CN102244985B - Processing method of surface-mounted pads on thick copper circuit board - Google Patents
Processing method of surface-mounted pads on thick copper circuit board Download PDFInfo
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Abstract
The invention discloses a processing method of surface-mounted pads on a thick copper circuit board. The processing method comprises the following steps: S01. patterning an external layer for the first time; 2. etching the external layer for the first time; 3. patterning the external layer for the second time; 4. etching the external layer for the second time; and 5. manufacturing a solder mask bridge among the surface-mounted pads by a fractional solder resisting method. The processing method has the beneficial effects that the surface-mounted pads are manufactured by a partitioned etching method, which strengthens size control of the surface-mounted pads and meets the design requirements; and the solder mask bridge among the surface-mounted pads are manufactured by utilizing the fractional solder resisting method so that the solder mask bridge and the circuit board are firmly connected together and are not easily separated from each other.
Description
Technical field
The present invention relates to the thick copper circuit board manufacture field, relate in particular to a kind of processing method of surface-mounted pads on thick copper.
Background technology
Thick copper circuit board: the thick printed wiring board more than or equal to 3OZ of copper;
OZ: the abbreviation of symbol ounce, Chinese are called " ounce ", are unit of measurement made in Great Britain, 1 ounce=28.35 grams, in wiring board, the 1OZ meaning is that on the area of 1 square feet, the weight of average Copper Foil is 28.35g, represents the average thickness of Copper Foil with the weight of unit are.
Surface label: be used for the pad that mounts with components and parts on wiring board, because the top of surface label is to need contact with components and parts conducting parts, in order to guarantee to conduct electricity the integrality of power or signal transmission, the size that the surface label line pushes up is subjected to strict control;
The 10mil/10mil surface label: the width that refers to surface label is 10mil, and spacing is also 10mil.
Thick copper coin is used in powerful power module field, and the market demand is increasing.And along with the increase of the power of components and parts, the thick requirement of the copper of thick copper coin is also more and more higher.But because the size of many components and parts is fixing, so its size to the surface label on the wiring board of using is also relatively fixing.The conventional machining method is: → outer graphics → outer etching → silk-screen welding resistance → contraposition/exposure → development → welding resistance curing →, wiring board state corresponding to each flow process as shown in Figure 1, according to the processing of conventional machining method, the surface label size can only control to 7mil usually, does not reach its tolerance; Thereby cause mounting area and cause underpower or the inadequate defective of signal not, cause great product defects.For the surface label of 10mil/10mil, need to make the welding resistance bridge between surface label, on the thick copper circuit board more than 4OZ, adopt conventional processing method can't process the surface label of this 10mil/10mil; In addition, the undersized welding resistance bridge of processing is also very difficult between thick copper coin surface label, and because the printing ink of silk-screen is thick, the exposure of the bottom of printing ink is incomplete, and the welding resistance bridge just is very easy to peel off, and then causes product the risk of tin short circuit easily to occur connecting.
On October 13rd, 2010, disclosed application number was that 200910029762.3 Chinese invention patent application relates to a kind of thick copper circuit board and circuit etching and solder-resisting manufacturing methods, be partially submerged in contact-making surface in contacted heat conductive insulating layer with the contacted thick copper circuit layer of each heat conductive insulating layer in wiring board, the making of this structure is produced thick copper circuit layer by respectively etched mode being carried out on the two sides of super thick Copper Foil, solves the circuit etching problem of super thick Copper Foil; Adopt the prepreg of high resin content as the heat conductive insulating layer, heat conductive insulating layer segment after lamination is packed in the circuit gap of thick copper circuit layer.The method is directly carried out etching to Copper Foil and is pressed in the wiring board substrate again, and difficulty of processing is larger.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of processing method of surface-mounted pads on thick copper, realizes the processing of surface-mounted pads on thick copper, especially the processing of the thick 5OZ of copper, 10mil/10mil surface label.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of processing method of surface-mounted pads on thick copper is provided, and described thick copper circuit board comprises surface label graphics field and line pattern zone, and described processing method comprises step:
S01: outer graphics for the first time: cover line pattern zone and surface label graphics field with dry film, expose the Copper Foil part that the line pattern zone need to etch away after overexposure, development;
S02: outer etching for the first time: etching is carried out in the line pattern zone, the Copper Foil that exposes in step S01 is etched away, form circuit and the first etching region;
S03: outer graphics for the second time: cover circuit pack and the unprocessed surface label graphics field in manufactured line pattern zone with dry film, through overexposure, develop after the exposing surface pinup picture shape zone Copper Foil part that need to etch away;
S04: outer etching for the second time: etching was carried out in effects on surface pinup picture shape zone, the Copper Foil that exposes in step S03 is etched away, cross the Copper Foil that stays after etching and form surface label, zone between adjacent two surface labels becomes the second etching region, and the zone except surface label and the second etching region is the 3rd etching region.
