JP2008263552A

JP2008263552A - Solid-state imaging device and manufacturing method thereof

Info

Publication number: JP2008263552A
Application number: JP2007106428A
Authority: JP
Inventors: Yasushi Nakagiri; 康司中桐; Masahiko Mikami; 雅彦三上; Bunichi Harazono; 文一原園
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 2007-04-13
Filing date: 2007-04-13
Publication date: 2008-10-30

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simply configured solid-state imaging device which is made thin and compact and has high rigidity by using a flexible wiring board, and to provide a manufacturing method therefor. <P>SOLUTION: The solid-state imaging device is such that a first flexible wiring board, having an opening portion and a reinforcing plate have the same external shape and are stacked into a single body, a light transparent member and a solid-state imaging element substrate are disposed to face each other so as to close the opening portion, and a second flexible wiring board is jointed with the first flexible wiring board, resin molding is carried out so as to cover the joint between the solid-state imaging element substrate and second flexible wiring board. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、固体撮像装置およびその製造方法に係り、特に、監視カメラ、医療用カメラ、車載用カメラ、情報通信端末用カメラなどの固体撮像素子を用いて形成される小型の固体撮像装置およびその製造方法に関するものである。 The present invention relates to a solid-state imaging device and a manufacturing method thereof, and in particular, a small-sized solid-state imaging device formed using a solid-state imaging device such as a surveillance camera, a medical camera, an in-vehicle camera, an information communication terminal camera, and the like. It relates to a manufacturing method.

近年、携帯電話、車載部品等で小型カメラの需要が急速に進展している。この種の小型カメラには固体撮像素子によりレンズなどの光学系を介して入力される画像を電気信号として出力する固体撮像装置が使用されている。そしてこの撮像装置の小型化、高性能化に伴い、カメラがより小型化し各方面での使用が増え、映像入力装置としての市場を広げている。従来の半導体撮像素子を用いた撮像装置は、レンズ、半導体撮像素子、その駆動回路および信号処理回路などを搭載したＬＳＩ等の部品を夫々筐体あるいは構造体に形成してこれらを組み合わせている。このような組み合わせによる実装構造は、平板上のプリント基板上に各素子を搭載することによって形成されていた。しかし、携帯電話等のさらなる薄型化への要求から個別のデバイスに対する薄型化、小型化への要求が年々高くなってきており、その要求に答えるために、フレキシブル配線板を用いて、より薄く小型の撮像装置とする試みが行われている。 In recent years, the demand for small cameras for mobile phones, in-vehicle components, etc. has been rapidly increasing. This type of small camera uses a solid-state imaging device that outputs an image input as an electrical signal by an optical system such as a lens by a solid-state imaging device. With the downsizing and high performance of this image pickup apparatus, the camera has become smaller and the use in various fields has increased, expanding the market as a video input apparatus. In a conventional image pickup apparatus using a semiconductor image pickup device, components such as an LSI on which a lens, a semiconductor image pickup device, a driving circuit thereof, a signal processing circuit, and the like are mounted are respectively formed in a housing or a structure and combined. The mounting structure by such a combination is formed by mounting each element on a printed circuit board on a flat plate. However, due to the demand for further thinning of mobile phones and the like, the demand for thinning and miniaturization of individual devices has been increasing year by year. To meet these demands, flexible wiring boards are used to make the device thinner and smaller. Attempts have been made to obtain an image pickup apparatus.

例えば、特許文献１では、フレキシブル配線板を挟んで透光性部材と光電変換素子を対向配置した光電変換装置が開示されている。また、特許文献２では、撮像素子とレンズ筐体が搭載された配線基板にフレキシブル配線板が直接接合されている構造が開示されている。 For example, Patent Document 1 discloses a photoelectric conversion device in which a translucent member and a photoelectric conversion element are arranged to face each other with a flexible wiring board interposed therebetween. Patent Document 2 discloses a structure in which a flexible wiring board is directly joined to a wiring board on which an imaging element and a lens housing are mounted.

特許文献１に開示されている図を図８に示す。透光性部材１０１がフレキシブル配線板１０２に接着剤１０３を介して接着されている。フレキシブル配線板１０２は、樹脂フィルム１０４に金属配線パターン１０５が配線されており、開口部１０６が開いている。透光性部材１０１および撮像素子１１２は開口部１０６を挟んで対向設置されている。撮像エリアにマイクロレンズ１１５が形成されている固体撮像素子１１２の電極パッド１１７にバンプ１１３があり、異方性導電膜１１１を介して、フレキシブル基板１０２の金属配線パターン１０５に電気的に接続されている。さらに封止樹脂１１６により、固体撮像素子１１２の接着強度を補強している。 The figure currently disclosed by patent document 1 is shown in FIG. The translucent member 101 is bonded to the flexible wiring board 102 with an adhesive 103. In the flexible wiring board 102, a metal wiring pattern 105 is wired on a resin film 104 and an opening 106 is open. The translucent member 101 and the image sensor 112 are disposed to face each other with the opening 106 interposed therebetween. A bump 113 is provided on the electrode pad 117 of the solid-state imaging device 112 in which the micro lens 115 is formed in the imaging area, and is electrically connected to the metal wiring pattern 105 of the flexible substrate 102 via the anisotropic conductive film 111. Yes. Further, the sealing resin 116 reinforces the adhesive strength of the solid-state image sensor 112.

