CN102747366A - Method for etching metal tag - Google Patents
Method for etching metal tag Download PDFInfo
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- CN102747366A CN102747366A CN2012102118333A CN201210211833A CN102747366A CN 102747366 A CN102747366 A CN 102747366A CN 2012102118333 A CN2012102118333 A CN 2012102118333A CN 201210211833 A CN201210211833 A CN 201210211833A CN 102747366 A CN102747366 A CN 102747366A
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Abstract
The invention provides a method for etching a metal tag. The method comprises the following steps of carrying out surface treatment on a base plate, coating a photosensitive material on an obverse side and a reverse side of the base plate subjected to surface treatment, carrying out exposure of the coated obverse side and the reverse side of the base plate, carrying out developing of the exposed base plate, pasting a repasted film on the developed reverse side of the base plate, etching the obverse side of the base plate of which the reverse side is pasted with the repasted film, pasting a repasted film on the etched obverse side of the base plate, removing the repasted film on the reverse side of the base plate, etching the reverse side without the repasted film, and removing the repasted film on the obverse side of the base plate. The method for etching a metal tag can reduce environmental pollution and solve the problem of product breakpoint residual.
Description
Technical field
The present invention relates to a kind of making method of metal tag, relate in particular to a kind of engraving method of metal tag.
Background technology
At present, some trade marks are selected electroforming process mostly for use or are made metal tag through stainless steel bridging technology etching products in order to reach certain designed effect (like mirror effect or ultra-thin etc.) in the market.But, adopting electroforming process to make in the process of metal tag, can discharge chromium component in environment, bigger to the pollution of environment.And when adopting stainless steel bridging technology etching products, product is understood residual breakpoint, influences the exterior quality of product.
In view of this, how designing a kind of engraving method of metal tag, to reduce the pollution of environment and to prevent that the residual of breakpoint arranged on the product, is the problem that the insider needs solution badly.
Summary of the invention
In prior art, adopting electroforming process to make metal tag can pollute environment, and has residual this defective of breakpoint through stainless steel bridge joint metal etch product, the invention provides a kind of engraving method of metal tag.
According to the present invention, a kind of engraving method of metal tag is provided, wherein, may further comprise the steps:
Substrate is provided and said substrate is carried out surface treatment;
The coating sensitive materials is in the front and the back side of surface treated said substrate;
Exposure is through the front and the back side of the said substrate of coating;
Develop through the said substrate of exposure;
Pasting changes the back side of obedient film in the said substrate of warp development;
Etched back is covered with the front of the said substrate of the obedient film of said commentaries on classics;
Paste the obedient film of said commentaries on classics in front through etched said substrate;
Demoulding is carried out at the back side to the said substrate that is covered with the obedient film of said commentaries on classics;
Etching is through the back side of the said substrate of demoulding; And
Demoulding is carried out in front to the said substrate that is covered with the obedient film of said commentaries on classics.
Preferably, in 170～220 ℃ of TRs, be coated with said sensitive materials on said substrate, and the speed of coating is 1.2～1.5M/min.
Preferably, the table top temperature of exposure when the said substrate of coating is 18～25 ℃.
Preferably, adopt sodium hydroxide solution or the positive plate developing liquid DP-4 said substrate that develops, carry out heat drying to accomplishing the said substrate that develops, drying temperature is 200～220 ℃.
Preferably, the DP-4 among the said positive plate developing liquid DP-4 and the volume ratio of water are 1: 10～1: 8.
Preferably, the acid fastness of the obedient film of said commentaries on classics is 8～12%, and the fastness to alkali of the obedient film of said commentaries on classics is 8～12%, and the viscosity of the obedient film of said commentaries on classics is 3～7.
Preferably, 1/4～3/4 of the front of the said substrate of etching to said substrate thickness.
Preferably, etched back be covered with the obedient film of said commentaries on classics said substrate the front to said substrate thickness 1/2.
Preferably, etching connects through the back side to the front with said substrate of the said substrate of demoulding.
Preferably, carry out etching through ferric chloride Solution(38, calculate by percentage to the quality, the concentration of said ferric chloride Solution(38 is 32～40%.
Advantage of the present invention is: the front and the back side through at substrate paste the obedient film of commentaries on classics; Come respectively the front and back of substrate is carried out etching; Can increase etch depth, and the label that obtains through the etching of this kind mode do not have breakpoint, can also reduce pollution in addition environment to substrate.
Embodiment
Carry out clear, intactly description in the face of the technical scheme in the embodiment of the invention down, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Embodiment 1
At first, a stainless steel substrate is provided, substrate thickness is 0.1mm, utilizes alkaline medicine that substrate is carried out surface treatment, removing the oiliness composition and the foreign matter of substrate two surface attachment, washing, pickling, again after the washing, dries.Then, to the front and the back side coating sensitive materials of the above-mentioned substrate of handling well, the speed of coating is 1.2M/min under 170 ℃ temperature.Next, aforesaid substrate is made public, the sensitive materials that is coated with on the substrate in order to prevent to make public can shrink, and therefore the table top temperature with the substrate place is controlled at 18 ℃.Then, the employing volume ratio is that 1: 10 positive plate developing liquid DP-4 develops to aforesaid substrate, and completion is carried out heat drying to substrate with 200 ℃ temperature after developing.Then, the back side of substrate pasted changes obedient film to protect, and the acid fastness of changeing obedient film is 8%, and fastness to alkali is 8%, and viscosity is 3.Then, utilizing mass percent concentration is that 32% ferric chloride Solution(38 carries out etching to the front of the substrate after developing, and is 1/4 of substrate thickness from the substrate front side etched depth.Again then, paste above-mentioned commentaries on classics card film so that substrate front side is protected in the intact substrate front side of etching.Next, demoulding is carried out at the back side of substrate.It is that 32% iron(ic)chloride carries out etching that continuation is used mass percent concentration to the back side of substrate, is etched to and connects through etched substrate front side.At last demoulding is carried out in the front of substrate.
Embodiment 2
At first, an aluminium sheet is provided, aluminium plate thickness is 0.5mm, utilizes alkaline medicine that aluminium sheet is carried out surface treatment, removing the oiliness composition and the foreign matter of aluminium sheet two surface attachment, washing, pickling, again after the washing, dries.Then, to the front and the back side coating sensitive materials of the above-mentioned aluminium sheet of handling well, the speed of coating is 1.5M/min under 220 ℃ temperature.Next, above-mentioned aluminium sheet is made public, the sensitive materials that is coated with on the aluminium sheet in order to prevent to make public can shrink, and therefore the table top temperature with the aluminium sheet place is controlled at 25 ℃.Then, the employing volume ratio is that 1: 8 positive plate developing liquid DP-4 develops to above-mentioned aluminium sheet, and completion is carried out heat drying to aluminium sheet with 220 ℃ temperature after developing.Then, the back side of aluminium sheet pasted changes obedient film to protect, and the acid fastness of changeing obedient film is 10%, and fastness to alkali is 10%, and viscosity is 5.Then, utilizing mass percent concentration is that 36% ferric chloride Solution(38 carries out etching to the front of the aluminium sheet after developing, and is 3/4 of aluminium plate thickness from the degree of depth of aluminium sheet front-side etch.Again then, paste above-mentioned commentaries on classics card film in the intact aluminium sheet front of etching with the aluminium sheet front protecting.Next, demoulding is carried out at the back side of aluminium sheet.It is that 36% iron(ic)chloride carries out etching that continuation is used mass percent concentration to the back side of aluminium sheet, is etched to and connects through etched aluminium sheet is positive.At last demoulding is carried out in the front of aluminium sheet.
Embodiment 3
At first, a stainless steel substrate is provided, substrate thickness is 0.7mm, utilizes alkaline medicine that substrate is carried out surface treatment, removing the oiliness composition and the foreign matter of substrate two surface attachment, washing, pickling, again after the washing, dries.Then, to the front and the back side coating sensitive materials of the above-mentioned substrate of handling well, the speed of coating is 1.4M/min under 200 ℃ temperature.Next, aforesaid substrate is made public, the sensitive materials that is coated with on the substrate in order to prevent to make public can shrink, and therefore the table top temperature with the substrate place is controlled at 22 ℃.Then, the employing volume ratio is that 1: 9 positive plate developing liquid DP-4 develops to aforesaid substrate, and completion is carried out heat drying to substrate with 210 ℃ temperature after developing.Then, the back side of substrate pasted changes obedient film to protect, and the acid fastness of changeing obedient film is 12%, and fastness to alkali is 12%, and viscosity is 7.Then, utilizing mass percent concentration is that 40% ferric chloride Solution(38 carries out etching to the front of the substrate after developing, and is 1/2 of substrate thickness from the substrate front side etched depth.Again then, paste above-mentioned commentaries on classics card film so that substrate front side is protected in the intact substrate front side of etching.Next, demoulding is carried out at the back side of substrate.It is that 40% iron(ic)chloride carries out etching that continuation is used mass percent concentration to the back side of substrate, is etched to and connects through etched substrate front side.At last demoulding is carried out in the front of substrate.
Advantage of the present invention is: the front and the back side through at substrate paste the obedient film of commentaries on classics; Come respectively the front and back of substrate is carried out etching; Can increase etch depth, and the label that obtains through the etching of this kind mode do not have breakpoint, can also reduce pollution in addition environment to substrate.
More than show and described ultimate principle of the present invention, principal character and advantage of the present invention.The technician of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification sheets just explains principle of the present invention; The present invention also has various changes and modifications under the prerequisite that does not break away from spirit and scope of the invention, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection domain to be defined by appending claims and equivalent thereof.
Claims (10)
1. the engraving method of a metal tag is characterized in that, may further comprise the steps:
Substrate is provided and said substrate is carried out surface treatment;
The coating sensitive materials is in the front and the back side of surface treated said substrate;
Exposure is through the front and the back side of the said substrate of coating;
Develop through the said substrate of exposure;
Pasting changes the back side of obedient film in the said substrate of warp development;
Etched back is covered with the front of the said substrate of the obedient film of said commentaries on classics;
Paste the obedient film of said commentaries on classics in front through etched said substrate;
Demoulding is carried out at the back side to the said substrate that is covered with the obedient film of said commentaries on classics;
Etching is through the back side of the said substrate of demoulding; And
Demoulding is carried out in front to the said substrate that is covered with the obedient film of said commentaries on classics.
2. the engraving method of metal tag as claimed in claim 1 is characterized in that, in 170～220 ℃ of TRs, be coated with said sensitive materials on said substrate, and the speed of coating is 1.2～1.5M/min.
3. the engraving method of metal tag as claimed in claim 1 is characterized in that, the table top temperature of exposure when the said substrate of coating is 18～25 ℃.
4. the engraving method of metal tag as claimed in claim 1 is characterized in that, adopts sodium hydroxide solution or the positive plate developing liquid DP-4 said substrate that develops, and carries out heat drying to accomplishing the said substrate that develops, and drying temperature is 200～220 ℃.
5. the engraving method of metal tag as claimed in claim 4 is characterized in that, the DP-4 among the said positive plate developing liquid DP-4 and the volume ratio of water are 1: 10～1: 8.
6. the engraving method of metal tag as claimed in claim 1 is characterized in that, the acid fastness of the obedient film of said commentaries on classics is 8～12%, and the fastness to alkali of the obedient film of said commentaries on classics is 8～12%, and the viscosity of the obedient film of said commentaries on classics is 3～7.
7. like the engraving method of each described metal tag of claim 1 to 6, it is characterized in that 1/4～3/4 of the front of the said substrate of etching to said substrate thickness.
8. the engraving method of metal tag as claimed in claim 7 is characterized in that, etched back be covered with the obedient film of said commentaries on classics said substrate the front to said substrate thickness 1/2.
9. the engraving method of metal tag as claimed in claim 8 is characterized in that, etching connects through the back side to the front with said substrate of the said substrate of demoulding.
10. the engraving method of metal tag as claimed in claim 9 is characterized in that, carries out etching through ferric chloride Solution(38, calculates by percentage to the quality, and the concentration of said ferric chloride Solution(38 is 32～40%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102118333A CN102747366A (en) | 2012-06-26 | 2012-06-26 | Method for etching metal tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102118333A CN102747366A (en) | 2012-06-26 | 2012-06-26 | Method for etching metal tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102747366A true CN102747366A (en) | 2012-10-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102118333A Pending CN102747366A (en) | 2012-06-26 | 2012-06-26 | Method for etching metal tag |
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| Country | Link |
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| CN (1) | CN102747366A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103218952A (en) * | 2013-03-10 | 2013-07-24 | 薛振安 | Signboard and production method thereof |
| CN104233300A (en) * | 2013-06-21 | 2014-12-24 | 镇江江城金属制品有限公司 | Etching method of stainless steel markplates |
| CN104404516A (en) * | 2014-11-28 | 2015-03-11 | 沈阳飞机工业（集团）有限公司 | Method for improving surface quality of aluminum alloy etched sign |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101271275A (en) * | 2008-04-28 | 2008-09-24 | 彩虹集团电子股份有限公司 | Horn net manufacturing technique by etching method |
| CN102356462A (en) * | 2009-03-17 | 2012-02-15 | 凸版印刷株式会社 | Method for manufacturing substrate for semiconductor element, and semiconductor device |
-
2012
- 2012-06-26 CN CN2012102118333A patent/CN102747366A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101271275A (en) * | 2008-04-28 | 2008-09-24 | 彩虹集团电子股份有限公司 | Horn net manufacturing technique by etching method |
| CN102356462A (en) * | 2009-03-17 | 2012-02-15 | 凸版印刷株式会社 | Method for manufacturing substrate for semiconductor element, and semiconductor device |
Non-Patent Citations (1)
| Title |
|---|
| 盛治中: "《模切工艺与工具制造》", 31 August 2011 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103218952A (en) * | 2013-03-10 | 2013-07-24 | 薛振安 | Signboard and production method thereof |
| CN104233300A (en) * | 2013-06-21 | 2014-12-24 | 镇江江城金属制品有限公司 | Etching method of stainless steel markplates |
| CN104404516A (en) * | 2014-11-28 | 2015-03-11 | 沈阳飞机工业（集团）有限公司 | Method for improving surface quality of aluminum alloy etched sign |
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Effective date of abandoning: 20170503 |
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