Wherein, after step S04, also comprise further the step of making welding resistance bridge between surface label, between described making surface label, the step of welding resistance bridge comprises:
S201: silk-screen welding resistance for the first time: at the PCB surface ink for screen printing, control ink thickness at 30 μ m～40 μ m;
S202: the exposure of contraposition for the first time: wiring board the first etching region, the second etching region and the 3rd etching region are exposed;
S203: develop for the first time: wiring board is put into developer solution develop;
S204: welding resistance is solidified for the first time;
S205: silk-screen welding resistance for the second time: at the PCB surface ink for screen printing;
S206: the exposure of contraposition for the second time: wiring board the first etching region and the 3rd etching region are exposed;
S207: second development: wiring board is put into developer solution develop;
S208: welding resistance is solidified for the second time.
Wherein, in step S03, the partial width specific surface that the surface label zone the covers large 7mil of meter width that is sticked.
Wherein, in step S04, etching factor is 4.0～5.0.
Wherein, in step S04, etching solution spray pressure is 3.2Kgf/cm
2～3.8Kgf/cm
2
Wherein, in step S04, etching solution spray pressure is 3.5Kgf/cm
2
Wherein, in step S203, developing time is 80～100s.
Wherein, in step S201, silk-screen mesh number is 51T/CM
2, ink viscosity is 80PaS.
Wherein, in step S205, silk-screen mesh number is 43T/CM
2, ink viscosity is 150PaS.
Wherein, in step S02, etching factor is 3.0～3.5, and etching solution spray pressure is 2Kgf/cm
2
the invention has the beneficial effects as follows: the etching forming circuit and the surface label that are different from prior art make the surface label size less, cause mounting area not and the inadequate defective of underpower or signal, processing method of the present invention adopts the subregion etching, etching is carried out respectively in effects on surface pinup picture shape zone and other graphics fields, owing to independent effects on surface pinup picture shape zone carrying out etching and processing, be beneficial to the process control to this key area processing, the accurate dimensional accuracy in the controlled working process, increase the size between surface label size and surface label, satisfy the design size requirement, electronic devices and components mount area and increase, mount reliable, can effectively guarantee electric property.
Further, the present invention also comprises the step of making welding resistance bridge between surface label, be different from silk-screen welding resistance in prior art, because printing ink thick bottom exposure not exclusively causes the welding resistance bridge easily to come off, the present invention adopts the method for substep silk-screen welding resistance to make welding resistance bridge between surface label, focuses on forming for the first time the welding resistance bridge between surface label during silk-screen, owing to controlling printing ink at less thickness, can fully expose in the printing ink bottom, the welding resistance bridge that develops after solidifying is not easy to peel off, and reliability is high.
Adopt processing method of the present invention, in actual production, successfully realized the processing of surface-mounted pads on thick copper, the batch machining of 3mil welding resistance bridge between the thick 5OZ of especially outer copper, 10mil/mil surface label and surface label.
Description of drawings
Fig. 1 is wiring board view corresponding to each flow process of prior art processing method;
Fig. 2 is the process chart of processing method of the present invention;
Fig. 3 is PCB surface pinup picture shape zone state schematic diagram corresponding to each flow process of processing method of the present invention.
Embodiment
By describing technology contents of the present invention, structural feature in detail, being realized purpose and effect, below in conjunction with execution mode and coordinate accompanying drawing to be explained in detail, and following embodiment is with the thick copper coin of 5OZ, the 10mil/mil surface label is the example explanation, certainly, described surface-mounted pads on thick copper processing aspect is not limited to the wiring board of the specification of lifting, and it also can be applicable in processing as thick copper circuit board surface labels such as 3OZ, 4OZ, 6OZ.