特許文献２では、配線基板とフレキシブル配線板の接合に異方導電性フィルムと接着剤を用いる点が示されている。異方導電性フィルムは配線基板との電気的接合を確保し、接着剤は接合強度を確保するために用いられている。接着剤はその接着強度を高めるために、フレキシブル配線板の異方導電性フィルムが接していない部分から配線基板の異方導電性フィルムが接していない部分までを覆っている。
特許第３２０７３１９号公報特開２００５−７２９７８号公報 In patent document 2, the point which uses an anisotropic conductive film and an adhesive agent for joining of a wiring board and a flexible wiring board is shown. An anisotropic conductive film ensures electrical bonding with a wiring board, and an adhesive is used to ensure bonding strength. In order to increase the adhesive strength, the adhesive covers the portion of the flexible wiring board that is not in contact with the anisotropic conductive film to the portion of the wiring board that is not in contact with the anisotropic conductive film.
Japanese Patent No. 3307319 JP 2005-72978 A

しかしながら、特許文献１に示される撮像装置においては、フレキシブル配線板のみで透光性部材と光電変換素子を保持するため、剛性を保つことができない。このため、携帯電話などの高い衝撃耐久性や押圧耐久性を要求するものに搭載した場合に、電気接続に問題が発生したり光軸がずれてしまうという課題があった。 However, in the imaging device disclosed in Patent Document 1, since the translucent member and the photoelectric conversion element are held only by the flexible wiring board, the rigidity cannot be maintained. For this reason, when it was mounted on a mobile phone or the like that requires high impact durability and pressure durability, there was a problem that a problem occurred in electrical connection or the optical axis shifted.

また、特許文献２に示される撮像装置においては、フレキシブル配線板を配線基板に接合し接着剤で接合補強を行っているが、固体撮像素子基板が設置されている配線基板が薄くなっていないために固体撮像装置全体を薄くすることができず、接着剤を異方導電性フィルムが接していない部分から配線基板の異方導電性フィルムが接していない部分までを覆うように塗布するためには、個別の固体撮像装置に対して斜め方向から接着剤塗布を行うというような特別な工程が発生するという課題があった。 In the imaging device disclosed in Patent Document 2, the flexible wiring board is joined to the wiring board and the bonding reinforcement is performed with an adhesive, but the wiring board on which the solid-state imaging device board is installed is not thinned. In order to apply the adhesive so as to cover from the portion where the anisotropic conductive film is not in contact to the portion where the anisotropic conductive film is not in contact with the wiring board There has been a problem that a special process of applying an adhesive from an oblique direction to an individual solid-state imaging device occurs.

本発明は、前記実情に鑑みてなされたもので、固体撮像装置の薄型化、小型化が容易で、作業性良く組み立てることができ、高剛性を得ることを目的とする。
また携帯電話等の小型化が可能な優れた固体撮像装置を提供することを目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to easily reduce the thickness and size of a solid-state imaging device, to assemble with good workability, and to obtain high rigidity.
It is another object of the present invention to provide an excellent solid-state imaging device that can be miniaturized, such as a mobile phone.

本発明の固体撮像装置は、開口部を持つ第１のフレキシブル配線板と、前記開口部に符合する開口部を持ち、前記第1のフレキシブル配線板に積層された補強板と、前記開口部を塞ぐように、前記補強板側に装着された透光性部材と、前記フレキシブル配線板側に装着された固体撮像素子基板と、前記第１のフレキシブル配線板に接合された第２のフレキシブル配線板と、前記前記第1のフレキシブル配線板と前記第２のフレキシブル配線板との接合部を覆う樹脂モールド部とを具備したことを特徴とする。
この構成により薄型でかつ、小型でありながらも高剛性を持ち、フレキシブル配線板同士の接続部の接着強度を高めることができる。また、この構成により、配線延長の形状に高い自由度を持つことができるという効果を有している。 A solid-state imaging device according to the present invention includes a first flexible wiring board having an opening, an opening that matches the opening, a reinforcing plate stacked on the first flexible wiring board, and the opening. A translucent member mounted on the reinforcing plate side, a solid-state imaging device substrate mounted on the flexible wiring board side, and a second flexible wiring board joined to the first flexible wiring board so as to close And a resin mold portion that covers a joint portion between the first flexible wiring board and the second flexible wiring board.
With this configuration, it is thin and has high rigidity while being small, and the adhesive strength of the connection portion between the flexible wiring boards can be increased. In addition, this configuration has an effect that the shape of the wiring extension can have a high degree of freedom.

また、本発明は、上記固体撮像装置において、前記第1のフレキシブル配線板上には、部品が搭載されており、前記樹脂モールド部が、前記部品を覆うように形成されたものを含む。
この構成により、より部品の接着性を高め、信頼性の向上をはかることができる。なおここで部品とは、チップ部品、固体撮像素子基板などを含むものとする。 The present invention includes the solid-state imaging device, wherein a component is mounted on the first flexible wiring board, and the resin mold portion is formed so as to cover the component.
With this configuration, it is possible to further improve the adhesiveness of components and improve reliability. Here, the component includes a chip component, a solid-state imaging device substrate, and the like.

また、本発明は、上記固体撮像装置において、前記補強板側には、前記透光性部材及び光学レンズが、前記開口部を挟んで対向設置されたものを含む。 In the solid-state imaging device according to the aspect of the invention, the translucent member and the optical lens may be opposed to each other on the reinforcing plate side with the opening interposed therebetween.

