CN108377326A - A kind of camera module and electronic equipment - Google Patents
A kind of camera module and electronic equipment Download PDFInfo
- Publication number
- CN108377326A CN108377326A CN201810523180.XA CN201810523180A CN108377326A CN 108377326 A CN108377326 A CN 108377326A CN 201810523180 A CN201810523180 A CN 201810523180A CN 108377326 A CN108377326 A CN 108377326A
- Authority
- CN
- China
- Prior art keywords
- camera module
- wiring board
- tablet
- pedestal
- sensitive chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a kind of camera module and electronic equipment, the camera module includes：Wiring board, the wiring board have opposite front and back；Receiving hole in the predeterminable area of the wiring board is set；With the fixed tablet of circuit back；Be arranged in the receiving hole and with the fixed sensitive chip of the tablet；With the fixed pedestal of the tablet, and the wiring board is between the pedestal and the tablet.The camera module is by the way that sensitive chip and pedestal to be also secured on the tablet of same high-flatness, have ignored the low problem of wiring board flatness itself, and the thickness of wiring board is replaced by the thickness of tablet, by the height for lowering sensitive chip, so that camera lens height is lowered, further reduced the thickness of camera module.
Description
Technical field
The present invention relates to camera module flatness design fields, more specifically more particularly to a kind of camera
Module and electronic equipment.
Background technology
With the continuous development of science and technology, the equipment with camera module is widely used to daily life
And in work.Wherein, along with the high speed development of the equipment such as smart mobile phone, the flatness and thickness of its camera module are wanted
Ask also higher and higher.
The flatness of camera module can change with the flatness of different component parts at present, and stability is poor,
And it is big for the management and control of flatness input manpower.
Invention content
To solve the above problems, the present invention provides a kind of camera module and electronic equipment, which passes through
Sensitive chip and pedestal are also secured on the tablet of same high-flatness, have ignored that wiring board flatness itself is low to ask
Topic, and the thickness of wiring board is replaced by the thickness of tablet, by the height of downward sensitive chip, camera lens height is made to lower,
It further reduced the thickness of camera module.
To achieve the above object, the present invention provides the following technical solutions：
A kind of camera module, the camera module include：
Wiring board, the wiring board have opposite front and back；
Receiving hole in the predeterminable area of the wiring board is set；
With the fixed tablet of circuit back；
Be arranged in the receiving hole and with the fixed sensitive chip of the tablet；
With the fixed pedestal of the tablet, and the wiring board is between the pedestal and the tablet.
Preferably, in above-mentioned camera module, on the direction of the wiring board receiving hole include the
A part and second part；
Wherein, the second part is close to the tablet, and the first part is arranged concentrically with the second part and institute
The size for stating first part is more than the size of the second part.
Preferably, in above-mentioned camera module, the tablet is steel disc tablet.
Preferably, in above-mentioned camera module, the camera module further includes：
The optical filter for deviating from the wiring board side in the pedestal is set.
Preferably, in above-mentioned camera module, the camera module further includes：
The motor for deviating from the pedestal side in the optical filter is set.
Preferably, in above-mentioned camera module, the camera module further includes：
The camera lens for deviating from the optical filter side in the motor is set.
Preferably, in above-mentioned camera module, the camera module further includes：
Protective film on the camera lens surface is set.
The present invention also provides a kind of electronic equipment, including camera module described in any one of the above embodiments.
By foregoing description it is found that a kind of camera module provided by the invention includes：Wiring board, the wiring board have
Opposite front and back；Receiving hole in the predeterminable area of the wiring board is set；It is fixed flat with the circuit back
Plate；Be arranged in the receiving hole and with the fixed sensitive chip of the tablet；With the fixed pedestal of the tablet, and the line
Road plate is between the pedestal and the tablet.
The camera module is had ignored by the way that sensitive chip and pedestal to be also secured on the tablet of same high-flatness
The low problem of wiring board flatness itself is realized with improving the flatness of camera module entirety under high-pixel camera module
Inclination or zero inclined requirement, and the thickness of wiring board is replaced by the thickness of tablet, by lowering the height of sensitive chip,
So that camera lens height is lowered, further reduced the thickness of camera module.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the front position structural schematic diagram between sensitive chip and wiring board in prior art camera module；
Fig. 2 is the back position structural schematic diagram between sensitive chip and wiring board in prior art camera module；
Fig. 3 is the lateral location structural schematic diagram between sensitive chip and wiring board in prior art camera module；
Fig. 4 is the schematic diagram of PCB surface flatness in prior art camera module；
Fig. 5 is the front position between sensitive chip and wiring board in a kind of camera module provided in an embodiment of the present invention
Structural schematic diagram；
Fig. 6 is the back position between sensitive chip and wiring board in a kind of camera module provided in an embodiment of the present invention
Structural schematic diagram；
Fig. 7 is the lateral location between sensitive chip and wiring board in a kind of camera module provided in an embodiment of the present invention
Structural schematic diagram；
Fig. 8 is a kind of structural schematic diagram of camera module provided in an embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1, Figure 2 and shown in Fig. 3, the intermediate region of wiring board 11 is not vacancy section in prior art camera module
Domain, sensitive chip 12 carry pad 13 by sensitive chip and carry 11 positive central area of assist side, and pedestal carries online
11 edge of road plate, i.e. pedestal carry region 14, and therefore, the flatness of entire camera module can be flat with 11 front surface of wiring board
The variation of whole degree and change.
As shown in figure 4, the outermost layer structure of wiring board is typically that anti-solder paste is arranged in assist side surface in camera module
Ink, at the same wiring board material itself be affected by temperature it is larger, it is difficult to ensure that the requirement of wiring board high-flatness, camera module
Sensitive chip, pedestal etc. need the surface of fixed assist side, and then can not ensure the flatness of camera module entirety.
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is described in further detail.
As shown in Fig. 5, Fig. 6 and Fig. 7, the camera module includes：
Wiring board 11, the wiring board 11 have opposite front and back；It is arranged in the preset areas of the wiring board 11
The receiving hole 15 in domain；With the fixed tablet in 11 back side of the wiring board 18；Setting in the receiving hole 15 and with the tablet
18 fixed sensitive chips 12；With 18 fixed pedestal of the tablet, and the wiring board 11 is located at the pedestal and described flat
Between plate 18.
Wherein, the predeterminable area is corresponding region during sensitive chip 12 carries, and the sensitive chip 12 is logical
Sensitive chip carrying pad 13 is crossed to be attached with wiring board 11.
Further, as shown in fig. 6, the size of the tablet 18 is more than the size in the carrying region of the wiring board 11,
So that the pedestal is mounted in the periphery of the tablet 18, i.e., the pedestal on tablet 18 carries region 19.
The camera module is had ignored by the way that sensitive chip and pedestal to be also secured on the tablet of same high-flatness
The low problem of wiring board flatness itself is realized with improving the flatness of camera module entirety under high-pixel camera module
Inclination or zero inclined requirement, and the thickness of wiring board is replaced by the thickness of tablet, by lowering the height of sensitive chip,
So that camera lens height is lowered, further reduced the thickness of camera module.
Further, as shown in Fig. 5, Fig. 6 and Fig. 7, on the direction of the wiring board receiving hole 15 wrap
Include first part 17 and second part 16；Wherein, the second part 16 is close to the tablet 18, the first part 17 and institute
State second part 16 be arranged concentrically and the size of the first part 17 be more than the second part 16 size.Described first
Divide 17 and the composition single order step structure of the second part 16.
Specifically, due to the weld pad that sensitive chip has centrally located photosensitive pixel and connected with photosensitive pixel, weldering
It is attached between pad and pad, which has conducting wire connection or conductive layer connection, by setting receiving hole 15 to
First part 17 and second part 16 constitute single order step structure, and sensitive chip 12 and wiring board 11 are carried out at step structure
Between pad connection, so that conducting wire or conductive layer is respectively positioned in first part 16, that is, ensure link position be less than PCB surface,
It ensure that the welding of welding effect stablized and do not interfere with the other circuits of PCB surface.
Further, the tablet 18 is steel disc.
Specifically, the flatness of steel disc is higher, and there are the performances such as high temperature resistant and resistance to deformation, by by sensitive chip and bottom
Seat is also secured on the tablet of same high-flatness, has ignored the low problem of wiring board flatness itself, to realize camera shooting
The high-flatness of head mould group entirety.
Further, as shown in figure 8, the camera module further includes：
The optical filter 21 for deviating from 11 side of the wiring board in the pedestal 20 is set.
Specifically, the type of the optical filter 21 in embodiments of the present invention and is not construed as limiting, can be answered according to specific reality
Depending on situation.
Further, as shown in figure 8, the camera module further includes：
The motor 22 for deviating from 20 side of the pedestal in the optical filter 21 is set.
Specifically, the motor 22 includes but is not limited to voice coil motor.
Further, as shown in figure 8, the camera module further includes：
The camera lens 23 for deviating from 21 side of the optical filter in the motor 22 is set.
Further, as shown in figure 8, the camera module further includes：
Protective film 24 on 23 surface of the camera lens is set.
Specifically, the protective film 24 is for preventing camera module from being damaged during installation, transport or use.
Based on the camera module that the above embodiment of the present invention provides, the present invention also provides a kind of electronic equipment, described
Electronic equipment includes the camera module.
Specifically, the electronic equipment includes but is not limited to the electronic equipments such as mobile phone, tablet computer and video camera.
By foregoing description it is found that camera module provided by the invention is by the way that sensitive chip and pedestal to be also secured to
On the tablet of same high-flatness, the low problem of wiring board flatness itself is had ignored, camera module is whole to put down to improve
Whole degree realizes inclination or zero inclined requirement under high-pixel camera module, and the thickness of wiring board is by the thickness institute of tablet
Instead of by lowering the height of sensitive chip, making camera lens height lower, further reduced the thickness of camera module.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest range caused.
Claims (8)
1. a kind of camera module, which is characterized in that the camera module includes：
Wiring board, the wiring board have opposite front and back；
Receiving hole in the predeterminable area of the wiring board is set；
With the fixed tablet of circuit back；
Be arranged in the receiving hole and with the fixed sensitive chip of the tablet；
With the fixed pedestal of the tablet, and the wiring board is between the pedestal and the tablet.
2. camera module according to claim 1, which is characterized in that described on the direction of the wiring board
Receiving hole includes first part and second part；
Wherein, the second part is close to the tablet, and the first part is arranged concentrically and described the with the second part
The size of a part is more than the size of the second part.
3. camera module according to claim 1, which is characterized in that the tablet is steel disc.
4. camera module according to claim 1, which is characterized in that the camera module further includes：
The optical filter for deviating from the wiring board side in the pedestal is set.
5. camera module according to claim 4, which is characterized in that the camera module further includes：
The motor for deviating from the pedestal side in the optical filter is set.
6. camera module according to claim 5, which is characterized in that the camera module further includes：
The camera lens for deviating from the optical filter side in the motor is set.
7. camera module according to claim 6, which is characterized in that the camera module further includes：
Protective film on the camera lens surface is set.
8. a kind of electronic equipment, which is characterized in that including such as claim 1-7 any one of them camera module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810523180.XA CN108377326A (en) | 2018-05-28 | 2018-05-28 | A kind of camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810523180.XA CN108377326A (en) | 2018-05-28 | 2018-05-28 | A kind of camera module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108377326A true CN108377326A (en) | 2018-08-07 |
Family
ID=63033630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810523180.XA Pending CN108377326A (en) | 2018-05-28 | 2018-05-28 | A kind of camera module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108377326A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112714239A (en) * | 2019-10-25 | 2021-04-27 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module, method thereof and electronic equipment |
| CN114173024A (en) * | 2020-09-11 | 2022-03-11 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, manufacturing method thereof and camera module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103266300A (en) * | 2013-05-27 | 2013-08-28 | 南昌欧菲光电技术有限公司 | Preparation method of optical filter, optical filter as well as camera module |
| CN103607535A (en) * | 2013-08-09 | 2014-02-26 | 南昌欧菲光电技术有限公司 | Camera module for mobile terminal and mobile terminal |
| CN107071238A (en) * | 2016-12-23 | 2017-08-18 | 江苏正桥影像科技股份有限公司 | A kind of ultra-thin high-definition camera module and its manufacturing process |
| CN208143361U (en) * | 2018-05-28 | 2018-11-23 | 信利光电股份有限公司 | A kind of camera module and electronic equipment |
-
2018
- 2018-05-28 CN CN201810523180.XA patent/CN108377326A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103266300A (en) * | 2013-05-27 | 2013-08-28 | 南昌欧菲光电技术有限公司 | Preparation method of optical filter, optical filter as well as camera module |
| CN103607535A (en) * | 2013-08-09 | 2014-02-26 | 南昌欧菲光电技术有限公司 | Camera module for mobile terminal and mobile terminal |
| CN107071238A (en) * | 2016-12-23 | 2017-08-18 | 江苏正桥影像科技股份有限公司 | A kind of ultra-thin high-definition camera module and its manufacturing process |
| CN208143361U (en) * | 2018-05-28 | 2018-11-23 | 信利光电股份有限公司 | A kind of camera module and electronic equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112714239A (en) * | 2019-10-25 | 2021-04-27 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module, method thereof and electronic equipment |
| CN112714239B (en) * | 2019-10-25 | 2022-07-22 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module, method thereof and electronic equipment |
| CN114173024A (en) * | 2020-09-11 | 2022-03-11 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, manufacturing method thereof and camera module |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180807 |