See also Fig. 2 and Fig. 3, the invention provides a kind of processing method of surface-mounted pads on thick copper, the thick copper circuit board surface comprises surface label graphics field and line pattern zone, and the technological process of processing method is:
S01: outer graphics for the first time: cover line pattern zone and surface label graphics field 1 with dry film 2, expose the Copper Foil part that the line pattern zone need to etch away after exposure, development.In this step to before the circuit board to explosure; need to make corresponding exposure film; this exposure film is not exposed the dry film that wiring board when exposure hides the Copper Foil part that need to etch away in the line pattern zone; and the dry film of all the other zones, line pattern zone and surface label graphics field is exposed; after development; this line pattern is not dissolved away by the dry film of exposure area in the zone, expose Copper Foil, and other regional dry films left behind through after exposure imagings the effect of Copper Foil being played protection.
S02: outer etching for the first time: etching is carried out in the line pattern zone, and the Copper Foil that will expose etches away, and forms circuit and the first etching region; In this step, spray wiring board with etching solution, the etched liquid of the Copper Foil that exposes etches away, and residually on wiring board has the Copper Foil in dry film zone can not etch away by etched liquid by the dry film protection.In one embodiment, controlling for the first time, outer etched etching factor is 3.0～3.5; Etching solution spray pressure is controlled to be 1.8Kgf/cm
2～2.2Kgf/cm
2, specifically be chosen as 2.0Kgf/cm
2
S03: outer graphics for the second time: cover circuit pack and the unprocessed surface label graphics field 1 in manufactured line pattern zone with dry film 2, through exposure, develop after the exposing surface pinup picture shape zone Copper Foil part that need to etch away.In this step; S03 is similar with step; before the circuit board to explosure; need to make corresponding exposure film; the Copper Foil part that when this exposure film makes the wiring board exposure, the surface label graphics field need to etch away is not exposed; and make other regional exposures of line pattern zone and surface label graphics field; after development; the dry film in the zone of this surface label graphics field unexposed portion is dissolved away; expose Copper Foil, and other regional dry films left behind through after exposure imaging the effect of Copper Foil being played protection.
S04: outer etching for the second time: etching was carried out in effects on surface pinup picture shape zone, the Copper Foil that will expose in pinup picture shape zone, exposure imaging rear surface etches away, thereby forms the second etching region 12, the 3rd etching region 13 except surface label 11 and the second etching region 12 between surface label 11, surface label; In this step, adopt the etching solution of high spray pressure to carry out repeatedly etching to the Copper Foil that exposes, cross the Copper Foil that stays after etching and form surface label 11.In one embodiment, control etching factor between 4.0～5.0; In one embodiment, etching solution spray pressure is 3.2Kgf/cm
2～3.8Kgf/cm
2In a specific embodiment, etching solution spray pressure is controlled to be 3.5Kgf/cm
2
In the present invention, other graphics field subregions beyond effects on surface pinup picture shape zone and surface label graphics field carry out etching, and effects on surface pinup picture shape zone carried out etching, reach the dimensional requirement of control surface subsides width 10mil and surface label spacing 10mil.In one embodiment, in step S03, the compensation of 7mil is strengthened in effects on surface pinup picture shape zone, and the surface label zone that makes that dry film covers guarantees that greater than the specified requirement of surface label zone the final surface label size that forms can be less than designing requirement.
Further, the present invention also is included in the step of making the welding resistance bridge between surface label after step S04, and its technological process is:
S201: silk-screen welding resistance for the first time: at PCB surface ink for screen printing 3, control printing ink 3 thickness at 30 μ m～40 μ m; Because ink thickness is less, can fully expose in printing ink bottom.In one embodiment, the silk screen mesh number that uses of this step is 51T/CM
2, ink viscosity is 80PaS.
S202: the exposure of contraposition for the first time: will expose after exposure film and wiring board contraposition, and the corresponding surface label of described exposure film graphics field is provided with the welding resistance bridge, the lip-deep printing ink of surface label does not expose, and remainder (comprising the surface label graphics field part corresponding with the welding resistance bridge of exposure film) is fully exposed.Owing to controlling printing ink 3 thickness in step S201 at 30 μ m～40 μ m, thereby the printing ink of welding resistance pars basilaris pontis can fully be exposed, and welding resistance bridge thickness is also little, overcome in prior art the welding resistance pars basilaris pontis and failed that abundant exposure is easily peeled off and larger-size defective.
