JP2001308302A - Image sensing device, product with image sensing device, and manufacturing method of image sensing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin image sensing device where manufacturing procedures and handling are simple, a product where the image sensing device is mounted, and a method for manufacturing the image sensing device. SOLUTION: This image sensing device is equipped with a film-like circuit board 1 that includes an opening part 1a and a wiring pattern 1b, and image sensing element 2 that includes a light reception surface 2a for receiving light from an image-forming lens through the opening part and is arranged onto the film-like circuit board, and a translucent plate 3 that seals the opening part on the film-like circuit board on a surface at a side opposite to a side where the image sensing element is arranged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an imaging device, a product equipped with the imaging device, and a method of manufacturing the imaging device.
More specifically, the present invention relates to a thin imaging device, an imaging device-equipped product, and a method of manufacturing an imaging device, which are easy to manufacture and handle.

[0002]

2. Description of the Related Art In a conventional image pickup apparatus, an image pickup device is die-bonded on a substrate, and input / output terminals of the image pickup device and external electrodes are connected by wire bonding. In addition, the light-transmitting plate is sealed while securing a space at a height to accommodate the wires in wire bonding. For this reason, miniaturization has been limited in both planar size and thickness. On the other hand, in an imaging device mounted on a camera, a mobile phone, or the like, if the planar size is reduced in size and the thickness is reduced, it becomes convenient to carry and the product value is significantly improved. For this reason, in recent years, imaging devices that have been improved in size and made thinner by improving the above structure have been commercialized one after another.

[0003] For example, FIG. 43 shows an example of a conventional image pickup apparatus which has been miniaturized and thinned as described above (Japanese Patent Laid-Open No. 5-260393). FIG. 43 is a front view, and FIG.
FIG. 44 is a sectional view taken along the line IV-IV in FIG. 43. 43 and 44, the wiring layer 1 is formed on the glass substrate 103.
31b is formed. Terminal 131c of this wiring
And the bump 104 provided on the input / output terminal of the image sensor 102 are connected. These light receiving assemblies are sealed with a sealing resin 109. Glass substrate 103
1 extending from the end of the wire to the outside of the sealing resin
The terminal 31b is connected to the wiring 101b of the flexible wiring board 101 prepared separately. According to the above structure, the wire bonding is omitted, and as a result, a planar reduction in size and a reduction in thickness can be realized.
In the above structure, the glass substrate 103 and the image sensor 1
When the front surface of the image sensor 02 is too close, moire or the like is likely to occur. To prevent this, a diffraction grating 148 is formed in the light receiving region 131a of the image sensor.

FIGS. 45 and 46 show another example of improvement in the prior art (Japanese Patent Laid-Open No. 7-99214). FIG.
According to FIG. 5 and FIG. 46, a TAB tape 101 in which copper leads 101b are arranged in parallel on an insulating sheet 101c is adhered to a glass substrate 103 by an adhesive 111. A bump 104 formed on a terminal of the copper lead 101b and an image sensor 102 for transmitting an electric signal converted from optical information by the image sensor.
Are connected to the input / output terminal 102b. This connection uses an anisotropic conductive film (ACF).
lm) 105 is used to prevent a short circuit from occurring at a portion other than a predetermined connection portion. The periphery of this connection portion is sealed with a sealing resin 109. Usually, a micro lens 115 is arranged corresponding to each pixel of the image sensor. Light that has entered the image sensor through the opening 101a of the TAB tape is converted from optical information into an electric signal by the image sensor, and transmitted to the external circuit via the connection unit.
With such a structure, size reduction and thickness reduction are achieved.

[0005]

However, according to the imaging apparatus disclosed in Japanese Patent Application Laid-Open No. 5-260393, it is necessary to form a wiring pattern on a glass substrate by, for example, applying a wiring pattern.
Usually, forming specially-spaced wiring patterns on a glass substrate requires special equipment and is not easy. Further, in the manufacturing process of the imaging equipment, it is necessary to precisely arrange the wiring pattern arranged on the glass substrate and the input / output terminal of the imaging device. However, in the mounting operation of the high-precision mounting device, contact with the device may occur, and the attached and formed wiring pattern may be lost or lost. For this reason, handling precautions, which are unnecessary for ordinary glass sheets, are required, which reduces the production efficiency and increases the disposal rate in the manufacturing process. Furthermore, the electrical connection with the product on which the image pickup device is mounted,
It was necessary to carry out relaying using a separately prepared flexible wiring board or the like.

On the other hand, the image pickup device described in Japanese Patent Application Laid-Open No. 7-99214 uses a TAB tape, and the TAB tape has a structure in which leads are bonded on an insulating sheet. In general, TAB tapes are inferior in terms of lead width and narrowing of the space between lead widths, and it is also difficult to multilayer circuit patterns, as compared to a flexible wiring board or the like. For this reason, there is a problem that there is a limit in increasing the density of the circuit pattern in the imaging device, and it is difficult to reduce the size of the imaging device. Further, the TAB tape lacks flexibility as compared with the flexible substrate. For example, when mounting on a mobile phone, an arrangement is adopted in which light outside the housing is received on the light receiving surface through an imaging lens,
When connecting the lead portion and the connector arranged on the product substrate, it is difficult to give a degree of freedom to the arrangement of the connector. In a product such as a mobile phone, it is advantageous to have a degree of freedom in the arrangement of connectors and the like in terms of high-density mounting of components. For this reason, there has been a demand for a thin imaging device that has a simple manufacturing procedure and handling and that can have a flexible connector arrangement when mounted on a product.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a thin and small imaging device and a product equipped with the imaging device, particularly a cellular phone, and a method of manufacturing the imaging device, which are easy to manufacture and handle. I do.

[0008]

According to a first aspect of the present invention, there is provided an image pickup apparatus having an opening, a film-like circuit board including a wiring pattern, and a light receiving element for receiving light from an imaging lens through the opening. An image pickup element disposed on the film-shaped circuit board, including a surface, and a light-transmitting plate for sealing an opening of the film-shaped circuit board on a side opposite to the side on which the image pickup element is disposed. 1).

According to this configuration, the imaging device can be manufactured by a simple procedure without providing a special process such as providing a circuit pattern on the light-transmitting plate. (A) a light-transmitting plate, (b) a film-like circuit board, and (c) an image sensor.
The light-receiving assembly, which has the light-receiving function constituted as a main member, can be easily sealed against foreign matter from the outside and moisture absorption without using a special sealing technique. Further, with the above configuration, a thin imaging device can be easily obtained. The image sensor is mounted face down on a film circuit board. For example, FCB
(Flip Chip Bonding) method. That is, the bumps formed on the input / output terminals of the image sensor are connected to the lands which are the terminals of the wiring on the film-like circuit board. In this connection, for example, only the bump and the land are connected using an anisotropic conductive film (ACF), so that a short circuit does not occur in other portions. The light-transmitting plate is provided on its surface with a filter function for blocking incoming light of a specific wavelength such as infrared light and a function for improving light transmittance by vapor deposition or the like. You may.

In the imaging device according to the first aspect, the film-like circuit board is a flexible printed circuit board.

A flexible printed circuit board is easy to bend. Therefore, it is not necessary to limit the position of the connector connected to the interface terminal in one product to one position corresponding to the position of the planar circuit board at the shortest distance. If the connector is arranged at a position corresponding to a length shorter than the length of the shortest distance of the flexible printed circuit board, the connection can be made by bending (flexing) the flexible circuit board. Therefore, it is possible to increase the degree of freedom in arranging the position of the connector to be connected to the interface terminal in one product, so that the arrangement of the connector can be the most suitable for miniaturization. Furthermore, when mounting on several types of products, it is possible to cope with several types of products by using a longer image pickup device, thereby reducing the number of parts and reducing the product price.

In the imaging device according to the first aspect, the distance between the imaging element and the light-transmitting plate is maintained at a predetermined value or more. There is provided a spacer means provided between the conductive plate and the conductive plate.

The distance between the light receiving surface of the image sensor and the light transmitting plate is
In order to form a good image, it is necessary that the value is not less than a predetermined value and does not vary. FCB using film circuit board
When mounting by the method, the above distance is (a) bump height, (b)
The thickness of the ACF and the thickness of the adhesive for bonding the translucent plate to the film-shaped circuit board are affected by the respective variations. However, the above-mentioned variation factor can be eliminated by the spacer means, and it is possible to secure a constant distance equal to or more than a predetermined value determined by the spacer means. Specifically, by providing a slightly larger opening without intercepting the light beam received by the light receiving surface and disposing the spacer component there, it is possible to easily eliminate the variation and secure the constant distance. . In addition, since the light-transmitting plate and the image sensor are usually arranged so as to be in contact with each other at two or more points, parallelism can be ensured between the light-transmitting plate and the imaging element with high accuracy.

In the imaging device according to the first aspect, the spacer component is a rubber elastic body.

According to this configuration, the height of the rubber elastic body is
Since the above-mentioned distance is determined, an imaging device having the above-mentioned constant distance can be stably obtained in production without being affected by the variation in the thickness of the adhesive. The rubber elastic body may be arranged in a frame shape surrounding the light receiving surface, or may be arranged in rows over several rows.

In the imaging apparatus according to the first aspect, the light-transmitting plate has a flattened shape formed integrally with the surface of the opening other than the light receiving surface so as to protrude toward the surface facing the image sensor. It has a thick portion, and the thickened portion is in contact with a region other than the light receiving surface of the image sensor (Claim 5).

With this configuration, the manufacturing process can be simplified without increasing the number of parts. Further, the light-transmitting plate is adhered only to the film-shaped circuit board, and the thickened portion only comes into contact with the front surface of the image sensor other than the light receiving surface, so that the thickness of the adhesive in other portions does not need to be considered. Good.

In the imaging device according to the first aspect, the light receiving assembly, which is an assembly of the imaging device, the film-like circuit board, and the light-transmitting plate, is sealed and integrated with the sealing resin. (Claim 6).

With this configuration, the sealing function of the light receiving assembly is improved, and the degree of integration of the light receiving assembly is improved. For this reason, for example, the adhesion of the ACF and the translucent plate to the film circuit board in FCB mounting can be provisional adhesion. As a result, the degree of freedom in selecting an adhesive in these temporary bondings can be increased. Further, if the sealing resin is made of a light-shielding material, unnecessary external light can be blocked from entering from the side surface of the translucent plate, so that the optical performance of the imaging device can be improved. Becomes

In the imaging device according to the first aspect, the sealing resin seals a side peripheral portion of the light receiving assembly, and a rear surface of the imaging device is fixed to a reinforcing plate.

The above-mentioned sealing resin can be formed by, for example, a molding method. In this case, two criteria, that is, the surface of the light-transmitting plate and the rear surface of the imaging device, can be used as references for the imaging device in the molding die. For this reason, rattling of the imaging device in the molding die can be reduced, and variation in the relative position between the sealing resin and the imaging device can be reduced. Further, it is possible to further promote a reduction in the thickness of the imaging device. Further, by employing the reinforcing plate, the strength, rigidity, durability and the like of the film-shaped circuit board can be increased.

In the imaging device according to the first aspect, a through hole is formed in the reinforcing plate, and the rear surface of the image sensor and the reinforcing plate are adhered to each other by an adhesive inserted in the through hole. Item 8).

According to this configuration, the adhesive is interposed between the image pickup element and the reinforcing plate, and the fluctuation can prevent the height fluctuation of the image pickup element. Also,
Since there is no above-mentioned intervention, it contributes to thinning. Further, since it becomes possible to shine light on the adhesive from the rear surface of the imaging device, an ultraviolet curing agent can be used for the adhesive. As a result, the curing time of the adhesive can be shortened, and the manufacturing cost can be reduced.

In the imaging apparatus according to the first aspect, the reinforcing plate is provided with a concave flat thinned portion on the surface side of the image sensor, and is formed between the thinned portion and the other area. The step portion has a wall extending in a certain direction, and the imaging device is disposed on the thinned portion in contact with the wall (claim 9).

The side surface of the image sensor is exposed with high precision in a dicing step in which the image sensor is singulated from a wafer. The imaging device can be assembled on the reinforcing plate with high accuracy by sliding the imaging device over the thinned portion and bringing the side surface into contact with the wall.

In the imaging device according to the first aspect, the imaging device is provided with a lens mount positioning structure that determines the arrangement of the lens mount that holds the imaging lens.

According to this configuration, the relative positional relationship among the imaging lens, the translucent plate, and the light receiving surface can be easily arranged with high precision, high reproducibility and assembling, and a screen with high display quality can be obtained. Becomes possible.

In the imaging apparatus according to the first aspect, the lens mount positioning structure includes a lens mount positioning portion provided on the reinforcing plate and a positioning portion provided on a contact portion of the lens mount with the reinforcing plate. (Claim 11).

With this configuration, the imaging lens can be simply and accurately positioned above the light receiving surface. In the imaging device according to the first aspect, the lens mount positioning structure includes a lens mount positioning portion provided on the sealing resin, and a positioning portion provided on a contact portion of the lens mount with the sealing resin. (Claim 1
2).

According to the above configuration, it is possible to easily assemble the lens mount and the light receiving assembly with high accuracy of the relative position.

In the imaging device according to the first aspect, the lens mount is in contact with the light-transmitting plate at a part of the positioning locking portion, and the lens mount and the film-like circuit board are sandwiched by the light-transmitting plate. They are opposed (claim 13).

According to this configuration, it is possible to assemble the distance between the imaging lens and the front surface of the translucent plate with high accuracy and high reproducibility. Needless to say, it is possible to easily assemble the lens mount by assuring the accuracy of the relative position between the lens mount and the light receiving assembly.

[0033] A product equipped with an imaging device according to the present invention is a product equipped with the imaging device according to any one of the first aspect,
It is arranged such that external light passes through the imaging lens and is received on the light receiving surface (claim 14).

In the product having the above-described configuration, a thin imaging device manufactured by a simple manufacturing process can be easily and reproducibly mounted with high accuracy in its arrangement.

In the product equipped with the imaging device of the present invention, the first
The imaging device according to any one of the above aspects is mounted, and the interface terminals of the film-shaped circuit board flex the film-shaped circuit board to the connector of the product board arranged on the product.
The connection is made in a state where the connection is made (claim 15).

In general, a film-like circuit board is easily bent. For this reason, it is not necessary to limit the location of the connector connected to the interface terminal within one product to one location corresponding to the shortest planar distance of the film circuit board. If the connector is arranged at a position corresponding to a length shorter than the shortest distance of the film-like circuit board, the connection can be made by bending (deflecting) the film-like circuit board. Therefore, the degree of freedom in arranging the connectors is increased, and it is possible to make the arrangement most suitable for downsizing. Furthermore, when mounting on several types of products, it is possible to cope with several types of products by using a longer image pickup device, thereby reducing the number of parts and reducing the product price.

In the product equipped with the imaging device of the present invention,
The imaging device according to any one of the aspects described above is mounted, the imaging device mounting portion is provided on a product substrate disposed on a product, and the imaging device includes a mounting portion that is mounted on the imaging device mounting portion.

According to this configuration, the imaging device can be easily arranged at the most desirable position with high accuracy and high reproducibility.

In the product equipped with the imaging device of the present invention, the first
Mounting the imaging device according to any of the aspects, the imaging device mounting portion is a protrusion fixed to a product substrate, and the mounting portion is provided on a reinforcing plate and is provided with a mounting hole into which the protrusion is fitted. (Claim 17).

By adopting this configuration, the image pickup apparatus can be easily mounted on a product. Further, it is not necessary to mount the image pickup device on the surface, and the image pickup device is not exposed to a high temperature unlike solder mounting, for example. For this reason, the degree of freedom in selecting the components of the imaging device is increased, and inexpensive plastic lenses and the like can be targeted.

In the product equipped with the imaging device of the present invention, the first
The imaging device according to any one of the aspects is mounted, the imaging device mounting portion is an imaging device storage holder fixed to a product substrate having an imaging device locking portion, and the mounting portion is provided to protrude from a reinforcing plate. Locking claw (claim 1)
8).

With the above structure, the image pickup device mounting portion can be easily obtained without performing complicated forming processing on the image pickup device holder. The arrangement of the imaging device on the product can be performed with good reproducibility.

In the product equipped with the imaging device of the present invention,
The imaging device according to any one of the aspects above is mounted, the imaging device mounting portion is a concave portion provided on a product substrate, and the mounting portion is fitted into a concave portion provided integrally with the sealing resin. It is a projected portion to be formed (claim 19).

With the simple structure described above, the imaging device can be easily assembled at a predetermined position of the mobile phone.

In any of the above products equipped with an imaging device,
The product is a mobile phone (claim 20).

The above-mentioned portable telephone is a compact portable telephone by mounting a thin imaging device manufactured through a simple manufacturing process. In addition, the arrangement of the imaging device can be performed with high reproducibility and high accuracy by a simple structure, so that a screen with high display quality can be obtained.

According to the first aspect of the present invention, there is provided a method of manufacturing an imaging device, comprising the steps of opening an opening in a film-like circuit board having a wiring pattern, and closing a light-transmitting plate by closing the opening of the film-like circuit board. Adhering to the film-shaped substrate (claim 21).

Normally, the film-shaped circuit board does not have the rigidity to support the board by itself, so that the handling in the manufacturing process, the transfer between apparatuses, and the like become easy, and the failure rate due to a handling error or a transfer trouble is reduced. Can be done. In addition, since the light-transmitting plate and the film-shaped circuit board are bonded in advance with an adhesive, it is possible to prevent gas components generated when the adhesive is cured from being mixed into the imaging device. Therefore, the degree of freedom in selecting an adhesive can be increased.

[0049]

Next, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1) FIG. 1 is a diagram showing an imaging apparatus according to the present embodiment. (A) is a front view, and (b) is a longitudinal sectional view. A light-transmitting plate 3 is arranged on the front side of the film-like circuit board 1 and a light-receiving surface 2a is
Is disposed. FIG.
FIG. 2A is a front view of the film circuit board, and FIG. 2B is a front view of an image sensor. Since the film-like circuit board is translucent, the wiring pattern arranged on the rear surface can be seen from the front. An opening 1a is opened in the film-shaped circuit board 1, and the upper part of the opening and
One side is surrounded by an outer frame. A wiring pattern including a land 1b, which is a terminal of the wiring, is arranged on the two outer frame portions. An interface 1c for inputting and outputting signals is provided below the opening, and the wiring extends from the lateral outer frame toward the interface 1c. Further, the image sensor 2 is provided with a light receiving surface 2a, and converts the optical information received by the light receiving surface into an electric signal. Input / output terminals 2b for sending out the electric signals to the interface unit are arranged at positions corresponding to the lands of the film circuit board.

FIG. 3 is a front view showing a state in which the image pickup device 2 is mounted face down on the film-like circuit board 1. At the time of mounting, the input / output terminal 2b of the image sensor 2 and the land 1b of the film circuit board are connected to each other by FCB (Flip Chip Bonding).
ng) and are electrically connected and implemented. For this connection, a bump is provided on the input / output terminal of the image sensor,
It is preferable to use an anisotropic conductive film (ACF). Opening 1a of film circuit board 1
Has a sufficiently large size so as to include the light receiving surface 2a in plan view.

