CN107155048A - Dual camera module and terminal device - Google Patents
Dual camera module and terminal device Download PDFInfo
- Publication number
- CN107155048A CN107155048A CN201610123964.4A CN201610123964A CN107155048A CN 107155048 A CN107155048 A CN 107155048A CN 201610123964 A CN201610123964 A CN 201610123964A CN 107155048 A CN107155048 A CN 107155048A
- Authority
- CN
- China
- Prior art keywords
- substrate
- camera module
- wiring board
- dual camera
- step hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000009977 dual effect Effects 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000008393 encapsulating agent Substances 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The present invention provides a kind of dual camera module, the dual camera module includes two camera modules, each camera module includes camera lens module and voice coil motor, cutoff filter and image sensing chip, each camera module also includes substrate and wiring board, the substrate includes first surface and the second surface opposite with the first surface, the first surface offers first step hole, the second surface is provided with second step hole, the first step hole and the second step hole are coaxial and connect, the cutoff filter is fixed in the first step hole, the image sensing chip is by being fixedly welded in the second step hole and being connected with the electrical property of substrate, the voice coil motor, the substrate and the wiring board sequentially coaxially set and the cutoff filter are located between the camera lens module and the image sensing chip, the substrate with the wiring board is by gluing fixation and is electrically connected with.
Description
Technical field
The present invention relates to camera technology field, more particularly to a kind of dual camera module and terminal device.
Background technology
Dual camera module includes two independent cameras being installed on same circuit board, two cameras
The same object of equidirectional can be taken pictures simultaneously, the first image and the second image are produced respectively, the
One image and the second image can also mutually compensate for obtaining the two dimensional image of high definition with compositing 3 d images.
Dual camera module generally include two lens units, two camera lens assembled bases, two cutoff filters,
Two image sensing chips and a circuit board.When image sensing chip is assembled with circuit board, first in circuit board
Precalculated position dispensing, two image sensing chips are separately assembled to precalculated position (Die Bonding), and with electricity
Road plate is adhesively fixed, then by terminal conjunction method (Wire Bonding), i.e., makes image sensing core by gold thread
Piece is electrically connected with circuit board.The problem of prior art is present is that two image sensing chips pass through gluing group
When being filled to circuit board, the complex process that image sensing chip is electrically connected with circuit board is made by terminal conjunction method
And cost is high.
The content of the invention
In view of the above-mentioned problems, it is an object of the invention to provide a kind of dual camera module to simplify dual camera
The manufacturing process of module, improves production efficiency, reduces cost.
The present invention also provides a kind of terminal device with the dual camera module.
The present invention provides a kind of dual camera module, and the dual camera module includes two camera modules,
Each camera module includes camera lens module and voice coil motor, cutoff filter and image sensing core
Piece, it is characterised in that each camera module also includes substrate and wiring board, the substrate includes the
One surface and the second surface opposite with the first surface, the first surface offer first step hole,
The second surface is provided with second step hole, and the first step hole and the second step hole are coaxial and mutually pass through
Logical, the cutoff filter is fixed in the first step hole, and the image sensing chip passes through weldering
Connect and be fixed in the second step hole and be connected with the electrical property of substrate, the voice coil motor, the substrate
Sequentially coaxially set with the wiring board and cause the cutoff filter to be located at the camera lens module and institute
State between image sensing chip, the substrate with the wiring board is by gluing fixation and is electrically connected with.
Wherein, the cutoff filter is fixed with the substrate by fortified resins, and fortified resins
For light-cured resin or it is mixed with the light-cured resin of carbon black-filled thing, pigment.
Wherein, the image sensing chip is electrically connected with the substrate by soldered ball, and soldered ball with it is described
Sealed at substrate connection using encapsulant.
Wherein, anisotropic conductive film is provided between the substrate and the wiring board, and it is conductive to anisotropy
Glued membrane makes the substrate and the gluing fixation of the wiring board using heat pressing process.
Wherein, it is electrically connected between the substrate and the wiring board by conducting metal.
Wherein, the substrate is ceramic substrate or pcb board.
The present invention also provides a kind of terminal device with above-mentioned dual camera module, and the terminal device includes
FPC (Flexible Printed Circuit) and above-mentioned dual camera module, one end of the FPC and described two
Individual wiring board is by gluing fixation and is electrically connected with.
Wherein, anisotropic conductive film is provided between the FPC and the wiring board, and it is conductive to anisotropy
Glued membrane makes the FPC and the gluing fixation of the wiring board using heat pressing process.
Wherein, it is electrically connected between the FPC and the wiring board by conducting metal.
Wherein, the other end of the FPC is additionally provided with connector.
The dual camera module that the present invention is provided, by the way that image sensing chip is fixed in the stepped hole of substrate,
Avoid installing using traditional handicraft because of image sensing chip and (image sensing chip is attached on circuit board
Predetermined dispensing position) caused by image sensing chip run-off the straight and the problem of influence image quality.Simultaneously
Wire bonding (Wire Bonding) technique of complexity is eliminated, production efficiency is improved, reduces cost.
