrate;
(6), remove the welding resistance ink of A face.
Aforesaid stage total eclipse carving technology, is characterized in that, aforementioned adhesive film is corrosion-resistant adhesive film.
Aforesaid stage total eclipse carving technology, is characterized in that, aforementioned corrosion-resistant adhesive film is PET film.
Aforesaid stage total eclipse carving technology, is characterized in that, in step (1), uses 85-95 order half tone to print substrate.
Aforesaid stage total eclipse carving technology, is characterized in that, in step (1), the substrate after printing is heat-wind circulate drying at 80 ℃.
Aforesaid stage total eclipse carving technology, is characterized in that, in step (2), substrate exposes in exposure machine.
Aforesaid stage total eclipse carving technology, is characterized in that, aforementioned exposure machine is cooled exposure machine, and lighthouse surface temperature is 28 ℃, and exposure energy is 400-600mj/cm 2.
Aforesaid stage total eclipse carving technology, is characterized in that, in step (2), also comprises following sub-step:
1., use image-developing liquor to carry out video picture to the substrate after exposing;
2., the substrate after video picture carried out to hot air circulation solidify, temperature is 145 ℃, the time is 50-60min.
Aforesaid stage total eclipse carving technology, is characterized in that, what the welding resistance ink on removal substrate adopted is detergent for ink.
Usefulness of the present invention is: processing step is reasonable in design, and processing procedure is simple, easily operation; Center of gravity is low, stable, is not easy to damage product; The etching products connectionless point that adopts method of the present invention to produce is not only attractive in appearance but also guaranteed good use function; By toughness film, be carrier, after whole etchings complete, product is not at random, and still proper alignment, on the film of viscosity, facilitates subsequent product processing or uses.
Embodiment
Introduce in detail the stage total eclipse carving technology of the present invention below.
The stage total eclipse carving technology of the present invention mainly comprised for three megastages, substrate inking and exposure stage, substrate one side second etch stage of etch phase and substrate another side first, introduced in detail the operation steps in each stage below that is::
(1), substrate inking and exposure stage
First, substrate is finished after clean, and the A face of doing, B face are remembered respectively in its two sides, then uses 85-95 order half tone to the upper welding resistance ink of the A face of substrate, B face printing uniformly.Screen painting can effectively be controlled coating thickness, prevents from filming too thick or too thin, too thick residual film or dry not enough, the too thin processing procedures such as not resistance to spraying that easily cause of easily causing of filming.
Then, by the substrate heat-wind circulate drying at 80 ℃ after printing, by the solvent evaporation in welding resistance ink.
Next, utilize exposure machine to expose to the A face of substrate, B face.
As a kind of preferred scheme, exposure machine can be selected cooled exposure machine, and lighthouse surface temperature is 28 ℃, and exposure energy is 400-600mj/cm 2, exposure energy Tai Gaoyi causes the residual film of follow-up video picture, too lowly may occur video picture lateral erosion.
In order to facilitate etching and to improve etched quality, the substrate after exposure is also proceeded to video picture, solidification treatment, concrete:
1. the substrate, after using image-developing liquor to exposure carries out video picture, will unexposedly film and dissolve and remove with image-developing liquor, retains the part of exposing.The selection of image-developing liquor, time of developing, solution temperature, hydro-peening pressure etc. are the conventional selection in this area and operation, do not repeat them here;
2., the substrate after video picture carried out to hot air circulation solidify, make welding resistance ink heating post-hardening become molecule crosslinked state.While solidifying, preferred temperature is 145 ℃, and the corresponding time is 50-60min.
(2), substrate one side etch phase first
When substrate is after above-mentioned inking and exposure stage, start to carry out the etching first of one side, that is:
First, adhesive film on the A of substrate face is pasted.
Then, utilize etching solution to carry out etching to exposed B face, etch depth does not penetrate substrate.That is to say, if now remove the adhesive film on A face, from A face, see substrate, its be still one intact, without the substrate of leak.
Because adhesive film is the carrier of fixing base, thus other there is stickiness and can all can be used as adhesive film of the present invention by not etched corrosion material, its preferred PET film.
After the B facet etch of substrate, with detergent for ink, remove the welding resistance ink of B face, the first tool model of the product on substrate now, but still all neat being fixed wtih on substrate are not scattered, and next wait for the second etch to A face.
(3), the second etch stage of substrate another side
After etching completes first, continue aforesaid substrate to carry out second etch, this time etching is that original A face, B face are processed on the contrary, and concrete operations are as follows:
First, at the B of aforesaid substrate face, paste adhesive film.
Then, the A face of substrate is carried out to etching, this time etch depth penetrates substrate, if now remove the adhesive film on B face, the product etching will all be scattered.
Etching is complete, adopts detergent for ink to remove the welding resistance ink of A face.
Now, after twice etching, still neat arrangement of the product that etching obtains, stick on adhesive film the processing that very convenient product is follow-up.
It should be noted that, etching solution and image-developing liquor are existing in this area; In addition, those skilled in the art it should be known that above-described embodiment does not limit the present invention in any form, and all employings are equal to replaces or technical scheme that the mode of equivalent transformation obtains, all drops in protection scope of the present invention.

