CN107948478A - A kind of periscopic zoom dual camera module and its processing method - Google Patents
A kind of periscopic zoom dual camera module and its processing method Download PDFInfo
- Publication number
- CN107948478A CN107948478A CN201711278372.0A CN201711278372A CN107948478A CN 107948478 A CN107948478 A CN 107948478A CN 201711278372 A CN201711278372 A CN 201711278372A CN 107948478 A CN107948478 A CN 107948478A
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- China
- Prior art keywords
- camera module
- submount
- module
- camera lens
- sensitive chip
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
Abstract
The embodiment of the invention discloses a kind of periscopic zoom dual camera module and its processing method, including the first sensitive chip and the second sensitive chip are equipped on to the first submount of module group substrates and the upper surface of the second submount respectively；First submount are connected by FPC soft boards with the second submount；Corresponding component is mounted on position corresponding with the first submount and the second submount respectively, first camera lens and the second camera lens are equipped on the first sensitive chip and the second sensitive chip respectively, and focus to the first camera lens and the second camera lens, form main camera module and secondary camera module；Make secondary camera module laterally disposed by 90 degree by the bending of FPC soft boards, and reflecting prism is set, make the optical axis coincidence of the optical axis and the second camera lens in secondary camera module of the light beam through reflecting prism reflection, to form periscopic zoom dual camera module.The embodiment of the present invention substantially increases processing efficiency, reduces process time and difficulty of processing, improves assembling yield.
Description
Technical field
The present embodiments relate to camera module technical field, more particularly to a kind of periscopic zoom dual camera mould
Group and its processing method.
Background technology
With the maturation gradually of camera technique, requirement of the user to camera lens and image quality is higher and higher, so periscopic
Zoom dual camera module comes into being.The module is broadly divided into main camera module and secondary camera module two parts, wherein,
Main camera module uses the camera lens of wide visual field angle, and secondary camera module uses the camera lens at narrow visual field angle, since field angle is smaller
Camera lens height it is higher, in order to reduce double whole heights for taking the photograph module, secondary camera module is usually taken the least important seat at a square table placements, is designed as prestige of diving
Formula structure, specifically refer to Fig. 1.When the picture of main camera module switches to the picture of secondary camera module, since pair is taken the photograph
As the angle of view of head mould group is narrow, the picture area that can be shown diminishes, i.e. the picture of central area is exaggerated, and is put with optics
Greatly, optical zoom effect is consistent.
In periscopic zoom dual camera module, main camera module and secondary camera module are independent shooting moulds
Group, and main camera module and the secondary respective module group substrates of camera module are separately independently arranged.In periscopic zoom
, it is necessary to which main camera and secondary camera are mounted on different module group substrates respectively in the manufacturing process of dual camera module,
Since two module group substrates are independently arranged, so two independent camera modules for also needing to have carried are according to certain knot
Structure is assembled, and in order to make the image energy of main camera module and secondary camera module is smooth to cut in use
Change, it is also necessary to two camera modules are carried out with optical axis contraposition calibration, makes the optical axis of two camera modules in same level
On, so that the manufacture of periscopic zoom dual camera module could be completed, the mode of generally use optical image does two shootings
The optical axis contraposition calibration of head mould group, still, since its calibration process is complex, makes manufacture difficulty larger, less efficient, causes
It is relatively low to assemble yield.
In consideration of it, how to provide a kind of periscopic zoom dual camera module for solving above-mentioned technical problem and its processing side
Method becomes the current urgent problem to be solved of those skilled in the art.
The content of the invention
The purpose of the embodiment of the present invention is to provide a kind of periscopic zoom dual camera module and its processing method, is using
During substantially increase processing efficiency, reduce process time and difficulty of processing, improve assembling yield.
In order to solve the above technical problems, an embodiment of the present invention provides a kind of processing of periscopic zoom dual camera module
Method, including：
First sensitive chip and the second sensitive chip are equipped on to the first submount and the second subbase of module group substrates respectively
The upper surface of plate；The module group substrates include first submount, second submount and FPC soft boards, first son
Substrate is connected by the FPC soft boards with second submount；
Corresponding component is mounted on position corresponding with first submount and second submount respectively, will
First camera lens and the second camera lens are equipped on first sensitive chip and second sensitive chip respectively, and to described first
Camera lens and second camera lens are focused, to form main camera module and secondary camera module；
Make the secondary camera module laterally disposed by 90 degree by FPC soft boards bending, and reflecting prism is set, make
The optical axis coincidence of the optical axis of light beam through reflecting prism reflection and the second camera lens in the secondary camera module, to form latent hope
Formula zoom dual camera module.
Optionally, first submount and/or second submount are the substrate being made based on PCB hardboards.
Optionally, first submount and/or second submount are the substrate being made based on FPC soft boards.
Optionally, first submount are connected specially by the FPC soft boards with second submount：
The surface of first submount is connected by the FPC soft boards with the surface of second submount.
The embodiment of the present invention additionally provides a kind of periscopic zoom dual camera module, including main camera module, pair are taken the photograph
As head mould group and reflecting prism, the substrate of the main camera module and the substrate of the secondary camera module pass through FPC soft boards
Connection, the pair camera module is laterally disposed, the optical axis of the light beam of the reflecting prism reflection and the secondary camera module
In camera lens optical axis coincidence.
Optionally, the substrate of the main camera module and/or the substrate of the secondary camera module are based on PCB hardboards
The substrate of making.
An embodiment of the present invention provides a kind of periscopic zoom dual camera module and its processing method, including：By first
Sensitive chip and the second sensitive chip are equipped on the first submount of module group substrates and the upper surface of the second submount respectively；Module
Substrate includes the first submount, the second submount and FPC soft boards, and the first submount are connected by FPC soft boards with the second submount；
Corresponding component is mounted on position corresponding with the first submount and the second submount respectively, by the first camera lens and the second mirror
Head is equipped on the first sensitive chip and the second sensitive chip respectively, and is focused to the first camera lens and the second camera lens, with shape
Into main camera module and secondary camera module；Make secondary camera module laterally disposed by 90 degree by the bending of FPC soft boards, and set
Reflecting prism is put, makes the optical axis coincidence of the optical axis and the second camera lens in secondary camera module of the light beam through reflecting prism reflection,
To form periscopic zoom dual camera module.
As it can be seen that the embodiment of the present invention is that main camera module and secondary camera module are made on same module group substrates
, module group substrates include two regions of the first submount and the second submount, the first sensitive chip and the equal position of the second sensitive chip
In the homonymy of module group substrates, so each component, the first mirror can be completed in same work position in process
The carrying and focusing work of head and the second camera lens, substantially increase processing efficiency, have saved time cost；And main shooting head mould
Group and secondary camera module share one piece of module group substrates, and the optical axis contraposition calibration of main camera module and secondary camera module can be with
Using the shape of module group substrates as benchmark, the complexity of optical axis contraposition calibration is thus greatly reduced, difficulty of processing is reduced, carries
High assembling yield.
Brief description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, below will be to institute in the prior art and embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of existing structure diagram of periscopic zoom dual camera module；
Fig. 2 is that a kind of flow of processing method of periscopic zoom dual camera module provided in an embodiment of the present invention is illustrated
Figure；
Fig. 3 is a kind of structure diagram of module group substrates provided in an embodiment of the present invention；
Fig. 4 is the knot of the main camera module and secondary camera module after the completion of a kind of carrying provided in an embodiment of the present invention
Structure schematic diagram；
A kind of Fig. 5 structure diagrams of periscopic zoom dual camera module provided in an embodiment of the present invention.
Embodiment
An embodiment of the present invention provides a kind of periscopic zoom dual camera module and its processing method, in use
Processing efficiency is substantially increased, reduces process time and difficulty of processing, improves assembling yield.
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
All other embodiments obtained without making creative work, belong to the scope of protection of the invention.
Fig. 2 is refer to, Fig. 2 is a kind of processing method of periscopic zoom dual camera module provided in an embodiment of the present invention
Flow diagram.This method includes：
S11：First sensitive chip and the second sensitive chip are equipped on to the first submount and second of module group substrates respectively
The upper surface of submount；Module group substrates include the first submount, the second submount and FPC soft boards, and the first submount are soft by FPC
Plate is connected with the second submount；
It should be noted that the module group substrates in the embodiment of the present invention include two camera module head zones, namely
Including two submount, and the first submount and the second submount are connected by FPC soft boards, so as to so that the first submount
With the sensitive chip installation position on the second submount upward, easy to which the first sensitive chip and the second sensitive chip are carried respectively
In on the first submount and the second submount.Certainly, need to make module in the manner described above before sensitive chip is carried
Substrate, is respectively provided with corresponding circuit and pad on the first submount and the second submount of module group substrates, first is photosensitive
Chip and the second sensitive chip by corresponding pad and corresponding connection, wherein, for the specific knot of module group substrates
Structure refer to a kind of cross-sectional view of module group substrates shown in Fig. 3.
S12：Corresponding component is mounted on position corresponding with the first submount and the second submount respectively, by first
Camera lens and the second camera lens are equipped on the first sensitive chip and the second sensitive chip respectively, and to the first camera lens and the second camera lens into
Row focusing, to form main camera module and secondary camera module；
Specifically, needing to set each component in camera module, a part of component is pasted in the embodiment of the present invention
Another part component, is mounted on the corresponding position of the second submount by the corresponding position loaded on the first submount.Pasting
After installing corresponding component, then the first camera lens is equipped on the first sensitive chip on the first submount, so that shape
Into main camera module, the second camera lens is equipped on the second sensitive chip on the second submount, is taken the photograph so as to form pair
As head mould group, the structure diagram of main camera module and secondary camera module after the completion of carrying refer to Fig. 4.
It should be noted that the field angle of the first camera lens corresponding with main camera module is wide visual field angle, imaged with pair
The field angle of corresponding second camera lens of head mould group is narrow visual field angle, and after the first camera lens and the second camera lens are carried, is needed
To focus to the first camera lens and the second camera lens.
Further, since the first sensitive chip and the second sensitive chip in the embodiment of the present invention are respectively positioned on the same of module group substrates
Side, so can be in same system in the work for being mounted to component and being carried to the first camera lens, the second camera lens
Post completion is made, namely each manufacture post geometry can synchronously complete the patch of each parts to two camera modules
Dress manufacture, compared with the prior art in separate that independent to make two camera module the time it takes shorter.
S13：Make secondary camera module laterally disposed by 90 degree by the bending of FPC soft boards, and reflecting prism is set, make through anti-
The optical axis coincidence of the optical axis and the second camera lens in secondary camera module of the light beam of prismatic reflection is penetrated, it is double to form periscopic zoom
Camera module.
Specifically, the first camera lens and the second camera lens are being mounted in shape on the first sensitive chip and the second sensitive chip respectively
Into after main camera module and secondary camera, since main camera module is identical with the lens direction of secondary camera module, and
Secondary camera module in periscopic zoom dual camera module is laterally disposed, so the embodiment of the present invention will can connect
The FPC soft board 90-degree bents of main camera module and secondary camera module, so that secondary camera module is laterally disposed in order to make to hang down
Straight incident light beam can be incident upon in the second camera lens of secondary camera module, so needing to set reflecting prism, make vertically to enter
The light beam penetrated can be by the reflective surface of reflecting prism into the second camera lens, and when ensureing that camera module is static, leads to
Cross reflecting prism and reflex to the optical axis of light beam and the optical axis coincidence of the second camera lens of the second camera lens, so that it is double to complete periscopic zoom
The making of camera module, specifically refer to Fig. 5.
In practical applications FPC soft boards can 90-degree bent to the left, 90-degree bent, overbending direction difference can also make pair to the right
The lens direction of camera module is different, so as to set the position of reflecting prism, the specific bending side of FPC soft boards accordingly
Particular determination is not done to this to the embodiment of the present invention.
It should be noted that since main camera module and secondary camera module are made using a module group substrates
, the mal-alignment of the line pad of Meike module can be controlled in the margin of tolerance of very little on substrate, so every shooting
The mal-alignment of sensitive chip in head mould group can also be controlled in the range of very little, main camera module and secondary shooting head mould
The optical axis contraposition calibration of group can be on the basis of the shape of module group substrates, relative to being taken the photograph in the prior art to two independently made
As head mould group does optical axis contraposition calibration, the optical axis of two camera modules of reduction of the embodiment of the present invention by way of optical image
Align the difficulty of calibration.
Further, the first submount and/or the second submount are the substrate being made based on PCB hardboards.
Specifically, the first submount and/or the second submount in the embodiment of the present invention can be made based on hardboard and
Into substrate, be specifically as follows the substrate that PCB hardboards are made, naturally it is also possible to specific unlimited using other hardboards.
Further, the first submount and/or the second submount are the substrate being made based on FPC soft boards.
It should also be noted that, can not only hardboard be used to make the first submount and/or second in the embodiment of the present invention
Submount, can also use FPC soft boards to make corresponding submount.
Further, the first submount are connected specially by FPC soft boards with the second submount：
The surface of first submount is connected by FPC soft boards with the surface of the second submount.
It should be noted that the FPC soft boards in the embodiment of the present invention can pass through the surface and second with the first submount
The surface of submount combines, so that both be connected.For example, the lower surface of the first submount passes through FPC soft boards and the second subbase
The lower surface of plate is connected, or the upper surface of the first submount is connected by FPC soft boards with the upper surface of the second submount.Certainly,
FPC soft boards can also be arranged at the centre of the first submount and the second submount, as the intermediate layer of the first submount and second
The intermediate layer of submount, so that the first submount and the second submount be connected, its specific connection mode embodiment of the present invention is not
Limit, can realize the purpose of the embodiment of the present invention.
An embodiment of the present invention provides a kind of processing method of periscopic zoom dual camera module, including：By the first sense
Optical chip and the second sensitive chip are equipped on the first submount of module group substrates and the upper surface of the second submount respectively；Module base
Plate includes the first submount, the second submount and FPC soft boards, and the first submount are connected by FPC soft boards with the second submount；Will
Corresponding component is mounted on position corresponding with the first submount and the second submount respectively, by the first camera lens and the second camera lens
It is equipped on the first sensitive chip and the second sensitive chip, and focuses to the first camera lens and the second camera lens respectively, is formed
Main camera module and secondary camera module；Make secondary camera module laterally disposed by 90 degree by the bending of FPC soft boards, and set
Reflecting prism, makes the optical axis coincidence of the optical axis and the second camera lens in secondary camera module of the light beam through reflecting prism reflection, with
Form periscopic zoom dual camera module.
As it can be seen that the embodiment of the present invention is that main camera module and secondary camera module are made on same module group substrates
, module group substrates include two regions of the first submount and the second submount, the first sensitive chip and the equal position of the second sensitive chip
In the homonymy of module group substrates, so each component, the first mirror can be completed in same work position in process
The carrying and focusing work of head and the second camera lens, substantially increase processing efficiency, have saved time cost；And main shooting head mould
Group and secondary camera module share one piece of module group substrates, and the optical axis contraposition calibration of main camera module and secondary camera module can be with
Using the shape of module group substrates as benchmark, the complexity of optical axis contraposition calibration is thus greatly reduced, difficulty of processing is reduced, carries
High assembling yield.
On the basis of above-described embodiment, Fig. 5 is refer to, Fig. 5 embodiment of the present invention additionally provides a kind of periscopic zoom
The structure diagram of dual camera module, the periscopic zoom dual camera module include main camera module, secondary shooting head mould
Group and reflecting prism, the substrate of main camera module are connected with the substrate of secondary camera module by FPC soft boards, pair shooting head mould
Group is laterally disposed, the optical axis coincidence of the optical axis of the light beam of reflecting prism reflection and the camera lens in secondary camera module.
It should be noted that the periscopic zoom dual camera module provided in the embodiment of the present invention is by above-mentioned reality
Apply what the periscopic zoom dual camera module processing method that example is provided was made, its manufacture craft difficulty is relatively low, processing
Efficiency is higher.Above method embodiment is refer to for specific introduce of periscopic zoom dual camera module processing method, this
Details are not described herein for application.
Optionally, the substrate of main camera module and/or the substrate of secondary camera module are the base made based on PCB hardboards
Plate.It is of course also possible to use other hardboards are as substrate, it is specific unlimited.
It should also be noted that, in the present specification, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or order.Moreover, term " comprising ", "comprising" or its any other variant meaning
Covering non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only include that
A little key elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic key element of equipment.In the absence of more restrictions, the key element limited by sentence "including a ...", is not arranged
Except also there are other identical element in the process, method, article or apparatus that includes the element.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide scope caused.
Claims (6)
- A kind of 1. processing method of periscopic zoom dual camera module, it is characterised in that including：First sensitive chip and the second sensitive chip are equipped on to the first submount and the second submount of module group substrates respectively Upper surface；The module group substrates include first submount, second submount and FPC soft boards, first submount It is connected by the FPC soft boards with second submount；Corresponding component is mounted on position corresponding with first submount and second submount respectively, by first Camera lens and the second camera lens are equipped on first sensitive chip and second sensitive chip respectively, and to first camera lens Focus with second camera lens, to form main camera module and secondary camera module；Make the secondary camera module laterally disposed by 90 degree by FPC soft boards bending, and reflecting prism is set, make through anti- The optical axis coincidence of the optical axis and the second camera lens in the secondary camera module of the light beam of prismatic reflection is penetrated, to form periscopic change Burnt dual camera module.
- 2. the processing method of periscopic zoom dual camera module according to claim 1, it is characterised in that described first Submount and/or second submount are the substrate being made based on PCB hardboards.
- 3. the processing method of periscopic zoom dual camera module according to claim 1, it is characterised in that described first Submount and/or second submount are the substrate being made based on FPC soft boards.
- 4. the processing method of the periscopic zoom dual camera module according to claims 1 to 3 any one, its feature exist In first submount are connected specially by the FPC soft boards with second submount：The surface of first submount is connected by the FPC soft boards with the surface of second submount.
- 5. a kind of periscopic zoom dual camera module, it is characterised in that including main camera module, secondary camera module and anti- Prism is penetrated, the substrate of the main camera module is connected with the substrate of the secondary camera module by FPC soft boards, and the pair is taken the photograph Picture head mould group is laterally disposed, the optical axis of the optical axis of the light beam of the reflecting prism reflection and the camera lens in the secondary camera module Overlap.
- 6. periscopic zoom dual camera module according to claim 5, it is characterised in that the main camera module Substrate and/or the substrate of the secondary camera module are the substrate made based on PCB hardboards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711278372.0A CN107948478B (en) | 2017-12-06 | 2017-12-06 | Periscopic zoom double-camera module and processing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711278372.0A CN107948478B (en) | 2017-12-06 | 2017-12-06 | Periscopic zoom double-camera module and processing method thereof |
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| CN107948478A true CN107948478A (en) | 2018-04-20 |
| CN107948478B CN107948478B (en) | 2020-08-14 |
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Cited By (4)
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| CN112187971A (en) * | 2019-07-05 | 2021-01-05 | 北京小米移动软件有限公司 | Periscopic camera module and terminal equipment |
| CN112672136A (en) * | 2020-12-24 | 2021-04-16 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113645374A (en) * | 2020-04-24 | 2021-11-12 | 宁波舜宇光电信息有限公司 | Periscopic camera module, multi-camera module and camera module assembling method |
| WO2023168551A1 (en) * | 2022-03-07 | 2023-09-14 | Huawei Technologies Co.,Ltd. | Camera system with two cameras integrated and method thereof |
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| Publication number | Publication date |
|---|---|
| CN107948478B (en) | 2020-08-14 |
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