CN102065643B - Method for making circuit board - Google Patents
Method for making circuit board Download PDFInfo
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- CN102065643B CN102065643B CN200910309844A CN200910309844A CN102065643B CN 102065643 B CN102065643 B CN 102065643B CN 200910309844 A CN200910309844 A CN 200910309844A CN 200910309844 A CN200910309844 A CN 200910309844A CN 102065643 B CN102065643 B CN 102065643B
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Abstract
The invention provides a method for making a circuit board. The method comprises the following steps: providing a circuit substrate comprising a first copper foil layer and an insulating layer; making a first conductive pattern and a first test hole in the first copper foil layer, wherein, the first conductive pattern comprises a first conductive circuit and a first pad; providing a first covering film, wherein, the first covering film is equipped with a first opening corresponding to the first pad and a second opening corresponding to the first test hole; press-fitting the first covering film on the first conductive pattern so that the first pad is exposed out of the first opening and the first test hole is exposed out of the second opening; filling a photosensitive material into the first opening and the second opening; removing one part of the photosensitive material from the first opening to form a first through hole exposed out of the first pad, and removing one part of the photosensitive material from the second opening to form a second test hole; and testing the relative position between the second test hole and the first test hole to judge whether the deviation between the first through hole and the first pad meets the requirement for deviation tolerance.
Description
Technical field
The present invention relates to field of circuit boards, relate in particular to a kind of manufacture method of circuit board.
Background technology
Printed circuit board (PCB) has obtained using widely because of having the packaging density advantages of higher.Application about the high density interconnected circuit plate sees also document Takahashi, A.Ooki, N.Nagai, A.Akahoshi; H.Mukoh, A.Wajima, M.Res.Lab.; High density multilayer printed circuit board for HITAC M-880, IEEE Trans.on Components, Packaging; And Manufacturing Technology, 1992,15 (4): 418-425.
The surperficial of conducting wire at circuit board need form the insulation welding resisting layer usually; Be used to cover the conducting wire part that need not be communicated with, and need come out with the conducting wire part that is communicated with of mount components or conducting wire with other with mount components or conducting wire.In the prior art, above-mentioned insulation welding resisting layer adopts the mode of printing photosensitive material to form usually.After the photosensitive material printing, to its exposure, development, thereby make the part that need keep still stay the surface of circuit board conductive wire, and the part that need not keep is promptly exposed from welding resisting layer with the part that outer other elements or circuit are communicated with need.Because the size of circuit board constantly reduces, the conducting wire is more and more intensive in the distribution of circuit board surface, needs the distance between circuit pack that exposes and the circuit that need cover also to diminish.In the process of making public, because the existence of exposure bias, thereby in the process of developing; The conducting wire part of easily needs being covered comes out; Make that the conductive paste of printing such as tin cream etc. are communicated with the conducting wire that former needs cover, in the subsequent detection process in the follow-up element pasted on surface process; The conducting wire short circuit of circuit board causes the bad of circuit board.
Summary of the invention
Therefore, be necessary to provide a kind of manufacture method of circuit board, can after exposure, just can detect the deviation situation of exposure.
Below will a kind of circuit board manufacturing method be described with embodiment.A kind of circuit board manufacturing method comprises step: the circuit substrate that comprises first copper foil layer and insulating barrier is provided; In first copper foil layer, make first conductive pattern and the first detection hole, said first conductive pattern comprises first conducting wire and first pad; First coverlay is provided, said first coverlay offer with corresponding first opening of first pad and with corresponding second opening in the first detection hole; First coverlay is pressed on first conductive pattern, the pad of winning is exposed from first opening, expose from second opening in the first detection hole; Utilize photosensitive material to fill first opening and second opening; Remove the part photosensitive material in first opening, thereby form first via hole that exposes first pad, remove the photosensitive material in part second opening, thereby form the second detection hole; Detect the relative position in the second detection hole and the first detection hole, thereby judge whether the deviation of first via hole and first pad satisfies the requirement of off normal tolerance.