S203: develop for the first time: wiring board is put into developer solution develop, the lip-deep printing ink of surface label is developed, and line pattern is regional, the printing ink of the welding resistance bridge corresponding region of surface label graphics field and exposure film is owing to fully being exposed, can not be developed, form welding resistance bridge 31 at the second etching region 12.In one embodiment, for reaching reasonable development effect, the control developing time is 80s～100s, can guarantee that welding resistance bridge 31 does not drop.
S204: welding resistance is solidified for the first time: solidify the welding resistance bridge 31 that forms in previous step.
S205: silk-screen welding resistance for the second time: ink for screen printing in the circuit board guarantees that the thickness of printing ink meets design requirement.In one embodiment, this step adopts 43T/CM
2The twine printing ink, ink viscosity is controlled to be 150PaS.
S206: contraposition for the second time exposure: guarantee that surface label 11 and welding resistance bridge 31 places are not exposed, the remainder exposure, thus guarantee fully to be exposed in all the other zones of surface label graphics field and line pattern zone, can reach requirement to guarantee final solder mask thickness.
S207: second development: wiring board is put in developer solution developed, the printing ink that is exposed on wiring board is developed.
S208: welding resistance is solidified for the second time: the solder mask 41 that on the curing circuit plate, step S11 forms.
In the present invention, first make the welding resistance bridge between surface label 11, ink thickness is less during silk-screen for the first time, in exposure process, the printing ink of bottom can fully be exposed, and after developing and solidifying, the welding resistance bridge of formation is more firm, be difficult for coming off from wiring board, formed so reliable welding resistance bridge between surface label.
the etching forming circuit and the surface label that are different from prior art make the surface label size less, cause mounting area not and the inadequate defective of underpower or signal, processing method of the present invention adopts the subregion etching, etching is carried out respectively in effects on surface pinup picture shape zone and other graphics fields, owing to independent effects on surface pinup picture shape zone carrying out etching and processing, be beneficial to the process control to this key area processing, the accurate dimensional accuracy in the controlled working process, increase the size between surface label size and surface label, satisfy the design size requirement, electronic devices and components mount area and increase, mount reliable, can effectively guarantee electric property.
Further, the present invention also comprises the step of making welding resistance bridge between surface label, be different from silk-screen welding resistance in prior art, due to printing ink thick bottom exposure not exclusively cause the welding resistance bridge easily to come off and welding resistance bridge size large, the present invention adopts the method for substep silk-screen welding resistance to make welding resistance bridge between surface label, focus on forming for the first time the welding resistance bridge between surface label during silk-screen, owing to controlling printing ink at less thickness, can fully expose in the printing ink bottom, welding resistance bridge after develop solidifying be not easy to peel off and size little, reliability is high.Adopt processing method of the present invention, in actual production, successfully realized the batch machining of 3mil welding resistance bridge between the thick 5OZ of outer copper, 10mil/mil surface label and surface label.
The above is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in scope of patent protection of the present invention.
Claims (10)
1. the processing method of a surface-mounted pads on thick copper, is characterized in that, described thick copper circuit board comprises surface label graphics field and line pattern zone, and described processing method comprises step:
S01: outer graphics for the first time: cover line pattern zone and surface label graphics field with dry film, expose the Copper Foil part that the line pattern zone need to etch away after overexposure, development;
S02: outer etching for the first time: etching is carried out in the line pattern zone, the Copper Foil that exposes in step S01 is etched away, form circuit and the first etching region;
S03: outer graphics for the second time: cover circuit pack and the unprocessed surface label graphics field in manufactured line pattern zone with dry film, through overexposure, develop after the exposing surface pinup picture shape zone Copper Foil part that need to etch away;
S04: outer etching for the second time: etching was carried out in effects on surface pinup picture shape zone, the Copper Foil that exposes in step S03 is etched away, cross the Copper Foil that stays after etching and form surface label, zone between adjacent two surface labels becomes the second etching region, and the zone except surface label and the second etching region is the 3rd etching region.
