CN203368929U - No-film flexible printed circuit board - Google Patents
No-film flexible printed circuit board Download PDFInfo
- Publication number
- CN203368929U CN203368929U CN 201320305566 CN201320305566U CN203368929U CN 203368929 U CN203368929 U CN 203368929U CN 201320305566 CN201320305566 CN 201320305566 CN 201320305566 U CN201320305566 U CN 201320305566U CN 203368929 U CN203368929 U CN 203368929U
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- fpc
- copper
- clad plate
- solder mask
- printed circuit
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a no-film flexible printed circuit board which mainly consists of a copper-clad plate, a solder mask layer, and a bonding layer. The solder mask layer covers one surface of the copper-clad plate. The other surface of the copper-clad plate covers the bonding layer. The solder mask layer is formed by screen printing ink or thin film materials of composite PET, PI and the like. The surface of the solder mask layer is provided with a micro bonding film. The other surface of the bonding layer is also provided with release paper, thereby further improving the composability of F-FPC and protection for the F-FPC. During the bonding and assembly process, the release paper is stripped from the bonding layer. The bonding and assembly combination of the F-FPC with other parts is completed through the bonding layer.
Description
Technical field
The utility model relates to the communication antenna field, relates in particular to a kind of F-FPC(Filmless Flexible Printed Circuit, without the film flexible printed circuit board).
Background technology
FPC(Flexible Printed Circuit, flexible printed circuit board) be the most complicated in the wiring board product, that purposes is the widest is a kind of, particularly because it has the characteristics such as frivolous, flexible, low-voltage, low consumpting power, can be along with size and the shape of electronic product inner space are carried out three-dimensional three-dimensional wiring, therefore, be widely used in the products such as notebook computer, liquid crystal display, hard disk, printer and automobile.
In the manufacturing process of prior art FPC, common FPC generally has single face or double sided board, and one deck Copper Foil or two-layer Copper Foil and substrate are compound, and then gum, and centre is bondd by a kind of PUR; Take double-deck FPC as example, as shown in Figure 1, be respectively arranged with copper foil layer 120, copper foil layer 130, adhesive-layer 140, adhesive-layer 150 and cover layer 160, cover layer 170 on the two sides of substrate layer 110, two-layer copper foil layer 120 and copper foil layer 130 hot curing respectively are compounded in the upper and lower surface of substrate layer 110, each cover layer 160 and cover layer 170 all adhesive-layer 140 and the adhesive-layer 150 by separately cover on corresponding copper foil layer 120 and copper foil layer 130, thereby form FPC.
And it is all thicker for the thickness that adds the FPC that is stamped substrate in prior art, characteristics when being difficult to meet frivolous and pliability and having relatively high expectations, in use, also can be restricted because of face shaping and the communication performance of communication products, and the cost of this kind of FPC is relatively high, the technique more complicated; Therefore, be necessary to propose that a kind of thickness is thinner, technique is simpler, and the lower FPC of cost.
The utility model content
In order to overcome the defect of prior art, reduce the cost of FPC, it is simple that the utility model aims to provide a kind of manufacture craft, and cost is lower and there is no a flexible printed circuit board of base material.
To achieve these goals, the utility model provides a kind of F-FPC, this F-FPC mainly is comprised of copper-clad plate, solder mask and adhesive layer, described solder mask covers the one side of described copper-clad plate, and the another side of described copper-clad plate covers described adhesive layer, by described adhesive layer, described F-FPC and miscellaneous part are assembled to laminating, thereby realize the function of F-FPC.
Preferably, described adhesive layer is a double faced adhesive tape, the one side of described double faced adhesive tape is fitted with described copper-clad plate, the another side of described double faced adhesive tape covers a release liners, by tearing, described release liners is mounted described F-FPC and miscellaneous part, and the thickness of described double faced adhesive tape is 10-30um, thus the integral thickness of reduction F-FPC.
Preferably, described solder mask is attached in described copper-clad plate, by other thin-film materials such as ink for screen printing or compound PET or PI in described copper-clad plate, forms described solder mask, and can be at the enterprising electroplating of described copper-clad plate, form an electrodeposited coating, make to facilitate this F-FPC to be connected with other elements.
Preferably, the surface of described solder mask also is provided with an enhancing film, for improving the intensity of F-FPC, and guarantees that F-FPC is not damaged and is convenient to the follow-up operation that mounts in mounting process.
Preferably, described enhancing film is micro-mucous membrane, and this micro-mucous membrane has good chemical-resistance and resistance to elevated temperatures.
Preferably, described copper-clad plate is Copper Foil, and the thickness of described Copper Foil is 18um or 12um, and the thickness of described Copper Foil is not as limit.
Compared with prior art, the beneficial effects of the utility model are as follows:
1, the utility model is owing to passing through directly to adopt Copper Foil and double faced adhesive tape laminating, compare and do not need base material with traditional FPC, greatly reduce the thickness of FPC, make its thickness much smaller than common FPC, the thickness of this utility model is generally less than 0.1mm, thereby has met the requirement of communication products to FPC thickness; And the manufacture craft of this F-FPC is simple, decrease the cost in F-FPC manufacturing process, make its range of application more extensive.
2, the utility model can complete by above two kinds of manufacture crafts, has not only enriched the F-FPC fabrication processing, and has increased the material selection scope; Difference due to copper-clad plate, can select the metal except Copper Foil to be made, the unavoidable making difficulty that occurs in manufacturing process, therefore, the implementation method of useful different process realizes the making of F-FPC, thus the possibility of the making of the F-FPC of raising unlike material.
The accompanying drawing explanation
The structural representation that Fig. 1 is FPC in prior art;
The exploded perspective view of the F-FPC structure that Fig. 2 is the utility model enforcement;
The schematic cross-section of the F-FPC structure that Fig. 3 is the utility model enforcement;
Fig. 4 is the utility model F-FPC structure exploded perspective view;
Fig. 5 is the utility model F-FPC structural section schematic diagram.
The symbol list:
110-substrate layer, 120-copper foil layer, 130-copper foil layer, 140-adhesive-layer, 150-adhesive-layer, 160-cover layer, 170-cover layer;
The 201-copper-clad plate, 202-solder mask, 203-adhesive layer, 204-release liners, the micro-mucous membrane of 205-.
embodiment:
Referring to the accompanying drawing that the utility model embodiment is shown, hereinafter will describe in more detail the utility model.Yet the utility model can be with realizations such as multi-form, specifications, and should not be construed as the restriction of the embodiment be subject in this proposition.On the contrary, it is abundant and complete open in order to reach proposing these embodiment, and makes more relevant those skilled in the art person understand scope of the present utility model fully.In these accompanying drawings, for clearly visible, may zoom in or out relative size.
As shown in Fig. 4-5, the F-FPC that the utility model provides, this F-FPC is comprised of copper-clad plate 201, solder mask 202 and adhesive layer 203, and solder mask 202 covers the one side of copper-clad plate 201, and the another side of copper-clad plate 201 covers adhesive layer 203; And this F-FPC is mounted F-FPC to be connected with miscellaneous part by adhesive layer 203, thereby realize the function of F-FPC.By this copper-clad plate directly and adhesive layer bonding, and be connected with other elements by adhesive layer, and this copper-clad plate is thinner one deck Copper Foil, and need on Copper Foil, do not add substrate, thereby greatly reduce the thickness of flexible printed circuit board.
The concrete preparation method of this F-FPC, can be prepared by two kinds of different techniques, wherein:
A kind of preparation method without the film flexible printed circuit board, comprise the steps:
(1) provide a copper-clad plate, the one side of copper-clad plate is bonding with the one side of adhesive layer;
(2) circuit etching shape in copper-clad plate;
(3) on the another side of copper-clad plate, ink for screen printing forms solder mask;
(4) carry out parcel plating on the another side of copper-clad plate.
The another kind of preparation method without the film flexible printed circuit board, comprise the steps:
(1) provide a copper-clad plate, the one side of copper-clad plate and an enhancing film are fitted;
(2) circuit etching figure in copper-clad plate;
(3) on the another side of copper-clad plate, ink for screen printing forms solder mask;
(4) carry out parcel plating on the another side of copper-clad plate;
(5) the enhancing film in copper-clad plate is peeled off, and copper-clad plate and adhesive layer is bonding.
In above-mentioned two kinds of methods that prepare without the film flexible printed circuit board, described solder mask can be the ink layer of silk-screen, can be also other film class materials such as PET, PI.
In actual application, in order to increase the toughness of F-FPC integral body, make it not fragile, concrete when attachment process, the utility model proposes two kinds of different preparation methods.
Embodiment 1
As shown in Figure 2 to Figure 3, a kind of F-FPC that the utility model provides, this F-FPC is comprised of copper-clad plate 201, solder mask 202 and adhesive layer 203, and wherein, solder mask 202 covers the one side of copper-clad plate 201, and the another side of copper-clad plate 201 covers adhesive layer 203; And this F-FPC is mounted F-FPC to be connected with miscellaneous part by adhesive layer 203, thereby realize the function of F-FPC.
Wherein, adhesive layer 203 is a double faced adhesive tape, the one side of double faced adhesive tape and copper-clad plate 201 laminatings, and another side covers release liners 204, and the thickness of double faced adhesive tape is 10-30um, and this thickness is as limit, thereby guarantees that the thickness of F-FPC generally is no more than 0.1mm; Solder mask 202 is attached in copper-clad plate 201, form solder mask 202 by ink for screen printing in copper-clad plate 201 or compound other thin-film materials, strengthening film is arranged on the surface of solder mask 202, thereby be convenient to F-FPC follow-up mount operation in use, release liners 204 is peeled off from the one side of adhesive layer 203, adhesive layer 203 is fitted whole F-FPC and miscellaneous part.
And copper-clad plate 201 is Copper Foil, there is no base material, thereby realize the flexible PCB without base material, and the thickness of Copper Foil is that 1/2OZ is 18um, or 1/3OZ is 12um; And the thickness of this Copper Foil can also be other thickness not as limit, can realize good conductivity and the overall performance of F-FPC.
Concrete, the implementation method of the F-FPC technique that the utility model provides, comprise the steps:
(1) provide a Copper Foil, the one side of Copper Foil is bonding with the one side of double faced adhesive tape;
(2) release liners is covered to the another side of double faced adhesive tape;
(3) circuit etching shape on Copper Foil;
(4) with ink for screen printing on the one side of double faced adhesive tape, do not form solder mask at Copper Foil;
(5) with the diverse location on the one side of double faced adhesive tape, do not carry out parcel plating at Copper Foil;
(6) cover the micro-mucous membrane of one deck on solder mask.
The F-FPC the utility model proposes is in actual application, due to Copper Foil or all available other metal materials or replacements of other thin-film materials of ink for screen printing, have certain variation in art production process, therefore, in order under different materials, better to realize that F-FPC, the utility model have proposed another different implementation method equally.
Embodiment 2
A kind of F-FPC that the utility model provides, this F-FPC comprises copper-clad plate 201, solder mask 202 and adhesive layer 203, and wherein, solder mask 202 covers the one side of copper-clad plate 201, and the another side of copper-clad plate 201 covers adhesive layer 203; And this F-FPC is mounted combination by adhesive layer 203 by F-FPC and miscellaneous part, thereby realize the function of F-FPC.
Wherein, adhesive layer 203 is a double faced adhesive tape, the one side of double faced adhesive tape and copper-clad plate 201 laminatings, and another side covers release liners 204, and the thickness of double faced adhesive tape is 10-30um, and this thickness is as limit, thereby guarantees that the thickness of F-FPC generally is no more than 0.1mm; Solder mask 202 is attached in copper-clad plate 201, form solder mask 202 by ink for screen printing in copper-clad plate 201 or compound other thin-film materials, strengthening film is arranged on the surface of solder mask 202, thereby be convenient to F-FPC follow-up mount operation in use, release liners 204 is peeled off from the one side of adhesive layer 203, made adhesive layer 203 whole F-FPC is connected to laminating with miscellaneous part.
And copper-clad plate 201 is Copper Foil, there is no base material, thereby realize the flexible PCB without base material, and the thickness of Copper Foil is that 1/2OZ is 18um, or 1/3OZ is 12um; And the thickness of this Copper Foil can also be other thickness not as limit, can realize good conductivity and the overall performance of F-FPC.
Concrete, the implementation method of the F-FPC technique that the utility model provides, comprise the steps:
(1) provide a Copper Foil, and cover micro-mucous membrane in the one side of Copper Foil;
(2) circuit etching figure on Copper Foil;
(3) on the another side of the Copper Foil that does not cover micro-mucous membrane, ink for screen printing forms solder mask;
(4) diverse location on the another side of the Copper Foil that does not cover micro-mucous membrane carries out parcel plating;
(5) micro-mucous membrane that will cover on Copper Foil one side is peeled off, and it is bonding with the one side of double faced adhesive tape this Copper Foil to be peeled off to the one side of micro-mucous membrane;
(6) release liners is covered to the another side of double faced adhesive tape;
(7) cover the micro-mucous membrane of one deck on solder mask.
Wherein, the micro-mucous membrane in step (7) can be a new micro-mucous membrane and covers on solder mask, also can cover on solder mask for the micro-mucous membrane after Copper Foil is peeled off; Micro-sticking film being combined on Copper Foil, then carrying out etching, is mainly to support this Copper Foil by this micro-mucous membrane, is convenient to etching.
Implementation method by above two kinds of different F-FPC techniques realizes the F-FPC the utility model proposes, at different materials, produced in the process of F-FPC, can and realize the difference of difficulty according to different materials, and select wherein a kind of technique to be realized, thereby improve the quality of making F-FPC; And F-FPC, in being mounted process, tears the release liners covered on double faced adhesive tape, F-FPC is mounted in communication products and goes with a side of double faced adhesive tape; Because this F-FPC manufacture craft is simple, and thinner thickness, be generally less than 0.1mm, in order conveniently to mount operation and to avoid, in mounting process, F-FPC is caused to damage, thereby a micro-mucous membrane is set in copper-clad plate.
And by the copper foil wire printing ink is formed to solder mask, thereby the protection Copper Foil is not oxidized, plays the effect of welding resistance, and can reach an agreement with product appearance simultaneously; By copper-clad plate is electroplated, thereby the protection Copper Foil is not oxidized and solderability or the conduction of increase Copper Foil.
In addition, we it should further be appreciated that, the utility model is not limited with this embodiment, the Copper Foil of the utility model design is not as limit, it can also be other foil material, and its thickness is not limited to 18um or 12um, these two kinds of thickness are only at one of this proposition embodiment preferably, can realize the characteristic that F-FPC integral body is thinner; And solder mask wherein, be not limited in this kind of material of printing ink that the present embodiment proposes, can also be for the thin-film material of other types, as thin-film materials such as PET or PI; Consideration due to the thinner consideration of F-FPC and adhered by double sided plaster intensity, be 10-30um by the thickness setting of double faced adhesive tape, and, in actual application, can also be adjusted by the thickness to double faced adhesive tape, thereby adapt to other communication products.
Obviously, those skilled in the art can carry out various changes and distortion and not break away from spirit and scope of the present utility model the utility model.Like this, if these modifications of the present utility model and distortion belong in the scope of the utility model claim and equivalent technologies thereof, the utility model also is intended to comprise these changes interior.
Claims (6)
1. one kind without the film flexible printed circuit board, it is characterized in that, copper-clad plate, solder mask and adhesive layer, consist of, described solder mask covers the one side of described copper-clad plate, and the another side of described copper-clad plate covers described adhesive layer.
2. according to claim 1ly without the film flexible printed circuit board, it is characterized in that, described adhesive layer is a double faced adhesive tape, and the one side of described double faced adhesive tape is fitted with described copper-clad plate, and the another side of described double faced adhesive tape covers a release liners; And the thickness of described double faced adhesive tape is 10-30um.
3. according to claim 1ly without the film flexible printed circuit board, it is characterized in that, described solder mask is attached in described copper-clad plate, by ink for screen printing in described copper-clad plate or compound other thin-film materials, forms described solder mask.
4. according to claim 1ly without the film flexible printed circuit board, it is characterized in that, the surface of described solder mask also is provided with an enhancing film.
5. according to claim 4ly without the film flexible printed circuit board, it is characterized in that, described enhancing film is micro-mucous membrane.
6. according to claim 1ly without the film flexible printed circuit board, it is characterized in that, described copper-clad plate is Copper Foil, and the thickness of described Copper Foil is 18um or 12um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320305566 CN203368929U (en) | 2013-05-30 | 2013-05-30 | No-film flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320305566 CN203368929U (en) | 2013-05-30 | 2013-05-30 | No-film flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203368929U true CN203368929U (en) | 2013-12-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320305566 Expired - Fee Related CN203368929U (en) | 2013-05-30 | 2013-05-30 | No-film flexible printed circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN203368929U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313504A (en) * | 2013-05-30 | 2013-09-18 | 上海安费诺永亿通讯电子有限公司 | Film-free flexible printed circuit board and production method thereof |
| CN105530762A (en) * | 2014-09-29 | 2016-04-27 | 深南电路有限公司 | Resistance welding processing method and circuit board |
-
2013
- 2013-05-30 CN CN 201320305566 patent/CN203368929U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313504A (en) * | 2013-05-30 | 2013-09-18 | 上海安费诺永亿通讯电子有限公司 | Film-free flexible printed circuit board and production method thereof |
| CN103313504B (en) * | 2013-05-30 | 2015-12-09 | 上海安费诺永亿通讯电子有限公司 | A kind of without film flexible printed circuit board and preparation method thereof |
| CN105530762A (en) * | 2014-09-29 | 2016-04-27 | 深南电路有限公司 | Resistance welding processing method and circuit board |
| CN105530762B (en) * | 2014-09-29 | 2018-08-07 | 深南电路有限公司 | Resistance welding processing method and circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20170530 |