Compared with prior art; The manufacture method of the circuit board that the present technique scheme provides, in the process of making, the deviation that can detect exposure and develop; Thereby can avoid flowing into successive process owing to circuit zone that circuit board surface that exposure and the deviation of developing make need not expose exposes the circuit board that the deviation that causes do not meet the demands; And cause the short circuit in circuit board detecting or the use, thus can promote the manufacture qualified rate of circuit board, reduce the production cost of circuit board.
Description of drawings
Fig. 1 is the sketch map of the circuit substrate that provides of present technique scheme implementation example.
Fig. 2 is the vertical view of the circuit substrate of the formation conducting wire that provides of present technique scheme implementation example.
Fig. 3 is the upward view of the circuit substrate of the formation conducting wire that provides of present technique scheme implementation example.
Fig. 4 is the generalized section of Fig. 2 along the IV-IV line.
Fig. 5 is the sketch map of first coverlay that provides of present technique scheme implementation example.
Fig. 6 is the sketch map of second coverlay that provides of present technique scheme implementation example.
Fig. 7 is the sketch map behind the conducting wire surface pressing coverlay that provides of present technique scheme implementation example.
Fig. 8 be present technique scheme implementation example provide be formed with behind the photosensitive material layer sketch map.
Fig. 9 is the sketch map after the photosensitive material layer that provides of present technique scheme implementation example develops.
Figure 10 is the sketch map that the circuit board development deviation to after developing that present technique scheme implementation example provides detects.
Figure 11 is the position relation that deviation satisfies the first detection hole and the second detection hole of off normal tolerance after the development that provides of present technique scheme implementation example.
Figure 12 is that the position in the first detection hole and the second detection hole of the discontented sufficient off normal tolerance of deviation after the development that provides of present technique scheme implementation example concerns.
Embodiment
Below in conjunction with accompanying drawing and embodiment the circuit board manufacturing method that the present technique scheme provides is described further.
A kind of circuit board manufacturing method that present technique scheme implementation example provides comprises the steps:
The first step sees also Fig. 1, and circuit substrate 100 is provided.
In the present embodiment, the circuit substrate 100 of employing is the common two-sided gum Copper Foil in present technique field, and promptly it comprises first copper foil layer 110, second copper foil layer 130 and the insulating barrier 120 between first copper foil layer 110 and second copper foil layer 130.
Second step; Please consult Fig. 2 to Fig. 4 in the lump; In first copper foil layer 110 of circuit substrate 100, make first conductive pattern 111 and the first detection hole 112, in second copper foil layer 130, make second conductive pattern 131 and and the first detection hole, 112 corresponding first loopholes 132.
In the present embodiment, adopt image transfer technology-etch process in first copper foil layer 110, to form first conductive pattern 111, and in first copper foil layer 110, remove one or more first detection hole 112 of regional etching formation of first conductive pattern 1111.First conductive pattern 111 comprises and is used for first pad 1111 and first conducting wire 1112 that are connected with extraneous or other layers conducting wire.In the present embodiment, the first detection hole 112 is an annular, and its external diameter is 1.0 millimeters.The external diameter that is appreciated that the first detection hole 112 can be set according to the circuit board of reality.In addition, the shape in the first detection hole 112 also is not limited to annular, and it also can be that inside is circular, and the outside can be designed to square and wait other shapes.The requirement of the off normal tolerance of the circuit that forms for the ease of mark, can be in the inner circular copper district 113 in the first detection hole 112 of annular etching formation off normal tolerance mark, to make things convenient for the subsequent detection operation.
In addition, two orthogonal diametric(al)s that can the first detection hole 112 are provided with Copper Foil does not have etched four linkage sections, and each linkage section is connected between first copper foil layer 110 in the circular copper district and 112 outsides, the first detection hole.When detecting, the direction of observation off normal that can be more convenient.
When forming first conductive pattern 111 and the first detection hole 112 through image transfer technology and etch process or after, formation second conductive pattern 131 and first loophole 132 second copper foil layer 130 in.Second conductive pattern 131 has and is used for and other elements or other second pad 1311 and second conducting wire 1312 that are connected of circuit layer.On the direction perpendicular to circuit substrate 100, first loophole 132 is corresponding each other with the first detection hole 112, preferably, and first loophole 132 and the 112 coaxial settings of the first detection hole, and the aperture of first loophole 132 is greater than the internal diameter in the first detection hole 112.Thereby 112 corresponding electrical circuits substrates, 100 corresponding zones, the first detection hole only have insulating barrier 120, can be transmitted to a side in the first detection hole 112 from a side of first loophole 132 when stronger light.In the present embodiment, the aperture of first loophole 132 is 1.5 millimeters.Be appreciated that first loophole 132 is used for to the first detection hole, 112 printing opacities, its shape of offering is not limited to the circle in the present embodiment, its also can for other like polygon or irregularly shaped.
The 3rd step, please consult Fig. 5 and Fig. 6 in the lump, first coverlay 200 and second coverlay 300 are provided.
First coverlay 200 is used for covering the zone that first conducting wire 111 need not be connected with the external world, and second coverlay 300 is used for covering the zone that second conducting wire 131 need not be connected with the external world.In the present embodiment, in first coverlay 200, offer with first conductive pattern 111 in first pad, 1111 corresponding first openings 210 and with first instrument connection, 112 corresponding second openings 220.In second coverlay 300, offer with second pad, 1311 corresponding the 3rd openings 310 of second conductive pattern 131 and with first loophole, 132 corresponding the 4th openings 320.The conducting wire that the needs corresponding with it are in communication with the outside is regional because the opening that the making precision of the opening of first coverlay 200 and second coverlay 300 is not enough to guarantee its formation and shape, the size of the connected region of conducting wire and offer accurate coupling the such as position, the opening size of in first coverlay 200 and second coverlay 300, offering all are slightly larger than, the size of test pattern and loophole.In the present embodiment, the shape of second opening 220 and the 4th opening 320 is circle, and its diameter is 1.5 millimeters.
The 4th step saw also Fig. 7, and first coverlay 200 is pressed on first conducting wire, 111 1 sides of circuit substrate 100, second coverlay 300 was pressed on second conducting wire, 131 1 sides of circuit substrate 100.
Make the coverlay 200 of winning be pressed on first conductive pattern, 111 1 sides of circuit substrate 100 through the mode that heats the high temperature pressing then of fitting, second coverlay 300 is pressed on second conductive pattern, 131 1 sides of circuit substrate 100.Wherein, first pad, 1,111 first openings 210 of first conductive pattern 111 expose, and first instrument connection 112 exposes from second opening 220.Second pad 1311 of second conducting wire 131 exposes from the 3rd opening 310, and expose from the 4th opening 320 in the zone of the insulating barrier 120 of first loophole, 132 correspondences.
The 5th step saw also Fig. 8, filling photosensitive material 400 in first opening 210 of first coverlay 200 and second opening 220.
In first opening 210 of first coverlay 200 and second opening 220, fill photosensitive material 400.Photosensitive material 400 can form through the mode of printing, and the zone that makes photosensitive material 400 and first opening 210 and second opening 220 expose closely contacts, and does not have region covered thereby can hide coverlay 200.Particularly, form the area of the area of photosensitive material 400 in first opening, 210 corresponding positions, thereby make the photosensitive material 400 that is formed in first opening 210 cover first opening 210 fully greater than its first corresponding opening 210.The photosensitive material 400 that in second opening 220, forms covers second opening 220 fully.In the present embodiment, the photosensitive materials 400 in second opening 220 be circle, itself and the 220 coaxial settings of second opening and diameter diameter greater than second opening 220, and its diameter is 1.7 millimeters.In the present embodiment, photosensitive material 400 can be the common photosensitive-ink in present technique field, and it can also can adopt negative photoresist to make for positive photoresist forms.
The 6th step; See also Fig. 9; Remove the part photosensitive material 400 in first opening 210; Thereby form first via hole 411 that exposes first pad 1112, the photosensitive material 400 formation second detection hole 421 of removing in part second opening 220 makes the first detection hole 112 expose from this second detection hole 421.
