CN103687324A - Thin plate solder mask printing method - Google Patents
Thin plate solder mask printing method Download PDFInfo
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- CN103687324A CN103687324A CN201310527937.XA CN201310527937A CN103687324A CN 103687324 A CN103687324 A CN 103687324A CN 201310527937 A CN201310527937 A CN 201310527937A CN 103687324 A CN103687324 A CN 103687324A
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Abstract
The invention discloses a thin plate solder mask printing method. The method comprises the following steps: preprocessing before solder masking; hole filling and base sheet plastering, i.e., using a metal conductive sheet to fill up a though hole of a circuit board, and applying two temperature-sensitive moisture-sensitive base sheets on a printing ink layer, the two temperature-sensitive moisture-sensitive base sheets being 50% overlapped; first surface printing, i.e., using a blocking point net to print a first surface, using a conductive backing plate to back a bottom portion and to be attached to the temperature-sensitive moisture-sensitive base sheets, and intensifying scraper pressure until printing ink in the filled hole flows out of a conducting hole to form printing ink beads; primary prebaking; second surface printing, i.e., using the blocking point net to print a second surface until the printing ink in the filled hole flows out of the conducting hole to form printing ink beads; secondary prebaking, i.e., performing the secondary prebaking on the circuit board; and alignment, exposure and development. According to the invention, through treatment of the temperature and the humidity of a circuit board before solder masking, the working environment reaches requirements before printing, and on the other hand, the module of an air guide backing plate is divided so that unevenness does not occur in a printing process.
Description
Technical field
The present invention relates to wiring board field, particularly a kind of thin plate anti-welding printing method.
Background technology
In process for manufacturing circuit board; after completing the making of outer-layer circuit, must carry out anti-welding conservation treatment to outer field circuit; just can avoid outer-layer circuit oxidized or solder shorts occurs; in addition; outer-layer circuit is carried out to anti-welding processing and can facilitate the welding processing of staff to assembly; save scolding tin, prevention line short, play protection copper cash simultaneously, prevent the effect that weld parts misplaces.It is first circuit board to be carried out to copper face preliminary treatment that past is used more soldering-inhibiting method in the industry, then adopt screen printing mode on circuit board, to print one deck anti-solder ink, then through pre-baked, exposure, develop and after the operation such as roasting complete the anti-welding processing to circuit board.But it is more that this conventional method is applied in thickness of slab is greater than the manufacture craft of circuit board of 0.4mm, technology is comparatively ripe, and the circuit board product of output meets the quality demand in market, but there are problems while adopting this soldering-inhibiting method silk-screen thickness of slab to be less than the thin plate of 0.4mm.(1) pretreated work is done to such an extent that be not very well, because lamella thickness is less, easily cause the quality hidden danger such as short circuit, the a large amount of man power and materials of needs in later stage compensate, affect properties of product, therefore wiring board is carried out to suitable preliminary treatment is very important a part of production link, essential.(2) on air guide pad, different parts people is not set, not only easily glues table top, on the hot air leveling for follow-up wiring board, have problems like this, can cause wiring board to occur the out-of-flatness of diverse location.
Summary of the invention
The problem that unresolved above-mentioned prior art exists, has of the present inventionly proposed a kind of thin plate anti-welding printing method.
A thin plate anti-welding printing method, comprises step:
Anti-welding pretreatment: wiring board is carried out to the processing of anti-welding front temperature and humidity, make its operational environment reach the requirement before printing, anti-welding front pretreated temperature is controlled at 150 degree left and right, first wiring board being placed on to relative humidity is less than under 60% environment and carries out wet process, and then dry under relative humidity is greater than 60% environment and carry out wet process for the second time, after drying for the third time, wet process being carried out in this wiring board subregion, dries in subregion;
Consent also pastes egative film: adopt a metallic conduction sheet to carry out consent to the through hole of wiring board, and the wet Negative plate paster of two temperature-sensitive senses is combined on an ink layer, the wet egative film 50% of described two temperature-sensitive senses is overlapping;
Printing first surface: adopt and keep off some reticulated printing first surface, adopt the conduction rebasing portion of backing plate, and fit with the wet egative film of described temperature-sensitive sense, increase the weight of scraper pressure, until the ink of consent overflows via, form ink pearl;
Pre-baked for the first time: wiring board is carried out pre-baked, the wiring board solvent evaporates after pre-baked, the part ink of the described ink layer protruding does not adhere to plate face;
Print second: adopt second of shelves point reticulated printing, until the ink of consent overflows via, form ink pearl;
Pre-baked for the second time: wiring board to be carried out pre-baked for the second time;
Contraposition, exposure, development: by a laser positioning element, the wiring board after pre-baked is for the second time carried out to contraposition, then the wet egative film of described temperature-sensitive sense is exposed, then remove egative film and described ink layer is developed.
Further, described air guide backing plate comprises hot and humid air guide backing plate module and low temperature and low humidity backing plate module.
Further, the lap laminating of the wet egative film of hot and humid air guide module and described temperature-sensitive sense, the non-overlapped part laminating of the wet egative film of low temperature and low humidity air guide module and described temperature-sensitive sense.
Further, after described printing first surface completes in the confined space that is full of nitrogen of ambient temperature and moisture standing 11-14min, start pre-bakedly for the first time, pre-baked temperature conditions is 71-78 degree, 15-25min; After first surface is pre-baked, wiring board is departed to described confined space and carry out standing 5-8min, start second printing, continuation standing 11-14min in described confined space after printing the second face completes, starts pre-baked for the second time.
The application is with respect to prior art, and it has following advantage and beneficial effect:
The processing of anti-welding front temperature and humidity is carried out in utilization of the present invention to wiring board, make its operational environment reach the requirement before printing, anti-welding front pretreated temperature is controlled at 150 degree left and right, first wiring board being placed on to relative humidity is less than under 60% environment and carries out wet process, and then dry under relative humidity is greater than 60% environment and carry out wet process for the second time, after drying for the third time, wet process being carried out in this wiring board subregion, dries in subregion.On the other hand, the Module Division to air guide backing plate, there will not be out-of-flatness in the printing process making.
Embodiment
Below by embodiment, technical scheme of the present invention is carried out to clear, complete description; obviously; described embodiment is only a part of embodiment of the present invention; rather than whole embodiment; based on embodiments of the invention; those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
In this article, relational language, such as first and second, top and bottom etc., can be used for an entity and another entity or action to distinguish, and not inevitable requirement or adopt described entity or action between this type of relation or the order of any reality.Term " comprises ", " comprising " or other any variants, be intended to contain and exclusively have, comprise that technique, method, article or the device of enumerating element not only comprise described element for one time, but also can comprise that other do not express process that list or described, method, object product or the intrinsic element of device.By " comprising ... " the element guiding, not more multiple constraint in the situation that, and is not precluded within process, method, article or the device that comprises described element and has extra similar elements.
The invention discloses a kind of thin plate anti-welding printing method, comprise step: anti-welding pretreatment: wiring board is carried out to the processing of anti-welding front temperature and humidity, make its operational environment reach the requirement before printing, anti-welding front pretreated temperature is controlled at 150 degree left and right, first wiring board being placed on to relative humidity is less than under 60% environment and carries out wet process, and then dry under relative humidity is greater than 60% environment and carry out wet process for the second time, after drying for the third time, wet process being carried out in this wiring board subregion, dries in subregion; Consent also pastes egative film: adopt a metallic conduction sheet to carry out consent to the through hole of wiring board, and the wet Negative plate paster of two temperature-sensitive senses is combined on an ink layer, the wet egative film 50% of described two temperature-sensitive senses is overlapping;
Printing first surface: adopt and keep off some reticulated printing first surface, adopt the conduction rebasing portion of backing plate, and fit with the wet egative film of described temperature-sensitive sense, increase the weight of scraper pressure, until the ink of consent overflows via, form ink pearl; Pre-baked for the first time: wiring board is carried out pre-baked, the wiring board solvent evaporates after pre-baked, the part ink of the described ink layer protruding does not adhere to plate face; Print second: adopt second of shelves point reticulated printing, until the ink of consent overflows via, form ink pearl; Pre-baked for the second time: wiring board to be carried out pre-baked for the second time;
Contraposition, exposure, development: by a laser positioning element, the wiring board after pre-baked is for the second time carried out to contraposition, then the wet egative film of temperature-sensitive sense is exposed, then remove egative film and described ink layer is developed.
Embodiment 1
In the present embodiment, air guide backing plate comprises hot and humid air guide backing plate module and low temperature and low humidity backing plate module.The lap laminating of the wet egative film of hot and humid air guide module and temperature-sensitive sense, the non-overlapped part laminating of the wet egative film of low temperature and low humidity air guide module and described temperature-sensitive sense.After printing first surface completes in the confined space that is full of nitrogen of ambient temperature and moisture standing 11min, start pre-bakedly for the first time, pre-baked temperature conditions is 72 degree, 16min; After first surface is pre-baked, wiring board is departed to confined space and carry out standing 5min, start second printing, continuation standing 11min in described confined space after printing the second face completes, starts pre-baked for the second time.
Embodiment 2
In the present embodiment, after printing first surface completes in the confined space that is full of nitrogen of ambient temperature and moisture standing 12min, start pre-bakedly for the first time, pre-baked temperature conditions is 73 degree, 17min; After first surface is pre-baked, wiring board is departed to confined space and carry out standing 6min, start second printing, continuation standing 12min in described confined space after printing the second face completes, starts pre-baked for the second time.
The processing of anti-welding front temperature and humidity is carried out in utilization of the present invention to wiring board, make its operational environment reach the requirement before printing, anti-welding front pretreated temperature is controlled at 150 degree left and right, first wiring board being placed on to relative humidity is less than under 60% environment and carries out wet process, and then dry under relative humidity is greater than 60% environment and carry out wet process for the second time, after drying for the third time, wet process being carried out in this wiring board subregion, dries in subregion.On the other hand, the Module Division to air guide backing plate, there will not be out-of-flatness in the printing process making.
The above embodiment has only expressed preferred embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (4)
1. a thin plate anti-welding printing method, is characterized in that comprising step:
Anti-welding pretreatment: wiring board is carried out to the processing of anti-welding front temperature and humidity, make its operational environment reach the requirement before printing, anti-welding front pretreated temperature is controlled at 150 degree left and right, first wiring board being placed on to relative humidity is less than under 60% environment and carries out wet process, and then dry under relative humidity is greater than 60% environment and carry out wet process for the second time, after drying for the third time, wet process being carried out in this wiring board subregion, dries in subregion;
Consent also pastes egative film: adopt a metallic conduction sheet to carry out consent to the through hole of wiring board, and the wet Negative plate paster of two temperature-sensitive senses is combined on an ink layer, the wet egative film 50% of described two temperature-sensitive senses is overlapping;
Printing first surface: adopt and keep off some reticulated printing first surface, adopt the conduction rebasing portion of backing plate, and fit with the wet egative film of described temperature-sensitive sense, increase the weight of scraper pressure, until the ink of consent overflows via, form ink pearl;
Pre-baked for the first time: wiring board is carried out pre-baked, the wiring board solvent evaporates after pre-baked, the part ink of the described ink layer protruding does not adhere to plate face;
Print second: adopt second of shelves point reticulated printing, until the ink of consent overflows via, form ink pearl;
Pre-baked for the second time: wiring board to be carried out pre-baked for the second time;
Contraposition, exposure, development: by a laser positioning element, the wiring board after pre-baked is for the second time carried out to contraposition, then the wet egative film of described temperature-sensitive sense is exposed, then remove egative film and described ink layer is developed.
2. a kind of thin plate anti-welding printing method as claimed in claim 1, is characterized in that, described air guide backing plate comprises hot and humid air guide backing plate module and low temperature and low humidity backing plate module.
3. a kind of thin plate anti-welding printing method as claimed in claim 2, it is characterized in that, the lap laminating of the wet egative film of described hot and humid air guide module and described temperature-sensitive sense, the non-overlapped part laminating of the wet egative film of described low temperature and low humidity air guide module and described temperature-sensitive sense.
4. a kind of thin plate anti-welding printing method as claimed in claim 1, it is characterized in that, after described printing first surface completes in the confined space that is full of nitrogen of ambient temperature and moisture standing 11-14min, start pre-baked for the first time, pre-baked temperature conditions is 71-78 degree, 15-25min; After first surface is pre-baked, wiring board is departed to described confined space and carry out standing 5-8min, start second printing, continuation standing 11-14min in described confined space after printing the second face completes, starts pre-baked for the second time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310527937.XA CN103687324A (en) | 2013-10-31 | 2013-10-31 | Thin plate solder mask printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310527937.XA CN103687324A (en) | 2013-10-31 | 2013-10-31 | Thin plate solder mask printing method |
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| CN103687324A true CN103687324A (en) | 2014-03-26 |
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| CN201310527937.XA Pending CN103687324A (en) | 2013-10-31 | 2013-10-31 | Thin plate solder mask printing method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869758A (en) * | 2015-05-15 | 2015-08-26 | 深圳崇达多层线路板有限公司 | Method for making solder-resisting layer on PCB sheet |
| CN105208790A (en) * | 2015-09-28 | 2015-12-30 | 江门崇达电路技术有限公司 | Method for manufacturing solder mask layer on PCB |
| CN107690232A (en) * | 2017-07-08 | 2018-02-13 | 广东成德电子科技股份有限公司 | Method for plugging for printed circuit board |
| CN109624533A (en) * | 2018-12-17 | 2019-04-16 | 智恩电子(大亚湾)有限公司 | A kind of thin plate double-sided printing process |
| CN110430689A (en) * | 2019-07-18 | 2019-11-08 | 宁波华远电子科技有限公司 | A kind of production method of thin plate through-hole dual-side ink |
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| JPS6481394A (en) * | 1987-09-24 | 1989-03-27 | Ibiden Co Ltd | Formation of photosolder resist film |
| CN102026495A (en) * | 2010-12-18 | 2011-04-20 | 奥士康精密电路（惠州）有限公司 | Sheet welding preventing method |
| CN102065643A (en) * | 2009-11-17 | 2011-05-18 | 富葵精密组件(深圳)有限公司 | Method for making circuit board |
| CN202374558U (en) * | 2011-12-05 | 2012-08-08 | 昆山雅森电子材料科技有限公司 | Cover film for FPC (Flexible Printed Circuit) and FPC structure |
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2013
- 2013-10-31 CN CN201310527937.XA patent/CN103687324A/en active Pending
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| JPS6481394A (en) * | 1987-09-24 | 1989-03-27 | Ibiden Co Ltd | Formation of photosolder resist film |
| CN102065643A (en) * | 2009-11-17 | 2011-05-18 | 富葵精密组件(深圳)有限公司 | Method for making circuit board |
| CN102026495A (en) * | 2010-12-18 | 2011-04-20 | 奥士康精密电路（惠州）有限公司 | Sheet welding preventing method |
| CN202374558U (en) * | 2011-12-05 | 2012-08-08 | 昆山雅森电子材料科技有限公司 | Cover film for FPC (Flexible Printed Circuit) and FPC structure |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869758A (en) * | 2015-05-15 | 2015-08-26 | 深圳崇达多层线路板有限公司 | Method for making solder-resisting layer on PCB sheet |
| CN105208790A (en) * | 2015-09-28 | 2015-12-30 | 江门崇达电路技术有限公司 | Method for manufacturing solder mask layer on PCB |
| CN105208790B (en) * | 2015-09-28 | 2018-08-03 | 江门崇达电路技术有限公司 | A method of making solder mask on PCB |
| CN107690232A (en) * | 2017-07-08 | 2018-02-13 | 广东成德电子科技股份有限公司 | Method for plugging for printed circuit board |
| CN109624533A (en) * | 2018-12-17 | 2019-04-16 | 智恩电子(大亚湾)有限公司 | A kind of thin plate double-sided printing process |
| CN110430689A (en) * | 2019-07-18 | 2019-11-08 | 宁波华远电子科技有限公司 | A kind of production method of thin plate through-hole dual-side ink |
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Application publication date: 20140326 |