JP3812587B2 - Imaging device - Google Patents

Description

  The present invention relates to an imaging device used in a mobile phone, a portable information terminal, other electronic devices such as a personal computer, a video camera, or a scanner.

  With recent progress in communication technology, imaging devices are widely used for portable information terminals of mobile phones. This imaging apparatus is required to be further miniaturized, and various technical developments have been made regarding the miniaturization.

  For example, in JP-A-11-191864, a CCD chip is arranged on one surface of a substrate provided with conductive printed wiring, and an opening is formed at the position of the substrate facing the effective pixel area of the CCD chip. A solid-state imaging device is described in which an imaging surface of a CCD chip is arranged so as to face an opening provided in a substrate. The publication also describes that the distance between the imaging lens and the CCD chip can be made closer by expanding the opening of the substrate toward the imaging lens.

Japanese Patent Laid-Open No. 11-191864 (first page-second page, FIG. 1-FIG. 2)

  In the conventional imaging device, the distance between the imaging lens and the CCD chip can be reduced, and the size reduction in the direction of the distance can be achieved. However, in the conventional imaging device, when a positional deviation of the CCD chip with respect to the imaging lens occurs, the effective image circle of the imaging lens deviates from the effective pixel area of the CCD chip, and the position where the image height is high, that is, the outermost part. In this case, the image is not formed on the effective pixel area of the CCD chip, and a good image cannot be obtained. In particular, when a sheet-like substrate such as an FPC is used, it is very difficult to ensure the desired positioning accuracy because the substrate itself is thin and soft.

  Therefore, the present invention has been made to solve such a problem, and it is possible to ensure the positional accuracy of the imaging element with respect to the imaging lens by simply attaching the frame surrounding the imaging element to the leg of the imaging lens. An object of the present invention is to provide a novel imaging device that can obtain a small image and can improve the structural strength of a support member having a lens barrel portion that is downsized.

  An image pickup apparatus according to the present invention includes a substrate having a through hole, an image pickup device having an image pickup surface fixed to the substrate and exposed in the hole portion, a frame surrounding the peripheral portion of the image pickup device, and the image pickup surface. An imaging lens to be imaged, a lens barrel portion that supports the imaging lens, and a support member having a leg portion in which an opening for inserting the frame body from the side opposite to the imaging lens is formed continuously from the lens barrel portion; A mounting portion for mounting the projecting portion of the frame body inserted in the opening and a rib extending from the support member in a direction opposite to the leg portion and facing the lens barrel portion. .

  As described above, according to the present invention, the structural strength of the support member having the leg portion formed with the opening for inserting the frame body from the side opposite to the imaging lens is continuous with the lens barrel portion supporting the imaging lens. Can be improved.

Embodiment 1 FIG.
Embodiment 1 of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view showing an imaging apparatus according to the first embodiment. 2A to 2C are process diagrams showing processes for configuring the imaging apparatus according to the first embodiment. FIG. 3 is a perspective view in which an AA line is added to the perspective view similar to FIG. 4 is a cross-sectional view taken along line AA when cut along line AA shown in FIG.

  1 to 4, reference numeral 1 denotes an image pickup device such as a CCD chip. Reference numeral 2 denotes an imaging surface of the imaging device 1. Reference numeral 3 denotes a film-like substrate (hereinafter simply referred to as “substrate”) made of FPC or the like, and a through hole 4 for exposing the imaging surface 2 is formed near one end thereof. A wiring pattern (not shown) is formed on one side or both sides of the substrate 3. As shown in FIG. 2B, the imaging element 1 is fixed to the back side of the substrate so that the imaging surface 2 is exposed above the film-like substrate 3 corresponding to the through hole 4. Reference numeral 5 denotes a frame surrounding the image pickup device 1 and is fixed to the image pickup device 1 so as to surround the periphery of the side surface of the image pickup device 1 as shown in FIG.

  Reference numerals 6 and 6 denote protrusions integrally formed with the frame body 5. The protrusions 6 and 6 are provided on the side in the width direction of the substrate 3 and protrude in the direction orthogonal to the extending direction of the substrate 3 indicated by the arrow in FIG. An imaging lens 7 forms an image on the imaging surface 2 through the through hole 4 of the substrate 3. Reference numeral 8 denotes a lens barrel portion that holds the imaging lens 7, 9 denotes a leg portion, and 10 denotes a support portion that connects the lens barrel portion 8 and the leg portion 9. The lens barrel 8, the legs 9 and the support 10 constitute a support member 11. As shown in FIG. 2C, the leg portion 9 is formed with recesses 13 and 13 into which the protruding portions 6 and 6 are fitted and mounted. FIG. 4 shows a state in which the protruding portions 6 and 6 of the frame 5 are mounted in the recesses 13 and 13 of the leg portion 9. As shown in FIG. 4, the opening portion 12 is formed by the leg portion 9 and the support portion 10, and the imaging element 1 and the substrate 3 integrated with the frame body 5 are inserted into the opening portion 12.

  Note that the frame body 5 and the support member 11 can be molded with high dimensional accuracy by injection molding of ABS resin or the like. By adopting such a molded product, the projections 6 and 6 of the frame 5, the recesses 13 and 13 of the leg 9, and the focal length adjusting means including the lens barrel 8 and the support 10 as described later are easy. Can be formed. Thus, the imaging lens 7 and the imaging element 1 that are easily held in the lens barrel 8 by mounting the protrusions 6 and 6 of the frame 5 and the recesses 13 and 13 of the leg 9 formed with high dimensional accuracy. The image by the imaging lens 7 is accurately formed on the imaging surface 2 of the imaging device 1.

  Further, as shown in FIG. 4, a screw groove is formed inside the lens barrel portion 8, and a screw groove that is screwed into the screw groove is formed in the indicating portion 10 (hereinafter referred to as screwing means 14a). . Furthermore, a guide part 14b is formed in the lens barrel part 8 in a double structure inside the screwing means 14a. The lens barrel portion 8 is configured to be able to adjust the focal length in the height direction with respect to the imaging surface 2 of the imaging lens 7 by the screwing means 14a, and the guide portion 14b and the support portion 10 are attached and fitted together. Accordingly, the relative position between the center of the optical axis of the imaging lens 7 and the imaging surface 2 is configured to be within a predetermined tolerance. Note that a hole 15 for allowing light imaged by the imaging lens 7 to pass therethrough is formed at a position on the imaging surface 2 of the support portion 10. Further, when the protrusions 6 and 6 of the frame body 5 and the recesses 13 and 13 of the leg 9 are held by fitting and mounting, a strict dimension crossing is required. The protrusions 6 and 6 of the frame 5 and the recesses 13 and 13 of the leg 9 may be fixed by fixing means 16 such as an agent. Here, “mounting” is a broad concept including both of these.

Embodiment 2. FIG.
Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a perspective view showing an imaging apparatus according to the second embodiment. FIG. 6 is an exploded perspective view of the imaging apparatus according to the second embodiment. FIG. 7 is a perspective view in which a line BB is added to the perspective view similar to FIG. 8 is a cross-sectional view taken along the line BB when cut along the line BB shown in FIG.

  5 to 8, reference numeral 17 denotes a recess provided in the leg portion 9 a in the extending direction of the substrate 3. The width of the recess 17 corresponds to the width of the substrate 3 drawn out from the opening 12. As shown in FIG. 8, the substrate 3 is drawn out from the opening 12 formed by the legs 9 and 9 a through the recess 17. At this time, unlike the case shown in FIG. 4, the substrate 3 can be taken out without being bent. In these drawings, the same reference numerals as those shown in FIG. 1 to FIG.

Embodiment 3 FIG.
Next, a third embodiment of the present invention will be described with reference to FIGS. FIG. 9 is a perspective view showing an example of the imaging apparatus according to the third embodiment. FIG. 10 is an exploded perspective view showing another example of the imaging apparatus according to the third embodiment. In FIG. 9, 18 is a fixing means such as an adhesive for fixing the leg portion 9a and the substrate 3 drawn to the outside in the concave portion 17 of the leg portion 9a. The substrate 3 and the leg portion 9a are fixed by the fixing means 18. The fixing means 18 uses, for example, an ultraviolet curable resin. Next, in FIG. 10, 19 is a convex portion provided on the leg portion 9a and projecting downward. Reference numeral 20 denotes a hole provided in the substrate 3, in which the convex portion 19 is inserted and the substrate 3 integrated with the imaging element 1 and the frame 5 and the support member 11 are positioned approximately. Reference numeral 21 denotes a reinforcing member for the substrate 3 provided around the hole 20. When the substrate 3 is a soft base material such as a film-like substrate, the substrate is less likely to be cut by stress such as external force after the projection 19 is inserted. .