Employing has the egative film with the corresponding transmission region of shape and position in first pad 1111 of first conductive pattern 111 and the first detection hole 112, and photosensitive material 400 is made public and develops.With the diameter of the transmission region of the first detection hole, 112 corresponding egative films diameter greater than the inner circular copper district 113 in the first detection hole 112.Thereby the photosensitive material in first opening 210 400 forms first via hole 411, forms the second detection hole 421 in the photosensitive material 400 in second opening 220 and the first detection hole 112 is exposed from this second detection hole 421.The first detection hole 112 can part be exposed from the second detection hole 421, also can all expose from the second detection hole 421, can cross the first detection hole 112 from 421 ejaculations of the second detection hole to guarantee the light that 112 direction directives second detect control 421 from the first detection hole.In the present embodiment, the diameter in the second detection hole 421 of formation equal inner circular copper district 113 diameter and twice the off normal tolerance absolute value add with.
The 7th step saw also Figure 10, detected the relative position in the first detection hole 112 and the second detection hole 421, thereby judged whether exposure and the deviation of developing satisfy the requirement of off normal tolerance, thereby obtained the circuit board 10 that the off normal tolerance meets the demands.
Because the second detection hole 421 and first via hole 411 form simultaneously, therefore, the deviation between first pad 1111 of the deviation between the second detection hole 421 and the first detection hole 112 and first via hole 411 and first conducting wire 111 equates.Therefore, detect the relative position in first test pattern 112 and the second detection hole 421, can judge whether the deviation between first pad 1111 of first via hole 411 and first conductive pattern 111 satisfies the requirement of off normal tolerance.
In the present embodiment, adopt visual inspection table apparatus (figure does not show) that the relative position in the first detection hole 112 and the second detection hole 421 is detected.Circuit board 10 is placed in parallel on the plummer 20 of visual inspection table apparatus, makes second coverlay 300 of circuit board 10 contact with plummer.The light of visual inspection table apparatus sees through plummer 20 and exposes to circuit board 10.This light sees through insulating barrier 120 and exposes to the first detection hole 112 through the 4th opening 320, first loophole 132.Because 112 places, the first detection hole do not have Copper Foil, light can see through, and the aperture in the second detection hole 421 is greater than the diameter in the inner circular copper district 113 in the first detection hole 112.
See also Figure 11, when the deviation of exposure imaging satisfies requiring of off normal tolerance, can observe the transmission region of annular in a side of first coverlay 200.See also Figure 12, when the deviation of exposure imaging did not satisfy requiring of off normal tolerance, the part in the first detection hole 112 was overlapping with the second detection hole 421, thereby all can not observe the transmission region of complete circle annular in a side of first coverlay 200.Certainly, also can adopt the checkout gear of visual inspection table apparatus to measure the size of the diverse location of transmission region, thereby judge whether the exposure imaging deviation satisfies the requirement of off normal tolerance.Satisfy the circuit board 10 of off normal tolerance thereby obtain the exposure imaging deviation, flow into successive process or application in order to avoid can not satisfy the circuit board 10 of off normal tolerance.
Certainly; The circuit board manufacturing method that the present technique scheme provides also can be when making second conductive pattern 131 be also made the 3rd detection hole in 130 layers of second Copper Foils; When making second conductive pattern 131 or when making first conductive pattern 11, also make and corresponding second loophole in the 3rd detection hole at first copper foil layer 110; Said second coverlay 300 also has six opening corresponding with the 3rd detection hole; Said first coverlay 200 also has and corresponding the 5th opening of second pad; When first coverlay 200 is pressed on first conductive pattern 111; Said second pad exposes from the 5th opening; During said second coverlay of pressing, the said the 3rd detects Kong Congdi six openings exposes, and also makes photosensitive material fill the 5th opening and the 6th opening when utilizing photosensitive material to fill first opening 210 and second opening 220 on second conductive pattern 131; Also remove the interior part photosensitive material of the 5th opening when removing the part photosensitive material in first opening 210 to form second via hole in the photosensitive material in the 5th opening; Also remove part photosensitive material in the 6th opening when removing the part photosensitive material of second opening 220 in the photosensitive material of the 6th opening, to form the 4th detection hole, when detecting the relative position in the second detection hole and the first detection hole or afterwards also through detecting the relative position in the 3rd detection hole and the 4th detection hole, judge whether the deviation of second via hole and second pad of the formation of second coverlay, one side satisfies the requirement of off normal tolerance.