また、本発明は、上記固体撮像装置において、前記補強板側には前記透光性部材及び光学レンズが装着されており、前記光学レンズと前記固体撮像素子基板とが、前記積層基板に形成された基準穴を表裏から共通基準として位置あわせされたものを含む。
この構成により、第１のフレキシブル基板と補強板が同じ外形寸法で積層構造をしており、固体撮像素子基板および透光性部材（あるいは光学レンズ）を搭載する際の基準穴が形成され、その周囲でフレキシブル配線板側に補強板の表面が露出しており、その基準穴を表裏から共通に用いて固体撮像素子基板、透光性部材を設置することができる。そのため、固体撮像装置の薄型化が容易で、作業性良く組み立てることができ、高剛性および光軸合わせの高精度性を得ることができる。その結果、携帯電話等の小型化が可能な優れた固体撮像装置を提供することができる。ここで固体撮像素子基板とはシリコン基板などの半導体基板上に固体撮像素子基板を形成した基板、主として個々のチップに分割したものをいう。また基準穴としては、周縁を壁で囲まれたいわゆる位置決め用の穴だけでなく、一部が外部に連通しているようないわゆる切込み部も含むものとする。さらに、基準穴を基準とした配線パターンや外形などを間接的に位置あわせに用いても構わない。 In the solid-state imaging device according to the present invention, the translucent member and the optical lens are mounted on the reinforcing plate side, and the optical lens and the solid-state imaging element substrate are formed on the laminated substrate. The reference holes are aligned as common reference from the front and back.
With this configuration, the first flexible substrate and the reinforcing plate have a laminated structure with the same outer dimensions, and a reference hole for mounting the solid-state imaging device substrate and the translucent member (or optical lens) is formed. The surface of the reinforcing plate is exposed around the flexible wiring board, and the solid-state imaging device substrate and the translucent member can be installed using the reference hole from the front and back in common. Therefore, the solid-state imaging device can be easily reduced in thickness, can be assembled with good workability, and high rigidity and high accuracy of optical axis alignment can be obtained. As a result, an excellent solid-state imaging device that can be miniaturized, such as a mobile phone, can be provided. Here, the solid-state image pickup device substrate refers to a substrate formed by forming a solid-state image pickup device substrate on a semiconductor substrate such as a silicon substrate, mainly divided into individual chips. The reference hole includes not only a so-called positioning hole whose peripheral edge is surrounded by a wall, but also a so-called cut portion in which a part thereof communicates with the outside. Furthermore, a wiring pattern or an outer shape based on the reference hole may be used indirectly for alignment.

また本発明は、上記固体撮像装置において、前記補強板側には前記透光性部材及び光学レンズが装着されており、前記光学レンズと前記固体撮像素子基板とが、表裏から基準穴を共通基準として位置あわせがなされたものを含む。さらにまた透光性部材もこの基準穴を共通基準として位置あわせがなされるようにするのが望ましい。 According to the present invention, in the solid-state imaging device, the translucent member and the optical lens are mounted on the reinforcing plate side, and the optical lens and the solid-state imaging device substrate have a common reference from the front and back sides. As well as those that have been aligned. Furthermore, it is desirable that the translucent member be aligned with the reference hole as a common reference.

本発明の固体撮像装置に用いる透光性部材を光学フィルタとしても良い。その結果、固体撮像素子への入射光の赤外線領域をカットして良好な撮像特性を得ることができる。 The translucent member used in the solid-state imaging device of the present invention may be an optical filter. As a result, good imaging characteristics can be obtained by cutting the infrared region of the incident light on the solid-state imaging device.

また、本発明の固体撮像装置に用いる補強板を金属板としても良い。その結果、固体撮像装置の高剛性を得ることができる。
また、本発明の固体撮像装置に用いるフレキシブル配線板の配線パターン接地部と金属補強板とが電気接続していても良い。その結果、電気特性の安定性を得ることができる。 The reinforcing plate used in the solid-state imaging device of the present invention may be a metal plate. As a result, high rigidity of the solid-state imaging device can be obtained.
Moreover, the wiring pattern grounding part of the flexible wiring board used for the solid-state imaging device of the present invention and the metal reinforcing plate may be electrically connected. As a result, stability of electrical characteristics can be obtained.

また、本発明の固体撮像装置に用いる固体撮像素子基板の裏面に遮光性膜が形成されていても良い。その結果、薄い固体撮像素子基板の場合に裏面からの光の透過によるノイズの発生を避けることができる。 In addition, a light-shielding film may be formed on the back surface of the solid-state imaging element substrate used in the solid-state imaging device of the present invention. As a result, in the case of a thin solid-state imaging device substrate, it is possible to avoid the generation of noise due to the transmission of light from the back surface.

また、本発明は、上記固体撮像装置において、前記透光性部材を設置する前記補強板の開口部周りの厚みが周囲よりも薄くなっているものを含む。 The present invention includes the solid-state imaging device, wherein the thickness around the opening of the reinforcing plate on which the translucent member is installed is thinner than the surroundings.

また、本発明は、上記固体撮像装置において、前記第２のフレキシブル配線板上にコネクタが配設されたものを含む。 Further, the present invention includes the solid-state imaging device in which a connector is disposed on the second flexible wiring board.

また、本発明は、上記固体撮像装置において、前記固体撮像素子基板および他の搭載された部品に樹脂モールドがなされたものを含む。 The present invention includes the solid-state imaging device, wherein the solid-state imaging device substrate and other mounted components are resin-molded.

また、本発明は、上記固体撮像装置において、前記固体撮像素子基板の裏面に遮光性膜が形成されたものを含む。 Further, the present invention includes the above-described solid-state imaging device in which a light-shielding film is formed on the back surface of the solid-state imaging element substrate.

また、前記遮光性膜は、前記固体撮像素子基板の裏面に形成された金属膜であってもよい。この構成により、薄型でより確実に裏面からの光を遮光することができる。 The light-shielding film may be a metal film formed on the back surface of the solid-state image sensor substrate. With this configuration, light from the back surface can be shielded more reliably with a thin shape.

また、前記遮光性膜は、前記固体撮像素子基板の裏面に形成された遮光性の樹脂膜であってもよい。この構成により、形成が容易でかつ確実に裏面からの光を遮光することができる。 The light-shielding film may be a light-shielding resin film formed on the back surface of the solid-state image sensor substrate. With this configuration, light from the back surface can be shielded easily and reliably.

