JP5047902B2 - Solid-state imaging device and electronic apparatus including the same - Google Patents

Description

  The present invention relates to a solid-state imaging device suitable for thinning and miniaturization of an electronic device and an electronic device including the same.

  A solid-state imaging device (camera module) has a configuration in which a solid-state imaging device is mounted on a substrate. This solid-state imaging device is used in various electronic devices (portable terminals) including communication devices such as mobile phones. Since recent electronic devices tend to be smaller and thinner, there is an increasing demand for thinner and smaller solid-state imaging devices.

For example, Patent Document 1 discloses a solid-state imaging device mounted on such an electronic device. FIG. 18 is a perspective view illustrating a manufacturing process of the solid-state imaging device disclosed in Patent Document 1. As shown in FIG. 18, when the solid-state imaging device 301 is mounted on an electronic device, first, the socket 302 is inserted into the through hole 304 formed in the substrate 303 of the electronic device. Next, the terminal 305 formed on the socket 302 and the terminal 306 formed on the substrate 303 are soldered. Finally, the solid-state imaging device 301 is inserted into the socket 302 soldered to the substrate 303. As a result, the solid-state imaging device 301 is mounted on an electronic device and is electrically connected to the substrate 303 via the socket 302.
JP 2007-123214 A (published May 17, 2007)

  However, the solid-state imaging device of Patent Document 1 is not suitable for reducing the thickness and size of electronic devices.

  Specifically, in Patent Document 1, in order to mount the solid-state imaging device 301 on an electronic device, the solid-state imaging device 301 is inserted into a socket 302. At this time, the terminal 307 formed on the outer surface of the solid-state imaging device 301 contacts the terminal 305 formed on the inner surface of the socket 302. That is, when the solid-state imaging device 301 is mounted on an electronic device, the socket 302 is disposed outside the solid-state imaging device 301. For this reason, naturally, the size of the socket 302 is larger than the size of the solid-state imaging device 301. That is, in order to mount the solid-state imaging device 301 of Patent Document 1 on an electronic device, the socket 302 having a size larger than the size in the surface direction (perpendicular to the optical axis) of the solid-state imaging device is required.

  Moreover, in Patent Document 1, a socket 302 is disposed on the back surface of the solid-state imaging device 301. For this reason, in order to mount the solid-state imaging device 301 on an electronic apparatus, in addition to the thickness of the solid-state imaging device 301, the thickness of the socket 302 is also required.

  However, as described above, recently, electronic devices such as camera-equipped mobile phones are required to be thinner and smaller. That is, in an electronic device, the space where the solid-state imaging device is mounted is very small. For this reason, no matter how small the solid-state imaging device 301 is, if the socket 302 larger than the solid-state imaging device 301 is required, or if the thickness of the socket 302 is required in addition to the thickness of the solid-state imaging device 301, this requirement Can't meet. Therefore, the solid-state imaging device disclosed in Patent Document 1 is not suitable for reducing the thickness and size of electronic devices.

  Accordingly, the present invention has been made in view of the above problems, and an object thereof is to realize a solid-state imaging device suitable for thinning and downsizing of an electronic device and an electronic device equipped with the solid-state imaging device. There is to do.

In order to solve the above problems, a solid-state imaging device of the present invention includes a lens unit including an imaging lens;
In a solid-state imaging device including a wiring board and a solid-state imaging device that are electrically connected to each other, and an imaging unit that converts a subject image formed by a lens unit into an electrical signal,
The wiring board has terminals for inputting / outputting signals to / from the outside,
The wiring board is folded, the terminals formed on the wiring board are routed to the top surface of the imaging unit, and the solid-state imaging device is disposed between the layers formed by folding the wiring board,
The imaging unit includes a housing unit that houses the solid-state imaging device, and a lens holder that holds the lens unit,
The wiring board has a through-hole penetrating in the thickness direction,
The lens holder is inserted into the through hole in a state where the wiring board is folded .

  According to the above invention, when the wiring board is folded, the external connection terminals formed on the wiring board are routed to the top surface of the imaging unit. That is, the wiring board is folded so that the terminals of the wiring board are exposed to the lens unit side. For this reason, when the solid-state imaging device of the present invention is mounted on an electronic device, the terminals of the wiring board drawn around the top surface of the imaging unit and the terminals of the electronic device main body are arranged in the optical axis direction. Accordingly, the solid-state imaging device can be mounted on the electronic device within the size of the surface direction of the solid-state imaging device (direction perpendicular to the optical axis). For this reason, the electronic device can be miniaturized.

  Furthermore, since the terminals of the wiring board are routed around the top surface of the imaging unit, the socket of the electronic device is disposed on the top surface of the imaging unit. That is, the socket of the electronic device is not disposed on the back surface of the solid-state imaging device (imaging unit) as in Patent Document 1, but is disposed on the lens unit side. For this reason, the thickness of the socket of the electronic device is included in the optical length (the distance from the imaging surface of the solid-state imaging device to the tip of the lens unit).

  On the other hand, when the socket is arranged on the back surface of the solid-state imaging device as in Patent Document 1, the optical length and the thickness of the socket exist independently. For this reason, when the solid-state imaging device is mounted on an electronic device, the thickness of the socket is required in addition to the thickness of the solid-state imaging device.

  As described above, according to the above-described invention, when the solid-state imaging device is mounted on the electronic device, the thickness of the socket required in Patent Document 1 is absorbed by the optical length. That is, since the thickness of the socket is not necessary, the electronic device can be thinned.

  Therefore, according to said invention, the solid-state imaging device suitable for size reduction and thickness reduction of an electronic device is realizable.

  The optical length of the solid-state imaging device is determined in advance depending on the positional relationship between the solid-state imaging device and the lens, and thus the thickness of the solid-state imaging device cannot be made smaller than the optical length.

Furthermore, according to the above invention, the lens holder is inserted into the through hole formed in the wiring board in a state where the wiring board is folded. Thereby, the wiring board can be folded with the lens holder as a target. Therefore, the wiring board can be easily folded and the wiring board can be aligned. Furthermore, if the lens holder is inserted into the through hole with the wiring board folded, the through hole is caught by the lens holder. For this reason, even if force acts on a wiring board, position shift of a wiring board does not arise. Therefore, the folded state of the wiring board can be fixed (maintained).

  In the solid-state imaging device of the present invention, it is preferable that at least one of the housing portion and the lens holder has a mounting assisting portion for assisting in mounting the solid-state imaging device on an electronic device.

  According to the above invention, the solid-state imaging device is mounted on the electronic device by the mounting auxiliary portion formed in at least one of the housing portion and the lens holder. Therefore, the solid-state imaging device can be mounted on the electronic apparatus with reference to the mounting auxiliary unit.

  In the solid-state imaging device of the present invention, it is preferable that the mounting auxiliary portion is a large-diameter portion where the outer diameter of the lens holder is relatively large.

  According to said invention, a solid-state imaging device can be mounted in an electronic device on the basis of the large diameter part of a lens holder.

  In the solid-state imaging device according to the aspect of the invention, it is preferable that the mounting auxiliary portion is an extending portion in which an outer edge portion of the housing portion extends in the optical axis direction.

  According to the invention described above, the solid-state imaging device can be mounted on the electronic apparatus with reference to the protrusion formed in the housing portion.

  In the solid-state imaging device of the present invention, it is preferable that the mounting auxiliary portion is a screw portion formed on the outer surface of the lens holder.

  According to the above invention, since the screw portion is formed on the outer surface of the lens holder, the solid-state imaging device can be mounted on the electronic device by the screw method.

In the solid-state imaging device of the present invention, a protrusion is formed in the housing portion,
The wiring board is preferably formed with a locking portion that is locked to the protrusion in a state in which the wiring board is folded.

  According to said invention, the protrusion formed in the accommodating part and the latching | locking part formed in the wiring board are latched mutually in the state by which the wiring board was folded. Thereby, the wiring board can be easily folded and the positioning of the wiring board is also possible. In addition, the folded state of the wiring board can be firmly fixed (maintained).

  In the solid-state imaging device of the present invention, it is preferable that the protrusion is formed at a corner portion of the housing portion.

  According to said invention, the protrusion for latching a wiring board and an accommodating part is formed in the corner | angular part of an accommodating part. Accordingly, it is possible to lock the wiring board and the accommodating portion to each other while avoiding the terminal formation region on the wiring board.

  In the solid-state imaging device of the present invention, the wiring board is preferably a flexible board.

  According to said invention, since a wiring board is a flexible substrate, folding of a wiring board becomes easy.

  In order to solve the above problems, an electronic apparatus according to the present invention includes any one of the solid-state imaging devices.

  According to the above invention, since the solid-state imaging device suitable for thinning and miniaturization of the electronic device is provided, it is possible to realize a thin and small electronic device.

In the solid-state imaging device of the present invention, the wiring board is folded, and terminals for inputting / outputting signals to / from the outside formed on the wiring board are routed to the top surface of the imaging unit , and the wiring board is folded. A solid-state imaging device is disposed between the layers that can be folded, and the imaging unit includes a housing unit that houses the solid-state imaging device and a lens holder that holds the lens unit, and the wiring board has a thickness direction. The lens holder is inserted into the through-hole in a state where the through-hole penetrating through is formed and the wiring board is folded . Therefore, there is an effect that it is possible to realize a solid-state imaging device suitable for downsizing and thinning of electronic devices.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a solid-state imaging device of the present invention. 2 is a cross-sectional view of the solid-state imaging device of FIG.

  As shown in FIG. 1, the solid-state imaging device 100 includes a lens unit 1 and an imaging unit 2. The lens unit 1 is held at the center of the imaging unit 2. A terminal 25 for external connection is routed around the top surface of the imaging unit 2, and the terminal 25 is exposed. For convenience of explanation, the lens unit 1 side is the upper side, and the imaging unit 2 side is the lower side.

  The lens unit 1 guides light from the outside to the imaging unit 2. As shown in FIG. 2, the lens unit 1 has a configuration in which an imaging lens 11 is held inside a hollow lens barrel 12. The lens unit 1 is screwed into the center of the imaging unit 2.

  The imaging unit 2 converts the subject image formed by the lens unit 1 into an electrical signal. That is, the imaging unit 2 photoelectrically converts incident light incident from the lens unit 1. FIG. 3 is an exploded perspective view of the imaging unit 2. The imaging unit 2 includes a wiring board 21, a solid-state imaging element 22, and a sensor holder 27. The solid-state image sensor 22 is mounted on the wiring board 21 and is accommodated in the sensor holder 27.

  The wiring board 21 takes out an electrical signal from the solid-state imaging device 22. The wiring board 21 has a patterned wiring (not shown) for electrical connection with the solid-state imaging device 22. The wiring board 21 is formed with a through hole 24 that penetrates in the thickness direction.

  FIG. 4 is a perspective view of the wiring board 21 as seen from the back side. As shown in FIG. 4, a plurality of terminals 25 are formed around the through hole 24 on the surface (back surface) opposite to the mounting surface of the solid-state imaging device 22 of the wiring substrate 21. The terminal 25 is for inputting / outputting a signal to / from the outside of the solid-state imaging device 100. Such a wiring board 21 is, for example, a printed board or a ceramic board. As will be described later, since the wiring board 21 is folded, it is preferably a flexible board.

  The solid-state imaging device 22 converts the subject image formed by the lens unit 1 into an electrical signal. The solid-state image sensor 22 is bonded to the front surface of the wiring board 21 (the surface opposite to the surface on which the terminals 25 are formed). The solid-state imaging device 22 is a semiconductor substrate (for example, a silicon single crystal substrate) on which a semiconductor circuit is formed, which is formed in a rectangular shape in plan view. The solid-state imaging device 22 is, for example, a charge-coupled device (CCD) image sensor, a complementary metal-oxide semiconductor (CMOS) image sensor, or a threshold voltage modulation image sensor (VMIS).

  As shown in FIG. 3, a light receiving unit 22 a in which a plurality of pixels are arranged in a matrix is formed on the surface (upper surface) of the solid-state imaging element 22. The light receiving unit 22a is a region that transmits light incident from the lens unit 1 (light transmission region), and is also referred to as a pixel area. The imaging surface of the imaging unit 2 is the light receiving unit 22a.

  The solid-state image sensor 22 converts the subject image formed on the light receiving unit 22a into an electrical signal and outputs the signal as an analog image signal. That is, photoelectric conversion is performed by the light receiving unit 22a. The operation of the solid-state image sensor 22 is controlled by a DSP (not shown), and the image signal generated by the solid-state image sensor 22 is processed by the DSP.

  In the present embodiment, the wiring board 21 and the solid-state imaging device 22 are electrically connected to each other by the wire 23.

  The sensor holder 27 includes a lens holder 28 that holds the lens unit 1, a storage unit 29 that stores the solid-state imaging device 22 therein, and a transparent substrate 30 that is held on the bottom surface of the lens holder 28. In the present embodiment, the lens holder 28 and the accommodating portion 29 are integrated.

  The lens holder 28 holds the lens unit 1 inside, and is provided at the center of the sensor holder 27. As shown in FIG. 3, the inner surface of the lens holder 28 is threaded. As a result, the lens unit 1 can be screwed into the lens holder 28. Further, the position of the lens unit 1 can be finely adjusted.

  In the present embodiment, the lens holder 28 has a mounting assisting unit for assisting in mounting the solid-state imaging device 100 on an electronic device. Specifically, in the present embodiment, as the mounting assisting portion, the lens holder 28 has a large-diameter portion 28a having a relatively large outer diameter. The large diameter portion 28 a is a portion extending in the circumferential direction from the side surface of the lens holder 28. The mounting state of the solid-state imaging device 100 on the electronic device will be described later.

  The accommodating part 29 accommodates the solid-state image sensor 22 inside. Protrusions 29 a are formed at the four corners of the upper surface (front surface) of the accommodating portion 29. The protrusion 29a protrudes upward in parallel to the optical axis. As will be described later, the protrusion 29a serves as a guide when the wiring board 21 is folded.

  The transparent substrate 30 is bonded to the bottom surface of the lens holder 28. The transparent substrate 30 is provided apart from the solid-state image sensor 22. The transparent substrate 30 covers at least the light receiving portion 22a of the solid-state imaging element 22. That is, the area of the surface of the transparent substrate 30 facing the light receiving part 22a is larger than the area of the light receiving part 22a. The transparent substrate 30 is made of, for example, translucent glass or resin. An optical filter such as an infrared cut filter may be formed on the transparent substrate 30 (the surface on the lens unit 1 side).

  In the solid-state imaging device 100, the wiring board 21 of the imaging unit 2 is folded. FIG. 5 is a perspective view of the imaging unit 2 and shows a folded state of the wiring board 21. As shown in FIG. 5, the wiring board 21 is folded along the accommodating portion 29. Thereby, the terminal 25 formed on the back surface of the wiring board 21 is routed to the top surface (upper surface) of the imaging unit 2.

  When the wiring board 21 is folded, the lens holder 28 is inserted into the through hole 24 of the wiring board 21. For this reason, the shape of the through hole 24 is the same as the shape of the upper surface of the lens holder 28.

  Further, in a state where the wiring board 21 is folded, the notch of the corner portion 26 around the through hole 24 is caught by the protrusion 29 a of the housing portion 29. Thus, the lens holder 28 and the protrusion 29a of the housing portion 29 serve as a guide when the wiring board 21 is folded. That is, the corner portion 26 is a locking portion that is locked to the protrusion 29a. Thereby, the alignment of the wiring board 21 becomes possible.

  Such a solid-state imaging device 100 takes in external light from the lens unit 1 through the transparent substrate 30 into the imaging unit 2. The captured light is guided to the light receiving unit 22a of the solid-state imaging device 22, and a subject image is formed on the light receiving unit 22a. The solid-state image sensor 22 converts the subject image into an electrical signal. In the imaging unit 2, various processes (image processing and the like) are performed on the converted electrical signal.

  FIG. 6 is a cross-sectional view illustrating an example of mounting the solid-state imaging device 100 on an electronic device. FIG. 7 is an exploded perspective view showing the configuration of the connection portion 5 of the electronic device main body.

  As shown in FIG. 6, the solid-state imaging device 100 is mounted on the connection unit 5 of the electronic device main body. Specifically, when the solid-state imaging device 100 is mounted on an electronic device, the large-diameter portion 28 a of the lens holder 28 is locked in a locking groove 57 formed in the connection portion 5. In this locked state, the terminal 25 of the solid-state imaging device 100 and the terminal 54 of the connection unit 5 are in contact with each other. Thereby, the solid-state imaging device 100 is electrically connected to the electronic apparatus main body.

  As shown in FIG. 7, the connection unit 5 of the electronic device main body includes a socket 51 and a substrate 52. Each of the socket 51 and the substrate 52 has openings 53 and 55 for securing an optical path at the center. Further, the lens unit 1 and the lens holder 28 are inserted into the openings 53 and 55 when the solid-state imaging device 100 is mounted. A locking groove 57 is formed on the inner side surface of the opening 53 of the socket 51. The large-diameter portion 28 a of the lens holder 28 of the solid-state imaging device 100 is locked in the locking groove 57. Thereby, the solid-state imaging device 100 is mounted on the electronic device.

  FIG. 8 is a cross-sectional view of the vicinity of the locking groove 57 of the socket 51. The locking groove 57 has a depth that does not penetrate in the thickness direction (optical axis direction) from the surface facing the solid-state imaging device 100. Furthermore, the bottom portion of the locking groove 57 extends in the direction perpendicular to the optical axis (horizontal direction in the figure) and extends again to the surface facing the solid-state imaging device 100. That is, the cross section of the locking groove 57 has a shape bent in a hook shape (J shape). Thereby, as described later, when the solid-state imaging device 100 is mounted on the electronic apparatus, the large-diameter portion 28 a of the lens holder 28 is locked in the locking groove 57.

  Further, the terminal 56 formed on the substrate 52 and the terminal 54 formed on the socket 51 are soldered together by solder 60. That is, the socket 51 is surface-mounted on the substrate 52. Thereby, the socket 51 and the board | substrate 52 are mutually electrically connected. The terminal 54 of the socket 51 is routed from the solder joint portion to the surface facing the solid-state imaging device 100. Thereby, the terminal 54 will be in the state exposed to the reverse surface of the solder joint part.

  Next, an example of a manufacturing method of the solid-state imaging device 100 and an electronic device in which the solid-state imaging device 100 is mounted will be described. 9 and 10 are cross-sectional views illustrating the manufacturing process of the solid-state imaging device 100. FIG. FIG. 11 is a perspective view illustrating a manufacturing process of an electronic device on which the solid-state imaging device 100 is mounted.

  As shown in FIG. 9, first, the solid-state imaging element 22 is die-bonded on the wiring board 21. Next, the wiring substrate 21 and the solid-state imaging element 22 are electrically connected by wire bonding using the wires 23. Next, the sensor holder 27 is mounted on the wiring board 21, and the solid-state imaging device 22 is accommodated inside the sensor holder 27.

  Next, the wiring board 21 is folded along the sensor holder 27 (see FIG. 5). At this time, the lens holder 28 is inserted into the through hole 24 formed in the wiring board 21. Further, the notch of the corner portion 26 of the wiring board 21 is hooked on the protrusion 29 a of the sensor holder 27. As a result, the terminals 25 formed on the wiring board 21 are arranged on the upper surface of the imaging unit 2.

  Finally, as shown in FIG. 10, the lens unit 1 is attached to the lens holder 28. Further, the lens unit 1 is screwed to adjust the focal length. In this way, the solid-state imaging device 100 can be manufactured.

  Next, as shown in FIG. 11, the lens unit 1 of the solid-state imaging device 100 is faced down (turned over) and mounted on the connection unit 5 of the electronic device body. That is, the solid-state imaging device 100 is mounted on the connection unit 5 of the electronic device body in a face-down state. At this time, the lens portion 1 is inserted into the sockets 53 and the openings 53 and 55 of the substrate 52 with the large diameter portion 28 a of the lens holder 28 aligned with the locking groove 57. Next, when the large-diameter portion 28a reaches the bottom of the locking groove 57, the solid-state imaging device 100 and the connection portion 5 are relatively rotated.

12 is a cross-sectional view showing a state in which the large diameter portion 28a of the lens holder 28 is locked in the groove of the connector in the manufacturing process of FIG. As shown in FIG. 12, a pressing member 58 is provided at the bottom (on the substrate 51 side) of the locking groove 57. The pressing member 58 applies tension to the large diameter portion 28 a of the lens holder 28 and guides the large diameter portion 28 a to the back of the locking groove 57.
When the solid-state imaging device 100 is mounted on the socket 51, the large diameter portion 28 a of the lens holder 28 is inserted into the locking groove 57. Next, when the large-diameter portion 28a reaches the bottom of the locking groove 57 and contacts the pressing member 58, the solid-state imaging device 100 is rotated. Thereby, the large diameter portion 28 a moves along the bottom portion of the locking groove 57. At this time, the pressing member 58 urges the large-diameter portion 28a toward the solid-state imaging device 100 (the direction in which the large-diameter portion 28a is inserted). Finally, the large-diameter portion 28a is locked in the back of the locking groove 57.

In this way, the large diameter portion 28 a is locked in the locking groove 57, and the solid-state imaging device 100 is mounted on the electronic device 110. Mounting the solid-state imaging device 100 on the main body of the electronic device is simple and can be performed manually.
FIG. 13 is a partial cross-sectional view of an electronic apparatus on which the solid-state imaging device 100 is mounted. As shown in FIG. 13, when the solid-state imaging device 100 is mounted, the terminal 25 formed on the imaging unit 2 (wiring board 21) of the solid-state imaging device 100, and the terminal 54 formed on the socket 51 of the electronic device body. Touch each other. Thereby, the solid-state imaging device 100 and the board | substrate 52 of an electronic device main body are electrically connected mutually. In addition, since the terminal 25 is drawn out to the top surface of the imaging unit 2, the terminal 25 and the terminal 54 are stacked in the optical axis direction. For this reason, the solid-state imaging device 100 can be mounted on the electronic device 110 within the size of the surface direction of the solid-state imaging device 100 (perpendicular to the optical axis). In FIG. 13, the side surface of the imaging unit 2 and the side surface of the socket 51 are flush with each other.

  As described above, according to the solid-state imaging device 100 of the present embodiment, when the wiring board 21 is folded, the external connection terminals 25 formed on the wiring board 21 are placed on the top surface of the imaging unit 2. Has been routed. That is, the wiring board 21 is folded so that the terminals 25 of the wiring board 21 are exposed to the lens unit 1 side. For this reason, when the solid-state imaging device 100 is mounted on the electronic device 110, the terminal 25 of the wiring board 21 drawn around the top surface of the imaging unit 2 and the terminal 54 of the electronic device main body are arranged in the optical axis direction. Is done. Thereby, the solid-state imaging device 100 can be mounted on the electronic device 110 within the size of the surface direction of the solid-state imaging device 100 (direction perpendicular to the optical axis). Therefore, the solid-state imaging device 100 suitable for downsizing and thinning of the electronic device 110 can be realized.

  In the present embodiment, the wiring board 21 and the solid-state imaging device 22 are connected by wire bonding. However, the solid-state imaging element 22 may be connected to the wiring board 21 by a flip chip method. FIG. 14 is a cross-sectional view showing an electronic apparatus 120 on which the solid-state imaging device 101 in which the solid-state imaging element 22 is connected to the wiring substrate 21 by a flip chip method is mounted. In this case, the solid-state imaging device 22 and the terminal 25 are provided on the same surface of the wiring board 21. That is, the mounting surface of the solid-state imaging element 22 of the wiring board 21 and the surface on which the terminals 25 are formed are the same surface. Further, in the configuration of FIG. 14, the transparent substrate 30 is provided on the solid-state imaging device 22 via an adhesive portion 31. The transparent substrate 30 covers a light receiving unit (not shown). Thereby, the adhesion of dust to the light receiving part can be prevented. In addition, although not shown, the bonding portion 31 is formed with a ventilation path for preventing condensation. Other configurations are the same as those described above.

  The solid-state imaging device 100 according to the present embodiment can be configured as follows. 15 to 17 are perspective views showing other solid-state imaging devices 102, 103, and 104.

  In the solid-state imaging device 102 of FIG. 15, the large-diameter portion 28 a of the lens holder 28 is larger than the solid-state imaging device 100. Thereby, the mounting state of the solid-state imaging device 102 in the electronic device can be reliably maintained.

  Further, in the solid-state imaging device 103 of FIG. 16, the protrusion (mounting auxiliary portion) 29 a formed in the housing portion 29 further extends in the optical axis direction (height direction) than the solid-state imaging device 100. Thereby, the protrusion 29a also serves as a guide when the solid-state imaging device 103 is mounted on the electronic device. Therefore, alignment between the solid-state imaging device 103 and the electronic device main body can be reliably performed.

  Further, in the solid-state imaging device 104 in FIG. 17, the large-diameter portion 28 a does not exist in the lens holder 28. This is different from the solid-state imaging device described above. In the solid-state imaging device 104 of FIG. 17, the lens holder 28 has a threaded portion (mounting assisting portion) 28b that is threaded on the outer surface. Thereby, the solid-state imaging device 104 can be mounted on the electronic device by a screw method. In this case, the inner surface of the opening 53 of the socket 51 only needs to be threaded so as to be screwed into the screw portion 28b, and the locking groove 57 is unnecessary.

  The solid-state imaging device of the present invention is suitable for electronic devices capable of photographing such as a mobile phone with a camera, a digital still camera, a video camera, and a security camera.

The present invention can also be expressed as follows.
[1] In a wiring board for a solid-state imaging device including an optical component (lens and a mechanism for holding the lens), an optical filter, a solid-state imaging element, and a wiring board for extracting an electrical signal of the solid-state imaging element, the electrical signal of the solid-state imaging element A wiring board characterized by having a through hole for the purpose of avoiding an optical region and positioning when the wiring board for taking out the wire is pulled out to the optical component side.
[2] Wiring board for taking out electrical signals of a solid-state imaging device in a solid-state imaging device comprising an optical component (lens and a mechanism for holding the lens), an optical filter, a solid-state imaging device, and a wiring board for taking out electrical signals of the solid-state imaging device A solid-state imaging device characterized in that an external input / output terminal is arranged on the optical component side by pulling out the optical component to the optical component side.
[3] In a solid-state image pickup device including an optical component (lens and a mechanism for holding the lens), an optical filter, a solid-state image pickup device, and a wiring board for extracting an electric signal of the solid-state image pickup device, for holding a socket for the solid-state image pickup device A solid-state imaging device having a mechanism in a holder of an optical component.
[4] In a method of manufacturing a solid-state image pickup device including an optical component (lens and a mechanism for holding the lens), an optical filter, a solid-state image pickup device, and a wiring board for taking out an electric signal of the solid-state image pickup device, a terminal of the socket for the solid-state image pickup device A solid-state imaging device manufacturing method, wherein the solid-state imaging device is face-down installed and held so that the terminals of the solid-state imaging device face each other.
[5] A solid-state image pickup device socket having a terminal for connecting the solid-state image pickup device and a surface-mounting terminal on the substrate and a through-hole for avoiding the optical region, and having a mechanism for holding the solid-state image pickup device in the through-hole. A socket for solid-state imaging devices.

  ADVANTAGE OF THE INVENTION According to this invention, this invention can provide the small-sized solid-state image sensor used for portable terminals including the communication apparatus which becomes small and thin more and more cheaply.

  In the conventional technique, since the socket for the solid-state imaging device is inserted into the substrate, it is necessary to provide a through-hole for insertion in the substrate, which makes it difficult to process the substrate and costs high. Further, since the structure is such that the solid-state imaging device is inserted into the socket, there is a problem that the size (area and volume) necessary for mounting the solid-state imaging device is increased.

  On the other hand, in the solid-state imaging device of the present invention, the terminals are arranged on the optical component side. For this reason, it is possible to install the solid-state imaging device face-down so that the terminal of the socket and the terminal of the solid-state imaging device face each other. Thereby, the size of the solid-state imaging device in the area direction can be reduced. Further, since the socket is surface-mounted on the substrate, only the through hole (opening 55) of the optical system needs to be formed in the substrate, and it is not necessary to form a terminal or the like in the opening 55. Therefore, according to the present invention, it is possible to provide a solid-state imaging device and mounting method that are lighter, thinner, and smaller than the prior art.

As described above, the solid-state imaging device of the present invention includes a lens unit including an imaging lens,
  In a solid-state imaging device including a wiring board and a solid-state imaging device that are electrically connected to each other, and an imaging unit that converts a subject image formed by a lens unit into an electrical signal,
  The wiring board has terminals for inputting / outputting signals to / from the outside,
  The wiring board may be folded and a terminal formed on the wiring board may be routed around the top surface of the imaging unit.

  According to the above invention, when the wiring board is folded, the external connection terminals formed on the wiring board are routed to the top surface of the imaging unit. That is, the wiring board is folded so that the terminals of the wiring board are exposed to the lens unit side. For this reason, when the solid-state imaging device of the present invention is mounted on an electronic device, the terminals of the wiring board drawn around the top surface of the imaging unit and the terminals of the electronic device main body are arranged in the optical axis direction. Accordingly, the solid-state imaging device can be mounted on the electronic device within the size of the surface direction of the solid-state imaging device (direction perpendicular to the optical axis). For this reason, the electronic device can be miniaturized.

  Furthermore, since the terminals of the wiring board are routed around the top surface of the imaging unit, the socket of the electronic device is disposed on the top surface of the imaging unit. That is, the socket of the electronic device is not disposed on the back surface of the solid-state imaging device (imaging unit) as in Patent Document 1, but is disposed on the lens unit side. For this reason, the thickness of the socket of the electronic device is included in the optical length (the distance from the imaging surface of the solid-state imaging device to the tip of the lens unit).

  On the other hand, when the socket is arranged on the back surface of the solid-state imaging device as in Patent Document 1, the optical length and the thickness of the socket exist independently. For this reason, when the solid-state imaging device is mounted on an electronic device, the thickness of the socket is required in addition to the thickness of the solid-state imaging device.

  As described above, according to the above-described invention, when the solid-state imaging device is mounted on the electronic device, the thickness of the socket required in Patent Document 1 is absorbed by the optical length. That is, since the thickness of the socket is not necessary, the electronic device can be thinned.

  Therefore, according to said invention, the solid-state imaging device suitable for size reduction and thickness reduction of an electronic device is realizable.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  INDUSTRIAL APPLICABILITY The present invention can be suitably used for a solid-state imaging device mounted on a portable terminal (electronic device) including a communication device that is increasingly required to be smaller and thinner. In addition, a high-quality and inexpensive solid-state imaging device can be provided.

It is a perspective view of the solid-state imaging device of the present invention. It is arrow sectional drawing of the solid-state imaging device of FIG. It is a disassembled perspective view of the imaging part in the solid-state imaging device of this invention. It is a perspective view of the back surface of the wiring board of the solid-state imaging device of the present invention. It is a perspective view of the imaging part of the solid-state imaging device of the present invention. It is sectional drawing of the electronic device of this invention. It is a perspective view which shows the connection part of the electronic device of FIG. It is sectional drawing which shows the latching groove formed in the connection part of the electronic device of FIG. It is a perspective view which shows the manufacturing process of the solid-state imaging device of this invention. It is a perspective view which shows the manufacturing process of the solid-state imaging device of this invention. It is a perspective view which shows the manufacturing process of the electronic device of this invention. FIG. 12 is a cross-sectional view showing a state in which the large-diameter portion of the lens holder is locked in the groove of the socket in the manufacturing process of FIG. 11. It is sectional drawing of another electronic device of this invention. It is sectional drawing of another electronic device of this invention. It is a perspective view of another solid-state imaging device of the present invention. It is a perspective view of another solid-state imaging device of the present invention. It is a perspective view of another solid-state imaging device of the present invention. It is a perspective view which shows the manufacturing process of the solid-state imaging device of patent document 1. FIG.

DESCRIPTION OF SYMBOLS 1 Lens part 2 Imaging part 21 Wiring board 22 Solid-state image sensor 24 Through-hole 25 Terminal 26 Corner | angular part 27 Sensor holder 28 Lens holder 28a Large diameter part (mounting auxiliary | assistant part)
28b Screw part 29 Accommodating part 29a Protrusion (mounting auxiliary part, extending part)
30 Transparent substrate 51 Socket 53, 55 Opening 54, 56 Terminal 57 Locking groove 100, 101, 102, 103, 104 Solid-state imaging device 110, 120 Electronic device

Claims (9)

A lens unit equipped with an imaging lens;
In a solid-state imaging device including a wiring board and a solid-state imaging device that are electrically connected to each other, and an imaging unit that converts a subject image formed by a lens unit into an electrical signal,
The wiring board has terminals for inputting / outputting signals to / from the outside,
The wiring board is folded, the terminals formed on the wiring board are routed to the top surface of the imaging unit, and the solid-state imaging device is disposed between the layers formed by folding the wiring board,
The imaging unit includes a housing unit that houses the solid-state imaging device, and a lens holder that holds the lens unit,
The wiring board has a through-hole penetrating in the thickness direction,
A solid-state imaging device , wherein the lens holder is inserted into the through hole in a state in which the wiring board is folded . The solid-state imaging device according to claim 1 , further comprising a mounting auxiliary unit for assisting mounting of the solid-state imaging device on an electronic device in at least one of the housing unit and the lens holder. The solid-state imaging device according to claim 2 , wherein the mounting auxiliary portion is a large-diameter portion having a relatively large outer diameter of the lens holder. The solid-state imaging device according to claim 2 , wherein the mounting auxiliary portion is an extending portion in which an outer edge portion of the housing portion extends in the optical axis direction. The solid-state imaging device according to claim 2 , wherein the mounting auxiliary portion is a screw portion formed on an outer surface of the lens holder. A protrusion is formed in the housing part,
The solid-state imaging according to any one of claims 1 to 5 , wherein a locking portion that is locked to the protrusion is formed on the wiring board in a state in which the wiring board is folded. apparatus. The solid-state imaging device according to claim 6 , wherein the protrusion is formed at a corner of the housing portion. Wiring board, the solid-state imaging device according to any one of claims 1 to 7, characterized in that a flexible substrate. The electronic device provided with the solid-state imaging device of any one of Claims 1-8 .

Images