In addition, circuit substrate 100 can in manufacturing process, then need not carry out the manufacturing process of second copper foil layer, 130 1 sides for single face gum Copper Foil yet.The circuit board manufacturing method that the present technique scheme provides can also form the more circuit board of multilayer.Particularly; Only need close single face gum Copper Foil in above-mentioned first coverlay, 200 1 side pressures; Make the insulating barrier of single face gum Copper Foil contact with coverlay 200; Copper foil layer at the single face gum Copper Foil of pressing forms conductive pattern and forms loophole in the zone corresponding with the first detection hole, fit then coverlay and formation photosensitive material, and this photosensitive material carried out exposure imaging; Thereby whether the off normal that can detect the single face gum copper foil surface exposure imaging of pressing satisfies the requirement of off normal tolerance, thereby can obtain the circuit board that the exposure bias of multilayer more all satisfies the off normal tolerance.
The manufacture method of the circuit board that the present technique scheme provides; In the process of making; The deviation that can detect exposure and develop, thus can avoid because the circuit zone that the circuit board surface that the exposure and the deviation of developing are need not expose exposes the circuit board inflow successive process that the deviation that causes does not meet the demands, and cause the short circuit in circuit board detecting or the use; Thereby can promote the making dose rate of circuit board, reduce the production cost of circuit board.
It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
1. circuit board manufacturing method comprises step:
The circuit substrate that comprises first copper foil layer and insulating barrier is provided;
In first copper foil layer, make first conductive pattern and the first detection hole, said first conductive pattern comprises first conducting wire and first pad;
First coverlay is provided, said first coverlay offer with corresponding first opening of first pad and with corresponding second opening in the first detection hole;
First coverlay is pressed on first conductive pattern, the pad of winning is exposed from first opening, expose from second opening in the first detection hole;
Utilize photosensitive material to fill first opening and second opening;
Remove the part photosensitive material in first opening, thereby form first via hole that exposes first pad, remove the photosensitive material in part second opening, thereby form the second detection hole and the first detection hole is exposed from this second detection hole; And
Detect the relative position in the second detection hole and the first detection hole, thereby judge whether the deviation of first via hole and first pad satisfies the requirement of off normal tolerance.
2. circuit board manufacturing method as claimed in claim 1 is characterized in that, the diameter of first opening is greater than the diameter of first pad, and the diameter of second opening is greater than the maximum gauge in the first detection hole.
3. circuit board manufacturing method as claimed in claim 1 is characterized in that, the relative position that detects the second detection hole and the first detection hole comprises step:
From insulating barrier one side incident ray,, light penetrates so that being incident in the first detection Kong Bingcong, the second detection hole through insulating barrier; And
Whether the shape that the light that observation is penetrated from the second detection hole forms meets reservation shape.
4. circuit board manufacturing method as claimed in claim 1; It is characterized in that; The said first detection hole is the annular opening that is formed at first copper foil layer, the aperture in the said second detection hole equal first instrument connection internal diameter and twice the off normal tolerance absolute value add with.
5. circuit board manufacturing method as claimed in claim 4; It is characterized in that; When detecting the relative position in the first detection hole and the second detection hole; Light is incident to the first detection hole and the second detection hole from insulating barrier one side, after detecting light to see through the first detection hole and the second detection hole from first coverlay, one side transmission region be shaped as annular the time, first via hole that exposure imaging forms and the deviation of first pad satisfy the requirement of off normal tolerance.
6. circuit board manufacturing method as claimed in claim 4 is characterized in that, inside, the said first detection hole has circular copper district, and said circular copper is formed with off normal tolerance mark in the district, is used to indicate the off normal tolerance of said first via hole and first pad.
7. circuit board manufacturing method as claimed in claim 1; It is characterized in that; Said circuit substrate also comprises second copper foil layer, said insulating barrier between first copper foil layer and second copper foil layer, form first conductive pattern and the first detection hole simultaneously or after; Form second conductive pattern and first loophole at second copper foil layer; Said first loophole is corresponding with the first detection hole, said first loophole and the coaxial setting in the first detection hole, and the diameter of first loophole is greater than the maximum gauge in the first detection hole.