Brief description of the drawings
In order to illustrate more clearly of technical scheme, below by using required in embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Mode, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of decomposition texture schematic diagram of dual camera module provided in an embodiment of the present invention；
Fig. 2 is the internal structure schematic diagram of the dual camera module shown in Fig. 1；
Fig. 3 is a kind of decomposition texture schematic diagram of terminal device provided in an embodiment of the present invention；
Fig. 4 is the internal structure schematic diagram of the terminal device shown in Fig. 3.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear
Chu, it is fully described by, it is clear that described embodiment is only a part of embodiment of the invention, rather than
Whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creation
Property work under the premise of the every other embodiment that is obtained, belong to the scope of protection of the invention.
Also referring to Fig. 1 and Fig. 2, present pre-ferred embodiments provide a kind of dual camera module 100.Institute
Stating dual camera module 100 includes two independent camera modules, and each described camera module includes
Camera lens module 10 and the voice coil motor 20 for supporting the camera lens module 10, cutoff filter 30, image
Sensor chip 40, substrate 60 and wiring board 70.Taken the photograph described in constitute the dual camera module 100 two
As head mould group can be set up in parallel, stagger arrangement sets or is disposed opposite to each other.It is understood that the present invention is to two
The arrangement mode of the camera module is not limited.In the present embodiment, two cameras preferably
Module is set up in parallel.
Further, the substrate 60 is circular or rectangular slab.In the present embodiment, the substrate 60
For rectangular slab.The substrate 60 is ceramic substrate or PCB (Printed Circuit Board) plate etc..By
There is the characteristics such as high intensity, high thermal conductivity, high-insulativity in ceramic substrate, in the present embodiment, preferred institute
Substrate 60 is stated for ceramic substrate.The substrate 60 include first surface 67 and with the phase of first surface 67
The second surface 68 of the back of the body.The first surface 67 offers first step hole 61, and the second surface 68 is set
There is second step hole 62.The first step hole 61 and the second step hole 62 are coaxial and connect, and
Form opposite two and support step.The first step hole 61 and the second step hole 62 are rectangle
Hole.The cutoff filter 30 is fixed in the first step hole 61 and by the first step hole
Step is supported described in 61 to support.The cutoff filter 30 passes through fortified resins with the substrate 60
31 are fixed, and fortified resins are light-cured resin or the photocuring for being mixed with carbon black-filled thing, pigment etc.
Resin.The image sensing chip 40 is by being fixedly welded in the second step hole 62 and by described the
Step is supported described in two stepped holes 62 to support, and the image sensing chip 40 and the electricity of substrate 60
Property connection.In the present embodiment, the image sensing chip 40 and the substrate 60 are electrical by soldered ball 63
Connect and sealed in junction with encapsulant 64.The encapsulant 64 be epoxy resin or its
Its encapsulant.Thus, the cutoff filter 30 is coaxially disposed with the image sensing chip 40,
The image sensing chip 40 is used for senses light intensity and coordinates the corresponding image of generation with the camera lens module 10
Signal.By the way that the image sensing chip 40 is fixed in the second step hole 62 of the substrate 60, keep away
Exempt to install using traditional handicraft because of image sensing chip and (be attached to image sensing chip pre- on circuit board
Fixed point glue position) caused by image sensing chip run-off the straight and the problem of influence image quality.Save simultaneously
Wire bonding (Wire Bonding) technique of complexity has been gone, production efficiency has been improved, reduces cost.
Further, the camera lens module 10 is provided by the voice coil motor 20 and supports and be contained in the sound
In coil motor 20.The voice coil motor 20 is cavity, and the voice coil motor 20 is used to promote the camera lens mould
Group 10 moves to reach focusing purpose.The voice coil motor is installed on the substrate 60, and makes the mirror
Head mould group 10 and the cutoff filter 30 are coaxial and are oppositely arranged.The voice coil motor 20 with it is described
Substrate 60 passes through gluing fixation.
Further, the wiring board 70 is one kind in pcb board, ceramic substrate or metal substrate etc..
In the present embodiment, the wiring board 70 is pcb board.The substrate 60 is provided with the second step hole 62
Side with the wiring board 70 is by gluing fixation and is electrically connected with.The substrate 60 and the wiring board
(the Anisotropic Conductive Film of anisotropic conductive film 71 are provided between 70；ACF) and hot pressing is used
The gluing fixation of technique.It is electrically connected between the substrate 60 and the wiring board 70 by conducting metal 72,
The conducting metal 72 is copper sheet or gold plated copper sheets.Thus, the voice coil motor 20, the substrate 60
Sequentially coaxially set with the wiring board 70 and cause the cutoff filter 30 to be located at the camera lens mould
Between group 10 and the image sensing chip 40.The image sensing chip 40 by the substrate 60 with
The wiring board 70 electrically conducts, and eliminates wire bonding (Wire Bonding) mounting process of complexity,
Production efficiency is improved, cost is reduced.
