CN105450913B

CN105450913B - Camera module, electric bracket, assembling method and application thereof

Info

Publication number: CN105450913B
Application number: CN201510869193.9A
Authority: CN
Inventors: 王明珠; 王胤欢; 陈飞帆; 黄桢; 陈振宇; 郭楠
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2015-12-01
Filing date: 2015-12-01
Publication date: 2020-04-28
Anticipated expiration: 2035-12-01
Also published as: CN105450913A

Abstract

A camera module and an electrical support, and an assembling method and application thereof, wherein the camera module comprises: the optical lens is positioned above the photosensitive chip, and the photosensitive chip is electrically connected to the electrical support by implanting a metal ball such as a copper ball, so that the cost is effectively saved and the electrical connection performance is ensured.

Description

Camera module, electric bracket, assembling method and application thereof

Technical Field

The present invention relates to the field of camera modules, and more particularly, to a camera module, an electrical stand, and methods of assembling and using the same.

Background

With the rapid development of electronic products, the position of the electronic products in daily life is more and more important. In order to meet the market demand for space saving and portability, electronic devices are increasingly being made thinner and lighter, which requires the size of each component of the electronic devices, especially the thickness of each component, to be smaller and smaller.

The conventional COB (chip on Board) process camera module is formed by assembling a rigid-flex board, a photosensitive chip, a lens base, a motor drive and a lens. All electronic components are placed on the surface layer of the circuit board, and the components are not overlapped with each other. Along with the requirement of high pixel, ultra-thin module, the formation of image of module of making a video recording requires also more and more highly, and then the equipment degree of difficulty increases, and the device specification is higher. Meanwhile, the larger the pixel is, the larger the chip area can be correspondingly increased, and the number of passive components such as driving resistors and driving capacitors can be correspondingly increased, namely, the size of the module can be increased more and more.

The existing mobile phone camera module packaging structure contradicts with the thinning and miniaturization of the mobile phone to the camera module, so a compact camera module and a novel packaging technology thereof need to be invented to meet the requirements of product development.

Although the camera module is widely applied in the field of current camera modules, the camera module has many disadvantages.

Firstly, in the manufacturing process of the camera module, the motor needs to be welded on the circuit board after the camera module is assembled, so as to realize the power-on connection of the motor. Not only is the process complicated, but there are also many additional problems that may arise from this welding process, for example, product yield is likely to be affected by the quality of the weld completion. Also, the welded connection is not secure and is easily damaged during use and maintenance.

Secondly, because be provided with the base between motor and the base, so the base need be strideed across in the connection between motor and the circuit board, not only occupation space, and the fastness is relatively weak moreover.

Third, according to the conventional art, the external soldered electrical connection between the motor and the base is more susceptible to the external environment, for example, dust may affect the connection effect and the service life.

In addition, in order to provide a good supporting function for the base, the base must have a large size and occupy a large space, so that the size of the whole camera module is increased. If the size of the base is reduced in order to reduce the size of the camera module, the supporting function of the base may be affected.

In addition, the circuit board of the conventional camera module is separately disposed at the bottom of the camera module, and the circuit board is relatively far away from the motor, the photosensitive chip and other components requiring energy supply. This not only requires the consumption of a large number of energy conducting elements, such as wires, but also does not adequately address the design of the elements making up the circuit as needed throughout the circuit layout of the camera module, so that the space occupied by the elements making up the circuit is not reduced as reasonably. That is to say, if the relative position relation of the circuit board of the camera module and other components is rationally arranged, the space occupied by the circuit components necessary for the camera module can be further reduced, and the size of the camera module can be further reduced. Of course, the width size or the thickness size of the camera module can be selectively reduced according to market needs.

In addition, there are two methods for connecting the substrates in the camera module in the prior art, one is a snap-fit connection, and the other is a plug-in connection. The plug-in connection generally adopts a mode of combining a male connector seat and a female connector seat, and the plug-in connection generally adopts a mode of a Pin Pin golden finger at the bottom of a substrate and utilizing a thimble to contact. However, the substrate of the camera module has a problem that the substrate can only be connected in the up-and-down direction. That is, a photosensitive chip is attached to the upper surface of the substrate, and a device is connected to the lower surface of the substrate, but it is impossible to perform a press-fit connection and an insertion connection at the same time. Therefore, the camera module structure in the prior art cannot meet the requirements for connecting different devices.

Furthermore, along with the improvement of the pixels of the camera module in the prior art, the area of the photosensitive chip in the camera module is correspondingly increased, and because the driving resistors, the driving capacitors and other components are correspondingly increased, the packaging size of the camera module is increased. But the equipment of the module of making a video recording of encapsulation among the prior art is higher and higher to the dimensional requirement of the module of making a video recording, and the more and more size of the module of making a video recording after requiring the encapsulation among the prior art is thinner better, and smaller and more handy better, therefore actual conditions and actual demand have produced the contradiction.

Therefore, it is highly desirable to provide a camera module in order to solve the above problems in the prior art.

Disclosure of Invention

It is an object of the present invention to provide a camera module and electrical stand, and methods of assembly and use thereof, wherein the camera module does not require a base as in conventional technology.

Another objective of the present invention is to provide a camera module, an electrical stand, and an assembly method and application thereof, wherein the camera module includes the electrical stand, and the electrical stand can be made into any shape, and has functions (electrical signal conduction of electronic devices such as a chip and a motor) of a conventional circuit board, and also has functions of a conventional base supporting a filter and serving as a base stand of the motor.

Another object of the present invention is to provide a camera module, an electrical stand, and an assembly method and application thereof, wherein the electrical stand integrates the functions of a base and a circuit board in a conventional camera module, so that the structure is more compact.

Another objective of the present invention is to provide a camera module, an electrical bracket, and an assembling method and an application thereof, wherein a boss may be disposed inside the electrical bracket or a connection point is formed at an inner side of the electrical bracket for electrically connecting with the photosensitive chip, and the electrical bracket and the photosensitive chip are electrically connected by implanting a metal ball on the photosensitive chip.

Another objective of the present invention is to provide a camera module, an electrical stand, and an assembling method and an application thereof, wherein a predetermined electrical component and a conductive component are disposed on the electrical stand to form a predetermined circuit between the electrical components.

Another object of the present invention is to provide a camera module, an electrical stand, and an assembling method and application thereof, wherein the electrical stand has a thin shape to meet the requirement of the camera module, and further to enable the electronic device to be designed in a thin style.

Another object of the present invention is to provide a camera module, an electrical stand, and a method for assembling and using the same, wherein the structure and shape of the electrical stand are adapted to other components of the camera module, so as to reduce the size of the entire camera module.

Another objective of the present invention is to provide a camera module, an electrical stand, and an assembly method and application thereof, wherein the camera module has a smaller structural size and a thinner thickness.

Another object of the present invention is to provide a camera module, an electrical stand, and an assembling method and an application thereof, wherein the camera module has no lens base type components, so as to save material cost.

Another object of the present invention is to provide a camera module, an electrical stand, and an assembly method and application thereof, wherein the passive electrical component of the camera module is embedded in the electrical stand, thereby eliminating the manufacturing process of the module, reducing the process steps, and saving the assembly cost.

Another object of the present invention is to provide a camera module, an electrical stand, and an assembling method and application thereof, wherein the camera module has the advantages of small size and firm structure.

Another object of the present invention is to provide a camera module, an electrical stand, and an assembly method and an application thereof, wherein the resistance-capacitance device of the camera module is embedded, so as to avoid bad module black spots caused by solder resist, dust, etc. in the resistance-capacitance device region, and improve the yield of products.

Another object of the present invention is to provide a camera module, an electrical stand, and an assembling method and an application thereof, wherein the camera module has an enhanced market competitiveness, particularly in high-end products, and further an enhanced market competitiveness of electronic devices using the camera module.

Another objective of the present invention is to provide a camera module, an electrical stand, and an assembling method and an application thereof, wherein the electrical stand has a strong market competitiveness, so as to enhance the market competitiveness of the camera module using the electrical stand and further enhance the market competitiveness of the corresponding electronic device.

An object of the present invention is to provide a camera module, an electrical stand, and an assembling method and application thereof, wherein the electrical stand can be used as a supporting element to support all components in the camera module, and can also be used as a circuit board to electrically connect the components in the camera module, thereby simplifying the structure of the camera module.

Another objective of the present invention is to provide a camera module, an electrical bracket, and an assembling method and application thereof, wherein the electrical bracket can be electrically connected to the photosensitive chip not only in the vertical direction, but also inside and outside the electrical bracket.

Another object of the present invention is to provide a camera module, an electrical stand, and an assembling method and application thereof, wherein the electrical stand can be connected to a device in multiple directions, which is beneficial to peripheral connection when too many pins are developed subsequently.

Another objective of the present invention is to provide a camera module, an electrical stand, and an assembling method and application thereof, wherein the photosensitive chip is disposed in a hollow portion of the electrical stand, so as to reduce the thickness of the electrical stand, which is further beneficial to reduce the thickness of the device using the camera module.

Another objective of the present invention is to provide a camera module, an electrical bracket, and an assembling method and an application thereof, wherein the electrical bracket has connection points led out in multiple directions, so as to be electrically connected to the photosensitive chip and further connected to other devices.

Another objective of the present invention is to provide a camera module, an electrical bracket, and an assembling method and an application thereof, wherein a bonding pad or a solder joint can be disposed under the electrical bracket to electrically interconnect with the flexible printed circuit board, and the interconnecting manner of the electrical bracket and the flexible printed circuit board includes, but is not limited to, anisotropic conductive adhesive, soldering, and the like.

Another object of the present invention is to provide a camera module, an electrical stand, and an assembling method and application thereof, wherein the electrical stand can be provided with connection points, and the connection points can be used for electrically interconnecting with other devices and fixing other devices.

Another object of the present invention is to provide a camera module, an electrical stand, and an assembling method and application thereof, so as to maximize the functions of the camera module. The module of making a video recording compares with conventional COB mode module and has high roughness performance, and it is portrait four corners homogeneity and is superior to the module of making a video recording of present conventionality.

Other advantages and features of the invention will become apparent from the following description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

The foregoing and other objects and advantages are achieved in accordance with the present invention by an electrical stand for a camera module, comprising a stand body and an electrical circuit, wherein the electrical circuit is disposed in the stand body and adapted to be electrically connected to a photo-sensing chip.

In one embodiment, the electrical bracket further comprises a series of connectors, wherein the connectors are disposed on a surface of the bracket body, wherein the connectors comprise a series of light-sensing chip connection points, a series of circuit board connection points, and a series of electronic component connectors.

In one embodiment, the electrical bracket may be shaped as a boss for carrying an IRCF or a lens.

In one embodiment, the electric bracket is embedded with passive components such as capacitors, resistors and the like.

In one embodiment, the electrical bracket can be provided with pads and pins on the boss-shaped body so as to be electrically interconnected with the chip and the motor.

In one embodiment, the photosensitive chip is electrically connected with the electrical support by implanting metal balls thereon.

In one embodiment, a pad or a pin is arranged above the electric bracket for electric conduction, wherein the pad or the pin above the electric bracket can extend upwards to be in conduction and interconnection with components such as a motor and the like, and the conduction and interconnection mode is selected from welding, anisotropic conductive adhesive or hot pressing; or the circuit board is conducted upwards from the position below the electric support until the end face of the module lens forms Housing.

According to another aspect of the present invention, there is provided a camera module, wherein the camera module includes:

an optical lens;

a photosensitive chip; and

an electrical support as described above;

the holder body of the electrical holder may further include a lens holder, wherein the optical lens is supported by the lens holder, and wherein the photo sensor chip is electrically connected to the electrical holder. The camera module can be implemented as a fixed focus camera module.

an optical lens;

a photosensitive chip;

a motor;

a light filter;

a flexible circuit board; and

an electrical support as described above;

wherein the optical lens is capable of being driven by the motor, the motor is supported by the electrical support, wherein the light sensing chip and the flexible circuit board are respectively electrically connected to the electrical support, wherein the optical filter is disposed between the optical lens and the light sensing chip; or

The electric bracket and the motor, the photosensitive chip or the flexible circuit board are used for being in power-on connection in a way that laminated resin is made on a reinforced steel plate or a copper plate, and an internal circuit is communicated with the electric conduction; or

The bottom layer of the electric bracket sinks and is hollowed out, and the chip can be placed in the bracket.

Wherein the camera module is implemented as an auto-focus camera module.

In other words, the present invention provides an electrical stand for supporting a camera module, the electrical stand including a stand body and a circuit, wherein the circuit is disposed on the stand body to make the electrical stand become a circuit board, and a metal ball is implanted on a photosensitive chip of the camera module to electrically connect the electrical stand and the photosensitive chip.

Preferably, the holder main body is a hollow ring structure including a top surface, a bottom surface, an outer side and an inner side, and a light passing hole, the top surface, the bottom surface, the outer side and the inner side are respectively electrically connected by the circuit, and the light passing hole passes through the top surface and the bottom surface of the holder main body.

Further, the inside of the bracket main body further comprises at least one pair of axially symmetrical bosses, the bosses extend to the inner side of the bracket main body and are positioned above the through holes, the bosses form a first accommodating space and a second accommodating space inside the electric bracket, and the upper surface and the lower surface of the bosses are electrically communicated with the circuit.

In some embodiments, the holder body further comprises a connecting device disposed on a surface of the holder body and electrically connected to the circuit in the holder body.

Preferably, the connecting device includes a photosensitive chip connecting point, and the photosensitive chip connecting point is disposed on the inner side of the electrical support and electrically connected to a photosensitive chip in the camera module.

Specifically, wherein the photosensitive chip connection point is located on the lower surface of the boss and is a bonding pad or a welding spot, and the photosensitive chip is electrically connected with the photosensitive chip connection point by implanting the metal ball.

Specifically, the metal ball is implanted into the photosensitive chip by soldering or hot pressing.

Preferably, wherein the metal ball is a copper ball.

In some embodiments, the diameter of the contact surface between the copper ball and the photosensitive chip is 40-100 um.

Preferably, wherein the height of the copper ball is 30-100 um.

In some embodiments, the connecting device further includes a circuit board connecting point disposed on the bottom surface of the bracket main body for electrically connecting to a flexible circuit board in the camera module.

In some embodiments, the connecting device further includes a motor connecting point disposed on the top surface of the stand body for electrically connecting to a driving device in the camera module.

Preferably, the connecting device further includes an electronic component connecting point, and the electronic component connecting point is disposed on the upper surface of the boss for electrically connecting an electronic component.

In some embodiments, the connecting device further comprises at least one supporting point, the supporting point is disposed on the surface of the stent body, and the supporting point is electrically non-conductive.

The present invention further provides a camera module, comprising:

an optical lens;

a photosensitive chip; and

in the above electrical support, the optical lens and the photosensitive chip are fixed to the electrical support, the optical lens is located above the photosensitive chip, and the photosensitive chip is implanted with a metal ball and electrically connected to the electrical support.

Preferably, the photosensitive chip is located in the second accommodating space and electrically connected to the electrical support by implanting the metal ball.

Specifically, the photosensitive chip is electrically connected with the photosensitive chip connection point on the electrical support by implanting the metal ball.

In some embodiments, the metal ball is implanted in the photosensitive chip by thermal compression or soldering.

Specifically, the metal ball is a copper ball.

Preferably, the diameter of the contact surface of the copper ball and the photosensitive chip is 40-100 um.

Preferably, wherein the height of the copper ball is 30-100 um.

In some embodiments, the camera module further includes a filter, and the filter is fixedly disposed in the first accommodating space.

Specifically, wherein the filter is fixed to the upper surface of the boss.

In some embodiments, the camera module further comprises a flexible circuit board electrically connected to the bottom surface of the electrical bracket.

Specifically, the flexible circuit board is electrically connected with a circuit board connection point on the electrical support.

In some embodiments, the camera module further comprises at least one electronic component electrically connected to the electrical bracket.

Specifically, the electronic component is electrically connected with the electronic component connection point on the electrical support.

Furthermore, the camera module further comprises a reinforcing element, and the reinforcing element is fixed on the flexible circuit board and electrically connected with the flexible circuit board.

Preferably, the reinforcing element is fixedly connected with the flexible circuit board through resin, and a conductive circuit is arranged inside the resin, so that the reinforcing element is electrically connected with the flexible circuit board.

In particular, wherein the stiffening element is a steel plate or a copper plate.

In some embodiments, the camera module further includes a motor electrically connected to the electrical bracket and the optical lens, so that the motor can be driven to adjust the focal length of the optical lens.

In some embodiments, the metal ball is implanted in the photosensitive chip by soldering or hot pressing.

Specifically, the metal ball is a copper ball.

Preferably, wherein the height of the copper ball is 30-100 um.

Specifically, wherein the filter is fixed by the upper surface of the boss.

Preferably, the electronic component is electrically connected with the electronic component connection point on the electric bracket.

In some embodiments, the camera module further includes a reinforcing element, and the reinforcing element is fixed on the flexible circuit board and electrically connected to the flexible circuit board.

Specifically, the reinforcing element and the flexible circuit board are fixedly connected through resin, and a conductive circuit is arranged inside the resin, so that the reinforcing element is electrically connected with the flexible circuit board.

Preferably wherein the stiffening element is a steel or copper plate.

Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.

Therefore, the camera module and the electric bracket can bring the following beneficial effects:

the camera module has the following advantages in the overall structure compared with the traditional COB camera module:

(1) the photosensitive chip is connected with the electric bracket in an interconnecting way and electrified;

(2) the electric bracket can be internally embedded with a capacitor, a resistor and a driving chip;

(3) the electric bracket can be provided with a boss, can carry a chip to be interconnected and conducted, and realizes electric conduction by implanting a metal ball, wherein the implanting mode of the metal ball comprises but is not limited to welding, hot pressing and the like; (ii) a

(4) The electric bracket can be provided with a boss and can carry a color filter;

(5) the electric support can set up the pad below, and the flexible line way board switches on the interconnection, operation modes such as anisotropic conducting resin, welding are not restricted in the department.

(6) The photosensitive chip and the connecting device under the electric support scheme are not limited to the up-down interconnection mode in the prior art any more, can realize the internal-external interconnection at the same time, and provide more wiring space for the connecting device.

(7) The electric bracket can support the connecting equipment to be connected in multiple directions of the electric bracket, and is beneficial to interconnection at the periphery of the electric bracket when the quantity of pins in subsequent development is too large.

(8) The electric support scheme can reduce the bottom thickness of the camera module because a plurality of directions can be interconnected with the connecting equipment.

(9) The inner side surface of the electric bracket can also be led out of a connection point and can be directly connected with a photosensitive chip in a mode of implanting a metal ball and the like, so that the structure is simple and light.

(10) The electric support with the sensitization chip carries out the electrical property through planting the mode of copper ball and switches on, and is not only simple quick, can greatly reduce moreover the manufacturing cost of the module of making a video recording.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

Fig. 1 is a sectional view of a camera module according to a first preferred embodiment of the present invention.

Fig. 2 is a partially enlarged view of the camera module according to the above first preferred embodiment of the present invention.

Fig. 3 is an assembly view of the camera module according to the above-described first preferred embodiment of the present invention.

Fig. 4 is a sectional view of a camera module according to a second preferred embodiment of the present invention.

Fig. 5 is a partially enlarged view of the camera module according to the second preferred embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

Fig. 1 to 3 illustrate a camera module according to a first preferred embodiment of the present invention. The camera module comprises an electrical support 10, a flexible printed circuit 20, a photosensitive chip 30, an optical lens 40 and a driving element 50.

The optical lens 40 is mounted to the driving element 50, and the optical lens 40 may be driven by the driving element 50 to be suitable for auto-focusing. The flexible printed circuit 20 and the driving element 50 are disposed on different sides of the electrical support 10, so that the optical lens 40 is located in a photosensitive path of the photosensitive chip 30, so that when the camera module is used for capturing an image of an object, light reflected by the object can be further received by the photosensitive chip 30 after being processed by the optical lens 40 to be suitable for photoelectric conversion. That is, in the present invention, the electrical bracket 10 may be used to connect the flexible wiring board 20 and the driving element 50. That is, the electrical support 10 integrates the functions of the base and the circuit board of the conventional camera module at the same time, so as to be used for assembling the lens assembly and connecting the flexible circuit board of the photosensitive chip.

The electrical stand 10 includes a stand body 11, an electrical circuit 12 and a series of connection means 13 and has a light passing hole 100. The circuit 12 is embedded in the holder body 11, wherein the connection device 13 is provided on the surface of the holder body 11. The circuit 12 includes a plurality of electrical components 121 and a set of conductors 122, wherein the set of conductors 122 can be electrically connected to the electrical components 121 in a predetermined manner and can be electrically connected to the driving component 50, the flexible printed circuit board 20 and the photosensitive chip 30 through the connecting device 13, so that the image capturing module forms a predetermined circuit for performing predetermined driving and adjustment.

As shown in fig. 1 to 3, the camera module according to the first preferred embodiment of the present invention includes a first frame portion 111, a second frame portion 112, and a third frame portion 113, where the first frame portion 111, the second frame portion 112, and the third frame portion 113 together form a hollow ring structure, the first frame portion 111 is stacked above the second frame portion 112, the third frame portion 113 extends to the inside of the first frame portion 111 and the second frame portion 112 to form a boss 1131, an upper surface 11311 of the boss 1131 and an inner side surface of the frame main body 111 form a first accommodating space 1110, and a lower surface 11312 of the boss 1131 and the inner side surface of the frame main body 111 form a second accommodating space 1120.

Preferably, the third support 113 has an annular shape, so that the boss 1131 has an annular shape. As a variation of the first preferred embodiment of the camera module according to the present invention, a person skilled in the art may determine the shape and number of the bosses 1131 according to the structure of the third support 113, for example, if the third support 113 is set to be any shape, the shape of the bosses 1131 may also be changed, as long as the upper surface and the lower surface of the bosses 1131 can form the first accommodating space 1110 and the second accommodating space 1120, respectively.

The structure of the boss of the holder body 11 of the electrical holder 10 of the camera module according to the first preferred embodiment of the present invention and the first holder portion 111 not only can provide firm support for the driving element 50 and the optical lens 40, but also can be beneficial to form a sufficient space to provide a reasonable arrangement space for other elements of the camera module.

Further, according to the first preferred embodiment of the present invention, the camera module further includes a filter 70 and a series of electronic components 80 (not shown in fig. 3), wherein the filter is used for filtering out stray light, so as to further improve the camera quality. The optical filter 70 and the electronic component 80 are disposed in a first accommodating space 1110 formed by the upper surfaces 11311 of the bosses 1131 formed by the third supports 113, so that the first accommodating space 1110 provides an accommodating space for the optical filter 70 and the electronic component 80.

The position of the light sensing chip 20 is adapted to the position of the light hole 100. According to the first preferred embodiment of the present invention, the photosensitive chip 20 is disposed in the second receiving space 1120 formed by the third frame 113 and the frame body 11, thereby fully utilizing the space of the light passing hole 100. The photosensitive chip 30 is electrically connected to the electrical support 10. Specifically, the photosensitive chip 30 includes a series of photosensitive chip conductors 31 and a photosensitive chip main body 32, wherein the photosensitive chip conductors 31 are disposed on the photosensitive chip main body 32.

The connecting device 13 of the electrical support 10 includes a series of photosensitive chip connecting points 131, wherein the photosensitive chip conductors 31 are electrically connectable to the corresponding photosensitive chip connecting points 131, so as to connect the photosensitive chips 30 and the electrical support 10. According to the first preferred embodiment of the present invention, the photo chip conductor 31 is embodied as a chip pad 311, and the chip pad 311 and the corresponding photo chip connection point 131 are electrically connected by implanting metal balls 200 on the chip pad 311. That is, the photosensitive chip 30 is electrically connected to the photosensitive chip connection point 131 of the electrical bracket 10 by implanting the metal ball 200 on the chip pad 311 of the photosensitive chip 30. More preferably, in the first preferred embodiment of the present invention, the metal ball 200 is embodied as a copper ball 201, the height of the copper ball 201 is 30-100um, and the diameter of the contact surface of the copper ball 201 and the chip pad 311 is 40-100 um. Of course, it should be understood by those skilled in the art that the photosensitive chip 30 and the electrical apparatus support 10 may be electrically connected by implanting other types of metal balls, and those skilled in the art may also adjust the height of the copper ball 201 and the diameter of the contact surface between the copper ball 201 and the chip pad 311 according to actual conditions. In addition, those skilled in the art may adopt other manners to achieve conduction between the photosensitive chip 30 and the electrical apparatus support 10, such as ultrasonic welding, hot pressing, and the like. The invention is not limited to the specific embodiments as long as the technical solutions same as or similar to the present invention are adopted and the technical effects same as or similar to the present invention are achieved.

As shown in the drawings, according to the first preferred embodiment of the present invention, the second receiving space 1120 provides a sufficient space for disposing and protecting the copper balls 201, and can make the electrically connectable connection between the photosensitive chip 30 and the electrical support 10 more stable.

It should be understood by those skilled in the art that the above-described structure of the stand body 11 including the first, second and

third stand portions

111, 112 and 113 is merely an example and not a limitation of the present invention. According to other embodiments of the present invention, the holder body 11 may also be formed in a stepped shape with respect to two bosses, a stepped shape with respect to three steps, or a non-stepped shape, and the present invention is not limited in this respect. In the design process of the camera module, the shape of the bracket main body 11 can be set as required.

As shown in fig. 1 and 2, the electrical support 10 is electrically connectable to the flexible wiring board 20. In particular the connection means 13 of the electrical rack 10 further comprises a series of circuit board connection points 132. The flexible circuit board 20 includes a series of circuit board conductors 21 and a circuit board body 22, wherein the circuit board conductors 21 are disposed on the circuit board body 22. The board conductors 21 are electrically connectable to the corresponding board connection points 132 to electrically connect the electrical support 10 to the flexible board 20, thereby electrically connecting the electrical support to a power supply. It should be noted that the connection manner of the circuit board connection point 132 and the flexible circuit board 20 includes, but is not limited to, anisotropic conductive adhesive or soldering, and those skilled in the art can select the connection manner according to the needs or practical situations, and the specific embodiment of the present invention is not limited thereto.

According to the first preferred embodiment of the present invention, the electrical bracket 10 is attached to the flexible printed circuit board 20, so that the electrical bracket 10 can be electrically connected to the electrical bracket 10 while being stably supported by the flexible printed circuit board 20. It is worth mentioning that the position of the circuit board conductor 21 on the circuit board main body 22 is adapted to the position of the circuit board connection point 132 on the electrical rack 10. So that when the flexible circuit board 20 is attached to the electrical support 10, the flexible circuit board 20 can be electrically connected to the circuit 12. The circuit board conductors 21 are electrically connectable to the circuit board connection points 132 on the electrical rack 10 by, but not limited to, soldering.

According to the first preferred embodiment of the present invention, the circuit board connection points 132 are embodied as circuit board pads. The electrical support 10 is soldered to the flexible printed circuit board 20. It should be understood by those skilled in the art that the arrangement of the mounting and the connection of the soldering are only examples and not limitations of the present invention. The connection between the electrical bracket 10 and the flexible wiring board 20 may be implemented as, but not limited to, soldering.

The connection means 13 further comprises a series of motor connection points 133 and a series of electronic connection points 134, wherein the motor connection points 133 are provided at the first top surface 1111 of the first frame portion 111. According to the first preferred embodiment of the present invention, the motor connection point 133 is embodied as a motor pad. The motor pads are used to electrically connect the drive element 50 to the circuit 12 so that the drive element 50 can be driven and further drive the optical lens 40 to adjust the camera module.

Preferably, in the first embodiment of the camera module according to the present invention, the driving element 50 is configured as a motor 50, but a person skilled in the art may select the type of the driving element 50 according to actual situations, and the specific implementation of the camera module according to the present invention is not limited thereto. The motor 50 includes a series of motor conductors 51 and a motor body 52, wherein the motor conductors 51 are disposed on the motor body 52. It is worth mentioning that the position of the motor conductor 51 on the motor body 52 corresponds to the position of the motor connection point 133 on the electrical stand 10. Such that when the motor 50 is disposed on the electrical stand 10, the motor 50 can be electrically connected to the circuit 12 and further electrically connected to the flexible wiring board 20. More specifically, the motor conductor 51 is electrically connectable to the motor connection point 133 on the electrical bracket 10, and the electrically connectable manner may be, but is not limited to, ACP (anisotropic conductive paste), ultrasonic welding, thermocompression welding, and reflow welding.

According to the first preferred embodiment of the present invention, the electronic component connection points 134 are disposed on the second top surface 1121 of the second bracket portion 112. The electronic component connection points 134 are embodied as electronic component pads for electrically connectable to the electronic component 80. It will be appreciated by those skilled in the art that the electrical connection of the electronic component 80 to the electrical bracket 10 may be, but is not limited to, soldering. As shown in fig. 1 to 3, in the first preferred embodiment of the present invention, the second top surface 1121 of the second support portion 112 is flush with the upper surface 11311 of the boss 1131, that is, the optical filter 70 and the electronic component 80 are located on the same plane. Alternatively, a person skilled in the art can determine the relative position relationship between the second top surface 1121 of the second bracket portion 112 and the upper surface 11311 of the boss 1131 according to practical situations, and as long as the same or similar technical solution is adopted and the same or similar technical effect is achieved as the present invention, all of which fall within the protection scope of the present invention, and the specific embodiment of the present invention is not limited thereto.

It should be noted that the flexible printed circuit board 20 and the electrical bracket 10 are separately provided to illustrate the present invention and not to limit the present invention. According to other embodiments of the present invention, the flexible printed circuit board 20 may be integrated with the electrical bracket 10. In addition, the shapes of the flexible printed circuit board 20 and the electrical bracket 10 may be set arbitrarily according to the needs.

In other words, the light sensing chip 30 and the electrical support 10 can be electrically connected to each other through the circuit 12, the light sensing chip connection point 131, the circuit board connection point 132, the motor connection point 133 and the electronic component connection point 134 included in the connection device 13. The technical solutions same as or similar to the present invention are adopted, the technical problems same as or similar to the present invention are solved, and the technical effects same as or similar to the present invention are achieved, all of which belong to the protection scope of the present invention, and the specific embodiments of the present invention are not limited thereto.

As a variation of the preferred embodiment of the camera module according to the present invention, the connecting device 13 may further include one or more supporting points, and the supporting points may be configured to be electrically conductive, and when the supporting points are electrically conductive, the device that needs to be electrically applied may be connected, of course, the supporting points may also be configured to be electrically non-conductive, such as solder joints or solder pads, and only serve as a fixing device, and a person skilled in the art may determine the type of each supporting point in the connecting device 13 according to actual requirements.

It should be noted that, those skilled in the art can determine the materials and connection manners of the circuit board connection point 132, the motor connection point 133 and the electronic component connection point 134 included in the connection device 13 according to actual requirements, for example, the circuit board connection point 132, the motor connection point 133 and the electronic component connection point 134 include, but are not limited to, gold wires, aluminum wires, copper wires, silver wires or metal balls, and the connection manners of the circuit board connection point 132, the motor connection point 133 and the electronic component connection point 134 also include, but are not limited to, soldering, gluing, attaching connection, inserting connection or pressing connection.

In addition, the connection device 13 may include the connection point 131, the connection point 132, the connection point 133 and the connection point 134, which are implemented as any shape and type such as a pad, a solder column, a glue dot, a glue column, etc., as long as the connection device can electrically connect the photo sensor 30 and the electrical support 10 and connect them to each other. In other words, as long as the same or similar technical solutions as the present invention are adopted and the same or similar technical effects as the present invention are achieved, the present invention is within the protection scope of the present invention, and the specific implementation of the camera module according to the present invention is not limited thereto.

It will be appreciated by those skilled in the art that the above-described connecting device 13 and the manner of arranging it are merely illustrative and not restrictive of the invention. Any embodiment that can achieve the objects of the present invention falls within the scope of the present invention.

In addition, as a further preferred aspect of the camera module of the present invention, the camera module further includes a reinforcing element, and the reinforcing element is electrically connected to the flexible printed circuit 20 for increasing the strength of the flexible printed circuit 20. Specifically, in the preferred embodiment of the camera module according to the present invention, the reinforcing element is disposed below the flexible printed circuit board 20, and the reinforcing element is electrically connected to the flexible printed circuit board 20. In other words, the strength of the flexible printed circuit board 20 is increased by the reinforcing element, and the arrangement of the reinforcing element does not affect the connection between the camera module and the external device. Preferably, in the preferred embodiment of the camera module according to the present invention, the reinforcing element is a metal plate, because the metal plate not only can achieve the functions of firmness and electric conduction, but also can achieve the effect of heat dissipation, thereby further improving the performance of the camera module according to the present invention.

More specifically, in the preferred embodiment of the camera module of the present invention, the metal plate includes, but is not limited to, a steel plate or a copper plate, and a resin laminate is formed on the steel plate or the copper plate to connect the steel plate/copper plate and the flexible printed circuit board 20, and a communication circuit is added inside the resin laminate, so as to electrically connect the flexible printed circuit board 20 and the steel plate/copper plate.

The skilled person can select the material of the stiffening element according to the actual situation, and as long as the technical solution is the same as or similar to the present invention and the technical effect the same as or similar to the present invention is achieved, all of which belong to the protection scope of the camera module set described in the present invention, and the specific embodiment of the present invention is not limited thereto.

It is worth mentioning that the electrical support according to the invention can be applied not only to a zoom camera module, but also to a fixed-focus camera module.

Fig. 4 and 5 illustrate a camera module according to a second preferred embodiment of the present invention. The camera module comprises an electrical support 10A, a flexible circuit board 20A, a photosensitive chip 30A and an optical lens 40A.

The electrical stand 10A includes a stand main body 11A, an electrical circuit 12A and a series of connection means 13A and has a light passing hole 100A. The circuit 12A includes a plurality of electrical elements 121A and a set of conductors 122A, wherein the set of conductors 122A is electrically connectable to the electrical elements 121A in a predetermined manner and electrically connectable to the flexible printed circuit board 20A and the photosensitive chip 30A through the connecting device 13A, so that the image pickup module forms a predetermined circuit.

The optical lens 40A and the photosensitive chip 30A are disposed on different sides of the electrical support 10A, so that the optical lens 40A is located in a photosensitive path of the photosensitive chip 30A, when the camera module is used for capturing an image of an object, light reflected by the object can be further received by the photosensitive chip 30A after being processed by the optical lens 40A to be suitable for photoelectric conversion. That is, in the present invention, the electrical stand 10A may be used to connect the flexible wiring board 20A. That is, the electrical support 10A integrates the functions of the base and the circuit board of the conventional camera module at the same time, so as to be used for assembling the lens assembly and connecting the flexible circuit board of the photosensitive chip. As shown in fig. 4 and 5, according to the second preferred embodiment of the present invention, the holder main body 11A includes a first holder portion 111A, a second holder portion 112A, a third holder portion 113A, and a lens holder 114A. It is worth mentioning that the first bracket portion 111A, the second bracket portion 112A and the third bracket portion 113A are integrally connected. The lens support body 114A may be integrally connected to the first holder portion 111A, the second holder portion 112A, or the third holder portion 113A of the holder main body 11A, or may be detachably connected to the first holder portion 111A, the second holder portion 112A, or the third holder portion 113A of the holder main body 11A. According to the second preferred embodiment of the present invention, the lens support body 114A is detachably coupled to the first frame portion 111A of the holder main body 11A. Of course, a person skilled in the art can determine the connection manner between the lens support body 114A and the first frame portion 111A of the frame body 11A according to practical situations, and the invention is not limited in this respect as long as the same or similar technical solutions are adopted and the same or similar technical effects as those of the invention are achieved.

As shown in fig. 4 to 5, according to the second preferred embodiment of the camera module of the present invention, the holder main body 11A includes a first holder portion 111A, a second holder portion 112A and a third holder portion 113A, the first holder portion 111A, the second holder portion 11A2 and the third holder portion 113A together form a hollow ring structure, wherein the first holder portion 111A is stacked above the second holder portion 112, the third holder portion 113A extends to the inner sides of the first holder portion 111A and the second holder portion 112 to form a boss 1131A, the upper surface 11311A of the boss 1131A and the inner surface of the holder main body 111A form a first accommodating space 1110A, and the lower surface 11312A of the boss 1131A and the inner surface of the holder main body 111A form a second accommodating space 1120A. Preferably, the third support 113A has an annular shape, so that the boss 1131A has an annular shape. As a second preferred embodiment of the camera module according to the present invention, a person skilled in the art may determine the shape and number of the bosses 1131A according to the structure of the third support 113A, for example, if the third support 113A is set to be any shape, the shape of the bosses 1131A may also be changed, as long as the upper surface and the lower surface of the boss 1131A can form the first accommodating space 1110A and the second accommodating space 1120A, respectively.

Such a structure of the boss of the holder body 11A of the electrical holder 10A of the camera module according to the second preferred embodiment of the present invention and the first holder portion 111 not only can provide firm support for the driving element 50 and the optical lens 40, but also can be advantageous in sufficiently forming a space for providing a reasonable installation space for other elements of the camera module.

Further, according to the second preferred embodiment of the present invention, the image capturing module further includes a filter 70A and a series of electronic components 80A (not shown in the figure), wherein the filter 70A is used for filtering out stray light, so as to further improve the image capturing quality. The optical filter 70A and the electronic component 80A are disposed in a first accommodating space 1110A formed by an upper surface 11311A of a boss 1131A formed by the third support 113A, so that the first accommodating space 1110A provides an accommodating space for the optical filter 70A and the electronic component 80A.

The position of the light sensing chip 20A is adapted to the position of the light hole 100A. According to the second preferred embodiment of the present invention, the photosensitive chip 20A is disposed in the second receiving space 1120A formed by the third holder 113A and the holder main body 11A, thereby making full use of the space of the light passing hole 100A. The photosensitive chip 30A is electrically connected to the electrical support 10A. Specifically, the photosensitive chip 30A includes a series of photosensitive chip conductors 31A and a photosensitive chip main body 32A, wherein the photosensitive chip conductors 31A are disposed on the photosensitive chip main body 32A.

The connecting device 13A of the electrical support 10A includes a series of photosensitive chip connecting points 131A, wherein the photosensitive chip conductors 31A are electrically connected to the corresponding photosensitive chip connecting points 131A, so as to interconnect and electrically connect the photosensitive chips 30A and the electrical support 10A. According to the second preferred embodiment of the present invention, the photo chip conductor 31A is embodied as a chip pad 311A, and the chip pad 311A and the corresponding photo chip connection point 131A are electrically connected by implanting metal balls 200A on the chip pad 311A. That is, the photosensitive chip 30A is electrically connected to the photosensitive chip connection point 131A of the electrical bracket 10A by implanting a metal ball 200A on the chip pad 311A of the photosensitive chip 30A. More preferably, in the second preferred embodiment of the present invention, the metal ball 200A is embodied as a copper ball 201A, the height of the copper ball 201A is 30-100um, and the diameter of the contact surface of the copper ball 201A and the chip pad 311A is 40-100 um. Of course, it should be understood by those skilled in the art that the photosensitive chip 30A and the electrical apparatus support 10A may be electrically connected by implanting other types of metal balls, and those skilled in the art may also adjust the height of the copper ball 201A and the diameter of the contact surface between the copper ball 201A and the chip pad 311A according to actual conditions. In addition, a person skilled in the art may use other methods to realize the conduction between the photosensitive chip 30A and the electrical apparatus support 10A, such as ultrasonic welding, hot pressing, and the like. The invention is not limited to the specific embodiments as long as the technical solutions same as or similar to the present invention are adopted and the technical effects same as or similar to the present invention are achieved.

As shown in the drawings, according to the second preferred embodiment of the present invention, the second receiving space 1120A provides a sufficient space for disposing and protecting the copper balls 201A, and can make the electrically connectable connection between the photosensitive chip 30A and the electrical support 10A more stable.

It should be understood by those skilled in the art that the above-described structure of the stand main body 11A including the first stand portion 111A, the second stand portion 112A and the third stand portion 113A is merely an example and not a limitation of the present invention. According to other embodiments of the present invention, the holder body 11A may also be formed in a stepped shape with respect to two bosses, a stepped shape with respect to three steps, or a non-stepped shape, and the present invention is not limited in this respect. In the design process of the camera module, the shape of the bracket main body 11A can be set as required.

As shown in fig. 4 and 5, the electrical support 10A is electrically connectable to the flexible wiring board 20A. Specifically, the connection device 13A of the electrical rack 10A further includes a series of circuit board connection points 132A. The flexible wiring board 20A includes a series of wiring board conductors 21A and a wiring board main body 22A, wherein the wiring board conductors 21A are provided to the wiring board main body 22A. The board conductors 21A are electrically connectable to the corresponding board connection points 132A to thereby electrically connect the electrical support 10A to the flexible board 20A, thereby electrically connecting the electrical support to a power supply.

According to the second preferred embodiment of the present invention, the electrical bracket 10A is attached to the flexible wiring board 20A, so that the electrical bracket 10A is electrically connectable to the electrical bracket 10A while being stably supported by the flexible wiring board 20A. It is worth mentioning that the position of the board conductor 21A on the board body 22A is adapted to the position of the board connection point 132A on the electrical rack 10A. So that when the flexible circuit board 20A is attached to the electrical support 10A, the flexible circuit board 20A can be electrically connected to the circuit 12A. The circuit board conductors 21A are electrically connectable to the circuit board connection points 132A on the electrical bracket 10A by, but not limited to, soldering.

According to the second preferred embodiment of the present invention, the circuit board connection point 132A is embodied as a circuit board pad. The electrical support 10A is soldered to the flexible wiring board 20A. It should be understood by those skilled in the art that the arrangement of the mounting and the connection of the soldering are only examples and not limitations of the present invention. The connection between the electrical bracket 10A and the flexible wiring board 20A may be implemented as, but not limited to, soldering.

The connecting device 13A further includes a series of lens support connection points 133A and a series of electronic component connection points 134A, wherein the lens support connection points 133A are disposed on the first top surface 1111A of the first mount portion 111A. According to the second preferred embodiment of the present invention, the lens holder connection point 133A is embodied as a lens holder pad. It is noted that not only the first holder portion 111A, the second holder portion 112A and the third holder portion 113A of the holder main body 11A can be used to embed a circuit, but also the lens support body 114 can be used to embed a circuit, so as to further increase the available space of the intrinsic elements and further reduce the size of the entire image pickup module. The lens holder pads are used to electrically connect the circuits embedded in the lens holder 114A to the circuits embedded in the first holder portion 111A, the second holder portion 112A, and the third holder portion 113A, and further form the circuits 12A. It will be appreciated by those skilled in the art that in embodiments where the lens support 114A is integrally connected to the first mount portion 111A, the second mount portion 112A, or the third mount portion 113A, the lens support connection point 133A is not required.

According to the second preferred embodiment of the present invention, the lens support 114A includes a series of lens support conductors 1141A and a lens support body 1142A, wherein the lens support conductors 1141A are disposed on the lens support body 1142A. It is worth mentioning that the position of the lens holder conductor 1141A on the lens holder body 1142A is adapted to the position of the lens holder connection point 133A on the electrical stand 10A. When the lens support body 114A is mounted on the first frame section 111A of the electrical stand 10A, the lens support body 114A can be electrically connected to the circuit 12A and further electrically connected to the flexible wiring board 20A. More specifically, the lens support body conductor 1141A is electrically connectable to the lens support body connection point 133A on the electrical bracket 10A, and the electrically connectable manner may be, but is not limited to, ACP (anisotropic conductive adhesive), ultrasonic welding, thermocompression welding, and reflow welding.

According to the second preferred embodiment of the present invention, the electronic component connection point 134A is disposed on the second top surface 1121A of the second bracket portion 112A. The electronic component connection points 134A are embodied as electronic component pads for electrically connectable the electronic component 80A. It will be appreciated by those skilled in the art that the electrical connection of the electronic component 80A to the electrical bracket 10A may be, but is not limited to, soldering.

It should be noted that the flexible printed circuit board 20A and the electrical bracket 10A are separately provided only for the purpose of illustration and not limitation. According to other embodiments of the present invention, the flexible printed circuit board 20A may be integrated with the electrical bracket 10A. The respective shapes or the integrated shapes of the flexible wiring board 20A and the electrical component holder 10A may be set as desired.

In other words, the light sensing chip 30A and the electrical bracket 10A can connect and conduct the light sensing chip connection point 131A, the circuit board connection point 132A, the motor connection point 133A and the electronic component connection point 134A included in the connection device 13A through the circuit 12A. The technical solutions same as or similar to the present invention are adopted, the technical problems same as or similar to the present invention are solved, and the technical effects same as or similar to the present invention are achieved, all of which belong to the protection scope of the present invention, and the specific embodiments of the present invention are not limited thereto.

As a variation of the preferred embodiment of the camera module according to the present invention, the connecting device 13A may further include more connecting points, and the connecting points may be configured to be electrically conductive, and when the connecting points are electrically conductive, the connecting points may be connected to devices that need to be electrically applied, and of course, the connecting points may also be configured to be non-conductive, such as solder joints or solder pads, and only serve as a fixing device, and a person skilled in the art may determine the type of each connecting point in the connecting device 13A according to actual requirements.

It should be noted that, a person skilled in the art may determine the materials and connection manners of the circuit board connection point 132A, the motor connection point 133A and the electronic component connection point 134A included in the connection device 13A according to actual requirements, for example, the circuit board connection point 132A, the motor connection point 133A and the electronic component connection point 134A include but are not limited to gold wires, aluminum wires, copper silver wires or metal balls, and the connection manners of the circuit board connection point 132A, the motor connection point 133A and the electronic component connection point 134A also include but are not limited to soldering, gluing, attaching, inserting, or crimping.

In addition, the connection device 13A may include the connection point 131A of the photosensitive chip, the connection point 132A of the circuit board, the connection point 133A of the motor, and the connection point 134A of the electronic component, which are embodied in any shape and type, such as a pad, a solder column, or a glue point, a glue column, etc., as long as the photosensitive chip 30A and the electrical support 10A are electrically connected to each other. In other words, as long as the same or similar technical solutions as the present invention are adopted and the same or similar technical effects as the present invention are achieved, the present invention is within the protection scope of the present invention, and the specific implementation of the camera module according to the present invention is not limited thereto.

Those skilled in the art will appreciate that the above-described connecting device 13A and the manner of arranging it are merely illustrative and not restrictive of the present invention. Any embodiment that can achieve the objects of the present invention falls within the scope of the present invention.

In addition, as a further preferred feature of the camera module of the present invention, the camera module further includes a reinforcing element, and the reinforcing element is electrically connected to the flexible printed circuit 20A for increasing the strength of the flexible printed circuit 20A. Specifically, in the preferred embodiment of the camera module according to the present invention, the reinforcing element is disposed below the flexible printed circuit 20A, and the reinforcing element is electrically connected to the flexible printed circuit 20A. In other words, the strength of the flexible printed circuit board 20A is increased by the reinforcing element, and the arrangement of the reinforcing element does not affect the connection between the camera module and the external device. Preferably, in the preferred embodiment of the camera module according to the present invention, the reinforcing element is a metal plate, because the metal plate not only can achieve the functions of firmness and electric conduction, but also can achieve the effect of heat dissipation, thereby further improving the performance of the camera module according to the present invention.

More specifically, in the preferred embodiment of the camera module of the present invention, the metal plate includes, but is not limited to, a steel plate or a copper plate, and a resin laminate is formed on the steel plate or the copper plate to connect the steel plate/copper plate and the flexible printed circuit board 20A, and a communication circuit is added inside the resin laminate, so as to electrically connect the flexible printed circuit board 20A and the steel plate/copper plate.

In addition, the invention also provides an electric connection method of the camera module, which comprises the following steps:

s1: providing an electrical support with a plurality of electrical components and a plurality of conductors for electrically connecting said electrical components;

s2: the photosensitive chip can be electrically connected with the electric bracket; and

s3: a flexible circuit board and the electrical support can be electrically connected.

The electric connection mode of the camera module further comprises the following steps:

s4: electrically connecting a motor to the electrical support; and

s5: and the flexible circuit board is connected to the electronic equipment to input a control signal.

In the step S2, the photo sensor chip and the electrical support are electrically connected by implanting a metal ball, and more preferably, the metal ball is a copper ball.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. An electrical stand for supporting a photo sensor chip and an optical lens of a camera module, the electrical stand comprising a stand body and a circuit, the circuit comprising a plurality of electrical components and a set of conductors, the electrical components being electrically connectable to the conductors, wherein the circuit is embedded in the stand body such that the electrical stand becomes a circuit board, wherein the electrical stand is electrically connected to the photo sensor chip by implanting a metal ball on the photo sensor chip of the camera module, and the photo sensor chip is fixed to the electrical stand, wherein the electrical stand simultaneously integrates functions of a base and a circuit board of a conventional camera module for supporting a motor or the optical lens.

2. The electrical stand of claim 1, wherein the stand body is a hollow ring structure including a top surface, a bottom surface, an outer side and an inner side, the top surface, the bottom surface, the outer side and the inner side being electrically connected by the electrical circuit, respectively, and having a light passing hole passing through the top surface and the bottom surface of the stand body.

3. The electrical bracket according to claim 2, wherein the interior of the bracket body further comprises at least one pair of axially symmetric bosses extending on the inner side of the bracket body and located above the light passing hole, and the bosses form a first receiving space and a second receiving space inside the electrical bracket, and upper and lower surfaces of the bosses are in electrical communication with the circuit.

4. The electrical stand of claim 3, wherein the stand body further comprises a connecting device disposed on a surface of the stand body and electrically connected to the electrical circuit in the stand body.

5. The electrical support of claim 4, wherein the connecting device comprises a connection point for a light sensor chip, the connection point for the light sensor chip being disposed inside the electrical support for electrically connecting to a light sensor chip in the camera module.

6. The electrical support of claim 5, wherein the connection point of the photosensitive chip is located on the lower surface of the boss and is a bonding pad or a solder joint, and the photosensitive chip is electrically connected to the connection point of the photosensitive chip by implanting the metal ball.

7. The electrical support of claim 6, wherein the metal balls are embedded in the photosensitive chip by soldering or hot pressing.

8. The electrical bracket of claim 7, wherein said metal ball is a copper ball.

9. The electrical support of claim 8, wherein the diameter of the contact surface of the copper ball and the photosensitive chip is 40-100 um.

10. An electrical bracket according to claim 9, wherein the copper balls have a height of 30-100 um.

11. The electrical stand of claim 6, wherein the connecting means further comprises a circuit board connecting point disposed on the bottom surface of the stand body for electrically connecting to a flexible circuit board in the camera module.

12. The electrical stand of claim 11, wherein the connecting device further comprises a motor connecting point disposed on the top surface of the stand body for electrically connecting to a driving device of the camera module.

13. The electrical stand of claim 12, wherein the connecting means further comprises an electrical component connecting point disposed on the upper surface of the boss for electrically connecting an electrical component.

14. The electrical rack of claim 4, wherein the connecting means further comprises at least one support point disposed on a surface of the rack body, the support point being electrically non-conductive.

15. A module of making a video recording, its characterized in that, the module of making a video recording includes:

an optical lens;

a photosensitive chip; and

an electrical stand, the electrical stand includes a stand main body and a circuit, the circuit includes a plurality of electric elements and a set of conductor, electric connection is in but electric component, wherein the circuit is buried in the stand main body so that the electrical stand becomes a circuit board, wherein make through implant a metal ball on the sensitization chip of the module of making a video recording the electric stand with sensitization chip carries out electric connection, and make the sensitization chip be fixed in the electrical stand, wherein, the electrical stand has integrateed the function that is used for supporting motor or the base of optical lens and circuit board of traditional module of making a video recording simultaneously, wherein, optical lens is located the top of sensitization chip, sensitization chip is through implanting a metal ball and electric connection in the electrical stand.

16. The camera module of claim 15, wherein the holder body is a hollow ring-shaped structure including a top surface, a bottom surface, an outer side and an inner side, and having a light passing hole, the top surface, the bottom surface, the outer side and the inner side are electrically connected by the circuit, respectively, the light passing hole passing through the top surface and the bottom surface of the holder body.

17. The camera module of claim 16, wherein the interior of the holder body further comprises at least one pair of axially symmetric bosses extending on the inner side of the holder body and located above the light passing hole, the bosses forming a first receiving space and a second receiving space inside the electrical holder, upper and lower surfaces of the bosses being in electrical communication with the circuit.

18. The camera module of claim 17, wherein the holder body further comprises a connecting device disposed on a surface of the holder body and electrically connected to the circuit in the holder body.

19. The camera module of claim 18, wherein the connecting means comprises a connection point for a photo sensor chip, the connection point being disposed inside the electrical bracket for electrically connecting to a photo sensor chip in the camera module.

20. The camera module of claim 19, wherein the connection point of the photo sensor chip is located on the lower surface of the boss and is a bonding pad or a solder joint, and the photo sensor chip is electrically connected to the connection point of the photo sensor chip by implanting the metal ball.

21. The camera module according to claim 20, wherein the metal balls are embedded in the photosensitive chip by soldering or hot pressing.

22. The camera module of claim 21, wherein the metal ball is a copper ball.

23. The camera module of claim 22, wherein the diameter of the contact surface of the copper ball and the photosensitive chip is 40-100 um.

24. The camera module of claim 23, wherein the copper balls have a height of 30-100 um.

25. The camera module of claim 20, wherein the connecting means further comprises a circuit board connecting point disposed on the bottom surface of the holder body for electrically connecting to a flexible circuit board in the camera module.

26. The camera module of claim 25, wherein the connecting means further comprises a motor connecting point disposed on the top surface of the holder body for electrically connecting to a driving means of the camera module.

27. The camera module of claim 26, wherein the connecting means further comprises an electronic component connecting point disposed on the upper surface of the boss for electrically connecting an electronic component.

28. The camera module of claim 18, wherein the connecting means further comprises at least one support point disposed on a surface of the holder body, and the support point is electrically non-conductive.

29. The camera module according to claim 17, wherein the photosensitive chip is located in the second receiving space and electrically connected to the electrical bracket by implanting the metal ball.

30. The camera module of claim 29, wherein the photo sensor chip is electrically connected to the photo sensor chip connection points on the electrical bracket by implanting the metal balls.

31. The camera module according to claim 30, wherein the metal balls are embedded in the photosensitive chip by thermal pressing or soldering.

32. The camera module of claim 31, wherein the metal ball is a copper ball.

33. The camera module of claim 32, wherein the diameter of the contact surface of the copper ball and the photosensitive chip is 40-100 um.

34. The camera module of claim 33, wherein the copper balls have a height of 30-100 um.

35. The camera module of claim 17, wherein the camera module further comprises a filter, and the filter is fixedly disposed in the first receiving space.

36. The camera module of claim 35, wherein the filter is secured to the upper surface of the boss.

37. The camera module of claim 36, wherein the camera module further comprises a flexible circuit board electrically connected to a bottom surface of the electrical bracket.

38. The camera module of claim 37, wherein the flexible circuit board is electrically connected to circuit board connection points on the electrical bracket.

39. The camera module of claim 37, wherein the camera module further comprises at least one electronic component, the electronic component being electrically connected to the electrical bracket.

40. The camera module of claim 39, wherein an electronic component is electrically connected to the electronic component connection points on the electrical bracket.

41. The camera module of claim 39, wherein the camera module further comprises a stiffener element, the stiffener element being fixed to and electrically connected to the flexible printed circuit.

42. The camera module according to claim 41, wherein the stiffening element is fixedly connected to the flexible printed circuit board through a resin, and a conductive trace is disposed inside the resin to electrically connect the stiffening element to the flexible printed circuit board.

43. The camera module of claim 42, wherein the stiffening element is a steel or copper plate.

44. The camera module of claim 17, wherein the camera module further comprises a motor electrically connected to the electrical bracket and to the optical lens, such that the motor can be driven to adjust the focal length of the optical lens.

45. The camera module according to claim 44, wherein the photosensitive chip is located in the second receiving space and electrically connected to the electrical bracket by implanting the metal balls.

46. The camera module of claim 45, wherein the photo sensor chip is electrically connected to the photo sensor chip connection points on the electrical bracket by implanting the metal balls.

47. The camera module according to claim 46, wherein the metal balls are embedded in the photosensitive chip by soldering or hot pressing.

48. The camera module of claim 47, wherein the metal ball is a copper ball.

49. The camera module of claim 48, wherein the diameter of the contact surface of the copper ball and the photosensitive chip is 40-100 um.

50. The camera module of claim 49, wherein the copper balls have a height of 30-100 um.

51. The camera module according to claim 44, wherein the camera module further comprises a filter fixedly disposed in the first receiving space.

52. The camera module of claim 51, wherein the filter is secured by the upper surface of the boss.

53. The camera module of claim 51, wherein the camera module further comprises a flexible circuit board electrically connected to a bottom surface of the electrical bracket.

54. The camera module of claim 53, wherein the flexible circuit board is electrically connected to circuit board connection points on the electrical bracket.

55. The camera module of claim 53, wherein the camera module further comprises at least one electronic component, the electronic component being electrically connected to the electrical bracket.

56. The camera module of claim 55, wherein electronic components are electrically connected to the electronic component connection points on the electrical bracket.

57. The camera module of claim 55, wherein the camera module further comprises a stiffener element, the stiffener element being secured to and electrically connected to the flexible circuit board.

58. The camera module according to claim 57, wherein the stiffening element is fixedly connected to the flexible printed circuit board through a resin, and a conductive trace is disposed inside the resin to electrically connect the stiffening element to the flexible printed circuit board.

59. The camera module of claim 58, wherein the stiffening element is a steel or copper plate.