CN114979434A

CN114979434A - Camera module and electronic equipment

Info

Publication number: CN114979434A
Application number: CN202210520884.8A
Authority: CN
Inventors: 张百成; 张以平; 钱力力; 刘兵波; 游兴龙
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-05-12
Filing date: 2022-05-12
Publication date: 2022-08-30

Abstract

The application mainly relates to camera module and electronic equipment, and camera module includes the base to and be located infrared filter and the image sensor of base back of the body both sides mutually, infrared filter forms first bonding interface with the base, and image sensor forms the second bonding interface with the base, and at least one in first bonding interface and the second bonding interface realizes the bonding by the waterproof ventilative glue of solidification. The application provides a camera module bonds infrared filter and/or image sensor in the base through waterproof ventilative glue, can enough realize fixing between the structure like this, and balanced base, infrared filter and image sensor enclose the pressure differential between the airtight cavity of establishing formation and the external environment, and alleviate external steam, dust etc. invade aforementioned airtight cavity, still need not to set up like correlation technique that and flee the gas pocket on the base, with the structure of simplifying the base, and increase the structural strength of base.

Description

Camera module and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a camera module and electronic equipment.

Background

With the continuous popularization of electronic devices, electronic devices have become indispensable social and entertainment tools in people's daily life, and people have higher and higher requirements for electronic devices. Taking electronic equipment such as a mobile phone as an example, the electronic equipment carries a camera module for users to take pictures, record videos, scan codes and the like.

Disclosure of Invention

The embodiment of the application provides a camera module, camera module includes the base to and be located infrared filter and the image sensor of base back of the body both sides mutually, infrared filter forms first bonding interface with the base, and image sensor forms the second bonding interface with the base, and at least one in first bonding interface and the second bonding interface realizes the bonding by the waterproof ventilative glue of solidification.

The embodiment of the application further provides an electronic device, the electronic device comprises a display module, a shell and the camera module, the shell is connected with the display module, and the camera module is located between the display module and the shell.

The beneficial effect of this application is: the application provides a camera module glues infrared filter piece and/or image sensor through waterproof ventilative gluing and bonds in the base, can enough realize fixing between the structure like this, and balanced base, infrared filter piece and image sensor enclose the pressure differential between the airtight cavity of establishing formation and the external environment, and alleviate external steam, dust etc. invade aforementioned airtight cavity, still need not to set up like correlation technique on the base and flee the gas pocket, in order to simplify the structure of base, and increase the structural strength of base.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic disassembled structural diagram of an embodiment of an electronic device provided in the present application;

FIG. 2 is a schematic diagram of a stacked structure of an embodiment of a camera module in the related art;

FIG. 3 is a schematic cross-sectional view of one embodiment of the base of FIG. 2;

fig. 4 is a schematic view of a stacked structure of an embodiment of the camera module provided in the present application;

fig. 5 is a schematic view of a laminated structure of another embodiment of the camera module provided in the present application;

fig. 6 is a schematic view of a laminated structure of a camera module according to still another embodiment of the present disclosure.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples, not all examples, and all other examples obtained by a person of ordinary skill in the art without making any creative effort fall within the protection scope of the present application.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1 to 3 together, fig. 1 is a schematic disassembled structure diagram of an embodiment of an electronic device provided in the present application, fig. 2 is a schematic laminated structure diagram of an embodiment of a camera module in the related art, and fig. 3 is a schematic cross-sectional structure diagram of an embodiment of a base in fig. 2.

In the present application, the electronic device 10 may be a portable device such as a mobile phone, a tablet computer, a notebook computer, and a wearable device. In the embodiment, the electronic device 10 is taken as a mobile phone for exemplary description.

Referring to fig. 1, an electronic device 10 may include a display module 11, a middle frame 12, and a rear cover 13. The display module 11 and the rear cover plate 13 are respectively located on two opposite sides of the middle frame 12, and can be assembled and connected with the middle frame 12 through one or a combination of assembling modes such as gluing, clamping, welding and the like, so that a basic structure that the display module 11 and the rear cover plate 13 clamp the middle frame 12 together is formed after the three are assembled. Further, the display module 11, the rear cover 13 and the middle frame 12 may form a cavity (not shown in fig. 1) with a certain volume, and the cavity may be used to mount a camera module 14, a main board 15, a battery 16 and other structural members, so that the electronic device 10 can implement corresponding functions. The display module 11, the camera module 14 and other components may be electrically connected to the main board 15, the battery 16 and the like through a Flexible Printed Circuit (FPC), so that they can be supplied with electric power from the battery 16 and can execute corresponding commands under the control of the main board 15. Based on this, the casing described in this application can include center 12 and back shroud 13, and the casing is connected with display module 11, and camera module 14 is located between display module 11 and the casing. The rear cover 13 and the middle frame 12 may be integrally formed structural members.

With reference to fig. 2, the camera module 14 may include a base 141, and an infrared filter 142 and an image sensor 143 located on opposite sides of the base 141, that is, the infrared filter 142 and the image sensor 143 may be fixedly connected to opposite sides of the base 141 by one or a combination of glue bonding, clamping, and screw connection. Wherein, infrared filter 142 can be blue glass, and infrared filter 142 is mainly used for filtering the infrared light to increase the imaging of camera module 14. Further, the image sensor 143 may be a sensor such as a Charge Coupled Device (CCD) or a Complementary Metal Oxide Semiconductor (CMOS) sensor. For an image sensor such as CMOS, it may be based on RGGB or RYYB. The image sensor 143 is mainly used to convert the optical signal into an electrical signal, so as to meet the imaging requirement of the camera module 14.

Further, the camera module 14 may further include a motor 144 located on a side of the ir filter 142 away from the image sensor 143, and a lens 145 connected to the motor 144, for example, the lens 145 is screwed to the motor 144, and the lens 145 can at least approach or move away from the ir filter 142 under the driving of the motor 144. The lens 145 may include a convex lens and/or a concave lens made of glass or plastic, or may be a liquid lens, which is mainly used for converging external light to facilitate imaging. Further, the motor 144 is mainly used for realizing the functions of focusing, optical anti-shake, etc. of the camera module 14, which are well known to those skilled in the art and will not be described herein again. Of course, in other embodiments, such as those that do not require focusing or optical anti-shake, the camera module 14 may not include the motor 144, as will be described in detail later.

The inventors of the present application found in long-term research and development work that: because the ir filter 142 and the image sensor 143 are generally disposed at intervals on the optical axis (as shown by the dashed dotted line in fig. 2) of the camera module 14, and the ir filter 142 and the image sensor 143 are often bonded to the base 141 through cured thermosetting adhesive, the base 141, the ir filter 142 and the image sensor 143 can be defined to form a sealed cavity (which can be defined as a "first sealed cavity"); there is external pressurization or toast the heating often in the in-process of assembling at camera module 14 or even electronic equipment 10, and camera module 14 also can produce a large amount of heats in the use, and the pressure in the first airtight cavity is too big easily under high temperature, high pressure, and then leads to structures such as infrared filter 142 to have the risk of losing efficacy such as fracture, the fracture appears between the structures. For this reason, referring to fig. 3, in the related art, an air escape hole 1411 is often formed in the base 141, and the pressure difference between the first sealed cavity and the external environment is balanced by the air escape hole 1411, so as to alleviate the aforementioned failure risk. Wherein, can cover waterproof ventilated membrane on escaping the gas pocket 1411, perhaps pack waterproof ventilative glue in escaping the gas pocket 1411 to alleviate first airtight cavity of invasion such as external steam, dust, and then increase camera module 14's reliability. However, the air vent 1411 formed in the base 141 not only easily deteriorates the overall strength of the base 141; moreover, if the total number of the escape holes 1411 is too large or the opening area of a single escape hole 1411 is too large, the risk that external moisture, dust and the like invade into the first sealed cavity is increased, whereas if the total number of the escape holes 1411 is too small or the opening area of a single escape hole 1411 is too small, the risk that the pressure difference between the first sealed cavity and the external environment cannot be balanced quickly is increased. To this, the application provides the technical scheme of a different design, also will be used for originally gluing infrared filter 142 and image sensor 143 and base 141's thermosetting glue to replace waterproof ventilative glue, can enough realize fixing between the structure like this, can balance the pressure differential between first airtight cavity and the external environment again to and alleviate first airtight cavity of invasion such as external steam, dust.

Referring to fig. 4 to 6 together, fig. 4 is a schematic view of a stacked structure of an embodiment of a camera module provided in the present application, fig. 5 is a schematic view of a stacked structure of another embodiment of a camera module provided in the present application, and fig. 6 is a schematic view of a stacked structure of another embodiment of a camera module provided in the present application.

The main differences from the above described embodiment are: in the present application, with reference to fig. 4 to 6, the infrared filter 142 and the base 141 may form a first bonding interface 100, and the image sensor 143 and the base 141 may form a second bonding interface 200. Wherein at least one of the first bonding interface 100 and the second bonding interface 200 can be bonded by a cured waterproof and breathable adhesive. Illustratively, the infrared filter 142 is bonded to the base 141 by a cured waterproof air-permeable adhesive, and the image sensor 143 is bonded to the base 141 by a cured waterproof air-permeable adhesive. Therefore, the fixing between the structural members can be realized, the pressure difference between the first closed cavity and the external environment can be balanced, the invasion of external water vapor, dust and the like into the first closed cavity can be relieved, and an escape hole does not need to be formed in the base 141 like the related art, so that the structure of the base 141 is simplified, and the structural strength of the base 141 is improved.

In some embodiments, in conjunction with fig. 4, lens 145 and mount 141 may form a third bonding interface 300, at least two of first bonding interface 100, second bonding interface 200, and third bonding interface 300 being bonded by a cured waterproof, breathable glue. For example: the infrared filter 142 is bonded with the base 141 through the cured waterproof air-permeable adhesive, and the image sensor 143 is bonded with the base 141 through the cured waterproof air-permeable adhesive; and lens 145 and mount 141 are bonded by a cured thermosetting adhesive. At this time, the first sealed cavity may balance the pressure difference with the external environment through the second bonding interface 200, and another sealed cavity (which may be defined as "second sealed cavity") enclosed by the base 141, the ir filter 142 and the lens 145 may balance the pressure difference with the external environment through the first bonding interface 100 and the second bonding interface 200. For another example: the lens 145 is bonded with the base 141 through the cured waterproof air-permeable adhesive, and the infrared filter 142 is bonded with the base 141 through the cured waterproof air-permeable adhesive; and the image sensor 143 is bonded to the base 141 by the cured thermosetting adhesive. At this time, the first sealed cavity may balance a pressure difference with the external environment through the first bonding interface 100 and the third bonding interface 300, and the second sealed cavity may balance a pressure difference with the external environment through the third bonding interface 300. Another example is: the infrared filter 142 is adhered to the base 141 by the cured waterproof air-permeable adhesive, the image sensor 143 is adhered to the base 141 by the cured waterproof air-permeable adhesive, and the lens 145 is adhered to the base 141 by the cured waterproof air-permeable adhesive. At this time, the first sealed cavity may be balanced in pressure difference with the external environment through the second bonding interface 200, or balanced in pressure difference with the external environment through the second bonding interface 200 and the third bonding interface 300; the second sealed chamber may be balanced from the external environment by the third bonding interface 300, or balanced by the first bonding interface 100 and the second bonding interface 200.

In other embodiments, in conjunction with fig. 5, the motor 144 and the base 141 may form a fourth bonding interface 400, at least two of the first bonding interface 100, the second bonding interface 200, and the fourth bonding interface 400 being bonded by a cured waterproof breathable adhesive. For example: the infrared filter 142 is bonded with the base 141 through the cured waterproof air-permeable adhesive, and the image sensor 143 is bonded with the base 141 through the cured waterproof air-permeable adhesive; and the motor 144 and the base 141 are bonded by the cured thermosetting adhesive. At this time, the first sealed cavity may balance a pressure difference with the external environment through the second bonding interface 200, and another sealed cavity (which may be defined as a "third sealed cavity") enclosed by the base 141, the ir filter 142, the motor 144 and the lens 145 may balance a pressure difference with the external environment through the first bonding interface 100 and the second bonding interface 200. For another example: the motor 144 is bonded with the base 141 through the cured waterproof breathable glue, and the infrared filter 142 is bonded with the base 141 through the cured waterproof breathable glue; and the image sensor 143 is bonded to the base 141 by the cured thermosetting adhesive. At this time, the first sealed cavity may balance a pressure difference with the external environment through the first and

fourth bonding interfaces

100 and 400, and the third sealed cavity may balance a pressure difference with the external environment through the fourth bonding interface 400. Another example is: the infrared filter 142 is adhered to the base 141 by the cured waterproof air-permeable adhesive, the image sensor 143 is adhered to the base 141 by the cured waterproof air-permeable adhesive, and the motor 144 is adhered to the base 141 by the cured waterproof air-permeable adhesive. At this time, the first sealed cavity may balance the pressure difference with the external environment through the second bonding interface 200, or balance the pressure difference with the external environment through the second bonding interface 200 and the fourth bonding interface 400; the third sealed chamber may be balanced from the external environment by the fourth adhesion interface 400, or balanced by the first adhesion interface 100 and the second adhesion interface 200.

In other embodiments, in conjunction with fig. 6, the image sensor 143 may include a substrate 1431 and a photosensitive chip 1432 disposed on a side of the substrate 1431 facing the infrared filter 142, where the substrate 1431 and the base 141 form the second bonding interface 200. At this time, the substrate 1431 is mainly used for mounting the photosensitive chip 1432, and implementing electrical connection between the photosensitive chip 1432 and other structural components, such as the motherboard 15 and the battery 16, so the substrate 1431 may be a circuit board; the light sensing chip 1432 is mainly used to convert an optical signal into an electrical signal, so the light sensing chip 1432 may be a sensor such as a CCD or a CMOS. Further, the camera module 14 may further include an auxiliary fixing member 146, and the auxiliary fixing member 146 may be configured to lock the substrate 1431 and the base 141 in a direction perpendicular to the optical axis of the camera module 14, so as to reduce a risk that the image sensor 143 and the base 141 slip and stagger under a limit condition that the electronic device 10 falls off, and the like, of the camera module 14, thereby increasing reliability of the camera module 14. Illustratively, the base plate 1431 and the base 141 are provided with mounting holes, and the auxiliary fixing member 146 is a post or a barb inserted into the mounting hole. The auxiliary fixing member 146 may be an integral structure with the substrate 1431 or the base 141. Of course, in the embodiment shown in fig. 4, the lens 145 and the base 141 may also be locked by the same or similar auxiliary fixing members in the direction perpendicular to the optical axis of the camera module 14; in the embodiment shown in fig. 5, the motor 144 and the base 141 can also be locked in a direction perpendicular to the optical axis of the camera module 14 by the same or similar auxiliary fixing members.

The components of the waterproof breathable adhesive described herein and their associated properties are described below by way of example.

In the present application, the waterproof and breathable adhesive may include a silicone resin, a fluoride ion-containing compound, and a curing agent. When the waterproof breathable glue is coated on the bonding interface and cured in the air, the fluorine-containing ionic compound is subjected to phase separation in the curing process of the organic silicon resin to form holes, so that the breathable effect is achieved. This is because the polarity of the fluorine-containing ion is lower than that of silicone, and a driving force for microphase separation exists between the two; meanwhile, the organic silicon resin can undergo a removal reaction such as deacidification, for example, a removal reaction such as deacetone and the like releases small molecules, the small molecules can escape from the waterproof breathable adhesive in a gas state under the action of the driving force, nanometer-scale micropores can be formed on the interface of fluorine-containing ions and organic silicon when the small molecules escape, and the micropores further form a micron-scale gas passage, so that the waterproof breathable adhesive has a breathable function after being cured. And the water vapor in the air can be condensed into water drops on the surface of the cured waterproof breathable glue, and the water drops are difficult to penetrate through the cured waterproof breathable glue through the gas channel under the action of surface tension (mutual pulling and balancing of water molecules) due to large particles, namely the waterproof breathable glue has a waterproof function after being cured.

The organic silicon resin is a polymer which is formed by alternately connecting silicon atoms and oxygen atoms to form a framework, and different organic groups are connected with the silicon atoms. Wherein, the organic silicon resin can comprise at least one of polymethyl silicon resin, polyethyl silicon resin, polyaryl organic silicon resin and polyalkyl aryl organic silicon resin.

The polarity of the fluorine-containing ions and the organic silicon has larger difference, and stronger driving force for promoting microphase separation exists between the fluorine-containing ions and the organic silicon, so that a micron-sized gas passage is formed in the waterproof breathable adhesive more easily. Wherein, the fluoride ion-containing compound can comprise at least one of polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, polyperfluoroethylpropylene, ethylene tetrafluoroethylene copolymer and ethylene chlorotrifluoroethylene copolymer.

The curing agent is used for promoting the organic silicon resin to generate a curing reaction, and further promoting the waterproof breathable glue to be cured. The curing agent may include at least one of an organotin curing agent, an organobismuth curing agent, and a platinum curing agent.

Further, the waterproof breathable glue can further comprise a coupling agent, so that the waterproof breathable glue has higher bonding strength and more excellent aging resistance after being cured. Among them, the coupling agent may be a silane coupling agent.

Illustratively, the content of the silicone resin may be 15 to 85 parts by mass, the content of the fluorine-containing ionic compound may be 10 to 80 parts by mass, and the content of the curing agent may be 0.01 to 5 parts by mass. Further, the content of the coupling agent may be 0.01 to 5 parts by mass. Based on the above-mentioned correlation analysis, if the content of the fluoride ion-containing compound is not too low, for example, less than 10 parts by mass, it is difficult to form micron-sized gas passages in the cured waterproof and breathable adhesive, and thus the cured waterproof and breathable adhesive has poor gas permeability; meanwhile, the content of the fluorine-containing ionic compound is not too high, for example, more than 80 parts by mass, which may result in over-developed gas passages in the waterproof breathable adhesive, and thus poor adhesion of the cured waterproof breathable adhesive, and easy collapse of the gas passages in the waterproof breathable adhesive.

Further, the present application mixes together different ingredients, different mass parts of silicone resin, fluoride ion-containing compound, curing agent and coupling agent to prepare different waterproof breathable adhesives, as shown in table 1 below. Based on this, with reference to fig. 6, different waterproof and air-permeable adhesives are applied to the first bonding interface 100 between the ir filter 142 and the base 141 and the second bonding interface 200 between the substrate 1431 and the base 141, so as to obtain different samples after the waterproof and air-permeable adhesives are cured; each sample was then subjected to a shear strength test for adhesion strength, a red ink penetration test for water resistance, and a pressure balance test for air permeability, as shown in table 2 below. In the comparative example, the substrate 1431, the infrared filter 142, and the base 141 are bonded by thermosetting adhesive.

Table 1: waterproof breathable adhesive prepared from organic silicon resin, fluorine-containing ion compound, curing agent and coupling agent in different components and different mass parts

Table 2: coating different waterproof breathable adhesives on the first bonding interface and the second bonding interface, and curing the waterproof breathable adhesives to obtain samples

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. The utility model provides a camera module, its characterized in that, camera module includes the base, and is located infrared filter and image sensor of the base both sides that carry on the back mutually, infrared filter with the base forms first bonding interface, image sensor with the base forms second bonding interface, first bonding interface with at least one of second bonding interface realizes the bonding by the waterproof ventilative glue of solidification.

2. The camera module according to claim 1, further comprising a lens disposed on a side of the ir filter facing away from the image sensor, wherein the lens and the base form a third bonding interface, and at least two of the first bonding interface, the second bonding interface, and the third bonding interface are bonded by the cured waterproof and air-permeable adhesive.

3. The camera module according to claim 1, further comprising a motor located on a side of the ir filter facing away from the image sensor and a lens connected to the motor, wherein the lens is at least capable of being close to or far away from the ir filter under the driving of the motor, the motor and the base form a fourth bonding interface, and at least two of the first bonding interface, the second bonding interface and the fourth bonding interface are bonded by the cured waterproof and air-permeable adhesive.

4. The camera module according to claim 1, wherein the image sensor comprises a substrate and a photo sensor chip disposed on a side of the substrate facing the ir filter, and the substrate and the base form the second bonding interface.

5. The camera module of claim 4, further comprising an auxiliary fixture configured to lock the base plate and the base in a direction perpendicular to an optical axis of the camera module.

6. The camera module according to claim 1, wherein the waterproof and breathable adhesive comprises a silicone resin, a fluorine-containing ionic compound and a curing agent; wherein the content of the organic silicon resin is 15-85 parts by mass, the content of the fluorine-containing ionic compound is 10-80 parts by mass, and the content of the curing agent is 0.01-5 parts by mass.

7. The camera module of claim 6, wherein the silicone resin comprises at least one of a polymethyl silicone resin, a polyethyl silicone resin, a polyaryl silicone resin, and a polyalkylaryl silicone resin.

8. The camera module according to claim 6, wherein the fluoride ion-containing compound comprises at least one of polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, polyperfluoroethylpropylene, ethylene tetrafluoroethylene copolymer, and ethylene chlorotrifluoroethylene copolymer.

9. The camera module according to claim 6, wherein the curing agent comprises at least one of an organotin curing agent, an organobismuth curing agent, and a platinum curing agent.

10. An electronic device comprising a display module, a housing, and the camera module of any one of claims 1-9, wherein the housing is coupled to the display module, and wherein the camera module is positioned between the display module and the housing.