8. circuit board manufacturing method as claimed in claim 7 is characterized in that, said second conductive pattern comprises second pad, and said circuit board manufacturing method also comprises step:
Second coverlay is provided, offer in said second coverlay with corresponding the 3rd opening of said second pad and with corresponding the 4th opening of first loophole; And
Said second coverlay of pressing makes second pad expose from the 3rd opening on second conductive pattern, and expose from the 4th opening in the insulating barrier zone that first loophole exposes.
9. circuit board manufacturing method as claimed in claim 8 is characterized in that, the diameter of said the 4th opening is greater than first loophole, and the diameter of the 3rd opening is greater than the diameter of second pad.
10. circuit board manufacturing method as claimed in claim 8; It is characterized in that; When making second conductive pattern, also in second copper foil layer, make the 3rd detection hole; When making second conductive pattern or when making first conductive pattern, also make and corresponding second loophole in the 3rd detection hole at first copper foil layer; Said second coverlay also has six opening corresponding with the 3rd detection hole; Said first coverlay also has and corresponding the 5th opening of second pad; When first coverlay was pressed on first conductive pattern, said second pad exposed from the 5th opening, on second conductive pattern during said second coverlay of pressing; The said the 3rd detects Kong Congdi six openings exposes; Also make photosensitive material fill the 5th opening and the 6th opening when utilizing photosensitive material to fill first opening and second opening, also remove part photosensitive material in the 5th opening when removing the part photosensitive material in first opening, also remove part photosensitive material in the 6th opening when removing the part photosensitive material of second opening in the photosensitive material of the 6th opening, to form the 4th detection hole to form second via hole in the photosensitive material in the 5th opening; When detecting the relative position in the second detection hole and the first detection hole or afterwards also through detecting the relative position in the 3rd detection hole and the 4th detection hole, judge whether the deviation of second via hole and second pad of the formation of second coverlay, one side satisfies the requirement of off normal tolerance.
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| CN200910309844A CN102065643B (en) | 2009-11-17 | 2009-11-17 | Method for making circuit board |
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| CN200910309844A CN102065643B (en) | 2009-11-17 | 2009-11-17 | Method for making circuit board |
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| CN102065643B true CN102065643B (en) | 2012-10-17 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI528876B (en) * | 2012-03-22 | 2016-04-01 | 矽品精密工業股份有限公司 | Medium board and its electrical testing method |
| CN104470211B (en) * | 2013-09-24 | 2018-02-27 | 深南电路股份有限公司 | Pcb board processing method and pcb board |
| TWI573504B (en) * | 2013-10-16 | 2017-03-01 | Adv Flexible Circuits Co Ltd | The optical positioning structure of the circuit substrate |
| CN103687324A (en) * | 2013-10-31 | 2014-03-26 | 胜宏科技（惠州）股份有限公司 | Thin plate solder mask printing method |
| CN104703390B (en) * | 2013-12-06 | 2017-12-26 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
| CN105764234B (en) * | 2014-12-19 | 2019-01-25 | 鹏鼎控股(深圳)股份有限公司 | Board structure of circuit and preparation method thereof |
| CN106304627B (en) * | 2015-05-13 | 2019-10-29 | 上海和辉光电有限公司 | A kind of test pad structure and preparation method thereof |
| TWI665455B (en) | 2018-05-30 | 2019-07-11 | 緯穎科技服務股份有限公司 | Circuit board for transmitting high speed signal and for said signal to be detected |
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| CN101153887A (en) * | 2006-09-28 | 2008-04-02 | 比亚迪股份有限公司 | Special circuit board for detecting FPC impact deflection and detecting method thereof |
| CN101442901A (en) * | 2007-11-22 | 2009-05-27 | 比亚迪股份有限公司 | Method for composing multilayer printed circuit board |
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| CN101153887A (en) * | 2006-09-28 | 2008-04-02 | 比亚迪股份有限公司 | Special circuit board for detecting FPC impact deflection and detecting method thereof |
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| CN101442901A (en) * | 2007-11-22 | 2009-05-27 | 比亚迪股份有限公司 | Method for composing multilayer printed circuit board |
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
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Effective date of registration: 20170306 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |