KR101070909B1 - Camera module - Google Patents

Abstract

An object of the present invention is to provide a camera module capable of integrating a terminal connecting an AF module and an external main board and a terminal connecting an image sensor module and an external board. The invention comprises: an image sensing element; An image sensor module including a device coupling part coupled to the image sensing device and a first signal transmission part extending from the device coupling part to protrude from the image sensing device and having an external coupling part coupled to an external substrate; An AF module having an AF element and a second signal transmission part connected to the AF element to move a power supply and a signal to an external substrate; A lens module having a plurality of lenses for condensing light with an image sensing device; And a fastening means for fastening the first signal transmission portion and the second signal transmission portion to electrically connect them.

Description

 Camera module {Camera module}

1 is an exploded perspective view of a camera module having a conventional AF module and an image sensing module,

2 is a cross-sectional view of the camera module of FIG.

3 is a cross-sectional view showing a camera module according to an embodiment of the present invention;

4 is a plan view illustrating part A of FIG. 3;

5 is a cross-sectional view taken along the line VV of FIG. 4,

6A to 6C are cross-sectional views illustrating a manufacturing process of the camera module of FIG. 3.

Explanation of symbols on the main parts of the drawings

100: camera module 120: image sensor module

121: image sensing element 124: first signal transmission unit

123 and 133: coupling holes 124b and 134b: circuit pattern

125: device coupling portion 126: external coupling portion

129: first pattern exposure unit 130: AF module

131: AF housing 134: second signal transmission unit

139: second pattern exposed portion 140: fastening means

154: conductive adhesive

The present invention relates to a camera module, and more particularly, to a camera module having an AF module for automatically focusing an object and an image sensing module connected to an external substrate and functioning to photograph an object.

Recently, devices such as mobile phones, PDAs, notebook PCs, bumper-mounted car rearview cameras, doors, and the like, are equipped with camera modules capable of performing imaging operations. The camera module included in such a device is of a very small size suitable for a portable device to be miniaturized, and therefore it is advantageous to reduce the overall size as much as possible.

Typically, a camera module provided in a small portable device includes an image sensor module and a lens housing provided on one side of the image sensor module. The image sensor module includes an image pickup device, a circuit board electrically connected to the image pickup device, and a flexible printed circuit board (FPCB) for sending the imaged signal to an external circuit. One or more lenses may be installed in the lens housing, and the same may further include an IR filter.

On the other hand, many imaging apparatuses, such as a digital camera, which have a lens group which moves along an optical axis and adjusts a focal point, have many auto focusing functions, and the user has a high demand for an auto focusing function. Therefore, in recent years, the camera module is responsible for the auto focusing function.

However, in order to add an auto focusing function to an existing camera module, an additional AF module is required, and such an AF module should be connected to an external main board. Therefore, each image sensor module and the AF module need to be composed of respective power and signal terminals, thus requiring separate connection terminals.

In other words, assuming that the camera module is mounted on the mobile phone, the main board of the mobile phone should supply signals and power to both the AF module and the image sensor module, which causes the overall structure of the camera module to be complicated. have.

In addition, since the camera module and the AF module have their respective power terminals, signal loss due to noise may occur.

The present invention is to solve the various problems including the above problems, the camera module which can integrate the terminal connecting the AF module and the external substrate and the terminal connecting the image sensor module and the external motherboard. It aims to provide.

Another object of the present invention is to provide a camera module having a structure in which the overall size is reduced.

In order to achieve the above object, the present inventors the camera module:

Image sensing elements;                     

A first signal transmission part including an element coupling part coupled to the image sensing element and an external coupling part extending from the element coupling part to protrude from the image sensing element and coupled to an external substrate;

An AF module having an AF element and a second signal transfer part connected to the AF element to move power and a signal to the external substrate;

A lens module having a plurality of lenses for condensing light with the image sensing device; And

And a fastening means for fastening the first signal transmission portion and the second signal transmission portion and electrically connecting them.

In this case, it is preferable that the first signal transmission unit and the second signal transmission unit are flexible circuit boards.

The first signal transmission unit may include an extension coupling part including a first pattern exposing part extending from the device coupling part to protrude outwardly of the image sensing device and exposing a part of a circuit pattern to the outside, A second pattern exposing portion having a circuit pattern portion exposed to the outside at a portion corresponding to the first pattern exposing portion of the signal transmission portion, wherein the fastening means includes a circuit pattern of the first pattern exposing portion and a circuit of the second pattern exposing portion It is preferable to fasten the patterns so that they contact each other.

In this case, coupling holes are formed in the first signal transmission unit and the second signal transmission unit, respectively, and the coupling means is coupled to pass through the respective coupling holes to couple the first signal transmission unit and the second signal transmission unit. It is preferably a mechanical element.                     

Here, the AF module includes a condenser lens for condensing light to the AF element, and an AF housing incorporating the AF element and the condenser lens, and a boss coupled to the fastening means passing through the coupling holes on the AF housing. Is preferably formed.

In addition, it is preferable that conductive adhesives are formed on the first pattern exposed portion and the second pattern exposed portion to be bonded to each other to electrically connect them.

On the other hand, the AF module is preferably stacked on top of the image sensor module.

Hereinafter, with reference to the embodiments of the present invention shown in the accompanying drawings will be described in more detail.

An exploded perspective view of a conventional camera module 10 is shown in FIG. 1, and a cross-sectional view of this camera module 10 is shown in FIG. 2. 1 and 2, the conventional camera module 10 includes an image sensor module 20, an AF module 30, and a lens module 40.

The image sensor module 20 includes a first signal transmission unit 24 having a circuit pattern formed therein, and an image sensing element 21 in which an image of an external image is captured and electrically connected to the circuit board.

The image sensing element 21 is formed with an imaging area for detecting light energy incident from the outside and converting the light energy into an electrical signal. That is, the image sensing device is an imaging device such as a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS).

The first signal transmission unit 24 may be a conventional printed circuit board (PCB), and according to an application to which the image sensor module 20 is applied, TCP (Tape Carrier Package) or COF (Chip On) Flexible Printed Circuit Boards (FPCBs), such as films, are used, and the first signal transfer unit 24 converts electrical signals, which are analog signals converted in the imaging area, into digital signals. Digital Converter) circuit can be arranged. In this case, one end of the first signal transmission unit 24 is coupled to the image sensing element 21, and the other end of the first signal transmission unit is formed with a connector 27 is coupled to the external substrate.

Meanwhile, although not shown in the drawing, the AF module 30 may detect an AF element including at least one photometric sensor, a condenser lens for focusing light on the photometric sensor, and a position for focusing. Position detecting means is provided. The AF element, the condenser lens, and the position detecting means are housed in the AF housing 31.

In addition, the AF module 30 includes a second signal transfer unit 34 coupled to the AF element to move a power supply and a signal between the external substrate and the AF element.

In this case, the second signal transmission unit 34 may use a conventional printed circuit board (PCB), and according to an application to which an image sensor module is applied, TCP (Tape Carrier Package) or COF (Chip On). Flexible Printed Circuit Boards (FPCBs) such as films are used. In this case, one end of the second signal transmission unit 34 is coupled to the AF element, and the other end of the second signal transmission unit 34 is coupled to the external substrate 37.

In the case where the first and second signal transmission parts 24 and 34 are flexible circuit boards, usually, a base layer such as polyimide or polyester, and a circuit pattern patterned on the surface of the base layer And an insulator layer formed on the circuit pattern.

The lens module 40 has a lens housing 41 and one or more lenses 42. In addition, the lens module 40 may further include a filter (not shown). The filter blocks a infrared ray incident into the lens housing and prevents light incident therein from being reflected. One side of the image sensing device is installed at the bottom of the hollow portion of the lens housing. An IR-cut coating is formed on an upper surface of the filter, and an anti-reflection coating for antireflection is formed on a lower surface of the filter.

In this case, the first signal transmission unit 24 provided in the image sensor module 20 and the second signal transmission unit 34 provided in the AF module 30 may be connected to an external substrate. 37). Therefore, the external substrate must separately supply signals and power to the connector 37 of the AF module 30 and the connector 27 of the image sensor module 20. As a result, the size of the camera module 10 is increased, and signal loss due to noise occurs.

Accordingly, the present invention, as shown in Figure 3, has a fastening means 140 for fastening and electrically connecting the first signal transmission unit 124 and the second signal transmission unit 134, to the external substrate Integrate the connected connectors into one.

That is, the camera module 100 according to the present invention includes an image sensing element 121, a first signal transmission unit 124, an AF module 130, and a lens module 40 (see FIG. 1). In this case, the image sensing device 121, which is a conventional imaging device, and the first signal transmission unit 124 may be combined to form the image sensor module 120.

 In this case, the first signal transfer unit 124 is formed with an element coupling unit 125 bonded to the image sensing element 121 and a connector 127 having one end coupled to an external substrate, and the image sensing element ( 121, an outer coupling part 126 extending from the element coupling part 125 is formed to protrude outward. Therefore, unlike the prior art, the second signal transmission unit 134 is not directly connected to the external substrate, but is coupled to the first signal transmission unit 124 and then coupled to the external coupling unit of the first signal transmission unit 124 ( 126 is electrically connected to the external substrate.

This eliminates the need for the external substrate to separately supply signals and power according to the AF module 130 and the image sensor module 120, thereby reducing signal loss due to noise.

Meanwhile, the first signal transmission unit 124 includes a first pattern exposure unit 129 in one side recess, and the second signal transmission unit 134 also contacts the first signal transmission unit and one side. The second pattern exposing portion 139 may be provided on one side recess. The first and second pattern exposing units 129 and 139 expose the circuit patterns 124b and 134b from the first and second signal transmitting units 124 and 134.

The first pattern exposed part 129 is formed in the extension coupling part 128, and the extension coupling part 128 is formed to extend from the device coupling part 125 so as to protrude to the outside of the image sensing device 121. In this case, the extension coupling part 128 may protrude from the image sensing element 121 in a direction opposite to the external coupling part 126. In addition, the second signal transmitting unit 134 may include a second pattern exposing unit 139 in which a portion of the circuit pattern 134b is exposed to the outside, and the fastening unit 140 may include the first pattern exposing unit 129. ) And the circuit pattern 134b of the second pattern exposed portion 139 overlap with each other and are in surface contact with each other. As a result, the first signal transmission unit 124 and the second signal transmission unit 134 may be electrically connected to each other.

Coupling holes 123 and 133 are formed in the first signal transmission unit 124 and the second signal transmission unit 134, respectively, and the fastening means 140 passes through the respective coupling holes 123 and 133. It may be a coupling mechanical element for coupling the first signal transmission unit 124 and the second signal transmission unit 134. Such fastening machine elements include screws, bolts, keys, coaters, pin joints, and the like.

That is, the second signal transmission unit 134 of the AF module 130 extends upwardly while surrounding one side of the AF housing 131 for accommodating the AF element or the like. Above the AF housing 131, the image sensor module 120 is stacked so as not to cause interference with the second signal transmission unit 134, and the extension coupling part 128 may be connected to the second signal transmission unit 134. It is arranged to contact with. In this case, in the position where the first and second signal transmission units 124 and 134 are in contact with each other, the extension coupling unit 128 is disposed above and the second signal transmission unit 134 is disposed below. In addition, coupling holes 123 and 133 are formed in an end of the extension coupling part 128 and the second signal transmission part 134 corresponding to the extension coupling part end, and the coupling holes 123 and 133 are fastened. As the 140 passes, the first signal transmission unit 124 and the second signal transmission unit 134 may be fastened.

In this case, a passive element 143 may be installed in the second signal transfer unit 134. In this case, when the extension coupling part 128 and the second signal transmission part 134 are fastened, it is necessary to prevent the passive element 143 from being damaged by the fastening means 140. Therefore, the passive element 143 is connected to the lower side of the second signal transmission unit 134, that is, close to the AF housing 131 so as not to be exposed to the outside, and the first signal transmission unit 124 is connected to the second signal transmission unit 124. It is preferable that the upper side of the signal transmission unit 134, that is, connected to be far from the AF housing 131, does not cause interference with the passive element 143.

As an example of such a coupling structure, as illustrated in FIGS. 4 and 5, a boss portion 132 is formed in a portion corresponding to the coupling holes 123 and 133 of the AF housing 131. A screw is disposed in the fastening means 140 so that the screw passes through the coupling holes 123 and 133 of the extension coupling part 128 and the second signal transmission part 134 into the boss part 132. Inserts can be combined. In this case, the bush 144 may be disposed between the upper side of the connection coupling portion 128 and the screw.

Meanwhile, conductive adhesives 154 such as a conductive paste or a conductive film are disposed on the first pattern exposing portion 129 and the second pattern exposing portion 139, respectively. The signal transmitter 124 and the second signal transmitter 134 may be electrically connected to each other. That is, when the first and second signal transmission units 124 and 134 are flexible circuit boards, the base layers 124a and 134a, such as polyimide and polyester, and the base layer Circuit patterns 124b and 134b patterned on surfaces and insulator layers 124c and 134c formed on the circuit patterns. In order to expose the circuit patterns 124b and 134b to the outside, an insulator formed on the circuit patterns is provided. Layers 124c and 134c should be removed. As a result, lifting occurs between the circuit patterns 124b and 134b of the first and second signal transmission units 124 and 134. In order to prevent this, a conductive paste or a conductive material is formed on the circuit patterns 124b and 134b. It is preferable to arrange conductive adhesives 154 such as a film. The conductive adhesive 154 may be an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP).

 In order to manufacture the camera module 100 having such a structure, as shown in FIG. 6A, a first signal transfer unit is disposed on one side of the image sensing element 121 and electrically connected to the image sensor module 120. 124 is placed. In this case, the first signal transfer unit 124 may include an element coupling unit 125 that is coupled to the image sensing element 121, and an external coupling unit 126 protruding from the image sensing element so as to be connected to an external substrate. The extension coupling part 128 protrudes from the image sensing element 121 in the opposite direction to the external coupling part 126. In addition, the circuit pattern 124b is exposed to the outside at a portion in contact with the second signal transmission unit 134 below the end of the extension coupling portion 128. A conductive adhesive 154 such as a conductive film or a conductive paste may be formed on the circuit pattern 124b exposed to the outside.

In addition, as shown in FIG. 6B, the AF module 130 is manufactured. In this case, the AF module 130 is provided with a second signal transmission part 134 disposed upwardly so as to wrap in an end direction corresponding to the extension coupling part of the AF housing 131. The passive element 135 may be disposed at the lower end of the second signal transmission unit 134. In this case, the circuit pattern 134b positioned at a portion of the upper side of the second signal transmission unit 134 corresponding to the extension coupling unit 128 is exposed to the outside. A conductive adhesive 154 such as a conductive film or a conductive paste may be formed on the circuit pattern 134b exposed to the outside.

Thereafter, as shown in FIG. 6C, the image sensor module 120 and the AF module 130 are combined. In this case, the circuit pattern 124b exposed to the outside by the first signal transfer unit 124 of the image sensor module 120 and the outside of the second signal transfer unit 134 of the AF module 134 are exposed to the outside. In order for the circuit pattern 134b to be in contact with each other, the extension coupling part 128 is disposed on the upper side, and the second signal transmission part 134 is disposed to cross each other on the lower side, and is fastened by the fastening means 140. The extension coupling part 128 and the second signal transmission part 134 are electrically connected to each other to be fastened.

According to the present invention having the structure as described above, in the camera module having an AF module and an image sensor module, a terminal coupled to an external substrate is integrated into one. As a result, the signal and power applied to the AF module and the image sensor module are processed using one signal transmitter, thereby reducing the cost and reducing the loss of the signal due to noise.

In addition, the AF module is stacked on the upper side of the image sensor module, the size of the camera module is reduced, the module shape is simplified.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and any person skilled in the art to which the present invention pertains may have various modifications and equivalent other embodiments. Will understand. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (8)

Image sensing elements; A first signal transmission part including an element coupling part coupled to the image sensing element and an external coupling part extending from the element coupling part to protrude from the image sensing element and coupled to an external substrate; An AF module having an AF element and a second signal transfer part connected to the AF element to move power and a signal to the external substrate; A lens module having a plurality of lenses for condensing light with the image sensing device; And And a fastening means for fastening the first signal transmission portion and the second signal transmission portion to electrically connect them. The method of claim 1, And the first signal transmission unit and the second signal transmission unit are flexible circuit boards. The method of claim 1, The first signal transmission unit includes an extension coupling part including a first pattern exposure part extending from the device coupling part so that a portion of the circuit pattern is exposed and protrudes out of the image sensing device. A second pattern exposure part having a portion of a circuit pattern exposed at a portion corresponding to the first pattern exposure part of the second signal transmission part; The fastening means is a camera module, characterized in that the circuit pattern of the circuit pattern of the first pattern exposed portion and the circuit pattern of the second pattern exposed portion is fastened in surface contact with each other. The method of claim 3, wherein A coupling hole is formed in each of the first signal transmission part and the second signal transmission part, and the fastening means passes through the respective coupling holes to couple the first signal transmission part and the second signal transmission part. Camera module, characterized in that. The method of claim 4, wherein The AF module includes a condenser lens for condensing light with the AF element, and an AF housing incorporating the AF element and the condenser lens. And a boss coupled to the fastening means passing through the coupling holes on the AF housing. The method of claim 5, And the first pattern exposed part is located farther from the AF housing than the second pattern exposed part. The method of claim 4, wherein The camera module, characterized in that the conductive adhesive is formed on the first pattern exposed portion and the second pattern exposed portion are bonded to each other to electrically connect them. The method of claim 1, The AF module is a camera module, characterized in that stacked on the image sensor module.

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