KR20070116434A - Multi-layer ceramic substrate, and camera module having the same - Google Patents

Abstract

A multi-layer ceramic substrate and a camera module having the same are provided to reduce the thickness of the camera module to keep up with the miniaturization of a device at which the camera module. A housing(35) has a lens(38) and an IR(Infrared Ray)-filter(36). The lens(38) receives an external image. The IR-filter(36) blocks an IR in a beam passing through the lens(38). A PCB(Printed Circuit Board), combined with the housing(35), has a passive element. An image pickup element(32), installed on the PCB, receives the image and converts the received image into an electric signal. The lens(38), the IR-filter(36), and the image pickup element(32) are disposed in a direction opposite to an object. The passive element is disposed in a side direction of the image pickup element(32) on the PCB.

Description

Multi-layer ceramic substrate, and camera module having the same

1 is a cross-sectional view showing the configuration of a conventional camera module, a cross-sectional view showing the interconnection between the image pickup device and the printed circuit board in the form of wire bonding.

Figure 2 is a cross-sectional view showing the configuration of a conventional camera module, a cross-sectional view showing the interconnection between the image pickup device and the printed circuit board in the form of flip chip bonding.

3 is a perspective view schematically showing the configuration of a camera module according to an embodiment of the present invention.

4 is a cross-sectional view taken along the line IV-IV of FIG.

5 is a cross-sectional view of the multilayer ceramic substrate according to the present invention included in the camera module of FIGS. 3 and 4.

6 to 14 are views sequentially illustrating a method of manufacturing a multilayer ceramic substrate and a camera module according to the present invention.

<Explanation of symbols for the main parts of the drawings>

10, 20, 30: camera module 11: printed circuit board

12, 32: imaging device 13, 33: flexible circuit board

14, 34: wire 15, 35: housing

16, 36: IR filter 18, 38: lens

19, 39: lens assembly 24: bump

27: molding material 31: multilayer ceramic substrate

The present invention relates to a multilayer ceramic substrate and a camera module having the same. More particularly, the present invention relates to a multilayer ceramic substrate having a plurality of ceramic thin plates stacked thereon, and to a compact device such as a mobile phone, which contributes to the miniaturization of the device. The present invention relates to a camera module capable of miniaturization.

The camera module is a device capable of capturing and transmitting video and pictures, and is used in mobile phones, notebook computers, PDAs, cameras for inserting monitors, rear view cameras for bumper mounting, and cameras for door / interphones.

In general, a wire bonding type and a flip chip type are commonly used as a form of interconnection between an image sensor chip and a substrate in a camera module.

1 and 2 are cross-sectional views showing the configuration of a conventional camera module. 1 is a cross-sectional view showing an interconnection between an image pickup device and a printed circuit board in a wire bonding form, and FIG. 2 is a view illustrating a connection between an image pickup device and a printed circuit board in a flip chip bonding form. It is a cross section.

As shown in FIGS. 1 and 2, the camera modules 10, 20 may include a housing 15, a lens assembly 19, an IR-filter 16, an imaging device 12, and a printed circuit board 11. Include. The housing 15 has the lens assembly 19 at the front, the lens assembly 19 comprising at least one lens 18, and the rear of the lens assembly 19 inside the housing 15. IR-filter 16 is arranged.

The imaging device 12 functions to receive light passing through the lens assembly 19 and the IR-filter 16 and convert the image into an electrical signal. The imaging element 12 is also arranged in line with the lens assembly 19 and the IR-filter 16. The coupling between the imaging device 12 and the printed circuit board 11 may be made by wire bonding electrically connected using the gold wire 14 as shown in FIG. As such, it may be coupled by flip chip bonding formed by forming the bumps 24.

The IR filter 16 blocks infrared rays incident to the housing 15 and prevents incident light from being reflected. To this end, an IR-cut coating may be formed on an upper surface of the IR filter 16, and an anti-reflection coating may be formed on the lower surface of the IR filter 16.

In the conventional camera module having such a configuration, there is a limit in miniaturizing its size, and according to the trend of miniaturization and thinning of devices, there is a great need for finding a solution.

The present invention is to solve the above problems, an object of the present invention is to provide a multi-layer ceramic substrate and a camera having the same that can greatly reduce the thickness of the camera module in accordance with the trend of miniaturization and thinning of the device on which the camera module is mounted To provide a module.

The object of the present invention as described above,

A housing including a lens for receiving an external image and an IR filter for blocking infrared rays of light passing through the lens;

A printed circuit board coupled to the housing and having a passive element; And

An imaging device installed on the printed circuit board to receive an image and convert the image into an electrical signal;

The lens, the IR-filter and the imaging element are arranged in a direction opposite to the subject,

The passive element is achieved by providing a camera module arranged laterally on the printed circuit board.

Here, the printed circuit board is preferably a multilayer ceramic substrate.

Here, the multilayer ceramic substrate preferably includes an external terminal to which the flexible circuit board is connected.

In addition, the object of the present invention as described above,

A multilayer ceramic substrate made by stacking a plurality of ceramic thin plates,

Each ceramic sheet is formed with a terminal for electrical connection,

Some of the ceramic thin plates form a device mounting portion in which a semiconductor device is to be installed in a state in which through holes are formed and stacked.

It is achieved by providing a multilayer ceramic substrate having passive elements on the side of the device seat.

Here, a terminal connected to the semiconductor element is formed on one surface of the direction in which the device seating portion is formed,

It is preferable that the other surface is formed with a terminal connected to the flexible circuit board.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a perspective view schematically showing the configuration of a camera module according to an embodiment of the present invention, Figure 4 is a cross-sectional view taken along the line IV-IV of Figure 3, Figure 5 shows the present invention A cross-sectional view of a multilayer ceramic substrate for a camera module is shown.

3 and 4, the camera module according to an embodiment of the present invention includes a housing 35, a lens assembly 39, an IR-filter 36, a printed circuit board, and an imaging device 32. do.

The passive element 37 is disposed on the printed circuit board. The printed circuit board is preferably made of a multilayer ceramic substrate 31, which can be provided with a passive element 37 while reducing its volume. The multilayer ceramic substrate 31 is formed by stacking a plurality of ceramic thin plates to form a substrate. Each of the ceramic thin plates may include a passive element, a ground plane, or an insulating layer. The passive element 37 may include a resistor, a capacitor, and the like.

The imaging device 32 converts an image of light passing through the lens 38 and the IR-filter 36 into an analog signal, and is a charge-coupled device (CCD) or a complementary metal. It may be a Complementary Metal Oxide Semiconductor (CMOS).

An analog-to-digital converter (ADC) circuit for converting an electrical signal, which is an analog signal converted by the imaging device 32, into a digital signal may be disposed on the multilayer ceramic substrate 31.

The printed circuit board 31 is coupled to a lower portion of the housing, and an imaging device 32 is disposed on an upper surface thereof. The printed circuit board 31 and the imaging device 32 are electrically connected by wires 34 as well illustrated in FIG. 4. Of course, in addition to wire bonding, electrical connection may be made by a method such as flip chip bonding.

In addition, the multilayer ceramic substrate 31 may be connected to a separate flexible printed circuit board (FPCB) 33 for connection with an external circuit or an external electronic component. The flexible circuit board 33 may be a tape carrier package (TCP) or a chip on film (COF).

The lens assembly 39 is coupled to the housing 35, and the lens assembly 39 includes one or more lenses 38, and an engagement portion between the lens assembly 39 and the housing 35 is It is combined so that foreign substances such as dust do not enter. At the rear of the lens 38, an IR-filter 36 is installed to block infrared light incident into the housing 35 and prevent reflection of light incident therein. To this end, an IR-cut coating may be formed on an upper surface of the IR filter 36, and an anti-reflection coating may be formed on the lower surface of the IR filter 36.

As shown in FIG. 5, the multilayer ceramic substrate 31 according to the present invention included in the camera module of FIGS. 3 and 4 is formed by stacking ceramic thin plates 311, 312, and 313. For example, connection terminals 314 connected to the imaging device 32 may be formed on one surface of the multilayer ceramic substrate 31. On the other side, a connection terminal 315 connected to the flexible circuit board 33 may be formed to be connected to an external circuit. Via holes are formed in the multilayer ceramic substrate 31, and connection terminals 316 penetrating the inside thereof are disposed to connect or connect the various connection terminals 314, 315, and 316 as necessary. It is possible to connect the connection terminals 318 connected to the passive element installed on the multilayer ceramic substrate 31. In addition to the connection between the terminals described here as an example, various three-dimensional circuit configurations are possible as necessary.

On the other hand, in the multilayer ceramic substrate 31, a passive element is an element in which the imaging element 32 is disposed on the multilayer ceramic substrate 31 in order to reduce the overall thickness in the thickness direction (the optical axis direction of the lens) of the ceramic thin plate. It may be disposed in the lateral direction of the seating portion 317.

In the drawings and the detailed description of the present invention, only the case where the image pickup device is disposed on the multilayer ceramic substrate is illustrated and described. However, when the multilayer ceramic substrate is used independently, including the case where the multilayer ceramic substrate is included in the camera module. In the device disposed on the element seating portion 317 of the multilayer ceramic substrate, various semiconductor devices may be disposed and used without being limited to the imaging device.

Hereinafter will be described a manufacturing method of a camera module according to the present invention.

6 to 14 are diagrams sequentially showing an example of a process of manufacturing a multilayer ceramic substrate for a camera module and a camera module according to the present invention.

First, as illustrated in FIG. 6, a plurality of ceramic thin plates 311, 312, and 313 are stacked to fabricate a multilayer ceramic substrate as illustrated in FIG. 7. Some of the laminated ceramic thin plates 311 and 312 are pre-designed to include through-holes 311b and 312b for imaging devices to be disposed later, protrusions 311a for passive devices to be installed later, and the like. In the state, the element seating portion 317 on which the imaging element is to be disposed or the protrusion 311a on which the passive element is to be seated are exposed to the outside.

Next, as shown in FIG. 8, an electrical connection 316 is formed through the via holes between the ceramic thin plates, and terminals 314, 315, and 318 necessary for connection to the outside are formed. The electrical connection terminal formed in the electrical connection configuration process includes a terminal 314 to be connected to the imaging device, a terminal 315 to be connected to the flexible circuit board, a terminal 318 to be connected to the passive element, and the necessary electrical connection between each terminal. Connections 316 through via-holes that enable the connection, and the like.

Next, as shown in FIG. 9, the passive element 37 is connected to the protrusion 311a protruding in the lateral direction of the element mounting portion 317 where the imaging element is to be disposed, and formed on the protrusion 311a. The connection terminal 318 and the passive element are electrically connected. Through this process, the multilayer ceramic substrate 31 according to the present invention is completed. Next, as illustrated in FIG. 10, the imaging device 32 is disposed on the device seating part 317. 9 and 10 are set to explain the manufacturing process of the multilayer ceramic substrate 31 according to the present invention, and may be different in the process of actually completing the final camera module 30. have.

Next, as shown in FIG. 11, the image pickup device 32 is connected to the connection terminal 314 on the multilayer ceramic substrate 31 by wire bonding 34. Unlike the illustrated example, when flip chip bonding is adopted as a connection method other than wire bonding, a process of forming bumps (not shown) in advance is added, and the imaging device 32 is mounted on the multilayer ceramic substrate 31. In this process, the electrical connection between the imaging device 32 and the multilayer ceramic substrate 31 is completed, and a process of covering a molding material (not shown) may be further added to protect the connection portion.

Then, as shown in FIG. 12, the housing 35 including the IR filter 36 and the multilayer ceramic substrate 31 including the imaging element 32 and the passive element 37 are combined. As shown in FIG. 13, the lens assembly 39 is coupled to the housing 35.

Next, as shown in FIG. 14, the camera module 30 is completed by connecting the multilayer ceramic substrate 31 and the flexible circuit board 33.

As described above, according to the present invention, the size of the camera module can be further reduced by providing a camera module having a multilayer ceramic substrate. In particular, when the passive element is disposed or formed in the lateral direction of the portion where the image pickup element is disposed in the multilayer ceramic substrate, the thickness of the substrate can be kept thinner, contributing to the miniaturization of the camera module. In addition, it is possible to manufacture a camera built-in device further reduced in size in accordance with the trend of miniaturization and thinning of the device on which the camera module is mounted.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (5)

A housing including a lens for receiving an external image and an IR filter for blocking infrared rays of light passing through the lens; A printed circuit board coupled to the housing and having a passive element; And An imaging device installed on the printed circuit board to receive an image and convert the image into an electrical signal; The lens, the IR-filter and the imaging element are arranged in a direction opposite to the subject, The passive element is a camera module disposed on the printed circuit board in the lateral direction of the image pickup device. The method of claim 1, The printed circuit board is a camera module, characterized in that the multilayer ceramic substrate. The method of claim 2, The multilayer ceramic substrate has an external terminal to which the flexible circuit board is connected. A multilayer ceramic substrate made by stacking a plurality of ceramic thin plates, Each ceramic sheet is formed with a terminal for electrical connection, Some of the ceramic thin plates form a device mounting portion in which a semiconductor device is to be installed in a state in which through holes are formed and stacked. The multilayer ceramic substrate having a passive element on the side of the device mounting portion. The method of claim 4, wherein A terminal connected to the semiconductor element is formed on one surface of the device mounting portion in the direction formed The other side of the multilayer ceramic substrate, characterized in that the terminal is connected to the flexible circuit board is formed.

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