CN109548289A - A kind of preparation method of photoelectric circuit board - Google Patents
A kind of preparation method of photoelectric circuit board Download PDFInfo
- Publication number
- CN109548289A CN109548289A CN201811442353.1A CN201811442353A CN109548289A CN 109548289 A CN109548289 A CN 109548289A CN 201811442353 A CN201811442353 A CN 201811442353A CN 109548289 A CN109548289 A CN 109548289A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- imaging
- exposure
- wiring board
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The invention discloses a kind of preparation methods of photoelectric circuit board, it is made including following original copy, exposure, imaging, microetch punching, the advantage of the invention is that, present invention expense needed for making photosensitive circuit plate is relatively low, and if operation is made according to step and permissible accuracy, the circuit board copper lattice cabling made can be clearly neat, has no burr, even very thin cabling is also in perfect order, simultaneously, raw materials for production cost and equipment investment of the photoelectric circuit board under the conditions of same performance are smaller, in the case where smaller investment, high production efficiency is conducive to be produced and processed.
Description
Technical field
The present invention relates to photoelectricity processing technique field, specially a kind of preparation method of photoelectric circuit board.
Background technique
Photosensitive circuit plate is called light print wiring board, is the photosensitive medicine film that circuit board is evenly coated in by light direct irradiation,
Have the place of illumination medicine film can developed dose dissolve, the light-sensitive surface not dissolved is retained on the copper sheet of circuit board, does not allow three
Ferric chloride solution corrosion, finally retaining becomes route.
The preparation method one side producing cost of present photoelectric circuit board is high, and production method is complicated, is unfavorable for one
The production of a little small cost input persons uses.
Summary of the invention
The present invention provides a kind of preparation method of photoelectric circuit board, and the present invention is taken needed for photosensitive circuit plate making
With relatively low, and if operation is made according to step and permissible accuracy, the circuit board copper lattice cabling made can
With it is clear neat, have no burr, even very thin cabling is also in perfect order, meanwhile, photoelectric circuit board is in same performance
Under the conditions of raw materials for production cost and equipment investment it is smaller, in the case where smaller investment, high production efficiency is conducive to carry out
Production and processing, can effectively solve the problems in above-mentioned background technique.
To achieve the above object, the invention provides the following technical scheme: a kind of preparation method of photoelectric circuit board, packet
Include following steps:
1) original copy makes: using one width line map of Software on Drawing on computers first, prints, printing after completing
In this link it should be particularly noted that the paper of printing, printing relationship between quality circuit board to the end success or not, it is former in printing
Mirror printed is selected when original text, to obtain highest resolution；
2) expose: S1: after having purchased photographic plate, first used according to needed for required determination photosensitive circuit plate it is big
It is small, with Jie's knife tripping protection film, wiring board has been cut with saw or Jie's knife, then with frustrating knife polishing wiring board flash, it is close to prevent
It connects bad；
S2: tearing protective film, and by the printing surface of printed line map, carbon dust face or ink face paste are on light-sensitive surface, so
It is forced up afterwards with one block of glass, it should be noted that compress, keep each contact surface cleaning without dirt, prevent from influencing to expose, to obtain highest
Resolution；
S3: selecting lighting apparatus, and lighting apparatus needed for photosensitive circuit plate uses the fluorescent lamp of 1KW power, but is exposing
