CN103068179B - The anti-welding process for making of a kind of Teflon printed circuit board - Google Patents
The anti-welding process for making of a kind of Teflon printed circuit board Download PDFInfo
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- CN103068179B CN103068179B CN201210557899.8A CN201210557899A CN103068179B CN 103068179 B CN103068179 B CN 103068179B CN 201210557899 A CN201210557899 A CN 201210557899A CN 103068179 B CN103068179 B CN 103068179B
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Abstract
The invention discloses the anti-welding process for making of a kind of Teflon printed circuit board, the method by first Teflon circuit board to be carried out successively pre-treatment pickling, the first green oil printing, first time pre-baked, improve film aligning, first time exposure, first time development, precuring process, pre-treatment nog plate, printings of second time green oil, film aligning, second time pre-baked, expose for the second time, the processing step such as second development and solidification process, finally obtain the Teflon printed circuit board that the inventive method is made.The present invention, on the basis of anti-welding manufacture craft equipment not increasing prior art, is changed by technological process and Teflon printed circuit board quality and reliability is improved.
Description
Technical field
The present invention relates to pcb board and manufacture field, particularly relate to the anti-welding process for making of a kind of Teflon printed circuit board.
Background technology
The anti-welding Making programme of current conventional PCB printed circuit board is:------pre-baked---film aligning---exposes---development---Post RDBMS to pre-treatment mill printed circuit board in green oil printing, wherein the design of film aligning is: according to customer requirement, the part of paster and plug-in unit or need window especially (as heat radiation is clapped) will be needed, design becomes light-blocking part and divides, due to light tight during exposure, position of being in the light can not get photopolymerization reaction, thus be obtained by reacting corresponding naked copper district to developer solution, PCB making is commonly called as again green oil and windows, this is the anti-welding manufacture craft of a kind of maturation of conventional PCB printed circuit board.
But the printed circuit sheet material characteristic of Teflon printed circuit board and conventional PCB printed circuit board is completely different, Teflon printed circuit board substrate surface does not have polarity, not hydrophilic, anti-weldingly equally can not carry out pre-treatment nog plate with conventional PCB, therefore the flow process generally making Teflon printed circuit board is: pre-treatment pickling (not nog plate), and------pre-baked---film aligning---exposes---development---Post RDBMS in green oil printing, make by this technological process and anti-weldingly there is more quality problem such as: copper face large area and be oxidized, green oil foaming etc.General PCB manufacturer is when Teflon printed circuit board takes on a certain scale, for solving above-mentioned quality problem, generally all can buy or pre-treatment is modified to super alligatoring production line, though the problem of copper face oxidation can be avoided thus, but still there are some insoluble problems: the foreign matter on copper face can not to be removed due to mechanical polish-brush as super alligatoring pre-treating technology, thus copper face foreign matter causes can not solving completely of green oil bubble problem, and super alligatoring apparatus for production line cost of investment is high, super alligatoring liquid medicine cost is high.
Therefore, have yet to be improved and developed in prior art.
Summary of the invention
The technical problem that the anti-welding process for making of a kind of Teflon of the present invention printed circuit board will solve is, many quality problem can be brought at the anti-welding process for making that use is conventional for Teflon material pcb board wherein, as problems such as the oxidation of copper face large area and green oil foamings, propose a kind of modification method, a kind of new anti-welding process for making of Teflon printed circuit board is provided.
The technical scheme that technical solution problem of the present invention adopts is as follows:
The anti-welding process for making of a kind of Teflon printed circuit board, is characterized in that, comprise following methods step:
A, first Teflon circuit board is carried out pre-treatment pickling, the glue stain that may exist except deoxidation and front operation or pollutant;
B, the first green oil printing is carried out to the Teflon printed circuit board that pre-treatment pickling completes, the anti-solder paste of colored green above base material on Teflon circuit board, all copper faces of described Teflon circuit board are windowed process, described copper face and edge thereof is made to be in exposed state, and use silk cutter to print, put it into after completing in stove that to carry out first time pre-baked;
C, carry out improvement film aligning to Teflon circuit board roasted in advance, described improvement film aligning is that the part except exposing in above-mentioned steps B carries out film aligning;
D, step C improved to the Teflon circuit board that completes of film aligning carries out first time exposure, first time develops and precuring process;
The copper face exposed in step C in E, the Teflon circuit board that completes precuring carries out pre-treatment nog plate, and carries out second time green oil to the plate face of Teflon circuit board and print and film aligning;
F, the Teflon circuit board completed pre-baked in step e carried out successively to second time is pre-baked, second time exposure, second development and solidification process.
The anti-welding process for making of described Teflon printed circuit board, is characterized in that,
Require when all copper faces of the circuit board of Teflon described in step C window process: size of windowing large 1.5-2mil more monolateral than copper face.
The anti-welding process for making of a kind of Teflon printed circuit board provided by the present invention, by all increasing windowing of 1.5-2mil when carrying out first time green oil printing to it to all copper faces, this partial design is except ensure that green oil contraposition is not gone up except copper face, give in green oil solidification process simultaneously, because the hydroscopicity of Teflon printed circuit sheet material itself is higher, the water vapour that moisture content in base material slowly evaporates formation provides a volatilization passage, thus avoid the problem of green oil foaming, better Teflon printed circuit board can be obtained anti-welding.
Accompanying drawing explanation
Fig. 1 is the anti-welding process for making flow chart of a kind of Teflon printed circuit board of the present invention.
Fig. 2 is the structural representation of Teflon printed circuit board before anti-welding making.
Fig. 3 is the Teflon printed circuit board structural representation after improving film aligning process in the anti-welding process for making of a kind of Teflon of the present invention printed circuit board.
Embodiment
For making object of the present invention, technical scheme and advantage clearly, clearly, developing simultaneously referring to accompanying drawing, the present invention is described in more detail for embodiment.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Fig. 1 is the anti-welding process for making flow chart of a kind of Teflon printed circuit board of the present invention, and as shown in Figure 1, method provided by the invention comprises the following steps:
S1, first Teflon circuit board is carried out pre-treatment pickling, the glue stain that may exist except deoxidation and front operation or pollutant.
Fluorine dragon material after the etching, substrate surface has certain activity, there is certain roughness on surface, therefore printed circuit board can not be ground before making is anti-welding, otherwise mill printed circuit board can cause, and Teflon printed circuit board face is smooth makes its adhesion losing green oil and base material, cause green oil to fall wet goods problem, the words copper face oxidation of not grinding printed circuit board affects outward appearance equally.Preferred employing carries out pickling to it in the process, remove its surface oxidized part and may exist glue stain or not clear pollutant.
S2, first time green oil printing is carried out to the Teflon printed circuit board that pre-treatment pickling completes, the anti-solder paste of colored green above base material on Teflon circuit board, all copper faces of described Teflon circuit board are windowed process, described copper face and edge thereof is made to be in exposed state, and use silk cutter to print, put it in stove pre-baked after completing.
In this step, require that green anti-solder paste only spreads upon above the base material of Teflon printed circuit board, that is to say and all base materials are filled green anti-solder paste (except customer requirement exposed locations), all copper faces are windowed, size of windowing large 1.5-2mil more monolateral than copper face, concrete execution mode, according to PCB producer self to capability, as long as can ensure that anti-welding glossy dark green oil in substrate location and copper face maintain gap, be convenient in follow-up green oil solidification process, because the hydroscopicity of Teflon printed circuit sheet material itself is higher, the water vapour that moisture content in base material slowly evaporates formation provides the passage that volatilizees, thus avoid the problem of green oil foaming.
S3, carry out improvement film aligning to Teflon circuit board roasted in advance, described improvement film aligning is that the part except exposing in above-mentioned steps S2 carries out film aligning.
To carrying out in improvement film aligning, this film aligning only carries out film aligning to the part being coated with anti-solder paste in Teflon printed circuit board, and being exposed to outer copper face will process it in step below.
Be illustrated in figure 2 the structural representation of Teflon printed circuit board before anti-welding making.In above-mentioned steps S2, coat anti-solder paste to above the copper face 1 on Teflon printed circuit board in its Fig. 2 and the base material outside edge thereof, and after carrying out first time green oil printing and after the improvement film aligning of this step, form the structure of the Teflon printed circuit board after improving film aligning process as shown in Figure 3.In Fig. 3, copper face 1 and distance copper face edge size are that the substrate regions 2 of 1.5-2mil will process in step below.
S4, step S3 improved to the Teflon circuit board that completes of film aligning carries out first time exposure, first time develops and precuring process.
The exposure of conventional use in prior art, development and precuring treatment technology is used to process the Teflon circuit board that improvement film aligning completes.
To complete in step of the present invention the flow process of first time anti-welding manufacture craft after above-mentioned steps terminates, then to step S4 obtain Teflon circuit board again carry out following process.
The copper face exposed in step C in S5, the Teflon circuit board that completes precuring carries out pre-treatment nog plate, and carries out second time green oil to the plate face of Teflon circuit board and print and film aligning.
Pre-treatment polishing is carried out to the copper face come out on Teflon circuit board do not processed in above-mentioned steps and edge thereof, removes the oxidized surface copper or other pollutants that may exist above it, ensure the fresh and not oxidized of copper surface.After pre-treatment nog plate terminates, use green oil printing conventional in existing anti-Welding and film aligning to the process of Teflon circuit board.
S6, the Teflon circuit board completed pre-baked in step S5 carried out successively to second time is pre-baked, second time exposure, second development and solidification process.
By the Teflon circuit board in above-mentioned steps is carried out again respectively pre-baked, exposure, development and solidification process, finally obtain the Teflon circuit board that the method that the invention provides obtains.
The anti-welding process for making of a kind of Teflon printed circuit board provided by the invention, it is by first carrying out pre-treatment pickling by Teflon circuit board, the glue stain that may exist except deoxidation and front operation or not clear pollutant; First green oil printing is carried out to the Teflon printed circuit board that pre-treatment pickling completes, the anti-solder paste of colored green above base material on Teflon circuit board, all copper faces of described Teflon circuit board are windowed process, described copper face and edge thereof is made to be in exposed state, and use silk cutter to print, put it into after completing in stove that to carry out first time pre-baked; Carry out improvement film aligning to Teflon circuit board roasted in advance, described improvement film aligning is that the part except exposing in above-mentioned steps carries out film aligning; The Teflon circuit board that improvement film aligning completes carries out first time exposure, first time development and precuring process; The copper face exposed in above-mentioned steps in the Teflon circuit board complete precuring carries out pre-treatment nog plate, and carries out the printing of second time green oil and film aligning to the plate face of Teflon circuit board; Teflon circuit board is carried out that second time is pre-baked successively, second time exposure, second development and solidification process.Finally obtain the Teflon printed circuit board that the inventive method is made.The present invention, on the basis of anti-welding manufacture craft equipment not increasing prior art, changes and changes while design tool makes Teflon printed circuit board quality and reliability get a promotion can form large batch of production scale again by technological process.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (2)
1. the anti-welding process for making of Teflon printed circuit board, is characterized in that, comprises following methods step:
A, first Teflon circuit board is carried out pre-treatment pickling, the glue stain that may exist except deoxidation and front operation or pollutant;
B, the first green oil printing is carried out to the Teflon printed circuit board that pre-treatment pickling completes, the anti-solder paste of colored green above base material on Teflon circuit board, all copper faces of described Teflon circuit board are windowed process, described copper face and edge thereof is made to be in exposed state, and use silk cutter to print, put it into after completing in stove that to carry out first time pre-baked; The anti-solder paste of described green and copper face maintain gap;
C, carry out improvement film aligning to Teflon circuit board roasted in advance, described improvement film aligning is that the part except exposing in above-mentioned steps B carries out film aligning;
D, step C improved to the Teflon circuit board that completes of film aligning carries out first time exposure, first time develops and precuring process;
The copper face exposed in step C in E, the Teflon circuit board that completes precuring carries out pre-treatment nog plate, and carries out second time green oil to the plate face of Teflon circuit board and print and film aligning;
F, the Teflon circuit board completed pre-baked in step e carried out successively to second time is pre-baked, second time exposure, second development and solidification process.
2. the anti-welding process for making of Teflon printed circuit board according to claim 1, is characterized in that,
Require when all copper faces of the circuit board of Teflon described in step C window process: size of windowing large 1.5-2mil more monolateral than copper face.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210557899.8A CN103068179B (en) | 2012-12-20 | 2012-12-20 | The anti-welding process for making of a kind of Teflon printed circuit board |
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| CN201210557899.8A CN103068179B (en) | 2012-12-20 | 2012-12-20 | The anti-welding process for making of a kind of Teflon printed circuit board |
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| CN103068179B true CN103068179B (en) | 2015-10-07 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103648234B (en) * | 2013-12-09 | 2016-09-07 | 深圳市深联电路有限公司 | A kind of thin plate V groove manufacture craft |
| CN104582280A (en) * | 2014-12-19 | 2015-04-29 | 胜华电子（惠阳）有限公司 | PTFE-based PCB manufacturing technique |
| CN110317361A (en) * | 2018-03-29 | 2019-10-11 | 广东兴达鸿业电子有限公司 | Ptfe surface treatment fluid and anti-welding pre-treating method |
| CN109195330A (en) * | 2018-09-03 | 2019-01-11 | 江门荣信电路板有限公司 | A kind of pcb board without copper optical point manufacturing method and its without bronzing point structure |
| CN109219268A (en) * | 2018-11-16 | 2019-01-15 | 深圳市五株科技股份有限公司 | A kind of secondary welding resistance method and thick copper sheet structure of thickness copper sheet |
| CN112020237B (en) * | 2020-08-31 | 2023-10-20 | 深圳全成信电子有限公司 | High-power thick copper circuit board anti-welding manufacturing process method |
| CN113968087B (en) * | 2021-10-25 | 2023-09-01 | 昆山万源通电子科技股份有限公司 | Two-ounce PCB (printed Circuit Board) non-color difference printing process |
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| CN102610911A (en) * | 2012-04-12 | 2012-07-25 | 上海祯显电子科技有限公司 | Film substrate |
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| JPH1154892A (en) * | 1997-07-31 | 1999-02-26 | Yupiteru Ind Co Ltd | Method and structure for attaching electronic component to glass fluororesin substrate |
| JP4876272B2 (en) * | 2008-04-02 | 2012-02-15 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Printed circuit board and manufacturing method thereof |
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