CN105530762A - Resistance welding processing method and circuit board - Google Patents
Resistance welding processing method and circuit board Download PDFInfo
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- CN105530762A CN105530762A CN201410514265.3A CN201410514265A CN105530762A CN 105530762 A CN105530762 A CN 105530762A CN 201410514265 A CN201410514265 A CN 201410514265A CN 105530762 A CN105530762 A CN 105530762A
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- circuit board
- solder resist
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Abstract
The invention discloses a resistance welding processing method and a circuit board and solves a problem of green oil missing during resistance welding in a circuit board manufacturing process. The method comprises steps that setting a first area coverage protection film of a resistance welding flux on the surface of the circuit board is not necessary; setting a second area setting colloid of the resistance welding flux on the surface of the circuit board is necessary, and a protection film is removed; a second area of the surface of the circuit board is provided with the resistance welding flux, and the resistance welding flux covers the colloid.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of resistance welding processing method and circuit board.
Background technology
In field of circuit boards, various surface-coated application is more and more.Said surface-coated comprises coating solder resist, such as green oil.And fall green oil problem be current circuit board processing in a still unsolved difficult problem.The main cause falling green oil is that the lateral erosion of green oil causes chemical medicinal liquid to attack circuit copper face below green oil, causes green oil unsettled, and then falls green oil.Kinds of processes is had to attempt to solve this problem at present.
A kind of existing solution walks super coarse surface process before welding resistance, improves green oil and copper face adhesion, to reduce green oil to a certain extent.Another kind of existing solution walks twice welding resistance technique, adopts a rear welding resistance to cover a front welding resistance, even if fall green oil, a front welding resistance also can be allowed not fall green oil, to reduce green oil to a certain extent.But, the limited efficiency of above-mentioned two kinds of methods, under fine and closely woven circuit and little pad are windowed and are needed the situations such as long-time chemical immersion after welding resistance processing, still exist and comparatively seriously fall green oil problem, and, the super coarse surface process that above-mentioned first method is carried out can reduce circuit board surface copper thickness, makes unqualified thickness lattice, and twice welding resistance technique of above-mentioned second method exists the unclean risk of development.
To sum up, prior art pilot scale figure solves the method that green oil problem adopts, and effect is not too obvious on the whole, can not avoid green oil problem.
Summary of the invention
The embodiment of the present invention provides a kind of resistance welding processing method and circuit board, falls green oil problem with the welding resistance solved in circuit board fabrication.
First aspect present invention provides a kind of resistance welding processing method, comprising: do not need at circuit board surface the first area covered with protective film arranging solder resist; Need the second area that solder resist is set that colloid is set at circuit board surface, and remove described diaphragm; Arrange solder resist at the second area of circuit board surface, described solder resist covers on described colloid.
Second aspect present invention provides a kind of circuit board, is provided with colloid between the line pattern of described circuit board surface and solder resist.
Therefore, the embodiment of the present invention adopts needs the region arranging solder resist first to arrange colloid at circuit board surface, and then carries out welding resistance processing, makes solder resist no longer directly overlay circuit board surface, but the technical scheme covered on colloid, achieve following technique effect:
The present invention program is due to the line pattern below solder resist being provided with one deck colloid; thus can be protected line pattern by colloid; the line pattern under solder resist is avoided to contact with the chemical medicinal liquid in following process process; line pattern is prevented to be corroded; and then avoid solder resist and come off, solve in prior art the problem falling green oil.Further, in preferred embodiment, by carrying out interference design to colloid, achieve the covering completely to solder resist line figure and protection, that can fundamentally stop to cause because of lateral erosion green oil problem.
In addition, the present invention program does not need to carry out super roughening treatment to circuit board surface, can not reduce the thickness of circuit board surface Copper Foil and hole copper.The present invention program does not need to carry out the welding resistance processing of repetition yet, there will not be because repeating the unclean problem of development that welding resistance causes.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic flow sheet of a kind of resistance welding processing method that the embodiment of the present invention provides;
Fig. 2 a and 2b is vertical view and the sectional view of circuit board in the embodiment of the present invention respectively;
Fig. 2 c is the schematic diagram arranging diaphragm in the embodiment of the present invention on circuit boards;
Fig. 2 d is the schematic diagram arranging colloid in the embodiment of the present invention on circuit boards;
Fig. 2 e is the schematic diagram arranging solder resist in the embodiment of the present invention on circuit boards.
Embodiment
The embodiment of the present invention provides a kind of resistance welding processing method and circuit board, falls green oil problem with the welding resistance solved in circuit board fabrication.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of resistance welding processing method, can comprise:
110, do not need at circuit board surface the first area covered with protective film that solder resist is set.
When after the line pattern completion of processing on circuit board, usually need to carry out surface-coated to circuit board, comprising: washing is carried out, such as plating nickel gold to some regional areas such as pads (PAD), prevent pad oxidized or improve solderability; Welding resistance coating is carried out to the line pattern beyond the regional areas such as pad and base material, one deck solder resist is set, line pattern and base material are protected, prevent line pattern oxidized.
Please refer to the circuit board vertical view shown in Fig. 2 a and the circuit board sectional view shown in Fig. 2 b, the surface of circuit board 20 can be divided into the first area 21 not needing to arrange solder resist and the second area 22 needing to arrange solder resist, wherein, first area includes the orifice ring 2103 etc. of pad 2101 and via 2102 and via 2102; Second area comprises line pattern 2201 and base material etc.For the ease of identify, in figure by the height of line pattern 2201 draw a little less than pad 2101 and orifice ring 2103, but should be appreciated that in practical application, the height of line pattern 2201 does not need lower than pad 2101 and orifice ring 2103.
In this step, optionally, first the process such as brown are carried out to circuit board 20, to improve the roughness on circuit board 20 surface, increase the adhesion of subsequent conditioning circuit plate surface (such as line pattern 2201) and colloid.Then, as shown in Figure 2 c, diaphragm 23 being set at circuit board surface, such as dry film, to not needing the first area 21 arranging solder resist to carry out covering protection, follow-uply needing the second area 22 that solder resist is set that colloid is set to facilitate.This step arranging diaphragm 23 can specifically comprise: after the full surface coverage diaphragm 23 of circuit board 20, diaphragm 23 is offered window 2301, the protected film 23 in first area 21 is covered, but second area 22 reveals from window 2301.Wherein, said window by exposure and development realize.
In preferred embodiment, in order to enable the follow-up colloid that arranges realize covering completely to second area 22 and protection, interference design can be adopted in this step on diaphragm 23 to offer window 2301, make the size of window 2301 be greater than the design size of second area 22.Such as, in the direction of line pattern 2201 towards base material, i.e., on the Width of line pattern 2201, make large 4 Mills (mil) of the single side size of window 2301; In the junction of line pattern 2201 and pad 2101 or orifice ring 2103, towards on the direction of pad 2101 or orifice ring 2103, make large 2 Mills (mil) of the single side size of window 2301; Like this, make follow-up when arranging colloid, colloid can cover second area 22 completely, implements to protect completely to the line pattern 2201 of second area 22.
120, need the second area that solder resist is set that colloid is set at circuit board surface, remove diaphragm.
In this step, as shown in Figure 2 d, colloid 24 is set on circuit board 20 surface, makes colloid 24 cover second area 22 by the window 2301 on diaphragm 23.In preferred embodiment, vacuum screen printing technique can be adopted at the surperficial whole plate silk gum body 24 of circuit board 20, controlled glue body 24 thickness between 5-10 micron, after silk-screen, by colloid 24 baking-curing.
After silk-screen colloid 24, the mission of diaphragm 23 completes, and diaphragm 23 can be removed, and, is also removed in the lump by the colloid 24 on diaphragm 23 meanwhile.In embody rule, sandbag+polish-brush technique can be adopted, the colloid 24 on diaphragm 23 and diaphragm 23 surface be removed totally, then adopts striping technique, guarantee that surface protection film is removed clean, and guarantee not residual colloid and diaphragm residue in via 2102.So far, only on second area 22, be coated with diaphragm 23, and because interference design, the coverage of diaphragm 23 slightly larger than the design size of second area 22, can carry out covering protection completely to the line pattern 2201 in second area 22.
In the embodiment of the present invention, said colloid 24 can be specifically the band organic substance of epoxy resin-matrix or siliceous colloid etc., can play the material that chemical resistance thing is removed after solidification.
130, arrange solder resist at the second area of circuit board surface, solder resist covers on colloid.
In this step, as shown in Figure 2 e, solder resist 25 is set at the second area on circuit board 20 surface.Wherein, the step arranging solder resist 25 can comprise: after the full surface-coated solder resist 25 of circuit board 20, carry out exposure imaging, removed by the solder resist 25 beyond second area 22, only retain solder resist 25 at second area 22.
In the embodiment of the present invention, owing to pre-setting colloid 24 on second area 22, then the solder resist 25 arranged in this step can cover on colloid 24 completely, instead of directly overlays circuit board 20 surface.In addition, owing to have employed interference design when arranging colloid 24, the support size of the solder resist 25 arranged in this step is less than the support size of colloid 24, and colloid 24 can not cover solder resist 25 above edge.So; in the process that solder resist 25 is set and other subsequent processes; set colloid 24 can realize the covering protection to second area 22 line pattern 2201; prevent chemical medicinal liquid from contacting and etching lines figure 2201, and then can avoid causing that solder resist 25 is unsettled and solder resist 25 that is that cause comes off because line pattern 2201 is corroded.
Therefore, the embodiment of the invention discloses a kind of resistance welding processing method, the method adopts needs the region arranging solder resist first to arrange colloid at circuit board surface, and then carry out welding resistance processing, solder resist is made no longer to directly overlay circuit board surface, but the technical scheme covered on colloid, achieve following technique effect:
The present invention program is due to the line pattern below solder resist being provided with one deck colloid; thus can be protected line pattern by colloid; the line pattern under solder resist is avoided to contact with the chemical medicinal liquid in following process process; line pattern is prevented to be corroded; and then avoid solder resist and come off, solve in prior art the problem falling green oil.Further, in preferred embodiment, by carrying out interference design to colloid, achieve the covering completely to solder resist line figure and protection, that can fundamentally stop to cause because of lateral erosion green oil problem.
In addition, the present invention program does not need to carry out super roughening treatment to circuit board surface, can not reduce the thickness of circuit board surface Copper Foil and hole copper.The present invention program does not need the welding resistance processing carrying out repetition yet, the problem that the development that there will not be therefore repetition welding resistance to cause is unclean.
Embodiment two,
Please refer to Fig. 2 e, the embodiment of the present invention provides a kind of circuit board 20, is provided with colloid 24 between the line pattern 2201 on this circuit board 20 surface and solder resist 25.
Embodiment of the present invention circuit board can adopt method disclosed in above-described embodiment one to obtain, and about the more explanation of this circuit board, please refer to the description in embodiment one.
Above, embodiment of the present invention I discloses a kind of circuit board, achieves following technique effect:
The present invention program protects line pattern owing to the line pattern below solder resist being provided with one deck colloid; thus can be protected line pattern by colloid; the line pattern under solder resist is avoided to contact with the chemical medicinal liquid in following process process; line pattern is prevented to be corroded; and then avoid solder resist and come off, solve in prior art the problem falling green oil.Further, in preferred embodiment, by carrying out interference design to colloid, achieve the covering completely to solder resist line figure and protection, that can fundamentally stop to cause because of lateral erosion green oil problem.
In addition, the present invention program does not need to carry out super roughening treatment to circuit board surface, can not reduce the thickness of circuit board surface Copper Foil and hole copper.The present invention program does not need the welding resistance processing carrying out repetition yet, the problem that the development that there will not be therefore repetition welding resistance to cause is unclean.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.
The resistance welding processing method provided the embodiment of the present invention above and circuit board are described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (8)
1. a resistance welding processing method, is characterized in that, comprising:
The first area covered with protective film that solder resist is set is not needed at circuit board surface;
Need the second area that solder resist is set that colloid is set at circuit board surface, and remove described diaphragm;
Arrange solder resist at the second area of circuit board surface, described solder resist covers on described colloid.
2. method according to claim 1, is characterized in that,
Described first area comprises the orifice ring of pad and via and described via;
Described second area comprises line pattern and base material.
3. method according to claim 1, is characterized in that, does not describedly need the first area covered with protective film arranging solder resist to comprise at circuit board surface:
After the full surface coverage diaphragm of circuit board, window offered by described diaphragm, described first area is covered by described diaphragm, but described second area is revealed in described window.
4. method according to claim 3, is characterized in that, describedly on described diaphragm, offers window comprise:
Adopt interference design to offer window on described diaphragm, make the size of described window be greater than the design size of described second area.
5. method according to claim 1, is characterized in that, describedly needs the second area arranging solder resist to arrange colloid at circuit board surface to comprise:
Adopt vacuum screen printing technique at circuit board surface whole plate silk gum body, control colloid thickness between 5-10 micron, and by described colloid baking-curing.
6. method according to claim 5, is characterized in that, the described diaphragm of described removal comprises:
By described diaphragm and silk-screen, the colloid on described diaphragm is all removed.
7., according to described method arbitrary in claim 1 to 6, it is characterized in that, the described second area at circuit board surface arranges solder resist, and described solder resist covers on described colloid and comprises:
After the full surface-coated solder resist of circuit board, carry out exposure imaging, the solder resist beyond described second area is removed, only retain solder resist at described second area.
8. a circuit board, is characterized in that, is provided with colloid between the line pattern of described circuit board surface and solder resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410514265.3A CN105530762B (en) | 2014-09-29 | 2014-09-29 | Resistance welding processing method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410514265.3A CN105530762B (en) | 2014-09-29 | 2014-09-29 | Resistance welding processing method and circuit board |
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| Publication Number | Publication Date |
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| CN105530762A true CN105530762A (en) | 2016-04-27 |
| CN105530762B CN105530762B (en) | 2018-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410514265.3A Active CN105530762B (en) | 2014-09-29 | 2014-09-29 | Resistance welding processing method and circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112638054A (en) * | 2019-10-09 | 2021-04-09 | 庆鼎精密电子（淮安）有限公司 | Manufacturing method of circuit board |
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| CN102244985A (en) * | 2011-04-21 | 2011-11-16 | 深南电路有限公司 | Processing method of surface-mounted pads on thick copper circuit board |
| CN103124472A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Flex-rigid printed circuit board manufacturing method and flex-rigid printed circuit board |
| CN103313509A (en) * | 2013-04-24 | 2013-09-18 | 上舜电子科技（中国）有限公司 | Metal-based conducting circuit board and manufacturing method thereof |
| CN203368929U (en) * | 2013-05-30 | 2013-12-25 | 上海安费诺永亿通讯电子有限公司 | No-film flexible printed circuit board |
| CN103582322A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
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2014
- 2014-09-29 CN CN201410514265.3A patent/CN105530762B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102244985A (en) * | 2011-04-21 | 2011-11-16 | 深南电路有限公司 | Processing method of surface-mounted pads on thick copper circuit board |
| CN103124472A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Flex-rigid printed circuit board manufacturing method and flex-rigid printed circuit board |
| CN103582322A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN103313509A (en) * | 2013-04-24 | 2013-09-18 | 上舜电子科技（中国）有限公司 | Metal-based conducting circuit board and manufacturing method thereof |
| CN203368929U (en) * | 2013-05-30 | 2013-12-25 | 上海安费诺永亿通讯电子有限公司 | No-film flexible printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112638054A (en) * | 2019-10-09 | 2021-04-09 | 庆鼎精密电子（淮安）有限公司 | Manufacturing method of circuit board |
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| CN105530762B (en) | 2018-08-07 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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