FIG. 4 is a sectional view taken along the line IV-IV in FIG. The film-like circuit board 1 and the translucent plate 3
They are bonded by an adhesive 6 interposed between them.
In mounting the imaging device 2 on the film-like circuit board 1, a bump 4 is formed on the input / output terminal 2b of the imaging device 2, and the bump 4 and the land (not shown) are anisotropic. They are connected using a conductive sheet (ACF) 5.

In the imaging apparatus according to the present embodiment, optical information of a subject passes through the light transmitting plate 3 and the opening 1a by an imaging lens (not shown) disposed in front of the light transmitting plate 3. An image is formed on the light receiving surface 2a, converted into an electric signal, and output. In the imaging device according to the present embodiment, there is no need to use a special technique such as providing a circuit pattern on the translucent plate. Further, it is not necessary to handle a TAB tape or the like in which wiring such as copper leads is exposed. The wiring patterns, including the lands, which are the terminals thereof, are disposed integrally with the film-like circuit board. Therefore, in assembling the light receiving assembly, the handling of the film circuit board and the like can be efficiently and simply performed. The light receiving assembly in the present imaging apparatus is a film-shaped circuit board 1
, The image sensor 2 and the translucent plate 3 are prepared, and a joining portion is provided between the members to easily form.
In the light receiving assembly, the inside can be easily sealed against moisture absorption from the outside, foreign matter intrusion, and the like. In addition, a thin light receiving assembly can be easily obtained. Note that the light-transmitting plate is formed on the surface with a filter function for blocking light of a specific wavelength such as infrared light or a function for improving light transmittance by a method such as vapor deposition. You may.

(Embodiment 2) The present embodiment relates to a method of manufacturing the image pickup device of Embodiment 1 described above. The feature of the manufacturing method in the present embodiment is that, as shown in FIG. 5, a light-transmitting plate 3 is bonded and integrated in advance to a film-like circuit board 1 such as a flexible printed board. FIG. 5A is a front view of a flexible printed circuit board to which the translucent plate 3 is bonded in advance.
(B) is a longitudinal sectional view thereof. Since the flexible printed board 1 is thin, the board itself has no rigidity to support itself. For this reason, in handling in the manufacturing and assembling process and transport after assembling into the imaging device,
There has been a problem that the grasp of the flexible printed circuit board becomes unstable. According to the manufacturing method in the present embodiment,
As shown in FIG. 5A, the film-like circuit board is reinforced by the high rigidity of the light-transmitting plate, and thereafter, for example, as shown in FIG.
As shown in (1), the image sensor is mounted face down. For this reason, handling in the process and transporting after assembling into the imaging device are facilitated, and a failure rate in the manufacturing process due to handling error, transport failure, or the like can be reduced. Further, since the light-transmitting plate and the film-like circuit board are integrated with the adhesive, it is possible to prevent gas components generated in the curing step of the adhesive from being mixed into the imaging device. As a result, when designing an imaging device,
It is possible to increase the degree of freedom in selecting an adhesive.

(Embodiment 3) FIG. 7 is a front view of an imaging apparatus according to the present embodiment. Film circuit board 1
Since the base film is translucent, the wires and lands disposed on the rear surface can be seen from the front. FIG. 8A is a front view in a state where the light transmitting plate 3 is removed from the imaging device shown in FIG. FIG. 8B is a front view of the translucent plate. The members denoted by the same reference numerals as those in the drawings of the first embodiment are the same members in the present embodiment. The feature of the present embodiment resides in that a rubber elastic body 7 is arranged around the light receiving surface 2a on the image sensor 2. Rubber elastic body 7
Is located on the periphery of the light receiving surface 2a of the image sensor 2 and within the range of the opening 1a of the film-shaped circuit board 1. For this reason, the distance between the rear surface of the light transmitting plate and the front surface of the image sensor, that is, the distance between the rear surface of the light transmitting plate and the light receiving surface can be kept constant without hindering the light receiving performance of the light receiving surface 2a. The above-mentioned rubber elastic body can be used as a spacer for setting the above-mentioned interval to a predetermined value. The rubber elastic body is usually arranged with a liquid silicone rubber material by a dispenser device or the like,
Then, it can be cured by heating to obtain a rubber elastic body.

FIG. 9 is a sectional view taken along line IX-IX in FIG. As shown in the figure, the translucent plate 3 includes a rubber elastic body 7.
While being supported by the adhesive, the adhesive 6 is bonded and integrated with the film circuit board by the adhesive 6. In the imaging device shown in the first embodiment, the distance between the translucent plate 3 and the light receiving surface 2a is FC
Based on the method B, there is a variation in the bump height, the ACF thickness, and the thickness of the translucent plate adhesive. However, in the present embodiment, the distance between the rear surface of the light transmitting plate and the front surface of the image sensor, or the distance between the rear surface of the light transmitting plate and the light receiving surface is determined by the height of the rubber elastic body. For this reason, an imaging device with stable quality can be easily manufactured without considering the above-described variation in the bonding portions. As shown in FIG. 10, the rubber elastic body may not be located at the periphery of the light receiving surface of the image sensor, but may be located at the position of another image sensor part, for example, at the front of the processing circuit part. . As described in the third embodiment, the rubber elastic body is usually
A liquid silicone rubber material can be placed in a dispenser device or the like, and then cured by heating to produce the product.

(Embodiment 4) FIG. 11A is a front view of an imaging apparatus according to Embodiment 4. FIG. In the present embodiment, the shape and arrangement of the rubber elastic body disclosed in the third embodiment are changed. With this change, while having the same effect as in the third embodiment, the usage amount of the rubber elastic body can be reduced, and the product cost can be reduced.
Further, in an example similar to FIG. 11A shown in FIG. 11B, since no rubber elastic body is arranged on the side peripheral edge of the light receiving surface, the width of the film circuit board or the image sensor is correspondingly increased. And can contribute to planar miniaturization.

(Embodiment 5) FIG.
FIG. 2 is a cross-sectional view of the imaging device in FIG. The feature of the present embodiment resides in that a spacer component is arranged between the imaging element 2 and the light transmitting plate 3. FIG. 13 is a schematic diagram in which the translucent plate and the spacer member of FIG. 12 are separated from each other. As shown in the figure, the spacer component 8 penetrates through the opening 1a of the film circuit board 1 and is disposed between the imaging device 2 and the light transmitting plate 3. Therefore, the size of the opening 1a
It has smaller dimensions.

Next, referring to FIG. 14, a description will be given of a procedure for manufacturing the image pickup apparatus according to the present embodiment. FIG. 14A is a front view showing a state in which an image sensor is mounted face-down on the rear surface of the film-shaped circuit board. Since the film-like circuit board is translucent, a wiring pattern including a land portion disposed on the rear surface can be seen. As shown in FIG. 14C, the spacer component 8 shown in FIG. 14B is fixed to the front surface of the image sensor other than the light receiving surface 2a by an adhesive (not shown) or the like. Next, as shown in FIG. 14D, the translucent plate 3 is arranged and fixed with an adhesive (not shown).

The rubber elastic bodies shown in the third and fourth embodiments can be manufactured by arranging a liquid silicone rubber material by a dispenser or the like and curing it by heating. According to the present embodiment, since it can be made into a component as a spacer component, the manufacturing process is simplified. Further, since the rubber elastic body is manufactured by the above-described manufacturing method, the height tends to vary. However, in this embodiment, since the spacer component can be stabilized by the molding accuracy, the spacer height can be configured with high accuracy.

(Embodiment 6) FIG.
It is a cross-sectional view of the light receiving assembly of the imaging device in,
FIG. 16 is a schematic diagram showing a state where the light-transmitting plate is separated from the light receiving assembly. In the present embodiment, the spacer component and the light-transmitting plate 3 in the fifth embodiment are integrally formed. That is, in the present embodiment, the translucent plate 3 and the spacer component 3a are integrally formed. FIG. 17 shows an integrated molded product of the translucent plate 3 and the spacer component 3a. FIG. 17A is a front view, and FIG. 17B is a longitudinal sectional view thereof.

FIG. 18 is a diagram showing a procedure of a method of manufacturing an imaging device according to the sixth embodiment. FIG. 18A is a front view of a state in which an image sensor is mounted face-down on the rear surface of the film-shaped circuit board. FIG. 18B is a front view of the integrally molded component as viewed from the spacer (convex) side. As shown in FIG. 18, the convex portion is arranged so as to be in contact with the image sensor, and is fixed to the film-like circuit board so as to seal the opening of the circuit board.

With this configuration, the distance between the light-transmitting plate and the light-receiving surface can be arranged with high precision, and the number of parts can be reduced.
As a result, the manufacturing process is simplified. Further, the film-like circuit board is bonded and integrated with an adhesive, and no adhesive layer is interposed between the light-transmitting plate and the image sensor. For this reason, it is possible to avoid a variation in the thickness of the adhesive due to the interposition of the adhesive layer in the above-described portion and a variation in the position of the translucent plate. For this reason, the present imaging device can be manufactured stably, and the application and curing steps of the adhesive can be omitted, and the adhesive itself can be omitted, so that the manufacturing cost can be reduced.

(Embodiment 7) In the image pickup apparatus of the present embodiment, the side peripheral portion of the light receiving assembly of the image pickup apparatus of Embodiments 1 to 6 is sealed with a sealing resin 9. FIG.
FIG. 27 is a diagram showing a light-receiving assembly of the imaging device in the seventh embodiment. FIG. 19A is a side view, and FIG.
Is a sectional view. The imaging device according to the present embodiment can be manufactured by arranging the imaging device described in Embodiments 1 to 6 in a resin extrusion mold and performing insert molding.

By the resin sealing to the side peripheral portion, the sealing performance is improved remarkably as compared with the sealing in which the translucent plate is adhered to the film circuit board.
The translucent plate can be reliably integrated. Therefore, the anisotropic conductive bonding (ACF) in the FCB mounting of the imaging device to the film circuit board and the bonding of the light transmitting plate to the film circuit board can be provisionally bonded. For this reason, it is not necessary to attach importance to the durability of the adhesive strength of these adhesives, so that the degree of freedom in selecting these adhesives can be expanded. Furthermore, if the sealing resin 9 is made light-shielding by sealing up to the side surface of the translucent plate, it is possible to block unnecessary incidence of external light from the side surface of the translucent plate. As a result, it is possible to improve the optical performance of the imaging device.

(Eighth Embodiment) FIG. 20 shows an eighth embodiment.
It is a side view which shows the light receiving assembly of the imaging device in FIG. FIG. 21 is a front view. In the imaging device according to the present embodiment, the sealing resin 9 according to the seventh embodiment is not disposed on the rear surface portion of the imaging device, but in a bare state, and the rear surface is bonded to a reinforcing plate 10 to reinforce the strength. . FIG.
FIG. 3 is a cross-sectional view of an imaging device in which a rear surface portion is in a bare state and a side peripheral portion is sealed with a resin. FIG. 23A is a front view of an imaging device in which a side peripheral portion is sealed with the sealing resin. In the figure, the interface portion 1d protrudes from the sealing resin and extends outward. FIG.
(B) is a rear view.

The reinforcing plate can be obtained, for example, by molding a metal plate or a resin. Normally, the thickness can be smaller than the thickness of the sealing resin 9 described in the seventh embodiment. Further, the sealing resin 9 can be usually formed by a molding method using a mold. However, in forming the sealing resin 9 as in the present embodiment, the reference of the imaging device in the molding die is only the surface of the translucent plate. For this reason, the relative position between the sealing resin 9 and the imaging device may vary depending on the position of the injection gate portion and the injection pressure in molding. However, by employing the configuration of the eighth embodiment, the reference in the molding die can be set to the front surface of the light-transmitting plate and the back surface of the image sensor. For this reason, rattling in the molding die can be reduced, and variation in the relative position between the sealing resin and the imaging device can be reduced. Further, as described above, it is possible to reduce the thickness of the imaging device and improve the optical performance.

(Embodiment 9) FIG. 24 is a diagram showing an imaging apparatus according to the present embodiment. The imaging lens 11 is supported by a lens mount 12 and is disposed in front of the translucent plate 3. The light-receiving assembly whose side peripheral portion is sealed with a sealing resin is die-bonded to the reinforcing plate 10 on the rear surface of the bare imaging element. In the lens mount,
A positioning protrusion (positioning portion) 12a is formed, and the positioning protrusion is locked to the lens mount positioning portion of the reinforcing plate 10. FIG.
FIG. 3 is a front view showing a reinforcing plate 10 and the light-receiving assembly whose side periphery is sealed with a sealing resin fixed to the reinforcing plate 10. The reinforcing plate 10 is provided with a locking concave portion (lens mount positioning portion) 10a in which the positioning convex portion 12a is locked. FIG. 26 is a view of the lens mount 12 shown in FIG. 24 as viewed from the rear side. The positioning projections 12a are arranged so as not to be aligned with each other along the side of the lens mount, and care is taken so that the above-mentioned positioning locking does not become unstable.

By adopting the above-described structure, after the positioning and locking are performed, the imaging lens 11 includes the light receiving section 2 when viewed in a plan view.
It is arranged so as to be accurately located at the central part in the area a. Therefore, the imaging device can be easily and accurately assembled.

(Embodiment 10) FIG. 27 is a diagram showing a state in which the imaging device according to Embodiment 10 is mounted on a product (for example, a mobile phone). In this imaging device, a reinforcing plate 10 for fixing a light receiving assembly sealed with a sealing resin 9 is provided on an imaging device mounting portion 1 provided on a product substrate 13.
4 attached. The above-described imaging device mounting portion (projection portion) 14 is arranged on a product substrate in advance by surface mounting. FIG. 28 is a front view of a state in which the light receiving assembly sealed with the sealing resin 9 is fixed on the reinforcing plate 10. The mounting plate 10 is provided with two mounting holes 10b into which the projections 14 serving as the imaging device mounting portions are fitted. FIG. 29 is a front view of the product substrate 13.
At a predetermined position of the product substrate 13, a protrusion 14 also having a function of positioning the imaging device is disposed by surface mounting. The positioning mounting component (projection) 14 has a flat portion for surface mounting on the product substrate 13 and a projection protruding from the flat portion. This projection is fitted into the mounting hole 10b provided in the reinforcing plate.

By the formation of the positioning mounting component 14, the imaging device can be easily arranged at a predetermined position in the product with high reproducibility and high accuracy. Further, it is not necessary to mount the image pickup device on the surface, for example, it is not necessary to mount the image pickup device by soldering, and the image pickup device is not heated to a high temperature. For this reason, the degree of freedom in selecting the components of the imaging device is increased, and for example, a plastic lens or a plastic translucent plate can be used. As a result, there is no restriction on the use of expensive optical glass materials, and it is possible to reduce the cost of the imaging device.

(Embodiment 11) FIG. 30 is a diagram showing an imaging apparatus according to Embodiment 11. FIG. 30A is a cross-sectional view showing a state in which the assembly sealed with the sealing resin is fixed to the reinforcing plate 10. FIG. 30B is a rear view of the imaging device as viewed from the rear side of the reinforcing plate. The reinforcing plate 10 has an imaging device fixing hole 10c.
The adhesive 15 is arranged in the hole from the rear surface side of the reinforcing plate, and the rear surface of the image sensor and the side wall of the hole are bonded and fixed.

By adopting the above structure, it is possible to prevent the adhesive between the image pickup device 2 and the reinforcing plate from interfering with each other, thereby preventing the distance between the image pickup device and the reinforcing plate from varying, and to promote the reduction in thickness. Can also. Further, since light can be applied to the adhesive from the rear surface of the image sensor, an ultraviolet curing agent can be used as the adhesive. For this reason, the curing time of the adhesive can be shortened, so that the manufacturing cost can be reduced.

(Twelfth Embodiment) FIG. 31 is a diagram showing an image pickup apparatus according to a twelfth embodiment. In the present embodiment, an imaging device housing area 10d, which is a concave thinned portion, is provided in the reinforcing plate 10, and a positioning step 10e is provided at the edge thereof.
To form The relative position of the image sensor with respect to the reinforcing plate 10 can be accurately determined by bringing the side surface of the image sensor 2 in the bare state of the image sensor into contact with the wall of the stepped portion. That is, as shown in FIGS. 32A and 32B, the assembly is arranged in a concave imaging device housing area 10 d provided in the reinforcing plate 10. The wall 10e of the imaging device storage area is accurately exposed so as to be a reference surface. Next, as shown in FIG. 33, the imaging device is slid in the direction indicated by the arrow, and is assembled so that the side surface of the imaging device contacts the wall 10e. The side surface 2 of the image sensor is secured with high precision by dicing in a process in which the image sensor 2 is cut out from a wafer and singulated.

By adopting the above structure, it is possible to accurately assemble the imaging device on the reinforcing plate without using a recognition device or the like.

(Thirteenth Embodiment) FIG. 34 is a diagram showing an imaging apparatus according to the thirteenth embodiment. In the figure,
The imaging device storage holder 16 is fixed in advance to a product on which the imaging device is mounted. From the reinforcing plate fixing the assembly including the image pickup device and the like, a fixing locking claw 10f fitted to the image pickup device housing holder 16 is provided.
It is formed to extend to have a spring function. FIG. 35 is a front view showing an image sensor and the like fixed to the reinforcing plate. The locking claws 10f for fixing are formed at four places in the vertical direction from the side of the reinforcing plate. FIG. 36 is a front view of the imaging device storage holder. The locking claw 1 is provided on the side wall of the imaging device housing holder 16.
Attachment concave portion 1 which is an imaging device locking portion to which 0f is fitted.
6a is provided. As described above, the locking claw 10f is attached to the mounting recess of the imaging device storage holder 16 (imaging device locking portion).
When fitted to 16a, the imaging device is held in the imaging device storage holder by the spring effect of the fixing claw 10f.

With the above structure, it is not necessary to provide a fixing claw portion in a complicated molding procedure in the imaging device holder, and the imaging device holder can be easily molded. Further, the positioning of the imaging device is facilitated.

(Embodiment 14) FIG. 37 is a sectional view of an imaging apparatus according to the present embodiment, and FIG.
FIG. 3 is a schematic diagram of a state where a lens mount with an imaging lens is separated from a sealing resin. In FIG. 38, a lens mount positioning convex portion (lens mount positioning portion) 9a is provided integrally with the sealing resin 9, and a positioning concave portion (positioning portion) provided integrally with the lens mount is provided on the lens mount 12. ) 12b. The above-described lens mount positioning projection 9a can be integrally provided on the sealing resin by a molding die.
b can also be integrally provided by a molding die for the lens mount. In the above structure, the lens mount having the imaging lens is assembled by fitting the lens mount positioning projection 9a into the positioning recess 12b. With the above structure, the lens mount and the imaging device can be easily assembled, and the relative positions can be stably and accurately assembled.

(Embodiment 15) FIG. 39 is a diagram showing an imaging apparatus according to Embodiment 15. FIG.
FIG. 3 is a diagram showing a state in which a lens mount with an imaging lens is separated from a sealing resin in the imaging device of the present embodiment. In the imaging device of the present embodiment, when the light-transmitting plate is made larger and the lens mount and the imaging device are integrated by the fitting structure, the contact surface of the lens mount is located on the upper surface of the light-transmitting plate. It has been hit.

By adopting this structure, while having the function of the above-described fourteenth embodiment, the distance from the imaging lens to the upper surface of the light transmitting plate can be easily assembled with high accuracy.

(Embodiment 16) FIG. 41 is a diagram showing an imaging apparatus according to Embodiment 16. FIG.
FIG. 4 is a diagram illustrating a state in which the imaging device is separated from the product substrate 13. In the present embodiment, an imaging device mounting recess 13a, which is an imaging device mounting portion also having a positioning function, is provided on the product substrate 13 in advance, and is a mounting portion provided integrally with a sealing resin of the imaging device. The projection 9a is fitted into the imaging device mounting recess 13a and assembled. In FIG. 41, the rear surface of the imaging element 2 and the product substrate 13 are integrated by an adhesive. By employing this structure, the imaging device can be easily and stably assembled at a predetermined position on the product substrate.

Although the embodiments of the present invention have been described above, the embodiments of the present invention disclosed above are merely examples, and the scope of the present invention is not limited to these embodiments. Not limited. The scope of the present invention is shown by the description of the claims, and further includes all modifications within the meaning and scope equivalent to the description of the claims.

[0083]

By using the structure of the film-shaped circuit board, the light-transmitting plate and the imaging device according to the present invention, the manufacturing procedure and handling are simple, and the imaging device and the mounting of the imaging device are reduced in thickness and size. It is possible to provide a method for manufacturing a product, particularly a mobile phone, and an imaging device.

[Brief description of the drawings]

FIG. 1A is a front view of a light receiving assembly of an imaging device according to a first embodiment. (B) It is the longitudinal cross-sectional view.

FIG. 2 (a) is a front view of the film circuit board of FIG. FIG. 2B is a front view of the image sensor of FIG. 1.

FIG. 3 is a front view showing a state in which an imaging element is mounted face down on a film-like circuit board in FIG. 1;

FIG. 4 is a sectional view taken along line IV-IV in FIG.

FIG. 5A is a front view showing a state where a light-transmitting plate (optical glass plate) is adhered to a film-like circuit board in the second embodiment. (B) It is the longitudinal cross-sectional view.

FIG. 6 is a diagram showing a procedure for mounting an image sensor face down on a film-like circuit board to which a light-transmitting plate is adhered in the second embodiment.

FIG. 7 is a front view of a light-receiving assembly of the imaging device according to the third embodiment.

FIG. 8A is a front view of a state in which a light-transmitting plate is removed from the state of FIG. 7; (B) It is a front view of a translucent plate.

FIG. 9 is a sectional view taken along line IX-IX in FIG. 7;

FIG. 10 is a diagram showing another example of the rubber elastic body according to the third embodiment.

11A is a diagram illustrating an example of a light-receiving assembly of an imaging device according to Embodiment 4. FIG. FIG. 12B is a diagram illustrating an example of a rubber elastic body similar to FIG. 11A.

FIG. 12 is a cross-sectional view of a light-receiving assembly of the imaging device according to the fifth embodiment.

FIG. 13 is a schematic diagram of a state in which a light-transmitting plate and a spacer member are separated from the state of FIG.

FIG. 14 is a diagram showing a procedure for assembling the light receiving assembly according to the fifth embodiment. (A) It is a front view in the state where the image sensor was mounted face down on the film circuit board. (B) It is a front view of a spacer member. FIG. 3C is a front view showing a state in which a spacer member is disposed on the film-shaped circuit board on which the imaging element is mounted. FIG. 15D is a front view showing a state where a light-transmitting plate is adhered to the state shown in FIG.

FIG. 15 is a cross-sectional view of a light-receiving assembly of the imaging device according to the sixth embodiment.

FIG. 16 is a schematic diagram of a state where a light-transmitting plate is separated from the state of FIG. 15 and placed.

FIG. 17 (a) is a front view of a translucent plate according to a sixth embodiment. (B) It is the side view.

FIG. 18 is a diagram showing a procedure for assembling the light receiving assembly according to the sixth embodiment. (A) It is a front view in the state where the translucent board was removed from the light receiving assembly. (B) It is a front view of a translucent plate. (C) A front view of a stage where a light-transmitting plate is arranged and a light-receiving assembly according to Embodiment 6 is completed.

FIG. 19 (a) is a side view of an imaging device according to a seventh embodiment. (B) It is a cross-sectional view of the imaging device in Embodiment 7.

FIG. 20 is a side view of the imaging device according to the eighth embodiment.

FIG. 21 is a front view of an imaging device according to an eighth embodiment.

FIG. 22 (a) is a side view showing a state where a reinforcing plate is removed from FIG. 20. (B) It is a cross-sectional view of the light-receiving assembly of the imaging device in Embodiment 8.

FIG. 23 (a) is a front view of FIG. 22 (a).
FIG. 23 (b) is a rear view of FIG.

FIG. 24 is a side view showing an imaging device in Embodiment 9;

FIG. 25 is a front view showing a state where a lens mount is removed from the imaging device shown in FIG. 24;

FIG. 26 is a rear view of the lens mount to which the imaging lens is attached.

FIG. 27 is a side view of the tenth embodiment at a stage where the light receiving assembly of the imaging device is attached to the product substrate.

FIG. 28 is a front view of the light receiving assembly in FIG. 27.

FIG. 29 is a front view of an image pickup device mounting portion provided on the product substrate shown in FIG. 27;

FIG. 30 (a) is a partial cross-sectional view of a light-receiving assembly of the imaging device in the eleventh embodiment. (B) It is a front view of the reinforcement plate of FIG. 30 (a).

FIG. 31 is a partial cross-sectional view of a light receiving assembly of an imaging device according to a twelfth embodiment.

FIG. 32 is a diagram illustrating a procedure for assembling the imaging device according to the twelfth embodiment;

FIG. 33 is a diagram illustrating a procedure for abutting an imaging element on a wall of a step portion of a reinforcing plate in assembling the imaging device of the twelfth embodiment.

FIG. 34 is a diagram showing a state in which a light-receiving assembly is arranged in an imaging device holder provided on a product substrate in the thirteenth embodiment.

FIG. 35 is a front view of a light receiving assembly provided with a reinforcing plate.

FIG. 36 is a front view of the imaging device holder.

FIG. 37 is a diagram illustrating an imaging device in Embodiment 14;

FIG. 38 is a schematic view showing a state where the lens mount is separated from the state of FIG. 37 and placed.

FIG. 39 is a diagram illustrating an imaging device in Embodiment 15;

40 is a schematic view showing a state where the lens mount is separated from the state of FIG. 39 and placed.

FIG. 41 is a diagram showing a state in which a mounting portion of a light-receiving assembly sealing resin is mounted on a sealing resin mounting portion provided on a product substrate in the sixteenth embodiment.

42 is a schematic diagram showing a state where the light receiving assembly is separated from the state of FIG. 41.

FIG. 43 is a front view showing a light receiving assembly of a conventional imaging device.

44 is a sectional view taken along the line IVIV-IVIV in FIG. 43.

FIG. 45 is a cross-sectional view of a light receiving assembly of another conventional imaging device.

FIG. 46 is a perspective view of the circuit board in FIG. 45.

[Explanation of symbols]

1 film-like circuit board, 1a opening, 1b wiring,
Reference Signs List 1c interface unit, rear surface of 1d interface unit, 2 image sensor, 2a light receiving surface, 2b input / output terminal of image sensor, 2c front surface of image sensor on which spacer member is mounted, 2d rear surface of image sensor, 3 translucent plate, 3a A spacer member integrally formed with a light-transmitting plate, 4 bumps provided on input / output terminals, 5 anisotropic conductive film (ACF), 6 adhesive, 7 rubber elastic body, 8 spacer member, 9 sealing resin, 9a sealing resin protrusion fitted into the lens mount, 10 reinforcing plate, 10a lens mount positioning portion, 10b mounting portion on the reinforcing plate side mounted on the mounting portion of the product substrate, 10c mounting hole for the reinforcing plate, 10d flat thinning Part, 10e Wall of stepped part, 10f
Claw parts protruding from the reinforcing plate, 11 imaging lenses,
12 lens mount, 12a lens mount side positioning section, 12b lens mount side positioning section, 1
3 Product board, 13a Image pickup device mounting portion provided on product substrate, 14 Image pickup device mounting portion provided on product substrate, 15
Adhesive, 16 Imager holder provided on product substrate, 16a Locking portion for locking claw projecting from reinforcing plate, 17 Adhesive.

Claims (21)

[Claims] 1. An imaging device having an opening, a film circuit board including a wiring pattern, and a light receiving surface for receiving light from an imaging lens through the opening, and disposed on the film circuit board. An imaging device, comprising: a light-transmitting plate that seals an opening of the film-shaped circuit board on a surface opposite to a side on which the imaging element is arranged. 2. The imaging device according to claim 1, wherein the film circuit board is a flexible printed circuit board. 3. An opening between a region other than the light receiving surface and a region between the image sensor and the light-transmitting plate, which secures a distance between the image sensor and the light-transmitting plate at a predetermined value or more. The imaging device according to claim 1, further comprising a spacer provided in the imaging device. 4. The spacer component is a rubber elastic body,
The imaging device according to claim 3. 5. The light-transmitting plate has a flat thickened portion formed integrally with and protruding from an opening in a region other than the light-receiving surface on a surface facing the imaging element. The imaging device according to claim 3, wherein the thickened portion is in contact with a region other than the light receiving surface of the imaging device. 6. The light-receiving assembly, which is an assembly of the imaging element, the film-shaped circuit board, and the light-transmitting plate, is sealed and integrated with a sealing resin. 5
The imaging device according to any one of the above. 7. The imaging device according to claim 6, wherein the sealing resin seals a side peripheral portion of the light receiving assembly, and a rear surface of the imaging device is fixed to a reinforcing plate. 8. The reinforcing plate is provided with a through hole, and the rear surface of the image sensor and the reinforcing plate are bonded to each other by an adhesive inserted into the through hole. An imaging device according to claim 1. 9. The reinforcing plate is provided with a concave flat thinned portion on the surface side of the image sensor, and a step formed between the thinned portion and another area is constant. The imaging device according to claim 6, further comprising a wall extending in a direction, wherein the imaging device is disposed on the thinned portion in contact with the wall. 10. The imaging device according to claim 1, wherein the imaging device is provided with a lens mount positioning structure that determines an arrangement of a lens mount that holds an imaging lens. 11. The lens mount positioning structure,
The imaging device according to claim 10, wherein the imaging device is configured by a lens mount positioning portion provided on the reinforcing plate, and a positioning portion provided on a contact portion of the lens mount with the reinforcing plate. 12. The lens mount positioning structure,
11. A lens mount positioning portion provided on the sealing resin, and a positioning portion provided on a contact portion of the lens mount to the sealing resin.
An imaging device according to claim 1. 13. The lens mount according to claim 1, wherein the lens mount abuts the light-transmitting plate at a part of the positioning portion, and faces the film circuit board with the light-transmitting plate interposed therebetween. Item 13. The imaging device according to Item 12. 14. A product on which the imaging device according to any one of claims 1 to 13 is mounted, wherein the product is arranged such that external light is received on the light receiving surface through an imaging lens. Products with an imaging device. 15. The film-like circuit board according to claim 14, wherein the interface terminals of the film-like circuit board are connected to connectors of a product board arranged on a product in a state where the film-like circuit board is bent (bent). The product equipped with the imaging device described in the above. 16. The product mounted with an imaging device according to claim 14, wherein the product substrate provided on the product includes an imaging device mounting portion, and the imaging device includes a mounting portion mounted to the imaging device mounting portion. 17. The imaging device according to claim 16, wherein the image pickup device mounting portion is a protrusion fixed to the product substrate, and the mounting portion is a mounting hole provided on the reinforcing plate, into which the protrusion is fitted. The product equipped with the imaging device described in the above. 18. The imaging device mounting portion is an imaging device storage holder fixed to the product substrate having an imaging device locking portion, and the mounting portion is a locking claw protruding from the reinforcing plate. An imaging device-mounted product according to claim 16. 19. The imaging device mounting portion is a concave portion provided on the product substrate, and the mounting portion is a protrusion provided integrally with the sealing resin and fitted into the concave portion. An imaging device-mounted product according to claim 16. 20. The imaging device-equipped product according to claim 14, wherein the imaging device-equipped product is a mobile phone equipped with the imaging device. 21. A method comprising the steps of: opening a film circuit board having a wiring pattern with an opening; and covering the film circuit board with an opening to adhere a light-transmitting plate to the film board. A method for manufacturing an imaging device.