Embodiment
Below in conjunction with accompanying drawing and embodiment the circuit board manufacturing method that the present technique scheme provides is described further.
A kind of circuit board manufacturing method that present technique scheme implementation example provides comprises the steps:
The first step sees also Fig. 1, and circuit substrate 100 is provided.
In the present embodiment, the circuit substrate 100 of employing is the common two-sided gum Copper Foil in present technique field, and promptly it comprises first copper foil layer 110, second copper foil layer 130 and the insulating barrier 120 between first copper foil layer 110 and second copper foil layer 130.
Second step; Please consult Fig. 2 to Fig. 4 in the lump; In first copper foil layer 110 of circuit substrate 100, make first conductive pattern 111 and the first detection hole 112, in second copper foil layer 130, make second conductive pattern 131 and and the first detection hole, 112 corresponding first loopholes 132.
In the present embodiment, adopt image transfer technology-etch process in first copper foil layer 110, to form first conductive pattern 111, and in first copper foil layer 110, remove one or more first detection hole 112 of regional etching formation of first conductive pattern 1111.First conductive pattern 111 comprises and is used for first pad 1111 and first conducting wire 1112 that are connected with extraneous or other layers conducting wire.In the present embodiment, the first detection hole 112 is an annular, and its external diameter is 1.0 millimeters.The external diameter that is appreciated that the first detection hole 112 can be set according to the circuit board of reality.In addition, the shape in the first detection hole 112 also is not limited to annular, and it also can be that inside is circular, and the outside can be designed to square and wait other shapes.The requirement of the off normal tolerance of the circuit that forms for the ease of mark, can be in the inner circular copper district 113 in the first detection hole 112 of annular etching formation off normal tolerance mark, to make things convenient for the subsequent detection operation.
In addition, two orthogonal diametric(al)s that can the first detection hole 112 are provided with Copper Foil does not have etched four linkage sections, and each linkage section is connected between first copper foil layer 110 in the circular copper district and 112 outsides, the first detection hole.When detecting, the direction of observation off normal that can be more convenient.
When forming first conductive pattern 111 and the first detection hole 112 through image transfer technology and etch process or after, formation second conductive pattern 131 and first loophole 132 second copper foil layer 130 in.Second conductive pattern 131 has and is used for and other elements or other second pad 1311 and second conducting wire 1312 that are connected of circuit layer.On the direction perpendicular to circuit substrate 100, first loophole 132 is corresponding each other with the first detection hole 112, preferably, and first loophole 132 and the 112 coaxial settings of the first detection hole, and the aperture of first loophole 132 is greater than the internal diameter in the first detection hole 112.Thereby 112 corresponding electrical circuits substrates, 100 corresponding zones, the first detection hole only have insulating barrier 120, can be transmitted to a side in the first detection hole 112 from a side of first loophole 132 when stronger light.In the present embodiment, the aperture of first loophole 132 is 1.5 millimeters.Be appreciated that first loophole 132 is used for to the first detection hole, 112 printing opacities, its shape of offering is not limited to the circle in the present embodiment, its also can for other like polygon or irregularly shaped.
The 3rd step, please consult Fig. 5 and Fig. 6 in the lump, first coverlay 200 and second coverlay 300 are provided.
First coverlay 200 is used for covering the zone that first conducting wire 111 need not be connected with the external world, and second coverlay 300 is used for covering the zone that second conducting wire 131 need not be connected with the external world.In the present embodiment, in first coverlay 200, offer with first conductive pattern 111 in first pad, 1111 corresponding first openings 210 and with first instrument connection, 112 corresponding second openings 220.In second coverlay 300, offer with second pad, 1311 corresponding the 3rd openings 310 of second conductive pattern 131 and with first loophole, 132 corresponding the 4th openings 320.The conducting wire that the needs corresponding with it are in communication with the outside is regional because the opening that the making precision of the opening of first coverlay 200 and second coverlay 300 is not enough to guarantee its formation and shape, the size of the connected region of conducting wire and offer accurate coupling the such as position, the opening size of in first coverlay 200 and second coverlay 300, offering all are slightly larger than, the size of test pattern and loophole.In the present embodiment, the shape of second opening 220 and the 4th opening 320 is circle, and its diameter is 1.5 millimeters.
The 4th step saw also Fig. 7, and first coverlay 200 is pressed on first conducting wire, 111 1 sides of circuit substrate 100, second coverlay 300 was pressed on second conducting wire, 131 1 sides of circuit substrate 100.
Make the coverlay 200 of winning be pressed on first conductive pattern, 111 1 sides of circuit substrate 100 through the mode that heats the high temperature pressing then of fitting, second coverlay 300 is pressed on second conductive pattern, 131 1 sides of circuit substrate 100.Wherein, first pad, 1,111 first openings 210 of first conductive pattern 111 expose, and first instrument connection 112 exposes from second opening 220.Second pad 1311 of second conducting wire 131 exposes from the 3rd opening 310, and expose from the 4th opening 320 in the zone of the insulating barrier 120 of first loophole, 132 correspondences.
The 5th step saw also Fig. 8, filling photosensitive material 400 in first opening 210 of first coverlay 200 and second opening 220.
In first opening 210 of first coverlay 200 and second opening 220, fill photosensitive material 400.Photosensitive material 400 can form through the mode of printing, and the zone that makes photosensitive material 400 and first opening 210 and second opening 220 expose closely contacts, and does not have region covered thereby can hide coverlay 200.Particularly, form the area of the area of photosensitive material 400 in first opening, 210 corresponding positions, thereby make the photosensitive material 400 that is formed in first opening 210 cover first opening 210 fully greater than its first corresponding opening 210.The photosensitive material 400 that in second opening 220, forms covers second opening 220 fully.In the present embodiment, the photosensitive materials 400 in second opening 220 be circle, itself and the 220 coaxial settings of second opening and diameter diameter greater than second opening 220, and its diameter is 1.7 millimeters.In the present embodiment, photosensitive material 400 can be the common photosensitive-ink in present technique field, and it can also can adopt negative photoresist to make for positive photoresist forms.
The 6th step; See also Fig. 9; Remove the part photosensitive material 400 in first opening 210; Thereby form first via hole 411 that exposes first pad 1112, the photosensitive material 400 formation second detection hole 421 of removing in part second opening 220 makes the first detection hole 112 expose from this second detection hole 421.
Employing has the egative film with the corresponding transmission region of shape and position in first pad 1111 of first conductive pattern 111 and the first detection hole 112, and photosensitive material 400 is made public and develops.With the diameter of the transmission region of the first detection hole, 112 corresponding egative films diameter greater than the inner circular copper district 113 in the first detection hole 112.Thereby the photosensitive material in first opening 210 400 forms first via hole 411, forms the second detection hole 421 in the photosensitive material 400 in second opening 220 and the first detection hole 112 is exposed from this second detection hole 421.The first detection hole 112 can part be exposed from the second detection hole 421, also can all expose from the second detection hole 421, can cross the first detection hole 112 from 421 ejaculations of the second detection hole to guarantee the light that 112 direction directives second detect control 421 from the first detection hole.In the present embodiment, the diameter in the second detection hole 421 of formation equal inner circular copper district 113 diameter and twice the off normal tolerance absolute value add with.
The 7th step saw also Figure 10, detected the relative position in the first detection hole 112 and the second detection hole 421, thereby judged whether exposure and the deviation of developing satisfy the requirement of off normal tolerance, thereby obtained the circuit board 10 that the off normal tolerance meets the demands.
Because the second detection hole 421 and first via hole 411 form simultaneously, therefore, the deviation between first pad 1111 of the deviation between the second detection hole 421 and the first detection hole 112 and first via hole 411 and first conducting wire 111 equates.Therefore, detect the relative position in first test pattern 112 and the second detection hole 421, can judge whether the deviation between first pad 1111 of first via hole 411 and first conductive pattern 111 satisfies the requirement of off normal tolerance.