2. the processing method of surface-mounted pads on thick copper according to claim 1 is characterized in that: after step S04, also comprise further the step of making welding resistance bridge between surface label, between described making surface label, the step of welding resistance bridge comprises:
S201: silk-screen welding resistance for the first time: at the PCB surface ink for screen printing, control ink thickness at 30 μ m ~ 40 μ m;
S202: the exposure of contraposition for the first time: wiring board the first etching region, the second etching region and the 3rd etching region are exposed;
S203: develop for the first time: wiring board is put into developer solution develop;
S204: welding resistance is solidified for the first time;
S205: silk-screen welding resistance for the second time: at the PCB surface ink for screen printing;
S206: the exposure of contraposition for the second time: wiring board the first etching region and the 3rd etching region are exposed;
S207: second development: wiring board is put into developer solution develop;
S208: welding resistance is solidified for the second time.
3. the processing method of surface-mounted pads on thick copper according to claim 1 is characterized in that: in step S03, and the partial width specific surface that the surface label zone the covers large 7mil of meter width that is sticked.
4. the processing method of surface-mounted pads on thick copper according to claim 2, it is characterized in that: in step S04, etching factor is 4.0 ~ 5.0.
5. the processing method of surface-mounted pads on thick copper according to claim 3 is characterized in that: in step S04, etching solution spray pressure is 3.2Kgf/cm
2~ 3.8Kgf/cm
2
6. the processing method of surface-mounted pads on thick copper according to claim 4 is characterized in that: in step S04, etching solution spray pressure is 3.5Kgf/cm
2
7. the processing method of according to claim 2,4 or 6 described surface-mounted pads on thick coppers, it is characterized in that: in step S203, developing time is 80 ~ 100s.
8. the processing method of surface-mounted pads on thick copper according to claim 7, it is characterized in that: in step S201, silk-screen mesh number is 51T/CM
2, ink viscosity is 80PaS.
9. the processing method of surface-mounted pads on thick copper according to claim 8, it is characterized in that: in step S205, silk-screen mesh number is 43T/CM
2, ink viscosity is 150PaS.
10. the processing method of surface-mounted pads on thick copper according to claim 9, it is characterized in that: in step S02, etching factor is 3.0 ~ 3.5, etching solution spray pressure is 2Kgf/cm
2
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| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
| CN103354702B (en) * | 2013-07-26 | 2016-05-25 | 东莞生益电子有限公司 | The circuit board that microwave circuit board manufacturing method and the method make |
| CN105530762B (en) * | 2014-09-29 | 2018-08-07 | 深南电路有限公司 | Resistance welding processing method and circuit board |
| CN105228363A (en) * | 2015-08-28 | 2016-01-06 | 江门崇达电路技术有限公司 | A kind of manufacture method of solder mask |
| CN105323974A (en) * | 2015-10-29 | 2016-02-10 | 深圳市五株科技股份有限公司 | Manufacture method of thick copper plate solder mask |
| CN106793500B (en) * | 2016-11-15 | 2021-11-26 | 智恩电子(大亚湾)有限公司 | Circuit board character printing method |
| CN106852033A (en) * | 2017-04-06 | 2017-06-13 | 昆山苏杭电路板有限公司 | High precision part very high current printed circuit board processing method |
| CN107708322B (en) * | 2017-10-30 | 2021-06-15 | 大连崇达电路有限公司 | Rework repairing method for solder resisting bridge falling |
| CN109618504B (en) * | 2019-01-31 | 2023-12-19 | 厦门弘信电子科技集团股份有限公司 | Jointed board structure of single-sided board and manufacturing method |
| CN112469204A (en) * | 2019-09-06 | 2021-03-09 | 庆鼎精密电子（淮安）有限公司 | Circuit board and method for manufacturing the same |
| CN111935907A (en) * | 2020-06-24 | 2020-11-13 | 惠州市金百泽电路科技有限公司 | Circuit board processing method for reducing galvanic effect |
| CN114466516B (en) * | 2022-01-27 | 2024-03-12 | 盐城维信电子有限公司 | Manufacturing method of vehicle-mounted flexible board and vehicle-mounted flexible board |
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