Also referring to Fig. 3 and Fig. 4, the present invention also provides a kind of terminal with the dual camera module and set
Standby 200.The terminal device 200 can be that the terminals such as camera, mobile phone, tablet personal computer, notebook computer are set
It is standby.The terminal device 200 includes FPC 210 (Flexible Printed Circuit) and the dual camera
Module 100, one end of the FPC 210 with described two wiring boards 70 are by gluing fixation and are electrically connected with.
Provided with anisotropic conductive film and using heat pressing process glue between the FPC 210 and described two wiring boards 70
Cementation is determined.It is electrically connected between the FPC 210 and the wiring board by conducting metal, the conductive gold
Belong to for copper sheet or gold plated copper sheets.The other end of the FPC 210 is additionally provided with connector 220.
Described above is the preferred embodiment of the present invention, it is noted that for the common skill of the art
For art personnel, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, this
A little improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of dual camera module, the dual camera module includes two camera modules, each described
Camera module includes camera lens module and voice coil motor, cutoff filter and image sensing chip, and it is special
Levy and be, each camera module also include substrate and wiring board, the substrate include first surface and
The second surface opposite with the first surface, the first surface offers first step hole, described second
Surface is provided with second step hole, and the first step hole and the second step hole are coaxial and connect, described
Cutoff filter is fixed in the first step hole, and the image sensing chip is fixed on described second
It is connected in stepped hole and with the electrical property of substrate, the voice coil motor, the substrate and the wiring board are successively
Be coaxially disposed and cause the cutoff filter be located at the camera lens module and the image sensing chip it
Between, the substrate with the wiring board is by gluing fixation and is electrically connected with.
2. dual camera module according to claim 1, it is characterised in that the IR cut filter
Piece is fixed with the substrate by fortified resins, and fortified resins are light-cured resin or are mixed with carbon black
The light-cured resin of filler, pigment.
3. dual camera module according to claim 1, it is characterised in that the image sensing chip
It is electrically connected with, and is carried out at soldered ball and the substrate connection using encapsulant by soldered ball with the substrate
Sealing.
4. dual camera module according to claim 1, it is characterised in that the substrate and the line
Anisotropic conductive film is provided between the plate of road, and the substrate is made using heat pressing process to anisotropic conductive film
With the gluing fixation of the wiring board.
5. the dual camera module according to claim 1 or 4, it is characterised in that the substrate and institute
State and be electrically connected with by conducting metal between wiring board.
6. dual camera module according to claim 1, it is characterised in that the substrate is ceramic base
Plate or pcb board.
7. a kind of terminal device with the dual camera module, it is characterised in that the terminal device bag
FPC (Flexible Printed Circuit) and the dual camera module as described in claim any one of 1-6 are included,
One end of the FPC with described two wiring boards are by gluing fixation and are electrically connected with.
8. terminal device according to claim 7, it is characterised in that the FPC and the wiring board
Between be provided with anisotropic conductive film, and the FPC and institute are made using heat pressing process to anisotropic conductive film
State the gluing fixation of wiring board.
9. the terminal device according to claim 7 or 8, it is characterised in that the FPC and the line
It is electrically connected between the plate of road by conducting metal.
10. terminal device according to claim 7, it is characterised in that the other end of the FPC is also
Provided with connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610123964.4A CN107155048A (en) | 2016-03-04 | 2016-03-04 | Dual camera module and terminal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610123964.4A CN107155048A (en) | 2016-03-04 | 2016-03-04 | Dual camera module and terminal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107155048A true CN107155048A (en) | 2017-09-12 |
Family
ID=59792059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610123964.4A Pending CN107155048A (en) | 2016-03-04 | 2016-03-04 | Dual camera module and terminal device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107155048A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107948478A (en) * | 2017-12-06 | 2018-04-20 | 信利光电股份有限公司 | A kind of periscopic zoom dual camera module and its processing method |
| CN108012055A (en) * | 2017-11-28 | 2018-05-08 | 信利光电股份有限公司 | A kind of multi-cam module |
| CN108055444A (en) * | 2018-01-11 | 2018-05-18 | 维沃移动通信有限公司 | A kind of camera module and mobile terminal |
| CN114979434A (en) * | 2022-05-12 | 2022-08-30 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
-
2016
- 2016-03-04 CN CN201610123964.4A patent/CN107155048A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012055A (en) * | 2017-11-28 | 2018-05-08 | 信利光电股份有限公司 | A kind of multi-cam module |
| CN107948478A (en) * | 2017-12-06 | 2018-04-20 | 信利光电股份有限公司 | A kind of periscopic zoom dual camera module and its processing method |
| CN107948478B (en) * | 2017-12-06 | 2020-08-14 | 信利光电股份有限公司 | Periscopic zoom double-camera module and processing method thereof |
| CN108055444A (en) * | 2018-01-11 | 2018-05-18 | 维沃移动通信有限公司 | A kind of camera module and mobile terminal |
| WO2019137465A1 (en) * | 2018-01-11 | 2019-07-18 | 维沃移动通信有限公司 | Camera module and mobile terminal |
| CN114979434A (en) * | 2022-05-12 | 2022-08-30 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170912 |
|
| WD01 | Invention patent application deemed withdrawn after publication |