Claims (9)

1. stage total eclipse carving technology, is characterized in that, comprises the following steps:
(1), the A of substrate, B two sides are printed and gone up welding resistance ink uniformly, and be dried;
(2), exposed in the A of aforesaid substrate, B two sides;
(3), at the A of aforesaid substrate face, paste adhesive film, B face is carried out to etching, etch depth does not penetrate substrate;
(4), remove the welding resistance ink of B face;
(5), the B face of aforesaid substrate is pasted to adhesive film, A face is carried out to etching, etch depth penetrates substrate;
(6), remove the welding resistance ink of A face.
2. stage total eclipse carving technology according to claim 1, is characterized in that, above-mentioned adhesive film is corrosion-resistant adhesive film.
3. stage total eclipse carving technology according to claim 2, is characterized in that, above-mentioned corrosion-resistant adhesive film is PET film.
4. stage total eclipse carving technology according to claim 1, is characterized in that, in step (1), uses 85-95 order half tone to print substrate.
5. stage total eclipse carving technology according to claim 1, is characterized in that, in step (1), the substrate after printing is heat-wind circulate drying at 80 ℃.
6. stage total eclipse carving technology according to claim 1, is characterized in that, in step (2), substrate exposes in exposure machine.
7. stage total eclipse carving technology according to claim 6, is characterized in that, above-mentioned exposure machine is cooled exposure machine, and lighthouse surface temperature is 28 ℃, and exposure energy is 400-600mj/cm 2.
8. stage total eclipse carving technology according to claim 6, is characterized in that, in step (2), also comprises following sub-step:
1., use image-developing liquor to carry out video picture to the substrate after exposing;
2., the substrate after video picture carried out to hot air circulation solidify, temperature is 145 ℃, the time is 50-60min.
9. according to the stage total eclipse carving technology described in claim 1 to 8 any one, it is characterized in that, what the welding resistance ink on removal substrate adopted is detergent for ink.
CN201310042224.4A 2013-02-04 2013-02-04 Stage total eclipse carving technology Active CN103966603B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310042224.4A CN103966603B (en) 2013-02-04 2013-02-04 Stage total eclipse carving technology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310042224.4A CN103966603B (en) 2013-02-04 2013-02-04 Stage total eclipse carving technology

Publications (2)

Publication Number Publication Date
CN103966603A true CN103966603A (en) 2014-08-06
CN103966603B CN103966603B (en) 2016-06-15

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Application Number Title Priority Date Filing Date
CN201310042224.4A Active CN103966603B (en) 2013-02-04 2013-02-04 Stage total eclipse carving technology

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CN (1) CN103966603B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060138083A1 (en) * 2004-10-26 2006-06-29 Declan Ryan Patterning and alteration of molecules
CN201928519U (en) * 2010-08-24 2011-08-10 王定锋 Double-sided circuit board manufactured by adhering juxtaposed flat leads with thermosetting adhesive film
CN102275867A (en) * 2011-07-12 2011-12-14 上海先进半导体制造股份有限公司 Semiconductor device with partially sealed shell and manufacturing method of semiconductor device
CN102323869A (en) * 2011-10-27 2012-01-18 东莞市润华光电有限公司 Method for manufacturing electrodes on two surfaces of capacitance touch screen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060138083A1 (en) * 2004-10-26 2006-06-29 Declan Ryan Patterning and alteration of molecules
CN201928519U (en) * 2010-08-24 2011-08-10 王定锋 Double-sided circuit board manufactured by adhering juxtaposed flat leads with thermosetting adhesive film
CN102275867A (en) * 2011-07-12 2011-12-14 上海先进半导体制造股份有限公司 Semiconductor device with partially sealed shell and manufacturing method of semiconductor device
CN102323869A (en) * 2011-10-27 2012-01-18 东莞市润华光电有限公司 Method for manufacturing electrodes on two surfaces of capacitance touch screen

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