CN204994081U - Module and printed circuit board make a video recording - Google Patents
Module and printed circuit board make a video recording Download PDFInfo
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- CN204994081U CN204994081U CN201520673617.XU CN201520673617U CN204994081U CN 204994081 U CN204994081 U CN 204994081U CN 201520673617 U CN201520673617 U CN 201520673617U CN 204994081 U CN204994081 U CN 204994081U
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- copper pattern
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 83
- 229910052802 copper Inorganic materials 0.000 claims abstract description 83
- 239000010949 copper Substances 0.000 claims abstract description 83
- 239000003292 glue Substances 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 48
- 238000010030 laminating Methods 0.000 abstract description 19
- 238000000059 patterning Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 35
- 238000002360 preparation method Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000003384 imaging method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000006698 induction Effects 0.000 description 4
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
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- Solid State Image Pick-Up Elements (AREA)
Abstract
The utility model provides a module and printed circuit board make a video recording. This circuit board includes: sensor laminating district is decide to body, the body upper limit, and first dew copper pattern, the patterning of first dew copper is in the sensor laminating is distinguished, wherein, first dew copper pattern includes: first line segment, first line segment have first end and second end, second line segment, second line segment have first end and second end to the first end of second line segment sets up with the first end of first line segment relatively, the third line segment, the one end of third line segment links to each other with the first end of first line segment, and the other end of third line segment links to each other with the second of second line segment end, and the fourth line segment, the one end of fourth line segment links to each other with the second of first line segment end, and the other end of fourth line segment links to each other with the first end of second line segment, and fourth line segment and third line segment are crossing to be set up to open at crossing deal with. From this, the basis has been improved the utility model discloses printed circuit board's yield.
Description
Technical field
The utility model relates to electronic device field, and particularly, the utility model relates to camera module and printed substrate, and more specifically, the utility model relates to a kind of printed substrate for camera module and a kind of camera module.
Background technology
Along with the development of electronic technology, electronic equipment also improves for the requirement of camera module pixel thereupon.Have the camera module of high pixel compared with traditional camera, manufacturing process is more complicated, for all parts of composition camera module, such as also stricter to the requirement of wiring board and image sensor etc.
But the structure at present for the camera module and printed substrate with higher pixel still haves much room for improvement.
Utility model content
The utility model is intended to solve one of technical problem in correlation technique at least to a certain extent.
The utility model completes based on the following discovery of inventor:
Have in the camera module process of higher pixel in preparation at present, yields is on the low side, shipment amount can not meet the demand preparing camera module, and image sensor be combined with wiring board after camera module easily produce dark angle when imaging, cause camera module yields on the low side.Inventor finds through further investigation; wiring board internal circuit connects general employing via hole technology; in order to prevent short circuit; usual meeting arranges solder mask on the surface of wiring board; image sensor is affixed on solder mask and is electrically connected with circuit board by lead-in wire; but; deformation can be there is in solder mask when high temperature; cause fixing image sensor meeting run-off the straight in the circuit board; affect the ability that transducer receives light; thus in imaging process, produce dark angle, affect the image quality of camera module, cause the yields of camera module in preparation process on the low side.In addition, when image sensor is conformed to wiring board, image sensor is fixed in the circuit board by usual employing glue, and in the process of a glue, the path of usual glue can overlap at the center of bonding, therefore, the amount of local glue can be caused more, and then after causing solidification, fixing image sensor in the circuit board tilts, affect the ability that transducer receives light, thus affect the image quality of camera module, cause the yields of camera module in preparation process on the low side.
In view of this, in first aspect of the present utility model, the utility model proposes a kind of printed substrate for camera module.Particularly, this wiring board comprises: body, described body limits transducer conformable region; And first reveals copper pattern, described first dew copper pattern is formed in described transducer conformable region; Wherein, described first dew copper pattern comprises: the first line segment, and described first line segment has first end and the second end; Second line segment, described second line segment has first end and the second end, and the first end of the first end of described second line segment and described first line segment is oppositely arranged; 3rd line segment, one end of described 3rd line segment is connected with the first end of described first line segment, and the other end of described 3rd line segment is connected with the second end of described second line segment; And the 4th line segment, one end of described 4th line segment is connected with the second end of described first line segment, and the other end of described 4th line segment is connected with the first end of described second line segment, and described 4th line segment and the 3rd line segment intersection are arranged, and disconnect in described intersection.Thus, can by the setting of above-mentioned dew copper pattern, control follow-up evenness when fitting with image sensor preferably, and reduce the intersection point of each bar line segment in above-mentioned pattern, and then image sensor tilts after avoiding the excessive solidification caused of glue that causes due to some tree lace road overlap, thus the generation at dark angle when avoiding imaging.And, the in transducer conformable region first dew copper pattern is utilized to fit on body by transducer, avoid the contact of transducer and ink, thus be out of shape the impact on transducer evenness after avoiding ink high-temperature process, and then the production yield of this wiring board and result of use further.
Particularly, described first line segment and described second line segment be arranged in parallel, and optionally, described first line segment has identical length with described second line segment.Thus, image sensor can be fitted on above-mentioned line segment by glue, complete the combination of image sensor and body, thus the evenness of transducer can be improved further, and then avoid owing to producing dark angle because sensor perturbations causes during shooting after laminating, and then the production yield of this wiring board and result of use further.
Particularly, this wiring board comprises further: base conformable region, and described base conformable region is arranged on the body; And second reveals copper pattern, described second dew copper pattern is arranged in described base conformable region, and described second dew copper pattern has closed circular pattern.Thus, the laminating of base can be completed by the second dew copper pattern, avoid the wiring board poor flatness caused due to ink distortion, thus improve production yield and the result of use of this wiring board.
In second aspect of the present utility model, the utility model proposes a kind of camera module.Particularly, this camera module comprises: the previously described printed substrate according to any one embodiment of the utility model.Thus, can by the previously described printed substrate according to any one embodiment of the utility model for this camera module provides the printed substrate with higher production yield and better result of use, and then can meet when preparing camera module for the demand of printed substrate in quantity and quality, and then improve production efficiency and the result of use of this camera module.
Particularly, this camera module comprises further: base, and described base is fitted on described second dew copper pattern by glue.Thus, by adopting glue, above-mentioned base can be fixed by the second dew copper pattern, and then avoid due to the impact of ink distortion on camera module evenness, for this camera module provides the base that laminating evenness is higher, and then improve production efficiency and the result of use of this camera module further.
Accompanying drawing explanation
Fig. 1 shows the part-structure schematic diagram of the printed substrate for camera module according to the utility model embodiment;
Fig. 2 shows the part-structure schematic diagram of the printed substrate for camera module according to another embodiment of the utility model;
Fig. 3 shows the part-structure schematic diagram of the printed substrate for camera module according to another embodiment of the utility model;
Fig. 4 shows the part-structure schematic diagram of the printed substrate for camera module according to another embodiment of the utility model;
Fig. 5 shows the structural representation of the printed substrate for camera module according to another embodiment of the utility model;
Fig. 6 shows the structural representation of the camera module according to the utility model embodiment;
Fig. 7 shows the flow chart of steps of the method for the printed substrate for the preparation of camera module according to the utility model embodiment;
Fig. 8 shows the flow chart of steps of the method for the printed substrate for the preparation of camera module according to another embodiment of the utility model; And
Fig. 9 shows the flow chart of steps of the method for the printed substrate for the preparation of camera module according to another embodiment of the utility model;
Description of reference numerals:
1000: body
100: the first dew copper patterns
200: image sensor
300: transducer conformable region
400: the second dew copper patterns
500: base conformable region
600: base
700: electronic component
800: weld pad
900: glue district
110: the first line segments
110A: the first line segment first end
110B: the first line segment second end
120: the second line segments
120A: the second line segment first end
120B: the second line segment second end
130: the three line segments
140: the four line segments
2000: wiring board layers of copper
3000: printing ink of circuit board layer
4000: circuit board function layer
Embodiment
Be described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the utility model, and can not being interpreted as restriction of the present utility model.
The utility model completes based on the following discovery of inventor:
Have in the camera module process of higher pixel in preparation at present, yields is on the low side, shipment amount can not meet the demand preparing camera module, and image sensor be combined with wiring board after camera module easily produce dark angle when imaging, cause camera module yields on the low side.Inventor finds through further investigation; wiring board internal circuit connects general employing via hole technology; in order to prevent short circuit; usual meeting arranges solder mask on the surface of wiring board; image sensor is affixed on solder mask and is electrically connected with circuit board by lead-in wire; but; deformation can be there is in solder mask when high temperature; cause fixing image sensor meeting run-off the straight in the circuit board; affect the ability that transducer receives light; thus in imaging process, produce dark angle, affect the image quality of camera module, cause the yields of camera module in preparation process on the low side.In addition, when image sensor is conformed to wiring board, image sensor is fixed in the circuit board by usual employing glue, and in the process of a glue, the path of usual glue can overlap at the center of bonding, therefore, the amount of local glue can be caused more, and then after causing solidification, fixing image sensor in the circuit board tilts, affect the ability that transducer receives light, thus affect the image quality of camera module, cause the yields of camera module in preparation process on the low side.
In the utility model, unless otherwise clearly defined and limited, term " is connected ", " connection ", the term such as " connection " should be interpreted broadly, and such as, can be directly be connected, also indirectly can be connected by intermediary or parts.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be, as long as meet the structural relation according to the utility model embodiment.
For the printed substrate of camera module
In view of this, in first aspect of the present utility model, with reference to figure 1, the utility model proposes a kind of printed substrate for camera module.According to embodiment of the present utility model, this wiring board comprises: body 1000 and the first dew copper pattern 100.Wherein, according to embodiment of the present utility model, in body 1000, limit transducer conformable region 300, for image sensor 200 of fitting; The response of light to external world can be converted into digital signal by image sensor 200, completes the imaging of camera module; First dew copper pattern 100, first reveals copper pattern 100 and is formed in transducer conformable region 300, to complete the laminating of image sensor 200 on body 1000.Particularly, according to embodiment of the present utility model, image sensor 200 is fitted on the first dew copper pattern 100 by glue.Causing short circuit to prevent that printed substrate forms electrical connection between each conducting wire, in the preparation process of printed substrate, needing to utilize the ink with welding resistance function to isolate each conducting wire on printed substrate or pad.But in the preparation process of printed substrate, also need to adopt the method for high-temperature soldering to fit on printed substrate by all kinds of electronic component or part, and solder mask, when high-temperature soldering, comparatively serious distortion can occur, therefore have a strong impact on the evenness of printed substrate.For the printed substrate for having high-pixel camera module, the management and control for the evenness of wiring board is more stricter than general wiring board, thus it is lower to result in wiring board preparation process production yield, can not meet the demand preparing camera module.According to embodiment of the present utility model, image sensor 200 is fitted on the first dew copper pattern 100 by glue, therefore avoid because ink is out of shape impact for transducer and wiring board evenness under the high temperature conditions, and then the production yield that improve according to the wiring board of the utility model embodiment and result of use.
According to embodiment of the present utility model, with reference to figure 2, the first dew copper pattern 100 can be formed by with lower part: the first line segment 110, second line segment 120, the 3rd line segment 130 and the 4th line segment 140.And, according to embodiment of the present utility model, the first end 110A of the first line segment 110 and first end 120A of the second line segment is oppositely arranged, one end of 3rd line segment 130 is connected with 110A, the other end is connected with 120B, one end of 4th line segment 140 is connected with 110B, the other end is connected with 120A, and, 4th line segment 140 is crossing with the 3rd line segment 130, and the 4th line segment 140 and the 3rd line segment 130 disconnect in intersection, such as, in the 3rd line segment 130 and the 4th line segment 140 intersection, the 3rd line segment 130 and the 4th line segment 140 one of disconnect.In addition, according to embodiment of the present utility model, the first dew copper pattern 100 can also have following characteristics further: length L110 that is parallel with the second line segment 120 and the first line segment is equal with the length L120 of the second line segment for the first line segment 110.Thus, can to be fitted to by image sensor 200 by glue has on the first dew copper pattern 100 of above-mentioned symmetrical structure, contact with the direct of solder mask by avoiding image sensor 200, prevent the wiring board roughness descent caused due to solder mask distortion, and then raising is according to the product yield of the wiring board of the utility model embodiment and result of use.In addition, the above-mentioned first dew copper pattern 100 with symmetrical structure can also provide for image sensor 200 the symmetrical laminating site that is evenly distributed, and then can ensure that each induction site had in the image sensor 200 of a fixed structure has homogeneous height and good planarization after laminating, thus ensure that in image sensor 200, each induction site is unaffected for the induction of light, and then improve the result of use according to the wiring board of the utility model embodiment further.
In addition, according to embodiment of the present utility model, first dew copper pattern 100 can also be made up of two equilateral triangles, thus, the symmetry of the first dew copper pattern 100 can be improved further, thus provide distribution more reasonably to fit site for image sensor 200, and then improve the result of use according to the wiring board of the utility model embodiment further.Specifically, according to an embodiment of the present utility model, can by carry out continuity point glue on the first dew copper pattern 100, complete by glue the laminating that image sensor 200 and first reveals copper pattern 100 easily.Such as, according to embodiment of the present utility model, with reference to figure 3, continuity point glue can from the intersection of the 3rd line segment 130 and the 4th line segment 140, according to the direction of arrow, from the 4th line segment 140 starting point glue, first through the first half of the 4th line segment 140, subsequently by the first line segment 110, the 3rd line segment 130, second line segment 120, finally get back to starting point Jiao Chu by the Lower Half of the 4th line segment 140, complete continuity point glue.A glue process mid-point glue path can be realized thus do not overlap, and then under the prerequisite that in copper pattern 100, each bar line segment is all connected is revealed in guarantee first, the image sensor 200 caused more than the glue quantity of other positions due to overlap point place glue quantity is avoided to tilt, thus the generation at dark angle when avoiding imaging, and then the production yield improved further according to the printed substrate of the utility model embodiment and result of use.
According to embodiment of the present utility model, with reference to figure 4, this wiring board can also have following structure further: base conformable region 500 and the second dew copper pattern 400.Wherein, base conformable region 500 is arranged on body 1000, and the second dew copper pattern 400 is arranged in base conformable region 500, and the second dew copper pattern 400 has closed circular pattern.Thus, the laminating of base can be completed by the second dew copper pattern 400, and then avoid the wiring board poor flatness caused due to ink distortion, thus the production yield that improve according to the wiring board of the utility model embodiment and result of use.
In addition, it will be appreciated by those skilled in the art that under the prerequisite not paying creative work, to according to the relevant change made for the printed substrate of camera module of the utility model embodiment and optimize and also belong to protection range of the present utility model.Such as, electronic component 700 and weld pad 800 can be added in the appropriate location of this wiring board, to further expand the electric function of this wiring board.Particularly, according to embodiment of the present utility model, with reference to figure 5, electronic component 700 can be arranged on (not shown) between base conformable region 500 (not shown) and transducer conformable region 300, to complete the electric function of the wiring board according to the utility model embodiment; Weld pad 800 can be arranged in body 1000 (not shown), so that for providing protection according to the wiring board of the utility model embodiment in welding process, and then improves the result of use according to the wiring board of the utility model embodiment.
In sum, owing to taking the laminating being completed the parts such as image sensor 200 and body 1000 by the first dew copper pattern 100 and the second dew copper pattern 400 according to the wiring board of embodiment of the present utility model, and then avoid all parts and contact with the direct of solder mask, therefore avoid because ink is out of shape impact on wiring board evenness in hot environment.Further, because the first dew copper pattern 100 has previously described pattern and feature, therefore can avoid because a local glue quantity that tree lace road overlap causes is too much, and then avoid causing image sensor 200 run-off the straight.Thus, the requirement of high-pixel camera module for printed substrate can be met according to the printed substrate of the utility model embodiment, so can be applied to there is high pixel camera module in.
Camera module
In second aspect of the present utility model, the utility model proposes a kind of camera module.According to embodiment of the present utility model, with reference to figure 6, this camera module comprises the previously described printed substrate for camera module according to any one embodiment of the utility model and base 600.Particularly, according to embodiment of the present utility model, the previously described printed substrate for camera module can have wiring board layers of copper 2000, printing ink of circuit board layer 3000 and circuit board function layer 4000 further.Wherein, wiring board layers of copper 2000 is arranged on the lower surface of circuit board function layer 4000, and the first dew copper pattern 100 and the second dew copper pattern 400 are arranged on the lower surface of wiring board layers of copper 2000, printing ink of circuit board layer 3000 is arranged on the lower surface of wiring board layers of copper 2000, and to cover in wiring board layers of copper 2000 lower surface the region beyond the first dew copper pattern 100 and the second dew copper pattern 400.Base 600 is fitted on the second dew copper pattern 400 by glue district 900.Thus, glue can be passed through, base 600 is fitted on the second dew copper pattern 400, complete base and the combination according to the printed substrate of the utility model embodiment, and then reduce the base and the out-of-flatness of wiring board faying face that cause due to ink distortion, and then raising is according to the production yields of the camera module of the utility model embodiment and result of use.
In addition, those skilled in the art can understand, because this camera module have employed the previously described printed substrate according to any one embodiment of the utility model, therefore the previously described feature and advantage about printed substrate are equally applicable to this camera module, do not repeat them here.
Conveniently immediately, below preparation is described according to the method for the printed substrate for camera module of the utility model embodiment.According to embodiment of the present utility model, with reference to figure 7, the method comprises:
S100 forms the first dew copper pattern
According to embodiment of the present utility model, in this step, a part of ink of removing printed substrate transducer conformable region, makes the layers of copper of ink lower floor, forms the first dew copper pattern 100.Particularly, according to embodiment of the present utility model, with reference to figure 2, this first dew copper pattern 100 is made up of the first line segment 110, second line segment 120, the 3rd line segment 130 and the 4th line segment 140.Further, according to embodiment of the present utility model, the first end 110A of the first line segment 110 and first end 120A of the second line segment is oppositely arranged, one end of 3rd line segment 130 is connected with 110A, the other end is connected with 120B, and one end of the 4th line segment 140 is connected with 110B, and the other end is connected with 120A.Such as, according to embodiment of the present utility model, can by printing, exposure and the method for developing, the ink of the fixed position of removing transducer conformable region, makes this position be exposed by the layers of copper that ink covers, and forms the first dew copper pattern with above-mentioned pattern.In addition, according to embodiment of the present utility model, the first line segment of the first dew copper pattern can be parallel with the second line segment, and the length L110 of the first line segment can be equal with the length L120 of the second line segment.Thus, can fit by image sensor 200 and first are revealed copper pattern 100, image sensor 200 is avoided to contact with the direct of solder mask, prevent the wiring board roughness descent caused due to solder mask distortion, and then improve the product yield preparing the method for wiring board utilized according to the utility model embodiment.And, the above-mentioned first dew copper pattern 100 with symmetrical structure can also have good symmetry for image sensor provides and draw the laminating site that do not overlap, glue path, and then can ensure that each induction site had in the image sensor of a fixed structure has homogeneous height and good planarization after laminating, thus ensure that image sensor does not produce dark angle due to sensor perturbations in imaging process, and then improve the result of use utilizing the wiring board prepared according to the method for the utility model embodiment further.
In addition, according to embodiment of the present utility model, the first dew copper pattern 100 can also be made up of two equilateral triangles.Thus, can by the first dew copper pattern 100 with said structure feature for subsequent images transducer step of fitting provides and has good symmetry and draw the laminating site that do not overlap, glue path, thus ensure that image sensor does not produce dark angle due to sensor perturbations in imaging process, and then improve the result of use utilizing the wiring board prepared according to the method for the utility model embodiment further.
S200 fits transducer
According to embodiment of the present utility model, glue coated on the first dew copper pattern 100 that S100 is formed, and image sensor 200 is fitted on above-mentioned first dew copper pattern 100, to obtain the printed substrate for camera module.Thus, can by adopting the mode be fixed on by image sensor 200 on first dew copper pattern 100, image sensor is avoided to contact with the direct of ink, thus avoid the impact because ink is out of shape under the high temperature conditions on image sensor evenness, and then ensure that image sensor does not produce dark angle due to sensor perturbations in imaging process, and then improve the product yield and result of use that utilize the wiring board prepared according to the method for the utility model embodiment further.
Particularly, with reference to figure 8, according to embodiment of the present utility model, S200 can further include following steps:
S210 continuity point glue
According to embodiment of the present utility model, by carrying out continuity point glue on the first dew copper pattern 100, the laminating of image sensor 200 can be completed easily.Particularly, according to embodiment of the present utility model, with reference to figure 3, can from the intersection of the 3rd line segment 130 and the 4th line segment 140, according to the direction of arrow, from the 4th line segment 140 starting point glue, point glue according to the direction of arrow, first through the first half of the 4th line segment 140, can pass through the first line segment 110, the 3rd line segment 130, second line segment 120 subsequently, finally get back to starting point Jiao Chu by the Lower Half of the 4th line segment 140, complete continuity point glue.Thus, the point glue process that a glue path do not overlap can be completed by continuity point glue, and then avoid the local glue quantity caused due to a glue path overlap and too much cause in follow-up laminating step and produce image sensor, and then improve further the product yield and result of use that utilize the wiring board prepared according to the method for the utility model embodiment.
S220 glue is fitted
According to embodiment of the present utility model, in this step, image sensor 200 is fitted on the first dew copper pattern 100 of continuity point glue process, complete the preparation of the wiring board of the method according to the utility model embodiment.Thus, image sensor 200 can be fixed on the first dew copper pattern 100 by glue, image sensor is avoided to contact with the direct of ink, thus avoid the impact because ink is out of shape under the high temperature conditions on image sensor evenness, and then improve the product yield and result of use that utilize the wiring board prepared according to the method for the utility model embodiment further.
In addition, according to embodiment of the present utility model, with reference to figure 9, following steps should be can further include for the preparation of the method for the printed substrate of camera module:
S300 forms the second dew copper pattern
According to embodiment of the present utility model, in this step, a part of ink layer of removing printed substrate, to form the second dew copper pattern 400.Wherein, the method removing ink is previously description, does not repeat them here.Further, according to embodiment of the present utility model, the second dew copper pattern 400 has closed circular pattern.Thus, can by the second dew copper pattern 400, for subsequent step laminating base provides binding site, and then avoid the direct combination of ink and base, thus avoid the wiring board poor flatness caused due to ink distortion, further increase the production yield and result of use that utilize the wiring board prepared according to the method for the utility model embodiment.
S400 fits base
According to embodiment of the present utility model, in this step, by carrying out continuity point glue on the second dew copper pattern 400, and by glue, base 600 is conformed on the second dew copper pattern 400.Thus, the laminating of base 600 can be completed by the second dew copper pattern 400, and then avoid the wiring board poor flatness caused due to ink distortion, thus improve the production yield and result of use that utilize the wiring board prepared according to the method for the utility model embodiment.
In sum, owing to adopting the laminating being completed the parts such as image sensor 200 and printed substrate by the first dew copper pattern 100 and the second dew copper pattern 400 according to the method for the utility model embodiment, and then avoid all parts and contact with the direct of solder mask, therefore avoid because ink is out of shape impact on wiring board evenness in hot environment.Further, because the first dew copper pattern 100 has previously described pattern and feature, therefore can avoid because a local glue quantity that tree lace road overlap causes is too much, and then avoid causing image sensor run-off the straight.Thus, the requirement of high-pixel camera module for printed substrate can be met according to printed substrate prepared by the method for the utility model embodiment, and then can for the preparation of the printed substrate of camera module with high pixel.
In description of the present utility model, term " longitudinal direction ", " transverse direction ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", the orientation of the instruction such as " end " or position relationship be based on orientation shown in the drawings or position relationship, it is only the utility model instead of require that the utility model with specific azimuth configuration and operation, therefore can not must be interpreted as restriction of the present utility model for convenience of description.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " another embodiment " etc. means to describe in conjunction with this embodiment are contained at least one embodiment of the present utility model.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this specification or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Although illustrate and described embodiment of the present utility model above, be understandable that, above-described embodiment is exemplary, can not be interpreted as restriction of the present utility model, those of ordinary skill in the art can change above-described embodiment, revises, replace and modification in scope of the present utility model.
Claims (5)
1. for a printed substrate for camera module, it is characterized in that, comprising:
Body, described body limits transducer conformable region; And
First dew copper pattern, described first dew copper pattern is formed in described transducer conformable region;
Wherein, described first dew copper pattern comprises:
First line segment, described first line segment has first end and the second end;
Second line segment, described second line segment has first end and the second end, and the first end of the first end of described second line segment and described first line segment is oppositely arranged;
3rd line segment, one end of described 3rd line segment is connected with the first end of described first line segment, and the other end of described 3rd line segment is connected with the second end of described second line segment; And
4th line segment, one end of described 4th line segment is connected with the second end of described first line segment, and the other end of described 4th line segment is connected with the first end of described second line segment, and described 4th line segment and the 3rd line segment intersection are arranged, and disconnect in described intersection.
2. the printed substrate for camera module according to claim 1, is characterized in that, described first line segment and described second line segment be arranged in parallel, and optionally, described first line segment has identical length with described second line segment.
3. the printed substrate for camera module according to claim 1, is characterized in that, described wiring board comprises further:
Base conformable region, described base conformable region is arranged on the body; And
Second dew copper pattern, described second dew copper pattern is arranged in described base conformable region, and described second dew copper pattern has closed circular pattern.
4. a camera module, is characterized in that, comprising: the printed substrate for camera module described in claims 1 to 3.
5. camera module according to claim 4, is characterized in that, described camera module comprises further:
Base, described base is fitted on described second dew copper pattern by glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520673617.XU CN204994081U (en) | 2015-09-01 | 2015-09-01 | Module and printed circuit board make a video recording |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520673617.XU CN204994081U (en) | 2015-09-01 | 2015-09-01 | Module and printed circuit board make a video recording |
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| Publication Number | Publication Date |
|---|---|
| CN204994081U true CN204994081U (en) | 2016-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520673617.XU Expired - Fee Related CN204994081U (en) | 2015-09-01 | 2015-09-01 | Module and printed circuit board make a video recording |
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| CN (1) | CN204994081U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142336A (en) * | 2015-09-01 | 2015-12-09 | 南昌欧菲光电技术有限公司 | Camera shooting module, printed circuit board and preparation method |
-
2015
- 2015-09-01 CN CN201520673617.XU patent/CN204994081U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142336A (en) * | 2015-09-01 | 2015-12-09 | 南昌欧菲光电技术有限公司 | Camera shooting module, printed circuit board and preparation method |
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| C14 | Grant of patent or utility model | ||
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Address after: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20210628 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Granted publication date: 20160120 |