Embodiment 4 FIG.
Next, a fourth embodiment of the present invention will be described with reference to FIGS. In the imaging device according to the second embodiment, the leg portion 9 of the support member 11 is provided with the concave portion 13 that is the first cutout portion, and the leg portion 9a is provided with the concave portion 17 that is the second cutout portion. When the notches are provided in the leg portions 9 and 9a as described above, the structural strength of the support member 11 that forms the opening 12 by the leg portions 9 and 9a is lowered. The image pickup apparatus according to this embodiment improves the structural strength of a portion where the support member 11 is provided with a notch or the like.

  FIG. 11 is a perspective view showing an example of the imaging apparatus according to Embodiment 4. In FIG. FIG. 12 is a perspective view showing another example of the imaging apparatus according to the fourth embodiment. 11 and 12, reference numeral 22 denotes a rib extending upward from the leg portion 9 a continuously to the support portion 10, and reference numeral 23 denotes a rib extending continuously from the support portion 10 to above the leg portion 9. By providing these reinforcing ribs 22 and 23, the leg portions 9 and 9a are reinforced. In the drawings, the same reference numerals indicate the same or corresponding parts. The imaging device 1, the substrate 3, the frame, and the like have the same configuration as the imaging device according to the above embodiment, but the illustration of the frame 5, the substrate 3, and the like is omitted in the description of the imaging device according to this embodiment. .

Embodiment 5 FIG.
Next, a fifth embodiment of the present invention will be described with reference to FIGS. In the imaging device according to the third embodiment, the substrate 3 is fixed to the leg portion 9a by the fixing means such as the adhesive 18, but the imaging device itself is downsized, and such fixing is performed. Then, when a strong impact is applied from the outside, the fixed state may not be sufficiently maintained. In the present embodiment, the substrate 3 and the support member 11 are firmly fixed. 13 and 14 are configuration perspective views showing the imaging device before the support member 11 is mounted on the substrate 3. FIG. FIG. 15 shows a third embodiment in which a CC line is added. FIG. 16 is a cross-sectional view taken along the line C-C when cut along the line C-C shown in FIG. 5.

  13 to 16, reference numerals 24 and 25 respectively denote a through hole 4 of the substrate 3 and a sealing member provided around the image pickup surface 2 of the image pickup device 1 exposed in the through hole 4, and 24 denotes an adhesive function. The liquid sealing member 25, which is a film-like sealing member 25 having an adhesive function as in the case of 24, shows the sealing member 24 in the cross-sectional view of the imaging device shown in FIG. 16. In the drawings, the same reference numerals indicate the same or corresponding parts, and detailed description thereof will be omitted.

  In the imaging apparatus according to this embodiment, as shown in FIG. 13 or FIG. 14, a sealing member 24 or 25 is provided around the through hole 4 of the substrate 3, and the substrate 3 is supported via the sealing member 24 or 25. Since the member 11 is fixed, a wide fixing surface between the substrate 3 and the support member 11 can be secured, and the substrate 3 and the support member 11 can be firmly fixed. As shown in FIG. 16, the substrate 3 accommodated in the opening 12 of the support member 11 is fixed to the support member 11 by the sealing member 24, and is used in a state in which an impact is applied from the outside due to dropping or the like. Even if it is done, peeling from the support member 11 of the board | substrate 3 etc. can be suppressed, the position shift of the image pick-up element 1 positioned in the focus position of the imaging lens 7 can be prevented, and desired reading accuracy can be maintained. A high-quality imaging device can be obtained.

  FIG. 17 is a cross-sectional configuration diagram showing a state in which the opening 12 of the imaging device according to this embodiment is sealed with a sealing member. As shown in FIG. 17, by sealing the opening 12 into which the imaging element 1, the frame 5 and the substrate 3 are inserted with a sealing member 26, the reliability against moisture absorption and the like is improved, and the opening 12 side Therefore, the back surface of the image sensor 1 can be prevented from being exposed in a bare state, so that the destruction of the image sensor due to external force or the like can be prevented.

Embodiment 6 FIG.
Next, Embodiment 6 will be described with reference to FIGS. In the image pickup apparatus according to this embodiment, the substrate 3 provided with the image pickup element 1 and the peripheral circuit element 27 is bent so that the image pickup element 1 and the peripheral circuit element are vertically overlapped. It is intended to fit within the opening 12 of the support member 11. The peripheral circuit element 27 is, for example, an image signal processing IC for optimizing the imaging state based on a signal output from the imaging element 1.

  FIG. 18 is a structural sectional view showing an imaging apparatus according to this embodiment. FIG. 19 is a structural cross-sectional view showing a state where the opening 12 of the imaging device shown in FIG. 18 is sealed with a sealing member. In FIGS. 18 and 19, 27 is a peripheral circuit element that overlaps the imaging element 1 in the vertical direction, and 28 is bent in the opening 12 of the support member 11 so that the imaging element 1 and the peripheral circuit element 27 overlap in the vertical direction. A film-like circuit board (hereinafter simply referred to as a board) 29 is a sealing member that seals the opening 12 of the support member 11 that houses the imaging element 1, the peripheral circuit element 27, and the board 28. In the drawings, the same reference numerals indicate the same or corresponding parts.

  As shown in FIGS. 18 and 19, according to the imaging apparatus according to this embodiment, the substrate 28 is bent to accommodate the imaging element 1 and the peripheral circuit element 27 in the opening 12 of the support member 11. A part, for example, a region on the substrate 28 drawn to the outside from the opening 12 of the support member 11, or separately from the imaging device, needs to be disposed on the main body side substrate of the device on which the imaging device is mounted. Accordingly, the configuration as the imaging device can be reduced in size and simplified. Further, since the opening 12 of the support member 11 that accommodates the imaging element 1, the peripheral circuit element 27, and the substrate 28 is sealed by the sealing member 29, the reliability with respect to moisture absorption and the like is improved, and the imaging element by external force or the like, In addition, destruction of peripheral circuit elements can be prevented.

Embodiment 7 FIG.
Next, Embodiment 7 will be described with reference to FIGS. In the imaging device according to the above-described embodiment, the protrusion 6 integrally formed on the frame 6 and the recess 13 of the leg 9 to which the protrusion 6 is fitted and mounted are respectively provided on the opposite sides of the frame 6 or the leg 9. Although the image pickup apparatus according to the present embodiment is provided one by one, the projecting portion of the frame body 6 that positions the image pickup element 1 and the image pickup lens 7 and the concave portion of the leg portion 9 are provided in the frame body 6. Alternatively, a plurality of legs 9 are provided on opposite sides, and each of them is reduced in size. FIG. 20 is a perspective view showing an imaging apparatus according to this embodiment, and FIG. 21 is an exploded perspective view showing the imaging apparatus according to this embodiment. In the present embodiment, a description will be given of a case where two protrusions of the frame 6 and two recesses of the leg 9 are provided on opposite sides.

  20 and 21, reference numerals 30 and 31 denote projecting portions formed integrally with the frame body 6, and reference numerals 32 and 33 denote concave portions of the leg portion 9 into which the projecting portions 30 and 31 are fitted and mounted, respectively. The imaging element 1 and the substrate 3 surrounding the frame 6 by fitting and mounting of the protrusions 30 and 31 and the recesses 32 and 33 are inserted into the opening 12 of the support member 11, and the imaging surface 2 of the imaging element 1. And the imaging position of the imaging lens 7 supported by the lens barrel 8 are achieved. 20 and 21, the leg portion 9 of the support member 11 is provided with the recess 17 having the width of the substrate 3, but the imaging device does not have the recess 17 as shown in FIG. 1. Can also be applied.

  In the imaging apparatus according to the present embodiment, the frame 6 and the support member 11 including the lens barrel portion 8, the leg portion 9, and the support portion 10 are fitted and attached to the plurality of protrusions 30 and 31 and the recesses 32 and 33. Since the portion to be connected is made smaller by making a plurality of portions, it is possible to alleviate and disperse the decrease in the structural strength of the portion by providing the support member 11 with a notch.

  Next, a method for manufacturing the imaging device according to this embodiment will be briefly described. FIG. 22A and FIG. 22B are process diagrams showing processes for configuring the imaging apparatus according to this embodiment. 22A and 22B, reference numeral 34 denotes a lead frame in which a plurality of frame bodies 6 are integrally formed. The lead frame 34 is connected to the frame body 5 via the projecting portions 30 and 31 of the frame body 5. It is integrally formed. As described above, the frame body 5 and the support member 11 are so-called molded products that are molded using a mold or the like. By forming the lead frame 34 as such a molded product, FIG. A lead frame 34 having such a plurality of frames 5 can be formed. In this embodiment, such a lead frame 37 is conveyed to manufacture the imaging device. In the drawings, the same reference numerals indicate the same or corresponding parts.

  As shown in FIG. 22B, in this embodiment, first, the substrate 3 on which the imaging device 1 is fixed is provided on each frame 5 of the conveyed lead frame 34, and the periphery of each imaging device 1 is provided. Is surrounded by a frame 5. In addition, the space | interval which provided the board | substrate 3 provided in the frame 5 between the each frame 5 and the board | substrate 3 and the frame 5 which were provided adjacently is provided. Next, each support member 11 having the imaging lens 7 is provided from above the substrate 3, and the recesses 32 and 33 provided in the leg portion 9 of the support member 11 are fitted and attached to the projecting portions 30 and 31 of the frame body 5. Let In addition, fixing means such as an adhesive is provided on the mounting portions of the protrusions 30 and 31 and the recesses 32 and 33 as needed, and the frame body 5 and the support member 11 are firmly fixed. Thereafter, the connection between the frame body 5 and the lead frame 34 is disconnected at the connection portion between the lead frame 34 and the projecting portions 30 and 31, thereby obtaining an imaging device.

  As described above, according to the manufacturing method according to this embodiment, the frame body 5 and the lead frame 34 connected to each other as shown in FIG. 5 and the distance between the frame bodies 5 can be formed with high dimensional accuracy, whereby the position of each frame body 5 can be easily determined, and the assembly of a plurality of imaging devices can be performed easily and quickly. It can be carried out. In addition, since the alignment between the frame 5 and the substrate 3 provided with the image pickup device 1 is facilitated, further automation of assembly by a machine can be easily realized. In the process diagram of the imaging apparatus shown in FIG. 22, two protrusions 30 and 31 and recesses 32 and 33 are provided on one side of the frame 5 and the leg 9, respectively, but are separated from the lead frame portion. However, the present invention is not limited to this as long as it can be easily performed in a stable shape.

Embodiment 8 FIG.
Next, an eighth embodiment will be described with reference to FIGS. FIG. 23 is an exploded perspective view showing the imaging apparatus according to this embodiment, to which a DD line is added, and FIG. 24 is a cross section taken along the line DD when cut along the line DD shown in FIG. FIG. In FIG. 23, reference numeral 35 denotes a holder that is attached to the imaging apparatus main body from above the support member 11 that supports the lens barrel portion 8, and 36 is provided in the holder 35, and the lens barrel portion 8 is inserted when the holder 35 is attached. 37 is an attaching portion used when attaching the holder 35 to the image pickup apparatus main body, 38 is a key portion provided at the tip of the attaching portion 37, and 39 is the supporting portion 10 constituting the supporting member 11. It is a contact part with the holder 35 provided in the corner. In the drawings, the same reference numerals indicate the same or corresponding parts, and detailed description thereof will be omitted.

  As shown in FIG. 23, since the holder 35 is provided with holes 36 through which the lens barrel portion 8 is passed, the holder 35 comes into contact with the contact portions 39 provided at the four corners of the support portion 10. . Further, as shown in FIG. 24, the attachment load in the direction of the arrow generated when attaching the holder 35 is applied to the extending direction of the leg portions 9 and 9 a continuous to the support portion 10 via the contact portion 39.

  When the holder 35 is attached to the image pickup apparatus body after assembling the image pickup element 1, the substrate 3, the support member 11, and the like, the attachment load is uniformly applied from the direction of the lens barrel 8 and is supported as shown in FIG. The structure of the member 11 is deformed, and a stress is generated in a direction in which the member 11 is peeled off at a connection portion between the imaging element 1 and the substrate 3. When such stress is generated, the image pickup device 1 and the substrate 3 are peeled off, causing a failure or the like.

  On the other hand, in the imaging apparatus according to the present embodiment, the mounting load at the time of mounting the holder 35 is not uniformly applied from the direction of the lens barrel portion 8, and the corners and legs of the support portion 10 are interposed via the contact portions 39. 9 and 9a, regardless of the attachment of the holder 35, it is possible to prevent the occurrence of stress acting on the connection portion of the image pickup device 1 and the substrate 3 due to such an attachment load, and the image pickup device 1, the substrate 3 and the support. It is possible to obtain a high-quality imaging device in which the occurrence of a failure or the like of the device after assembling the member 11 or the like is prevented.

  Further, a reinforcing member such as a rib connecting the contact portions 39 may be provided between the contact portions 39 provided at the corners of the support portion 10. FIG. 26 is a structural perspective view showing the imaging apparatus according to this embodiment provided with a reinforcing member. In FIG. 26, reference numeral 40 denotes a rib that is continuous with the support portion 10 and extends above the leg portions 9 and 9 a, and is a reinforcing member that connects the contact portions 39 provided at the corners of the support portion 10. In the drawings, the same reference numerals indicate the same or corresponding parts, and detailed description thereof will be omitted. As shown in FIG. 26, since the structure of the support member 11 is reinforced by providing the reinforcing member 40 for connecting the contact portion 39, it is possible to prevent the occurrence of stress due to the mounting load of the holder 35 as described above. In addition, it is possible to obtain a high-quality imaging device that prevents the occurrence of device failure and the like.

1 is a perspective view showing an imaging apparatus according to Embodiment 1 of the present invention. It is process drawing which shows the process for comprising the imaging device which concerns on Embodiment 1 of this invention. It is the perspective view which added the AA line to the perspective view similar to FIG. FIG. 4 is a cross-sectional view taken along line AA when the imaging device illustrated in FIG. 3 is cut along line AA. It is a perspective view which shows the imaging device by Embodiment 2 of this invention. It is a disassembled perspective view which shows the imaging device by Embodiment 2 of this invention. It is the perspective view which added the BB line to the perspective view similar to FIG. FIG. 8 is a cross-sectional view taken along the line BB when the imaging apparatus illustrated in FIG. 7 is cut along the line BB. It is a perspective view which shows the imaging device by Embodiment 3 of this invention. It is a disassembled perspective view which shows the imaging device by Embodiment 3 of this invention. It is a perspective block diagram shown about the supporting member 11 of the imaging device by Embodiment 4 of this invention. It is a perspective block diagram shown about the supporting member 11 of the imaging device by Embodiment 4 of this invention. It is an imaging device by Embodiment 5 of this invention, Comprising: It is a perspective block diagram shown about the imaging device before attaching the supporting member 11. FIG. It is an imaging device by Embodiment 5 of this invention, Comprising: It is a perspective block diagram shown about the imaging device before attaching the supporting member 11. FIG. It is a disassembled perspective view which shows the imaging device by Embodiment 5 of this invention, Comprising: The imaging device which added CC line | wire. It is CC sectional view taken on the line CC of the imaging device shown in FIG. FIG. 17 is a cross-sectional configuration diagram illustrating a state where an opening 12 of the imaging device illustrated in FIG. 16 is sealed with a sealing member 26. It is a cross-sectional block diagram which shows the imaging device by Embodiment 6 of this invention. It is a cross-sectional block diagram which shows the imaging device by Embodiment 6 of this invention. It is a perspective view which shows the imaging device by Embodiment 7 of this invention. It is a disassembled perspective view which shows the imaging device by Embodiment 7 of this invention. It is process drawing which shows the process for comprising the imaging device shown in FIG. It is an exploded perspective view which shows the imaging device by Embodiment 8 of this invention, Comprising: The imaging device which added the DD line | wire. It is DD sectional view when the imaging device shown in FIG. 23 is cut | disconnected by DD line. It is a cross-sectional block diagram for demonstrating the imaging device by Embodiment 8 of this invention. It is a perspective view which shows the imaging device by Embodiment 8 of this invention.

Explanation of symbols

1 imaging device, 2 imaging surface, 3,28 substrate, 4 through hole, 5 frame,
6, 30, 31 Projection, 7 Imaging lens, 8 Lens barrel, 9, 9a Leg,
10 support part, 11 support member, 12 opening part,
13, 32, 33 recess (first notch),
14a screwing means (focal length adjusting means), 14b guide part, 16 fixing means 17 concave part (second notch part), 18 fixing means, 19 convex part,
20 holes, 21 reinforcing members, 22, 23, 40 ribs (reinforcing members),
24, 25 fixing means, 26, 29 sealing member, 27 peripheral circuit element,
34 lead frame, 35 holder, 39 contact part.

Claims (4)

A substrate having a through-hole, an image pickup device having an image pickup surface fixed to the substrate and exposed in the hole portion, a frame surrounding the periphery of the image pickup device, an image pickup lens for forming an image on the image pickup surface, and the image pickup lens A support member having a leg portion formed with an opening for inserting the frame body from the side opposite to the imaging lens, and a support member provided on the leg portion. An imaging apparatus comprising: a mounting portion for mounting the inserted protruding portion of the frame body; and a rib extending from the support member in a direction opposite to the leg portion and facing the lens barrel portion. The imaging apparatus according to claim 1, further comprising a fixing unit that fixes the substrate to the support member through the opening. The imaging device according to claim 2, wherein the opening is sealed with a sealing resin. The imaging device according to claim 1, wherein the substrate is a film-like substrate.

Images