In the present embodiment, adopt visual inspection table apparatus (figure does not show) that the relative position in the first detection hole 112 and the second detection hole 421 is detected.Circuit board 10 is placed in parallel on the plummer 20 of visual inspection table apparatus, makes second coverlay 300 of circuit board 10 contact with plummer.The light of visual inspection table apparatus sees through plummer 20 and exposes to circuit board 10.This light sees through insulating barrier 120 and exposes to the first detection hole 112 through the 4th opening 320, first loophole 132.Because 112 places, the first detection hole do not have Copper Foil, light can see through, and the aperture in the second detection hole 421 is greater than the diameter in the inner circular copper district 113 in the first detection hole 112.
See also Figure 11, when the deviation of exposure imaging satisfies requiring of off normal tolerance, can observe the transmission region of annular in a side of first coverlay 200.See also Figure 12, when the deviation of exposure imaging did not satisfy requiring of off normal tolerance, the part in the first detection hole 112 was overlapping with the second detection hole 421, thereby all can not observe the transmission region of complete circle annular in a side of first coverlay 200.Certainly, also can adopt the checkout gear of visual inspection table apparatus to measure the size of the diverse location of transmission region, thereby judge whether the exposure imaging deviation satisfies the requirement of off normal tolerance.Satisfy the circuit board 10 of off normal tolerance thereby obtain the exposure imaging deviation, flow into successive process or application in order to avoid can not satisfy the circuit board 10 of off normal tolerance.
Certainly; The circuit board manufacturing method that the present technique scheme provides also can be when making second conductive pattern 131 be also made the 3rd detection hole in 130 layers of second Copper Foils; When making second conductive pattern 131 or when making first conductive pattern 11, also make and corresponding second loophole in the 3rd detection hole at first copper foil layer 110; Said second coverlay 300 also has six opening corresponding with the 3rd detection hole; Said first coverlay 200 also has and corresponding the 5th opening of second pad; When first coverlay 200 is pressed on first conductive pattern 111; Said second pad exposes from the 5th opening; During said second coverlay of pressing, the said the 3rd detects Kong Congdi six openings exposes, and also makes photosensitive material fill the 5th opening and the 6th opening when utilizing photosensitive material to fill first opening 210 and second opening 220 on second conductive pattern 131; Also remove the interior part photosensitive material of the 5th opening when removing the part photosensitive material in first opening 210 to form second via hole in the photosensitive material in the 5th opening; Also remove part photosensitive material in the 6th opening when removing the part photosensitive material of second opening 220 in the photosensitive material of the 6th opening, to form the 4th detection hole, when detecting the relative position in the second detection hole and the first detection hole or afterwards also through detecting the relative position in the 3rd detection hole and the 4th detection hole, judge whether the deviation of second via hole and second pad of the formation of second coverlay, one side satisfies the requirement of off normal tolerance.
In addition, circuit substrate 100 can in manufacturing process, then need not carry out the manufacturing process of second copper foil layer, 130 1 sides for single face gum Copper Foil yet.The circuit board manufacturing method that the present technique scheme provides can also form the more circuit board of multilayer.Particularly; Only need close single face gum Copper Foil in above-mentioned first coverlay, 200 1 side pressures; Make the insulating barrier of single face gum Copper Foil contact with coverlay 200; Copper foil layer at the single face gum Copper Foil of pressing forms conductive pattern and forms loophole in the zone corresponding with the first detection hole, fit then coverlay and formation photosensitive material, and this photosensitive material carried out exposure imaging; Thereby whether the off normal that can detect the single face gum copper foil surface exposure imaging of pressing satisfies the requirement of off normal tolerance, thereby can obtain the circuit board that the exposure bias of multilayer more all satisfies the off normal tolerance.
The manufacture method of the circuit board that the present technique scheme provides; In the process of making; The deviation that can detect exposure and develop, thus can avoid because the circuit zone that the circuit board surface that the exposure and the deviation of developing are need not expose exposes the circuit board inflow successive process that the deviation that causes does not meet the demands, and cause the short circuit in circuit board detecting or the use; Thereby can promote the making dose rate of circuit board, reduce the production cost of circuit board.
It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.