CN102065643A - Method for making circuit board - Google Patents
Method for making circuit board Download PDFInfo
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- CN102065643A CN102065643A CN2009103098443A CN200910309844A CN102065643A CN 102065643 A CN102065643 A CN 102065643A CN 2009103098443 A CN2009103098443 A CN 2009103098443A CN 200910309844 A CN200910309844 A CN 200910309844A CN 102065643 A CN102065643 A CN 102065643A
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Abstract
The invention provides a method for making a circuit board. The method comprises the following steps: providing a circuit substrate comprising a first copper foil layer and an insulating layer; making a first conductive pattern and a first test hole in the first copper foil layer, wherein, the first conductive pattern comprises a first conductive circuit and a first pad; providing a first covering film, wherein, the first covering film is equipped with a first opening corresponding to the first pad and a second opening corresponding to the first test hole; press-fitting the first covering film on the first conductive pattern so that the first pad is exposed out of the first opening and the first test hole is exposed out of the second opening; filling a photosensitive material into the first opening and the second opening; removing one part of the photosensitive material from the first opening to form a first through hole exposed out of the first pad, and removing one part of the photosensitive material from the second opening to form a second test hole; and testing the relative position between the second test hole and the first test hole to judge whether the deviation between the first through hole and the first pad meets the requirement for deviation tolerance.
Description
Technical field
The present invention relates to field of circuit boards, relate in particular to a kind of manufacture method of circuit board.
Background technology
Printed circuit board (PCB) has obtained using widely because of having the packaging density advantages of higher.Application about the high density interconnected circuit plate sees also document Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab., High density multilayer printed circuit board for HITAC M-880, IEEETrans.on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 418-425.
The surperficial of conducting wire at circuit board need form the insulation welding resisting layer usually, being used to cover does not need the conducting wire part that is communicated with mount components or conducting wire, and will need to come out with the conducting wire part that is communicated with of mount components or conducting wire with other.In the prior art, above-mentioned insulation welding resisting layer adopts the mode of printing photosensitive material to form usually.After the photosensitive material printing, to its exposure, development, thereby make the part that needs to keep still stay the surface of circuit board conductive wire, and the part that does not need to keep is promptly exposed from welding resisting layer with the part that outer other elements or circuit are communicated with need.Because the size of circuit board constantly reduces, the conducting wire is more and more intensive in the distribution of circuit board surface, needs the distance between circuit pack that exposes and the circuit that need cover also to diminish.In the process of exposing, because the existence of exposure bias, thereby in the process of developing, the conducting wire part that needs are covered comes out easily, make that the conductive paste of printing such as tin cream etc. are communicated with the conducting wire that former needs cover, in the subsequent detection process in the follow-up element pasted on surface process, the conducting wire short circuit of circuit board causes the bad of circuit board.
Summary of the invention
Therefore, be necessary to provide a kind of manufacture method of circuit board, can after exposure, just can detect the deviation situation of exposure.
Below will a kind of circuit board manufacturing method be described with embodiment.
A kind of circuit board manufacturing method comprises step: the circuit substrate that comprises first copper foil layer and insulating barrier is provided; Make first conductive pattern and first and detect the hole in first copper foil layer, described first conductive pattern comprises first conducting wire and first pad; First coverlay is provided, described first coverlay offer with corresponding first opening of first pad and with first detect corresponding second opening in hole; First coverlay is pressed on first conductive pattern, the pad of winning is exposed from first opening, first detects the hole exposes from second opening; Utilize photosensitive material to fill first opening and second opening; Remove the part photosensitive material in first opening, thereby form first via hole that exposes first pad, remove the photosensitive material in part second opening, detect the hole thereby form second; Detect second and detect the relative position in the hole and the first detection hole, thereby judge whether the deviation of first via hole and first pad satisfies the requirement of off normal tolerance.
Compared with prior art, the manufacture method of the circuit board that the technical program provides, in the process of making, the deviation that can detect exposure and develop, thereby can avoid flowing into successive process owing to circuit zone that circuit board surface that exposure and the deviation of developing make need not expose exposes the circuit board that the deviation that causes do not meet the demands, and cause short circuit in circuit board detecting or the use, thus can promote the making yield of circuit board, reduce the production cost of circuit board.
Description of drawings
Fig. 1 is the schematic diagram of the circuit substrate that provides of the technical program embodiment.
Fig. 2 is the vertical view of the circuit substrate of the formation conducting wire that provides of the technical program embodiment.
Fig. 3 is the upward view of the circuit substrate of the formation conducting wire that provides of the technical program embodiment.
Fig. 4 is the generalized section of Fig. 2 along the IV-IV line.
Fig. 5 is the schematic diagram of first coverlay that provides of the technical program embodiment.
Fig. 6 is the schematic diagram of second coverlay that provides of the technical program embodiment.
Fig. 7 is the schematic diagram behind the conducting wire surface pressing coverlay that provides of the technical program embodiment.
Fig. 8 be the technical program embodiment provide be formed with behind the photosensitive material layer schematic diagram.
Fig. 9 is the schematic diagram after the photosensitive material layer that provides of the technical program embodiment develops.
Figure 10 is the schematic diagram that the circuit board development deviation to after developing that the technical program embodiment provides detects.
Figure 11 is that deviation satisfies first of off normal tolerance and detects hole and second and detect the position in hole and concern after the development that provides of the technical program embodiment.
Figure 12 is first the detecting hole and second and detect the position in hole and concern of the discontented sufficient off normal tolerance of deviation after the development that provides of the technical program embodiment.
Embodiment
Below in conjunction with drawings and Examples the circuit board manufacturing method that the technical program provides is described further.
A kind of circuit board manufacturing method that the technical program embodiment provides comprises the steps:
The first step sees also Fig. 1, and circuit substrate 100 is provided.
In the present embodiment, the circuit substrate 100 of employing is the common two-sided gum Copper Foil in present technique field, and promptly it comprises first copper foil layer 110, second copper foil layer 130 and the insulating barrier 120 between first copper foil layer 110 and second copper foil layer 130.
Second step, see also Fig. 2 to Fig. 4, making first conductive pattern 111 and first detects hole 112 in first copper foil layer 110 of circuit substrate 100, makes second conductive pattern 131 and and the first detection hole, 112 corresponding first loopholes 132 in second copper foil layer 130.
In the present embodiment, adopt image transfer technology-etch process in first copper foil layer 110, to form first conductive pattern 111, and the regional etching except that first conductive pattern 1111 form one or more first detection hole 112 in first copper foil layer 110.First conductive pattern 111 comprises and is used for first pad 1111 and first conducting wire 1112 that are connected with extraneous or other layers conducting wire.In the present embodiment, the first detection hole 112 is an annular, and its external diameter is 1.0 millimeters.The external diameter that is appreciated that the first detection hole 112 can be set according to the circuit board of reality.In addition, first shape that detects hole 112 also is not limited to annular, and it also can be that inside is circular, and the outside can be designed to square and wait other shapes.The requirement of the off normal tolerance of the circuit that forms for the ease of mark, can be in first of annular detects the inner circular copper district 113 in hole 112 etching formation off normal tolerance mark, to make things convenient for the subsequent detection operation.
In addition, two orthogonal diametric(al)s that can first detect hole 112 are provided with Copper Foil does not have etched four linkage sections, and each linkage section is connected between first copper foil layer 110 in circular copper district and first detection 112 outsides, hole.When detecting, the direction of observation off normal that can be more convenient.
When forming first conductive pattern 111 and first to detect hole 112 by image transfer technology and etch process or afterwards, formation second conductive pattern 131 and first loophole 132 second copper foil layer 130 in.Second conductive pattern 131 has and is used for and other elements or other second pad 1311 and second conducting wire 1312 that are connected of circuit layer.On the direction perpendicular to circuit substrate 100, it is corresponding mutually that first loophole 132 and first detects hole 112, and preferably, first loophole 132 detects hole 112 coaxial settings with first, and the aperture of first loophole 132 is greater than the internal diameter in the first detection hole 112.Thereby first zone of detecting circuit substrate 100 correspondences of hole 112 correspondences only has insulating barrier 120, can be transmitted to a side in the first detection hole 112 from a side of first loophole 132 when stronger light.In the present embodiment, the aperture of first loophole 132 is 1.5 millimeters.Be appreciated that first loophole 132 is used for detecting hole 112 printing opacities to first, its shape of offering is not limited to the circle in the present embodiment, its also can for other as polygon or irregularly shaped.
The 3rd step saw also Fig. 5 and Fig. 6, and first coverlay 200 and second coverlay 300 are provided.
First coverlay 200 is used for covering first conducting wire 111 and does not need and the extraneous zone that is connected, and second coverlay 300 is used for covering second conducting wire 131 and does not need and the extraneous zone that is connected.In the present embodiment, in first coverlay 200, offer with first conductive pattern 111 in first pad, 1111 corresponding first openings 210 and with first instrument connection, 112 corresponding second openings 220.In second coverlay 300, offer with second pad, 1311 corresponding the 3rd openings 310 of second conductive pattern 131 and with first loophole, 132 corresponding the 4th openings 320.Because the opening that the making precision of the opening of first coverlay 200 and second coverlay 300 is not enough to guarantee its formation and shape, the size of the connected region of conducting wire and offer accurate coupling the such as position, the opening size of offering in first coverlay 200 and second coverlay 300 all are slightly larger than the size of zone, conducting wire, test pattern and loophole that the needs corresponding with it are in communication with the outside.In the present embodiment, the shape of second opening 220 and the 4th opening 320 is circle, and its diameter is 1.5 millimeters.
The 4th step saw also Fig. 7, and first coverlay 200 is pressed on first conducting wire, 111 1 sides of circuit substrate 100, second coverlay 300 was pressed on second conducting wire, 131 1 sides of circuit substrate 100.
Make the coverlay 200 of winning be pressed on first conductive pattern, 111 1 sides of circuit substrate 100 by the mode that heats the high temperature pressing then of fitting, second coverlay 300 is pressed on second conductive pattern, 131 1 sides of circuit substrate 100.Wherein, first pad, 1,111 first openings 210 of first conductive pattern 111 expose, and first instrument connection 112 exposes from second opening 220.Second pad 1311 of second conducting wire 131 exposes from the 3rd opening 310, and expose from the 4th opening 320 in the zone of the insulating barrier 120 of first loophole, 132 correspondences.
The 5th step saw also Fig. 8, filling photosensitive material 400 in first opening 210 of first coverlay 200 and second opening 220.
In first opening 210 of first coverlay 200 and second opening 220, fill photosensitive material 400.Photosensitive material 400 can form by the mode of printing, and the zone that makes photosensitive material 400 and first opening 210 and second opening 220 expose closely contacts, thereby can hide the zone that coverlay 200 does not have covering.Particularly, form the area of the area of photosensitive material 400 in first opening, 210 corresponding positions, thereby make the photosensitive material 400 that is formed in first opening 210 cover first opening 210 fully greater than first opening 210 of its correspondence.The photosensitive material 400 that forms in second opening 220 covers second opening 220 fully.In the present embodiment, the photosensitive materials 400 in second opening 220 be circle, itself and the 220 coaxial settings of second opening and diameter diameter greater than second opening 220, and its diameter is 1.7 millimeters.In the present embodiment, photosensitive material 400 can be the common photosensitive-ink in present technique field, and it can also can adopt negative photoresist to make for positive photoresist forms.
The 6th step, see also Fig. 9, remove the part photosensitive material 400 in first opening 210, thereby formation exposes first via hole 411 of first pad 1112, and the photosensitive materials 400 in removal part second opening 220 form the second detection holes 421 makes the first detection hole 112 expose from this second detection hole 421.
Employing has the egative film that detects the corresponding transmission region of shape and position in hole 112 with first pad 1111 of first conductive pattern 111 and first, and photosensitive material 400 is exposed and develops.With first detect the diameter of transmission region of hole 112 corresponding egative films greater than first diameter that detects the inner circular copper district 113 in hole 112.Thereby the photosensitive material in first opening 210 400 forms first via hole 411, forms second in the photosensitive material 400 in second opening 220 and detects hole 421 and the first detection hole 112 is exposed from this second detection hole 421.First detects hole 112 can part detects hole 421 from second and expose, and also can all detect hole 421 from second and expose, to guarantee that detecting light that hole 112 direction directives second detect control 421 from first can cross first and detect hole 112 and detect hole 421 from second and penetrate.In the present embodiment, the diameter that the diameter that second of formation detects hole 421 equals inner circular copper district 113 and the absolute value of the off normal tolerance of twice add with.
The 7th step saw also Figure 10, detected first and detected the relative position that hole 421 is detected in hole 112 and second, thereby judge whether exposure and the deviation of developing satisfy the requirement of off normal tolerance, thereby obtain the circuit board 10 that the off normal tolerance meets the demands.
Forms simultaneously with first via hole 411 because second detects hole 421, therefore, the deviation between first pad 1111 of the deviation between the second detection hole 421 and the first detection hole 112 and first via hole 411 and first conducting wire 111 equates.Therefore, detect the relative position that first test pattern 112 and second detects hole 421, can judge whether the deviation between first pad 1111 of first via hole 411 and first conductive pattern 111 satisfies the requirement of off normal tolerance.
In the present embodiment, adopt visual inspection table apparatus (figure does not show) that first relative position that detects the hole 112 and the second detection hole 421 is detected.Circuit board 10 is placed in parallel on the plummer 20 of visual inspection table apparatus, makes second coverlay 300 of circuit board 10 contact with plummer.The light of visual inspection table apparatus sees through plummer 20 and exposes to circuit board 10.This light sees through insulating barrier 120 and exposes to the first detection hole 112 by the 4th opening 320, first loophole 132.Do not have Copper Foil because first detects 112 places, hole, light can see through, and the aperture in the second detection hole 421 is greater than the diameter in the inner circular copper district 113 in the first detection hole 112.
See also Figure 11, when the deviation of exposure imaging satisfies requiring of off normal tolerance, can observe the transmission region of annular in a side of first coverlay 200.See also Figure 12, when the deviation of exposure imaging did not satisfy requiring of off normal tolerance, it is overlapping that first part and second that detects hole 112 detects hole 421, thereby all can not observe the transmission region of complete circle annular in a side of first coverlay 200.Certainly, also can adopt the checkout gear of visual inspection table apparatus to measure the size of the diverse location of transmission region, thereby judge whether the exposure imaging deviation satisfies the requirement of off normal tolerance.Satisfy the circuit board 10 of off normal tolerance thereby obtain the exposure imaging deviation, flow into successive process or application in order to avoid can not satisfy the circuit board 10 of off normal tolerance.
Certainly, the circuit board manufacturing method that the technical program provides also can be when making second conductive pattern 131 be also made the 3rd and is detected the hole in 130 layers of second Copper Foils, when making second conductive pattern 131 or when making first conductive pattern 11, also make and corresponding second loophole in the 3rd detection hole at first copper foil layer 110, described second coverlay 300 also has and the 6th corresponding opening of the 3rd detection hole, described first coverlay 200 also has and corresponding the 5th opening of second pad, when first coverlay 200 is pressed on first conductive pattern 111, described second pad exposes from the 5th opening, on second conductive pattern 131 during described second coverlay of pressing, the described the 3rd detects Kong Congdi six openings exposes, also make photosensitive material fill the 5th opening and the 6th opening when utilizing photosensitive material to fill first opening 210 and second opening 220, also remove the interior part photosensitive material of the 5th opening when removing the part photosensitive material in first opening 210 to form second via hole in the photosensitive material in the 5th opening, the part photosensitive material of also removing when removing the part photosensitive material of second opening 220 in the 6th opening detects the hole to form the 4th in the photosensitive material of the 6th opening, detect second when detecting hole and first and detect the relative position in hole or afterwards also by detecting the 3rd relative position that detects hole and the 4th detection hole, judge whether the deviation of second via hole of second coverlay, one side formation and second pad satisfies the requirement of off normal tolerance.
In addition, circuit substrate 100 can in manufacturing process, then not need to carry out the manufacturing process of second copper foil layer, 130 1 sides for single face gum Copper Foil yet.The circuit board manufacturing method that the technical program provides can also form more multi-layered circuit board.Particularly, only need close single face gum Copper Foil in above-mentioned first coverlay, 200 1 side pressures, make the insulating barrier of single face gum Copper Foil contact with coverlay 200, form conductive pattern and detecting corresponding zone, hole and form loophole at the copper foil layer of the single face gum Copper Foil of pressing with first, fit then coverlay and form photosensitive material, and this photosensitive material carried out exposure imaging, thereby whether the off normal that can detect the single face gum copper foil surface exposure imaging of pressing satisfies the requirement of off normal tolerance, thereby can obtain the circuit board that more multi-layered exposure bias all satisfies the off normal tolerance.
The manufacture method of the circuit board that the technical program provides, in the process of making, the deviation that can detect exposure and develop, thereby can avoid flowing into successive process owing to circuit zone that circuit board surface that exposure and the deviation of developing are need not expose exposes the circuit board that the deviation that causes do not meet the demands, and cause short circuit in circuit board detecting or the use, thereby can promote the making dose rate of circuit board, reduce the production cost of circuit board.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
1. circuit board manufacturing method comprises step:
The circuit substrate that comprises first copper foil layer and insulating barrier is provided;
Make first conductive pattern and first and detect the hole in first copper foil layer, described first conductive pattern comprises first conducting wire and first pad;
First coverlay is provided, described first coverlay offer with corresponding first opening of first pad and with first detect corresponding second opening in hole;
First coverlay is pressed on first conductive pattern, the pad of winning is exposed from first opening, first detects the hole exposes from second opening;
Utilize photosensitive material to fill first opening and second opening;
Remove the interior part photosensitive material of first opening, thereby formation exposes first via hole of first pad, remove the photosensitive material in part second opening, detect the hole and the first detection hole is exposed from this second detection hole thereby form second; And
Detect second and detect the relative position in the hole and the first detection hole, thereby judge whether the deviation of first via hole and first pad satisfies the requirement of off normal tolerance.
2. circuit board manufacturing method as claimed in claim 1 is characterized in that, the diameter of first opening is greater than the diameter of first pad, and the diameter of second opening is greater than the maximum gauge in the first detection hole.
3. circuit board manufacturing method as claimed in claim 1 is characterized in that, detects second relative position that detects the hole and the first detection hole and comprises step:
From insulating barrier one side incident ray,, light penetrates so that being incident in the first detection Kong Bingcong, the second detection hole through insulating barrier; And
Whether observation meets reservation shape from second shape that detects the light formation of penetrating the hole.
4. circuit board manufacturing method as claimed in claim 1, it is characterized in that, described first to detect the hole be the annular opening that is formed at first copper foil layer, the internal diameter that described second aperture of detecting the hole equals first instrument connection and the absolute value of the off normal tolerance of twice add with.
5. circuit board manufacturing method as claimed in claim 4, it is characterized in that, when detecting the relative position in the first detection hole and the second detection hole, light is incident to first from insulating barrier one side and detects the hole and the second detection hole, when detect from first coverlay, one side light see through first detect hole and second to detect the hole after transmission region be shaped as annular the time, first via hole that exposure imaging forms and the deviation of first pad satisfy the requirement of off normal tolerance.
6. circuit board manufacturing method as claimed in claim 4 is characterized in that, described first detects inside, hole has circular copper district, and described circular copper is formed with off normal tolerance mark in the district, is used to indicate the off normal tolerance of described first via hole and first pad.
7. circuit board manufacturing method as claimed in claim 1, it is characterized in that, described circuit substrate also comprises second copper foil layer, described insulating barrier is between first copper foil layer and second copper foil layer, detect the hole simultaneously or afterwards forming first conductive pattern and first, form second conductive pattern and first loophole at second copper foil layer, it is corresponding that described first loophole and first detects the hole, described first loophole detects the coaxial setting in hole with first, and the diameter of first loophole is greater than the maximum gauge in the first detection hole.
8. circuit board manufacturing method as claimed in claim 7 is characterized in that, described second conductive pattern comprises second pad, and described circuit board manufacturing method also comprises step:
Second coverlay is provided, offer in described second coverlay with corresponding the 3rd opening of described second pad and with corresponding the 4th opening of first loophole; And
Described second coverlay of pressing makes second pad expose from the 3rd opening on second conductive pattern, and expose from the 4th opening in the insulating barrier zone that first loophole exposes.
9. circuit board manufacturing method as claimed in claim 8 is characterized in that, the diameter of described the 4th opening is greater than first loophole, and the diameter of the 3rd opening is greater than the diameter of second pad.
10. circuit board manufacturing method as claimed in claim 8, it is characterized in that, when making second conductive pattern, also in second copper foil layer, make the 3rd and detect the hole, when making second conductive pattern or when making first conductive pattern, also make and corresponding second loophole in the 3rd detection hole at first copper foil layer, described second coverlay also has and the 5th corresponding opening of the 3rd detection hole, described first coverlay also has and corresponding the 6th opening of second pad, when first coverlay is pressed on first conductive pattern, described second pad exposes from the 6th opening, on second conductive pattern during described second coverlay of pressing, the described the 3rd detects Kong Congdi five openings exposes, also make photosensitive material fill the 5th opening and the 6th opening when utilizing photosensitive material to fill first opening and second opening, also remove the interior part photosensitive material of the 5th opening when removing the part photosensitive material in first opening to form second via hole in the photosensitive material in the 5th opening, the part photosensitive material of also removing when removing the part photosensitive material of second opening in the 6th opening detects the hole to form the 4th in the photosensitive material of the 6th opening, detect second when detecting hole and first and detect the relative position in hole or afterwards also by detecting the 3rd relative position that detects hole and the 4th detection hole, judge whether the deviation of second via hole of second coverlay, one side formation and second pad satisfies the requirement of off normal tolerance.
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| CN200910309844A CN102065643B (en) | 2009-11-17 | 2009-11-17 | Method for making circuit board |
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| CN200910309844A CN102065643B (en) | 2009-11-17 | 2009-11-17 | Method for making circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103325771A (en) * | 2012-03-22 | 2013-09-25 | 矽品精密工业股份有限公司 | Interposer and electrical testing method thereof |
| CN103687324A (en) * | 2013-10-31 | 2014-03-26 | 胜宏科技（惠州）股份有限公司 | Thin plate solder mask printing method |
| CN104470211A (en) * | 2013-09-24 | 2015-03-25 | 深南电路有限公司 | PCB machining method and PCB |
| CN104703390A (en) * | 2013-12-06 | 2015-06-10 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
| CN105764234A (en) * | 2014-12-19 | 2016-07-13 | 富葵精密组件(深圳)有限公司 | Circuit board structure and manufacturing method thereof |
| CN106304627A (en) * | 2015-05-13 | 2017-01-04 | 上海和辉光电有限公司 | A kind of test pad structure and preparation method thereof |
| CN104582243B (en) * | 2013-10-16 | 2018-07-27 | 易鼎股份有限公司 | Optical positioning structure of circuit substrate |
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| CN101153887B (en) * | 2006-09-28 | 2010-12-15 | 比亚迪股份有限公司 | Special circuit board for detecting FPC impact deflection and detecting method thereof |
| CN100472772C (en) * | 2007-05-15 | 2009-03-25 | 日月光半导体制造股份有限公司 | Circuit board and circuit structure |
| CN101442901B (en) * | 2007-11-22 | 2011-11-16 | 比亚迪股份有限公司 | Method for composing multilayer printed circuit board |
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| CN103325771A (en) * | 2012-03-22 | 2013-09-25 | 矽品精密工业股份有限公司 | Interposer and electrical testing method thereof |
| CN104470211A (en) * | 2013-09-24 | 2015-03-25 | 深南电路有限公司 | PCB machining method and PCB |
| CN104470211B (en) * | 2013-09-24 | 2018-02-27 | 深南电路股份有限公司 | Pcb board processing method and pcb board |
| CN104582243B (en) * | 2013-10-16 | 2018-07-27 | 易鼎股份有限公司 | Optical positioning structure of circuit substrate |
| CN103687324A (en) * | 2013-10-31 | 2014-03-26 | 胜宏科技（惠州）股份有限公司 | Thin plate solder mask printing method |
| CN104703390B (en) * | 2013-12-06 | 2017-12-26 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
| CN104703390A (en) * | 2013-12-06 | 2015-06-10 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
| CN105764234A (en) * | 2014-12-19 | 2016-07-13 | 富葵精密组件(深圳)有限公司 | Circuit board structure and manufacturing method thereof |
| CN105764234B (en) * | 2014-12-19 | 2019-01-25 | 鹏鼎控股(深圳)股份有限公司 | Board structure of circuit and preparation method thereof |
| CN106304627A (en) * | 2015-05-13 | 2017-01-04 | 上海和辉光电有限公司 | A kind of test pad structure and preparation method thereof |
| CN106304627B (en) * | 2015-05-13 | 2019-10-29 | 上海和辉光电有限公司 | A kind of test pad structure and preparation method thereof |
| CN110557882A (en) * | 2018-05-30 | 2019-12-10 | 纬颖科技服务股份有限公司 | circuit board for transmitting and testing high-speed signal |
| US10775427B2 (en) | 2018-05-30 | 2020-09-15 | Wiwynn Corporation | Circuit board for transmitting high speed signal and for said signal to be detected |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
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| C53 | Correction of patent for invention or patent application | ||
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170306 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |