CN105530762B - Resistance welding processing method and circuit board - Google Patents
Resistance welding processing method and circuit board Download PDFInfo
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- CN105530762B CN105530762B CN201410514265.3A CN201410514265A CN105530762B CN 105530762 B CN105530762 B CN 105530762B CN 201410514265 A CN201410514265 A CN 201410514265A CN 105530762 B CN105530762 B CN 105530762B
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- circuit board
- solder resist
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- colloid
- protective film
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Abstract
The invention discloses a kind of resistance welding processing method and circuit boards, fall green oil with the welding resistance solved the problems, such as in circuit board fabrication.In some feasible embodiments of the invention, method includes：In circuit board surface, the first area covering protection film of solder resist need not be set；It needs the second area that solder resist is set that colloid is set in circuit board surface, and removes the protective film；Solder resist is set in the second area of circuit board surface, the solder resist is covered on the colloid.
Description
Technical field
The present invention relates to circuit board technology fields, and in particular to a kind of resistance welding processing method and circuit board.
Background technology
In field of circuit boards, various surface coating applications are more and more.Described surface coating includes coating
Solder resist, such as green oil.And it is a still unsolved problem in current circuit board processing to fall green oil problem.Fall the master of green oil
Want the reason is that the lateral erosion of green oil cause chemical medicinal liquid attack green oil below circuit copper face, cause green oil hanging, and then fall green oil.
Attempt at present to solve the problems, such as this there are many technique.
A kind of existing solution is that super coarse surface processing is walked before welding resistance, green oil and copper face binding force is improved, with one
Determine to reduce green oil in degree.Another existing solution is to walk welding resistance technique twice, after before a welding resistance covering
Welding resistance can also allow a preceding welding resistance not fall green oil, to reduce green oil to a certain extent even if falling green oil.But it is above-mentioned
The effect of two methods is limited, needs the feelings such as long-time chemical immersion after fine and closely woven circuit and the windowing of small pad and welding resistance processing
Under condition, however it remains it is more serious fall green oil problem, moreover, above-mentioned first method carry out super coarse surface processing can reduce
Circuit board surface copper thickness makes unqualified thickness lattice, the technique of welding resistance twice of above-mentioned second method there is the not clean wind that develops
Danger.
To sum up, method used by solving the problems, such as green oil is attempted in the prior art, and effect is less apparent on the whole, no
It is avoided that green oil problem.
Invention content
A kind of resistance welding processing method of offer of the embodiment of the present invention and circuit board, are fallen green with the welding resistance solved in circuit board fabrication
Oily problem.
First aspect present invention provides a kind of resistance welding processing method, including：In circuit board surface, solder resist need not be set
First area covering protection film；Need the second area that solder resist is set that colloid is set in circuit board surface, and described in removal
Protective film；Solder resist is set in the second area of circuit board surface, the solder resist is covered on the colloid.
Second aspect of the present invention provides a kind of circuit board, is arranged between the line pattern and solder resist of the circuit board surface
There is colloid.
Therefore the embodiment of the present invention uses and needs the region that solder resist is arranged that colloid is first arranged in circuit board surface,
Then welding resistance processing is carried out again, solder resist is made no longer to directly overlay circuit board surface, but is covered in the technical side on colloid
Case achieves following technique effect：
The present invention program, thus can be by colloid pair due to being provided with one layer of colloid on the line pattern below solder resist
Line pattern is protected, and the line pattern under solder resist is avoided to be contacted with the chemical medicinal liquid during following process, it is therefore prevented that
Line pattern is corroded, and then avoids solder resist and fall off, and solves the problems, such as to fall green oil in the prior art.Also, it is preferred that real
It applies in example, by carrying out interference design to colloid, realizes and line pattern under solder resist is completely covered and protects, Ke Yicong
Fundamentally prevent to fall green oil problem caused by lateral erosion.
In addition, the present invention program need not carry out super roughening treatment to circuit board surface, circuit board surface copper will not be reduced
The thickness of foil and hole copper.The welding resistance processing that the present invention program need not also be repeated, is not in caused by repeating welding resistance
Develop not clean problem.
Description of the drawings
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of flow diagram of resistance welding processing method provided in an embodiment of the present invention；
Fig. 2 a and 2b are the top view and section view of circuit board in the embodiment of the present invention respectively；
Fig. 2 c are the schematic diagrames that protective film is arranged in the embodiment of the present invention on circuit boards；
Fig. 2 d are the schematic diagrames that colloid is arranged in the embodiment of the present invention on circuit boards；
Fig. 2 e are the schematic diagrames that solder resist is arranged in the embodiment of the present invention on circuit boards.
Specific implementation mode
A kind of resistance welding processing method of offer of the embodiment of the present invention and circuit board, are fallen green with the welding resistance solved in circuit board fabrication
Oily problem.
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
The every other embodiment that member is obtained without making creative work should all belong to the model that the present invention protects
It encloses.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Referring to FIG. 1, the embodiment of the present invention provides a kind of resistance welding processing method, it may include：
110, the first area covering protection film of solder resist need not be set in circuit board surface.
After line pattern completion of processing on circuit board, it usually needs surface coating is carried out to circuit board, including：Butt welding
Some regional areas such as disk (PAD) are coated into row metal, such as plating nickel gold, prevent pad from being aoxidized or being improved solderability；Butt welding
Line pattern and base material other than the regional areas such as disk carry out welding resistance coating, one layer of solder resist are arranged, to line pattern and base material
It is protected, prevents line pattern from being aoxidized.
Circuit board sectional view shown in circuit board vertical view and Fig. 2 b shown in a is please referred to Fig.2, the surface of circuit board 20 can
It is divided into the first area 21 that solder resist need not be set and needs the second area 22 that solder resist is set, wherein wraps first area
Include the orifice ring 2103 etc. of pad 2101 and via hole 2102 and via hole 2102；Second area include line pattern 2201 with
And base material etc..For the ease of identification, slightly below pad 2101 and the orifice ring 2103 for drawing the height of line pattern 2201 in figure, but
It is it should be appreciated that in practical application, the height of line pattern 2201 need not be less than pad 2101 and orifice ring 2103.
In this step, optionally, the processing such as brown are carried out to circuit board 20 first, to improve the coarse of 20 surface of circuit board
Degree increases the binding force of subsequent conditioning circuit plate surface (such as line pattern 2201) and colloid.Then, as shown in Figure 2 c, in circuit
Protective film 23, such as dry film is arranged in plate surface, and the first area 21 to solder resist need not be arranged carries out covering protection, with convenient
Subsequently needing the second area 22 that solder resist is set that colloid is set.The step of setting protective film 23, may particularly include：In electricity
After 20 full surface covering protection film 23 of road plate, window 2301 is opened up on protective film 23 so that first area 21 is by protective film 23
Covering, but second area 22 is revealed from window 2301.Wherein, described windowing can pass through exposed and developed realization.
In preferred embodiment, being completely covered and protecting to second area 22 is realized in order to enable colloid subsequently is arranged,
Interference design can be used in this step and open up window 2301 on protective film 23, the size of window 2301 is made to be more than second area 22
Design size.For example, in line pattern 2201 towards the direction of base material, i.e., in the width direction of line pattern 2201 so that
Big 4 Mill (mil) of single side size of window 2301；In the junction of line pattern 2201 and pad 2101 or orifice ring 2103, court
To on the direction of pad 2101 or orifice ring 2103 so that big 2 Mill (mil) of single side size of window 2301；In this way, making subsequently to set
When setting colloid, second area 22 can be completely covered in colloid, implement to protect completely to the line pattern 2201 of second area 22.
120, it needs the second area that solder resist is set that colloid is set in circuit board surface, removes protective film.
In this step, as shown in Figure 2 d, colloid 24 is set on 20 surface of circuit board, colloid 24 is made to pass through on protective film 23
Window 2301 is covered in second area 22.In preferred embodiment, vacuum screen printing technique can be used in 20 surface whole plate silk of circuit board
Colloid 24 can control 24 thickness of colloid between 5-10 microns, after silk-screen, by 24 baking-curing of colloid.
After silk-screen colloid 24, the mission of protective film 23 is completed, and can remove protective film 23, meanwhile, it will be on protective film 23
Colloid 24 also remove together.In concrete application, sandbag+polish-brush technique can be used, by 23 surface of protective film 23 and protective film
Colloid 24 is removed totally, then is used and removed membrane process, it is ensured that surface protection film removal is clean, and ensures not residual in via hole 2102
Stay colloid and protective film residue.So far, protective film 23 is only covered on second area 22, and because interference designs, protective film
23 coverage area may be slightly larger than the design size of second area 22, be carried out completely to the line pattern 2201 in second area 22
Covering protection.
In the embodiment of the present invention, described colloid 24 can be specifically organic matter or siliceous colloid with epoxy resin-matrix
Deng the substance of anti-chemicals removal can be played after solidification.
130, solder resist is set in the second area of circuit board surface, solder resist is covered on colloid.
In this step, as shown in Figure 2 e, solder resist 25 is arranged in the second area on 20 surface of circuit board.Wherein, setting resistance
The step of solder flux 25, may include：20 full surface of circuit board coat solder resist 25 after carry out exposure imaging, by second area 22 with
Outer solder resist 25 removes, and only retains solder resist 25 in second area 22.
In the embodiment of the present invention, due to pre-setting colloid 24 on second area 22, then the resistance that is arranged in this step
Solder flux 25 can be completely covered on colloid 24, rather than directly overlay 20 surface of circuit board.In addition, when due to setting colloid 24
Interference design is used, the support size for the solder resist 25 being arranged in this step is less than the support size of colloid 24,24 side of colloid
Solder resist 25 will not be covered above edge.Then, set in the process and other subsequent processes of setting solder resist 25
Colloid 24 covering protection to 22 line pattern 2201 of second area may be implemented, prevent chemical medicinal liquid contact and etching lines
Figure 2201, so can avoid because line pattern 2201 be corroded cause solder resist 25 hanging caused by solder resist 25 fall off.
Therefore the embodiment of the invention discloses a kind of resistance welding processing methods, this method is used to be needed in circuit board surface
Colloid is first arranged in the region that solder resist is arranged, and then carries out welding resistance processing again, solder resist is made no longer to directly overlay circuit board
Surface, but it is covered in the technical solution on colloid, achieve following technique effect：
The present invention program, thus can be by colloid pair due to being provided with one layer of colloid on the line pattern below solder resist
Line pattern is protected, and the line pattern under solder resist is avoided to be contacted with the chemical medicinal liquid during following process, it is therefore prevented that
Line pattern is corroded, and then avoids solder resist and fall off, and solves the problems, such as to fall green oil in the prior art.Also, it is preferred that real
It applies in example, by carrying out interference design to colloid, realizes and line pattern under solder resist is completely covered and protects, Ke Yicong
Fundamentally prevent to fall green oil problem caused by lateral erosion.
In addition, the present invention program need not carry out super roughening treatment to circuit board surface, circuit board surface copper will not be reduced
The thickness of foil and hole copper.The welding resistance processing that the present invention program need not also be repeated is not in therefore to repeat welding resistance to cause
The not clean problem of development.
Embodiment two,
E is please referred to Fig.2, the embodiment of the present invention provides a kind of circuit board 20, the line pattern 2201 on 20 surface of circuit board
Colloid 24 is provided between solder resist 25.
Circuit board of the embodiment of the present invention can be used method disclosed in above-described embodiment one and be made, about the more of the circuit board
Explanation, please refer to the description in embodiment one.
More than, I of the embodiment of the present invention discloses a kind of circuit board, achieves following technique effect：
The present invention program is due to protecting line pattern provided with one layer of colloid on the line pattern below solder resist
Shield, thus can protect line pattern by colloid, during avoiding line pattern and the following process under solder resist
Chemical medicinal liquid contacts, it is therefore prevented that line pattern is corroded, and then avoids solder resist and fall off, and solves and falls green oil in the prior art
The problem of.Also, in preferred embodiment, by colloid carry out interference design, realize under solder resist line pattern it is complete
All standing and protection can fundamentally prevent to fall green oil problem caused by lateral erosion.
In addition, the present invention program need not carry out super roughening treatment to circuit board surface, circuit board surface copper will not be reduced
The thickness of foil and hole copper.The welding resistance processing that the present invention program need not also be repeated is not in therefore to repeat welding resistance to cause
The not clean problem of development.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for each method embodiment above-mentioned, for simple description, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should understand that, the present invention is not limited by described sequence of movement because according to
According to the present invention, certain steps may be used other sequences or be carried out at the same time.Next, those skilled in the art should also know that,
Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module
Must.