Light time, it should be noted that exposure uniformly, is exposing constantly, it should be noted that mobile fluorescent lamp, it is ensured that uniformly photosensitive, in exposure, the time exists
15 minutes, sensitive time may be indicated on the specification of photographic plate, in order to guarantee that photosensitive circuit plate can smoothly be made,
Prolonging exposure time is proper；
3) image: S1: allotment imaging agent strictly matches the water of 400cc according to the imaging agent of 1 packet 20g, i.e. the ratio of 1:20 is matched
Imaging agent processed matches container plastic tub, and cannot use metal basin, it is recommended here that with plastic barrel first deployed imaging to scale
Liquid, pourable use at any time, but used imaging liquid cannot refund plastic bottle again；
S2: 2) the photographic plate film surface exposed in is put upward in people's imaging liquid, container was rocked every 10 seconds, until copper foil
High-visible and when rising there is no green mist, imaging is completed；
S3: wiring board being put under tap and is gently rinsed, and removes extra imaging agent；
4) microetch: S1: blocky ferric trichloride and hot water are deployed according to the ratio of 1:3, container can only use plastic tub, can also
With with plastic bucket；
S2: wiring board being put in people's liquor ferri trichloridi, is corroded, and surface of circuit board facing downward and is at liquid level
Place, the speed corroded in this way, when corroding progress, can will keep the dynamic of corrosive liquid, stir hot water frequently, corrode than very fast
10-20 minutes, this therebetween, Yao Jinliang avoids touching wiring board with things such as tweezers, otherwise may scrape disconnected photosensitive layer, preceding
Function is abandoned to the greatest extent；
S3: clear water irrigation lines plate, then electricity consumption blowing drying is dry just, or can be wiped on wiring board with alcohol
Possible remaining green matter, that is light-sensitive surface, will not be had an impact to welding；
5) punch: after the wiring board corroded taking-up is rinsed well, parallel edition icon goes out the position punched, and then uses and bores
Hole equipment is punched, and location hole can be first made before punching, i.e., pitting, purpose is first pounded out at punching with a sharp nail
It is that drill bit is made to be easy positioning, difficult to slide in punching, causes to damage circuit board, drill bit should be kept with circuit board always when punching
Vertically, production can be completed after the completion of drilling.
According to the above technical scheme: the paper that printing is selected described 1) is translucent template, transparent, translucent or 70g
Copy paper, to ensure that original text face will keep cleaning without dirt after printing.
According to the above technical scheme: 2) sunlight exposure also can be used in the middle exposure, and strong sunlight can accelerate exposure effect
Rate, the time needed is shorter, nor photosensitive uneven with worrying.
According to the above technical scheme: 3) in the imaging but in order to insure, it should wait several seconds for clock, again to ensure percentage
Hundred imagings, general imaging need 2 to 3 minutes, it should be noted that in development, not operate under strong light, otherwise will affect imaging.
Compared with the prior art, the advantages of the present invention are as follows present invention expense needed for making photosensitive circuit plate is opposite
It is lower, and if operation is made according to step and permissible accuracy, the circuit board copper lattice cabling made can be clear
Neatly, have no burr, even very thin cabling is also in perfect order, meanwhile, photoelectric circuit board is under the conditions of same performance
Raw materials for production cost and equipment investment it is smaller, in the case where smaller investment, high production efficiency be conducive to carry out production plus
Work.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.
In the accompanying drawings:
Fig. 1 is flow diagram of the invention.
Specific embodiment
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, it should be understood that preferred reality described herein
Apply example only for the purpose of illustrating and explaining the present invention and is not intended to limit the present invention.
Embodiment 1: it as shown in Figure 1, the present invention provides a kind of preparation method of photoelectric circuit board, including walks as follows
It is rapid:
1. a kind of preparation method of photoelectric circuit board, characterized by the following steps:
1) original copy makes: using one width line map of Software on Drawing on computers first, prints, printing after completing
In this link it should be particularly noted that the paper of printing, printing relationship between quality circuit board to the end success or not, it is former in printing
Mirror printed is selected when original text, to obtain highest resolution；
2) expose: S1: after having purchased photographic plate, first used according to needed for required determination photosensitive circuit plate it is big
It is small, with Jie's knife tripping protection film, wiring board has been cut with saw or Jie's knife, then with frustrating knife polishing wiring board flash, it is close to prevent
It connects bad；
S2: tearing protective film, and by the printing surface of printed line map, carbon dust face or ink face paste are on light-sensitive surface, so
It is forced up afterwards with one block of glass, it should be noted that compress, keep each contact surface cleaning without dirt, prevent from influencing to expose, to obtain highest
Resolution；
S3: selecting lighting apparatus, and lighting apparatus needed for photosensitive circuit plate uses the fluorescent lamp of 1KW power, but is exposing
Light time, it should be noted that exposure uniformly, is exposing constantly, it should be noted that mobile fluorescent lamp, it is ensured that uniformly photosensitive, in exposure, the time exists
15 minutes, sensitive time may be indicated on the specification of photographic plate, in order to guarantee that photosensitive circuit plate can smoothly be made,
Prolonging exposure time is proper；
3) image: S1: allotment imaging agent strictly matches the water of 400cc according to the imaging agent of 1 packet 20g, i.e. the ratio of 1:20 is matched
Imaging agent processed matches container plastic tub, and cannot use metal basin, it is recommended here that with plastic barrel first deployed imaging to scale
Liquid, pourable use at any time, but used imaging liquid cannot refund plastic bottle again；
S2: 2) the photographic plate film surface exposed in is put upward in people's imaging liquid, container was rocked every 10 seconds, until copper foil
High-visible and when rising there is no green mist, imaging is completed；
S3: wiring board being put under tap and is gently rinsed, and removes extra imaging agent；
4) microetch: S1: blocky ferric trichloride and hot water are deployed according to the ratio of 1:3, container can only use plastic tub, can also
With with plastic bucket；
S2: wiring board being put in people's liquor ferri trichloridi, is corroded, and surface of circuit board facing downward and is at liquid level
Place, the speed corroded in this way, when corroding progress, can will keep the dynamic of corrosive liquid, stir hot water frequently, corrode than very fast
10-20 minutes, this therebetween, Yao Jinliang avoids touching wiring board with things such as tweezers, otherwise may scrape disconnected photosensitive layer, preceding
Function is abandoned to the greatest extent；
S3: clear water irrigation lines plate, then electricity consumption blowing drying is dry just, or can be wiped on wiring board with alcohol
Possible remaining green matter, that is light-sensitive surface, will not be had an impact to welding；
5) punch: after the wiring board corroded taking-up is rinsed well, parallel edition icon goes out the position punched, and then uses and bores
Hole equipment is punched, and location hole can be first made before punching, i.e., pitting, purpose is first pounded out at punching with a sharp nail
It is that drill bit is made to be easy positioning, difficult to slide in punching, causes to damage circuit board, drill bit should be kept with circuit board always when punching
Vertically, production can be completed after the completion of drilling.
According to the above technical scheme: 1) paper that printing is selected is translucent template, and transparent, translucent or 70g is duplicated
Paper, to ensure that original text face will keep cleaning without dirt after printing.
According to the above technical scheme: 2) sunlight exposure also can be used in exposure in, and strong sunlight can accelerate exposure efficiency, needs
The time wanted is shorter, nor photosensitive uneven with worrying.
According to the above technical scheme: 3) in imaging but in order to insure, it should wait several seconds for clock, again to ensure very to show
Picture, general imaging need 2 to 3 minutes, it should be noted that in development, not operate under strong light, otherwise will affect imaging.
According to the above technical scheme: 5) after punching is completed, circuit board comprehensively being checked, in particular for having
Without circuit break and short circuit, after inspection, it is able to confirm that no flaw, i.e., is polished using dry sanding paper circuit board, in item
In the case that part allows, the measure for preventing copper sheet from aoxidizing is taken.
Experimental example:
Experimental subjects: using photoelectric circuit board obtained by the embodiment of the present invention as experimental group one, two He of experimental group
Experimental group three, the photoelectric circuit board for choosing specialized company's production on the market is contrast groups one, the photoelectricity of little company's production
Photosensitive circuit plate is contrast groups two and hand-made photoelectric circuit board is contrast groups three.
Experiment purpose: the raw material cost of manufacture and equipment under the conditions of same performance of analysis each group photoelectric circuit board
Input cost.
Experimental method: by photoelectric circuit board made from this experimental group, the photoelectric circuit board of contrast groups, identical
Under conditions of performance, cost used in its raw material and equipment input cost are tested, and record experimental result.
Experimental result table:
By the above experimental result table it is found that the raw materials for production of photoelectric circuit board of the invention under the conditions of same performance
Cost and equipment investment are smaller, while in the case where smaller investment, high production efficiency.
It is an advantage of the current invention that present invention expense needed for making photosensitive circuit plate is relatively low, and if operation
Made according to step and permissible accuracy, the circuit board copper lattice cabling made can it is clearly neat, have no burr, i.e.,
Make to be that very thin cabling is also in perfect order, meanwhile, raw materials for production cost of photoelectric circuit board under the conditions of same performance and
Equipment investment is smaller, and in the case where smaller investment, high production efficiency is conducive to be produced and processed.
Finally, it should be noted that being not intended to restrict the invention the foregoing is merely preferred embodiment of the invention, to the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, for those skilled in the art, still can be with
It modifies the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.It is all
Within the spirit and principles in the present invention, any modification, equivalent replacement, improvement and so on should be included in guarantor of the invention
Within the scope of shield.
Claims (5)
1. a kind of preparation method of photoelectric circuit board, characterized by the following steps:
1) original copy makes: using one width line map of Software on Drawing on computers first, prints after completing, is printing this
In link it should be particularly noted that the paper of printing, printing relationship between quality circuit board to the end success or not, in type-script
Mirror printed is selected, to obtain highest resolution；
2) expose: S1: after having purchased photographic plate, the size of the photosensitive circuit plate first used according to needed for required determination is used
Jie's knife tripping protection film has cut wiring board with saw or Jie's knife, then with knife polishing wiring board flash is frustrated, to prevent contiguity not
It is good；
S2: tearing protective film, and by the printing surface of printed line map, then carbon dust face or ink face paste are used on light-sensitive surface
One block of glass forces up, it should be noted that compresses, keeps each contact surface cleaning without dirt, prevent from influencing to expose, to obtain highest parsing
Degree；
S3: selecting lighting apparatus, and lighting apparatus needed for photosensitive circuit plate uses the fluorescent lamp of 1KW power, but in exposure,
It is noted that exposure is uniformly, exposing constantly, it should be noted that mobile fluorescent lamp, it is ensured that uniformly photosensitive, in exposure, the time is at 15 points
Clock may indicate sensitive time on the specification of photographic plate, in order to guarantee that photosensitive circuit plate can smoothly be made, extend and expose
It is proper between light time；
3) image: S1: allotment imaging agent strictly matches the water of 400cc according to the imaging agent of 1 packet 20g, i.e. the ratio of 1:20 is prepared aobvious
As agent, match container plastic tub, and metal basin cannot be used, it is recommended here that with the plastic barrel deployed imaging liquid of elder generation to scale,
Pourable use at any time, but used imaging liquid cannot refund plastic bottle again；
S2: 2) the photographic plate film surface exposed in is put upward in people's imaging liquid, container was rocked every 10 seconds, until copper foil is clear
It can be seen that and when rising there is no green mist, imaging is completed；
S3: wiring board being put under tap and is gently rinsed, and removes extra imaging agent；
4) microetch: S1: blocky ferric trichloride and hot water are deployed according to the ratio of 1:3, container can only use plastic tub, can also use
Plastic bucket；
S2: wiring board being put in people's liquor ferri trichloridi, is corroded, and surface of circuit board facing downward and is at liquid level, this
The speed of sample corrosion, when corroding progress, can will keep the dynamic of corrosive liquid than very fast, stir hot water frequently, and corrosion 10-20 divides
Clock, this therebetween, Yao Jinliang avoids touching wiring board with things such as tweezers, otherwise may scrape disconnected photosensitive layer, all that has been achieved is spoiled；
S3: clear water irrigation lines plate, then electricity consumption blowing drying is dry just, or can be wiped with alcohol may on wiring board
Remaining green matter, that is light-sensitive surface, will not be had an impact to welding；
5) punch: after the wiring board corroded taking-up is rinsed well, parallel edition icon goes out the position punched, and is then set with drilling
It is standby to be punched, location hole can be first made before punching, i.e., pitting is first pounded out at punching with a sharp nail, it is therefore an objective to make
Drill bit is easy positioning, difficult to slide in punching, causes to damage circuit board, drill bit should keep hanging down with circuit board always when punching
Directly, production can be completed after the completion of drilling.
2. a kind of preparation method of photoelectric circuit board, it is characterised in that: the paper that printing is selected described 1) is translucent sulphur
Sour paper, transparent, translucent or 70g copy paper, to ensure that original text face will keep cleaning without dirt after printing.
3. a kind of preparation method of photoelectric circuit board, it is characterised in that: 2) sunlight exposure also can be used in the middle exposure,
Strong sunlight can accelerate exposure efficiency, and the time needed is shorter, nor photosensitive uneven with worrying.
4. a kind of preparation method of photoelectric circuit board, it is characterised in that: 3) in the imaging but in order to insure, it should again
Clock is waited several seconds for, to ensure very to image, general imaging needs 2 to 3 minutes, it should be noted that, should not be under strong light in development
Operation, otherwise will affect imaging.
5. a kind of preparation method of photoelectric circuit board, it is characterised in that: it is described 5) punching complete after, to circuit board into
Row is comprehensive to be checked, in particular for whether there is or not circuit break and short circuits, after inspection, is able to confirm that no flaw, i.e., using mill
Sand paper polishes to circuit board, when conditions permit, takes the measure for preventing copper sheet from aoxidizing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811442353.1A CN109548289A (en) | 2018-11-29 | 2018-11-29 | A kind of preparation method of photoelectric circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811442353.1A CN109548289A (en) | 2018-11-29 | 2018-11-29 | A kind of preparation method of photoelectric circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109548289A true CN109548289A (en) | 2019-03-29 |
Family
ID=65852318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811442353.1A Pending CN109548289A (en) | 2018-11-29 | 2018-11-29 | A kind of preparation method of photoelectric circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN109548289A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573477A (en) * | 2021-06-21 | 2021-10-29 | 广州添利电子科技有限公司 | PCB (printed Circuit Board) manufacturing indication method, production coefficient generation method, pre-expansion system, medium and equipment |
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|---|---|---|---|---|
| CN1296374A (en) * | 1999-11-11 | 2001-05-23 | 周静 | Circuit board making kit and making method |
| CN104244599A (en) * | 2013-06-24 | 2014-12-24 | 吴晓琴 | Manufacturing method for printed circuit board |
-
2018
- 2018-11-29 CN CN201811442353.1A patent/CN109548289A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1296374A (en) * | 1999-11-11 | 2001-05-23 | 周静 | Circuit board making kit and making method |
| CN104244599A (en) * | 2013-06-24 | 2014-12-24 | 吴晓琴 | Manufacturing method for printed circuit board |
Non-Patent Citations (4)
| Title |
|---|
| 907LOVE907: "感光电路板，https://baike.baidu.com/history/%E6%84%9F%E5%85%89%E7%94%B5%E8%B7%AF%E6%9D%BF/1859431/103471109", 《百度百科》 * |
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| 共同成长888: "电子制作：感光板—感光电路板的使用，http://www.360doc.com/content/15/0714/01/12109864_484757289.shtml", 《360个人图书馆》 * |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573477A (en) * | 2021-06-21 | 2021-10-29 | 广州添利电子科技有限公司 | PCB (printed Circuit Board) manufacturing indication method, production coefficient generation method, pre-expansion system, medium and equipment |
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Application publication date: 20190329 |
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