また、本発明の固体撮像装置の製造方法は、第１のフレキシブル配線板を補強板に貼り付ける工程と、外形をプレス裁断する工程と、前記第１のフレキシブル基板の開口部を塞ぐように固体撮像素子基板を搭載する工程と、補強板の開口部を塞ぐように透光性部材を搭載する工程と、第２のフレキシブル配線板を第１のフレキシブル配線板に接合する工程と、前記固体撮像素子基板および前記第２のフレキシブル配線板と第１のフレキシブル配線板の接合部を覆うように樹脂モールドを行う工程とからなることを特徴としている。そのため簡易に、薄くて、小型でありながらも高剛性を持ち、配線延長の形状に高い自由度を持つ固体撮像装置を製造することができる。 The solid-state imaging device manufacturing method of the present invention includes a step of attaching the first flexible wiring board to the reinforcing plate, a step of press cutting the outer shape, and a solid so as to close the opening of the first flexible substrate. A step of mounting the image pickup device substrate, a step of mounting a translucent member so as to close the opening of the reinforcing plate, a step of bonding the second flexible wiring board to the first flexible wiring board, and the solid-state imaging The method includes a step of resin molding so as to cover the element substrate and the joint between the second flexible wiring board and the first flexible wiring board. Therefore, it is possible to easily manufacture a solid-state imaging device that is thin and small, has high rigidity, and has a high degree of freedom in the shape of wiring extension.

また、本発明の固体撮像装置の製造方法における固体撮像素子基板を搭載する方法として、固体撮像素子基板の配線部にバンプを形成した後に導電性接着剤をバンプに転写して、フレキシブル基板にフリップチップ実装し、熱硬化により電気接合を確保し、接合部周りに封止樹脂を注入する実装方法を用いても良い。その結果、固体撮像素子基板搭載部での熱変形にも対応可能な信頼性の高い電気特性を得ることができる。 In addition, as a method for mounting the solid-state image pickup device substrate in the manufacturing method of the solid-state image pickup device of the present invention, after forming the bump on the wiring portion of the solid-state image pickup device substrate, the conductive adhesive is transferred to the bump and flipped to the flexible substrate A mounting method may be used in which chip bonding is performed, electric bonding is ensured by thermosetting, and a sealing resin is injected around the bonding portion. As a result, it is possible to obtain highly reliable electrical characteristics that can cope with thermal deformation in the solid-state imaging device substrate mounting portion.

このように、本発明の固体撮像装置およびその製造方法を用いることにより、固体撮像装置の薄型化、小型化が可能で、簡易に高剛性を持つ固体撮像装置を製造することができる。その結果、携帯端末装置の薄型化、小型化も可能となる。 As described above, by using the solid-state imaging device and the manufacturing method thereof according to the present invention, the solid-state imaging device can be thinned and miniaturized, and a solid-state imaging device having high rigidity can be easily manufactured. As a result, the mobile terminal device can be reduced in thickness and size.

本発明によれば、開口部を持つ第１のフレキシブル配線板と補強板とを外形形状を同じくして積層一体化するとともに、透光性部材と固体撮像素子基板が開口部を塞ぐように対向設置し、第２のフレキシブル配線板が第１のフレキシブル配線板と接合され、前記前記第1のフレキシブル配線板と前記第２のフレキシブル配線板との接合部を覆うように樹脂モールドしているため、固体撮像装置の薄型化、小型化が可能で、フレキシブル基板同士の接続部の密着強度を高めることができ、簡易に高剛性を持つ固体撮像装置およびその製造方法を提供することができる。 According to the present invention, the first flexible wiring board having the opening and the reinforcing plate are laminated and integrated with the same outer shape, and the translucent member and the solid-state imaging device substrate face each other so as to close the opening. Since the second flexible wiring board is installed and bonded to the first flexible wiring board and is resin-molded so as to cover the joint between the first flexible wiring board and the second flexible wiring board. Further, the solid-state imaging device can be made thinner and smaller, the adhesion strength of the connecting portion between the flexible substrates can be increased, and a solid-state imaging device having high rigidity and a method for manufacturing the same can be easily provided.

以下、本発明に係る実施の形態について図面を参照して詳細に説明する。
（実施の形態１）
図１は、本実施の形態１の固体撮像装置の分解斜視図である。図２は、本実施の形態１の固体撮像装置に用いられるフレキシブル配線板の上面図、図３は、本実施の形態１の固体撮像装置の分解斜視図、図４は、本実施の形態１の固体撮像装置の斜視図、図５は、本実施の形態１の固体撮像装置の斜視図である。
本発明の固体撮像装置は、図１および図５に示すように、第１のフレキシブル配線板１に接合された第２のフレキシブル配線板３０とを具備し、前記前記第1のフレキシブル配線板と前記第２のフレキシブル配線板との接合部を覆う樹脂モールド部(樹脂パッケージ)１８とを具備したことを特徴とするものである。すなわち、この固体撮像装置は、開口部を持つ第１のフレキシブル配線板１と、この第１のフレキシブル配線板１に積層一体化された補強板２とで構成された積層基板と、この積層基板の補強板２側に開口部を塞ぐように設置された透光性部材１４および光学レンズ１５と、この積層基板の第１のフレキシブル配線板１側に設置された固体撮像素子基板１０とを具備し、この補強板２は固体撮像素子基板設置用の基準穴としての切り込み部３と位置決め穴５とを具備しており、この切り込み部３と位置決め穴５との周縁で、前記フレキシブル配線板１側にも補強板２が露出しており、これら２つの基準穴を共通基準として、積層基板の両面で、固体撮像素子基板と、透光性部材１４および光学レンズ１５（レンズ筐体１６）が配置されている。 Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.
(Embodiment 1)
FIG. 1 is an exploded perspective view of the solid-state imaging device according to the first embodiment. 2 is a top view of a flexible wiring board used in the solid-state imaging device of the first embodiment, FIG. 3 is an exploded perspective view of the solid-state imaging device of the first embodiment, and FIG. 4 is the first embodiment. FIG. 5 is a perspective view of the solid-state imaging device of the first embodiment.
As shown in FIGS. 1 and 5, the solid-state imaging device of the present invention includes a second flexible wiring board 30 joined to the first flexible wiring board 1, and the first flexible wiring board and A resin mold portion (resin package) 18 is provided which covers a joint portion with the second flexible wiring board. That is, the solid-state imaging device includes a laminated substrate including a first flexible wiring board 1 having an opening, a reinforcing plate 2 laminated and integrated on the first flexible wiring board 1, and the laminated substrate. A transparent member 14 and an optical lens 15 installed so as to close the opening on the reinforcing plate 2 side, and a solid-state imaging device substrate 10 installed on the first flexible wiring board 1 side of the laminated substrate. The reinforcing plate 2 includes a notch 3 serving as a reference hole for installing the solid-state image pickup device substrate and a positioning hole 5, and the flexible wiring board 1 is formed at the periphery of the notch 3 and the positioning hole 5. The reinforcing plate 2 is also exposed on the side, and the solid image pickup device substrate, the translucent member 14 and the optical lens 15 (lens housing 16) are provided on both sides of the laminated substrate using these two reference holes as a common reference. Arranged

また、この例では、図１に示すように、開口部のあるフレキシブル配線板１と外形形状が同じ大きさの補強板２とを積層一体化している。この場合のフレキシブル配線板１には２５μｍの厚さのポリイミド樹脂フィルムをフィルム基体１ａ（ベースフィルム）として用い、補強板２には１５０μｍの厚さのＳＵＳ板を用いた。そして、このフレキシブル配線板１は図２に上面図を示すように、フィルム基体１ａ上に金属配線パターン１ｂが形成されている。フレキシブル配線板１には金属配線パターン１ｂが形成されている。さらに、固体撮像素子基板１０を電気的に接続するように第１のフレキシブル配線板１上に設置する。そして、延長板として第２のフレキシブル配線板３０をフレキシブル配線板１上に電気的に接続した。この場合の接続には非導電性の接着剤を用いて接着を行い、第１のフレキシブル配線板１の配線パターンと延長板である第２のフレキシブル配線板３０の配線パターン（図示せず）を直接接触させて導通させる方法を取った。この延長フレキシブル配線板３０には、チップ部品１１とコネクタ１２が搭載されており、このコネクタ１２により、携帯機器本体の配線基板（図示せず）と接続する。また、金属配線パターン１ｂの接地部はＳＵＳの補強板２と電気的に接続させている。さらに、このとき用いた固体撮像素子基板１０は裏面に遮光性膜（図示せず）を塗布したものを使用した。 In this example, as shown in FIG. 1, a flexible wiring board 1 having an opening and a reinforcing plate 2 having the same outer shape are laminated and integrated. In this case, a polyimide resin film having a thickness of 25 μm was used as the film substrate 1 a (base film) for the flexible wiring board 1, and a SUS board having a thickness of 150 μm was used for the reinforcing plate 2. The flexible wiring board 1 has a metal wiring pattern 1b formed on a film substrate 1a as shown in a top view in FIG. A metal wiring pattern 1 b is formed on the flexible wiring board 1. Further, the solid-state imaging device substrate 10 is installed on the first flexible wiring board 1 so as to be electrically connected. And the 2nd flexible wiring board 30 was electrically connected on the flexible wiring board 1 as an extension board. In this case, non-conductive adhesive is used for connection, and the wiring pattern of the first flexible wiring board 1 and the wiring pattern (not shown) of the second flexible wiring board 30 as an extension plate are connected. The method of conducting by direct contact was taken. A chip component 11 and a connector 12 are mounted on the extended flexible wiring board 30, and the connector 12 is connected to a wiring board (not shown) of the mobile device body. The grounding portion of the metal wiring pattern 1b is electrically connected to the SUS reinforcing plate 2. Further, the solid-state imaging device substrate 10 used at this time was a substrate having a light-shielding film (not shown) applied to the back surface.

そして、補強板２には基準穴としての切込み部３が形成されており、その周辺に補強板の露出部４を形成している。また、基準穴としての位置決め穴５があり、その周辺に補強板２の露出部６を形成している。つまり、基準穴としての切り込み部３および位置決め穴５は表からも裏からも補強板２で形成した形状が基準として認識できることになる。そして、開口部７が開けられており、その周辺は補強板２の露出部８を形成している。フレキシブル配線板１には金属配線パターン１ｂが形成されており、固体撮像素子基板１０を電気的に接続するように設置されている。第１のフレキシブル配線板１上には金属配線パターン１ｂと接続するようにチップ部品１１が設置されている。また、金属配線パターン１ｂの接地部はＳＵＳの補強板２と電気接続がなされている。さらに、このとき用いた固体撮像素子基板１０は裏面に遮光膜として黒色のエポキシ樹脂膜（図示せず）を塗布したものを使用した。なおこの遮光膜としては、固体撮像素子基板１０の裏面に成膜されたタングステン薄膜などの金属膜であってもよい。 The reinforcing plate 2 is formed with a cut portion 3 as a reference hole, and an exposed portion 4 of the reinforcing plate is formed around the cut portion 3. Further, there is a positioning hole 5 as a reference hole, and an exposed portion 6 of the reinforcing plate 2 is formed around the positioning hole 5. That is, the cut portion 3 and the positioning hole 5 as the reference holes can be recognized as the reference from the shape formed by the reinforcing plate 2 from the front and the back. And the opening part 7 is opened, The periphery forms the exposed part 8 of the reinforcement board 2. As shown in FIG. A metal wiring pattern 1b is formed on the flexible wiring board 1, and is installed so as to electrically connect the solid-state imaging device substrate 10. A chip component 11 is installed on the first flexible wiring board 1 so as to be connected to the metal wiring pattern 1b. The ground portion of the metal wiring pattern 1b is electrically connected to the SUS reinforcing plate 2. Furthermore, the solid-state image pickup device substrate 10 used at this time used a back surface coated with a black epoxy resin film (not shown) as a light shielding film. The light shielding film may be a metal film such as a tungsten thin film formed on the back surface of the solid-state imaging device substrate 10.

このような構成を持つことにより、フレキシブル基板１の薄さのメリットを活かしながら同じ外形を持つ補強板２による高強度性を確保し、さらに、フレキシブル配線板同士の接続部の密着強度を高めることができる。 By having such a configuration, the strength of the reinforcing plate 2 having the same outer shape is secured while taking advantage of the thinness of the flexible substrate 1, and further, the adhesion strength of the connection portion between the flexible wiring boards is increased. Can do.

また、基準穴としての切込み部３や位置決め穴５は、固体撮像素子基板１０を設置するときの基準となり、反対側にレンズ筐体１６を設置するときにも共通の基準として使用することができるため、固体撮像素子基板１０と光学レンズ１５との光軸を高精度で合わせることができる。補強板の露出部４、６を形成することにより第１のフレキシブル配線板１のズレや端面における突起物等の基準認識の邪魔になるようなものを避けることができ、ＳＵＳ端面の高精度性での形状を確保することができる。 Further, the notch 3 or the positioning hole 5 as a reference hole serves as a reference when installing the solid-state imaging device substrate 10 and can be used as a common reference when installing the lens housing 16 on the opposite side. Therefore, the optical axes of the solid-state imaging device substrate 10 and the optical lens 15 can be aligned with high accuracy. By forming the exposed portions 4 and 6 of the reinforcing plate, it is possible to avoid an obstacle to the reference recognition such as a deviation of the first flexible wiring board 1 and a projection on the end surface, and the high accuracy of the SUS end surface. The shape at can be secured.

また、開口部７周辺の補強板の露出部８も同様に固体撮像素子基板１０の撮像エリアに対する遮蔽物等の発生を抑制し、撮像エリアを高精度で確保することができる。第１のフレキシブル配線板１の表面にチップ部品１１を搭載することにより、電気配線設計の自由度が高まる。つまり固体撮像素子近傍にチップ部品をおくことができ、電気特性の最適化を図ることができる。また、コネクタ１２を第２のフレキシブル基板３０上に搭載することにより固体撮像素子基板１０からの信号を第１のフレキシブル基板１およびこれに直接接続された第２のフレキシブル基板３０を介して外部に取り出すことができて、携帯機器との接続を自由に行うことができる。第１のフレキシブル配線板１を補強板２よりも大きくしてそのままフレキシブル配線として使用した場合には、補強板２との段差部での折れ曲がりによる配線切れが発生してしまうことがあるため、このように分離状態から接続することが好ましい。また、金属配線パターン１ｂをＳＵＳの補強板２に電気接続しているので、ノイズ抑制や静電遮蔽が行えるため、電気特性の安定性を得ることができる。さらに、固体撮像素子基板１０の裏面にタングステンなどの金属薄膜からなる遮光性膜が塗布されているので、固体撮像素子基板１０の裏面からの光入射による撮像信号のノイズの低減を図ることができる。 Similarly, the exposed portion 8 of the reinforcing plate around the opening 7 can also suppress the occurrence of a shield or the like with respect to the imaging area of the solid-state imaging device substrate 10 and can secure the imaging area with high accuracy. By mounting the chip component 11 on the surface of the first flexible wiring board 1, the degree of freedom of electrical wiring design is increased. That is, a chip component can be placed in the vicinity of the solid-state imaging device, and electrical characteristics can be optimized. Further, by mounting the connector 12 on the second flexible substrate 30, a signal from the solid-state imaging device substrate 10 can be transmitted to the outside through the first flexible substrate 1 and the second flexible substrate 30 directly connected thereto. It can be taken out and can be freely connected to a portable device. When the first flexible wiring board 1 is made larger than the reinforcing plate 2 and used as it is as a flexible wiring, the wiring breakage may occur due to the bending at the step portion with the reinforcing plate 2. Thus, it is preferable to connect from a separated state. In addition, since the metal wiring pattern 1b is electrically connected to the SUS reinforcing plate 2, noise suppression and electrostatic shielding can be performed, so that stability of electrical characteristics can be obtained. Furthermore, since a light-shielding film made of a metal thin film such as tungsten is applied to the back surface of the solid-state image sensor substrate 10, noise of the image signal due to light incidence from the back surface of the solid-state image sensor substrate 10 can be reduced. .

このような構成を持つことにより、第１のフレキシブル配線板１の薄さのメリットを活かしながら同じ外形を持つ補強板２による高強度性を確保することができる。また、第２のフレキシブル配線板３０にコネクタ１２を別途準備することにより、本来のフレキシブル特性を活かしながら、自由度の高い延長ケーブル形状、コネクタ形状を選択することができる。また、コネクタ１２に不具合が発生しているかどうかを確認したうえで、第１のフレキシブル配線板１と接続することができるため、コネクタ１２の不良の発生に起因して高価な固体撮像素子基板１０ごと固体撮像装置がＮＧとなってしまうような事態を回避することができ、結果としてコストの低減を図ることができる。また、このコネクタを用いて、携帯機器本体に容易に電気接続することができる。また、金属配線パターン１ｂをＳＵＳの補強板２に電気接続しているので、ノイズ抑制や静電遮蔽が行えるため、電気特性の安定性を得ることができる。さらに、固体撮像素子基板１０の裏面に遮光性膜が塗布されているので、固体撮像素子基板１０裏面からの光入射による撮像信号のノイズを無くすことができる。 By having such a configuration, it is possible to ensure high strength by the reinforcing plate 2 having the same outer shape while taking advantage of the thinness of the first flexible wiring board 1. Further, by separately preparing the connector 12 on the second flexible wiring board 30, it is possible to select an extended cable shape and a connector shape with a high degree of freedom while utilizing the original flexible characteristics. Further, since it is possible to connect to the first flexible wiring board 1 after confirming whether or not a failure has occurred in the connector 12, the expensive solid-state image pickup device substrate 10 is caused by the occurrence of a defect in the connector 12. Thus, it is possible to avoid a situation where the solid-state imaging device becomes NG, and as a result, it is possible to reduce the cost. In addition, this connector can be easily electrically connected to the mobile device body. In addition, since the metal wiring pattern 1b is electrically connected to the SUS reinforcing plate 2, noise suppression and electrostatic shielding can be performed, so that stability of electrical characteristics can be obtained. Furthermore, since the light-shielding film is applied to the back surface of the solid-state image sensor substrate 10, noise of the image signal due to light incidence from the back surface of the solid-state image sensor substrate 10 can be eliminated.

図３は、本実施の形態１の固体撮像装置の分解斜視図であり、図１の固体撮像装置を裏面から見たものである。
第１のフレキシブル配線板１と外形形状が同じ大きさの補強板２とを積層一体化しており、基準穴としての切込み部３と位置決め穴５とを形成している。そして、補強板２にも開口部７が開けてあり、その周辺には補強板２の全体厚みよりも薄い段差部１３を形成している。透光性部材１４をこの段差部１３に落とし込んで補強板２に設置する。透光性部材１４には、赤外線カットフィルタ機能を持つガラスを使用した。そして、光学レンズ１５と一体化したレンズ筐体１６には、基準突起部１７が形成されている。図に示している基準突起部１７は基準穴としての位置決め穴５に嵌合するものであり、切込み部３に嵌合する基準となる突起は図示していないが同様に形成されている。３０は第２のフレキシブル配線板である。 FIG. 3 is an exploded perspective view of the solid-state imaging device of the first embodiment, and is a view of the solid-state imaging device of FIG.
The first flexible wiring board 1 and the reinforcing plate 2 having the same outer shape are laminated and integrated to form a cut portion 3 and a positioning hole 5 as a reference hole. An opening 7 is also formed in the reinforcing plate 2, and a step 13 that is thinner than the entire thickness of the reinforcing plate 2 is formed around the opening 7. The translucent member 14 is dropped into the step portion 13 and installed on the reinforcing plate 2. For the translucent member 14, glass having an infrared cut filter function was used. A reference protrusion 17 is formed on the lens housing 16 integrated with the optical lens 15. The reference protrusion 17 shown in the drawing is fitted into the positioning hole 5 as a reference hole, and the reference protrusion to be fitted into the notch 3 is not shown, but is similarly formed. Reference numeral 30 denotes a second flexible wiring board.

このような構成を持つことにより、透光性部材１４の位置ずれを無くし、接着用の接着剤の余分なエリアへの拡がりも抑制しながら、透光性部材１４を開口部７を塞ぐように段差部１３へと接着することができる。また、レンズ筐体１６の基準突起部１７を基準穴としての位置決め穴５や基準穴としての切り込み部３へと嵌合することにより、反対側の固体撮像素子基板１０と共通の基準とすることができるため、高精度の光軸合わせを行うことができる。 By having such a configuration, the translucent member 14 is closed so that the position of the translucent member 14 is eliminated and the spreading of the adhesive for bonding to an excessive area is suppressed, while the opening 7 is closed. It can be bonded to the stepped portion 13. Further, by fitting the reference projection 17 of the lens housing 16 into the positioning hole 5 as a reference hole or the notch 3 as a reference hole, the reference is common to the solid-state image sensor substrate 10 on the opposite side. Therefore, highly accurate optical axis alignment can be performed.

図４は本実施の形態１の固体撮像装置の斜視図であり、図１と同じ側から見た図である。
フレキシブル配線板１と外形形状が同じ大きさの補強板２とを積層一体化しており、基準穴としての切込み部３と基準穴としての位置決め穴５を形成している。そして、フレキシブル配線板１とフレキシブル配線板３０との接合部を覆うようにモールド樹脂１８を形成している。この場合、固体撮像素子基板１０、チップ部品１１も含めてモールド樹脂１８で覆っている。そして、基準穴としての切込み部３を避けるようにモールド樹脂切込み部１９を形成している。また、図示していないが、基準穴５からはモールド樹脂１８がはみ出ておらずレンズ筐体１６の基準突起部１７の勘合には支障が無いようにしている。 FIG. 4 is a perspective view of the solid-state imaging device according to the first embodiment, and is a view seen from the same side as FIG.
A flexible wiring board 1 and a reinforcing plate 2 having the same outer shape are laminated and integrated, and a cut portion 3 as a reference hole and a positioning hole 5 as a reference hole are formed. Then, the mold resin 18 is formed so as to cover the joint portion between the flexible wiring board 1 and the flexible wiring board 30. In this case, the solid-state imaging device substrate 10 and the chip component 11 are covered with the mold resin 18. And the mold resin notch part 19 is formed so that the notch part 3 as a reference | standard hole may be avoided. Although not shown, the mold resin 18 does not protrude from the reference hole 5 so that the fitting of the reference protrusion 17 of the lens housing 16 is not hindered.