It is provided for the embodiments of the invention resistance welding processing method above and circuit board is described in detail, but is above real
The explanation for applying example is merely used to help understand the method and its core concept of the present invention, should not be construed as limiting the invention.
Those skilled in the art, according to the thought of the present invention, in the technical scope disclosed by the present invention, the change that can be readily occurred in
Change or replace, should be covered by the protection scope of the present invention.
Claims (7)
1. a kind of resistance welding processing method, which is characterized in that including：
In circuit board surface, the first area covering protection film of solder resist need not be set；
It needs the second area that solder resist is set that colloid is set in circuit board surface, and removes the protective film；
Solder resist is set in the second area of circuit board surface, the solder resist is covered on the colloid.
2. according to the method described in claim 1, it is characterized in that,
The first area includes the orifice ring of pad and via hole and the via hole；
The second area includes line pattern and base material.
3. according to the method described in claim 1, it is characterized in that, described the of solder resist need not be arranged in circuit board surface
One region overlay protective film includes：
After the full surface covering protection film of circuit board, window is opened up on the protective film so that the first area is described
Protective film covers, but the second area is revealed in the window.
4. according to the method described in claim 3, it is characterized in that, described open up window on the protective film and include：
Window is opened up on the protective film using interference design, the size of the window is made to be more than the design of the second area
Size.
5. according to the method described in claim 1, it is characterized in that, described need to be arranged the second of solder resist in circuit board surface
Colloid is arranged in region：
Using vacuum screen printing technique in circuit board surface whole plate silk gum body, control colloid thickness is between 5-10 microns, and by institute
State colloid baking-curing.
6. according to the method described in claim 5, it is characterized in that, the removal protective film includes：
The colloid of the protective film and silk-screen on the protective film is all removed.
7. according to any method in claim 1 to 6, which is characterized in that the second area in circuit board surface
Solder resist is set, and the solder resist, which is covered on the colloid, includes：
Exposure imaging is carried out after the full surface coating solder resist of circuit board, the solder resist other than the second area is removed, only
Retain solder resist in the second area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410514265.3A CN105530762B (en) | 2014-09-29 | 2014-09-29 | Resistance welding processing method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410514265.3A CN105530762B (en) | 2014-09-29 | 2014-09-29 | Resistance welding processing method and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105530762A CN105530762A (en) | 2016-04-27 |
| CN105530762B true CN105530762B (en) | 2018-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410514265.3A Active CN105530762B (en) | 2014-09-29 | 2014-09-29 | Resistance welding processing method and circuit board |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112638054A (en) * | 2019-10-09 | 2021-04-09 | 庆鼎精密电子（淮安）有限公司 | Manufacturing method of circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244985A (en) * | 2011-04-21 | 2011-11-16 | 深南电路有限公司 | Processing method of surface-mounted pads on thick copper circuit board |
| CN103124472A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Flex-rigid printed circuit board manufacturing method and flex-rigid printed circuit board |
| CN103313509A (en) * | 2013-04-24 | 2013-09-18 | 上舜电子科技（中国）有限公司 | Metal-based conducting circuit board and manufacturing method thereof |
| CN203368929U (en) * | 2013-05-30 | 2013-12-25 | 上海安费诺永亿通讯电子有限公司 | No-film flexible printed circuit board |
| CN103582322A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
-
2014
- 2014-09-29 CN CN201410514265.3A patent/CN105530762B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244985A (en) * | 2011-04-21 | 2011-11-16 | 深南电路有限公司 | Processing method of surface-mounted pads on thick copper circuit board |
| CN103124472A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Flex-rigid printed circuit board manufacturing method and flex-rigid printed circuit board |
| CN103582322A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN103313509A (en) * | 2013-04-24 | 2013-09-18 | 上舜电子科技（中国）有限公司 | Metal-based conducting circuit board and manufacturing method thereof |
| CN203368929U (en) * | 2013-05-30 | 2013-12-25 | 上海安费诺永亿通讯电子有限公司 | No-film flexible printed circuit board |
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| CN105530762A (en) | 2016-04-27 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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