このような構成をとることにより、固体撮像素子基板１０やチップ部品１１の部品脱落を防ぎ、強固に接着しておくことができる。さらに固体撮像素子基板１０の裏面にもモールド樹脂１８を形成することにより、固体撮像素子基板１０の裏面からの透過光によるノイズを抑制することができる。固体撮像素子基板１０の裏面からの透過光をより抑制するために固体撮像素子基板１０の裏面に前述したように遮光膜が形成されていても良い。モールド樹脂１８についてもモールド樹脂切込み部１９を確保するようにモールドすることにより、基準穴としての切り込み部３への遮蔽物の進入を無くすことができる。 By adopting such a configuration, it is possible to prevent the solid-state image pickup device substrate 10 and the chip component 11 from falling off and firmly adhere to each other. Furthermore, by forming the mold resin 18 on the back surface of the solid-state image sensor substrate 10, noise due to transmitted light from the back surface of the solid-state image sensor substrate 10 can be suppressed. In order to further suppress the transmitted light from the back surface of the solid-state image sensor substrate 10, a light shielding film may be formed on the back surface of the solid-state image sensor substrate 10 as described above. By molding the mold resin 18 so as to ensure the mold resin cut portion 19, it is possible to eliminate the entry of the shielding object into the cut portion 3 as a reference hole.

図５は、本実施の形態１の固体撮像装置の斜視図であり、図３と同じ側から見た図である。
モールド樹脂１８が形成されたフレキシブル配線板１と補強板２の上からレンズ筐体１６が搭載されている。固体撮像素子基板１０の設置と同じ基準を用いているので、高精度の光軸合わせを行うことができる。 FIG. 5 is a perspective view of the solid-state imaging device according to the first embodiment, and is a view seen from the same side as FIG.
A lens housing 16 is mounted on the flexible wiring board 1 and the reinforcing plate 2 on which the mold resin 18 is formed. Since the same standard as the installation of the solid-state image pickup device substrate 10 is used, highly accurate optical axis alignment can be performed.

（実施の形態２）
図６は、本実施の形態２の固体撮像装置の製造方法を示す断面図である。
図７は、本実施の形態２の固体撮像装置の製造方法を示す断面図である。
図６(ａ)において、フレキシブル配線板１を構成するフレキシブル基材１ａにビアを通し、両面に金属層からなる配線パターン１ｂの配線を形成する。フレキシブル基材ａには２５μｍの厚さのポリイミドフィルムを使用した。この場合、多数個取りの配線パターン１ｂを一度に形成した。 (Embodiment 2)
FIG. 6 is a cross-sectional view illustrating a method for manufacturing the solid-state imaging device according to the second embodiment.
FIG. 7 is a cross-sectional view illustrating the method for manufacturing the solid-state imaging device according to the second embodiment.
In FIG. 6A, vias are passed through a flexible substrate 1a constituting the flexible wiring board 1, and wiring of a wiring pattern 1b made of a metal layer is formed on both surfaces. A polyimide film having a thickness of 25 μm was used for the flexible substrate a. In this case, a multi-piece wiring pattern 1b was formed at a time.

図６（ｂ）において、補強板２をフレキシブル基板の全面に貼り付けた。補強板には、１５０μｍの厚さのＳＵＳ板を用いた。フレキシブル配線板１と補強板２の貼り付けには、導電性接着剤（図示せず）を用いて接着した。そのため、フレキシブル配線板１の配線の接地部とＳＵＳ板を用いた補強板２とが電気的に接続している。図示していないが、補強板２側で接地したくない配線パターンの表面には絶縁膜を形成している。 In FIG.6 (b), the reinforcement board 2 was affixed on the whole surface of the flexible substrate. As the reinforcing plate, a SUS plate having a thickness of 150 μm was used. The flexible wiring board 1 and the reinforcing board 2 were bonded using a conductive adhesive (not shown). Therefore, the grounding part of the wiring of the flexible wiring board 1 and the reinforcing plate 2 using the SUS board are electrically connected. Although not shown, an insulating film is formed on the surface of the wiring pattern that is not desired to be grounded on the reinforcing plate 2 side.

図６（ｃ）においては、フレキシブル配線板１と補強板２を積層一体化した後に外形をプレス裁断により個片に切り落とした。
図６（ｄ）においては、基準穴としての位置決め穴５または切込み部３および開口部７をエッチングにより穴を開け、穴部周りは補強板の露出部４、６を確保した。また開口部７の補強板２側には、透光性部材を搭載するための段差部１３を形成した。このようにして、本発明の固体撮像装置用の実装基板としての積層基板を作製した。 In FIG. 6C, after the flexible wiring board 1 and the reinforcing board 2 were laminated and integrated, the outer shape was cut into individual pieces by press cutting.
In FIG. 6D, the positioning hole 5 as the reference hole or the notch 3 and the opening 7 are formed by etching, and the exposed portions 4 and 6 of the reinforcing plate are secured around the hole. Further, a stepped portion 13 for mounting a translucent member was formed on the reinforcing plate 2 side of the opening 7. In this way, a multilayer substrate as a mounting substrate for the solid-state imaging device of the present invention was produced.

このようにして形成された積層基板（図７（ａ））を用い、図７（ｂ）に示すように、補強板２の段差部１３に透光性部材１４を接着し、透光性部材１４に対向して開口部を塞ぐようにフレキシブル配線板１の金属配線パターン１ｂに固体撮像素子基板１０を設置した。このとき、固体撮像素子基板１０の電極（図示せず）上にバンプ１０ｂを形成し、その先端に導電性接着剤１０ｃを転写形成した。このときのバンプ１０ｂは金線で形成し、導電性接着剤１０ｃは銀ペーストとした。基準穴５を基準として固体撮像素子基板１０を金属配線パターン１ｂ上に設置した後に、導電性接着剤１ｃを加熱硬化した。続いて接続部の補強のために封止樹脂９を注入して加熱硬化した。 Using the multilayer substrate thus formed (FIG. 7A), as shown in FIG. 7B, a translucent member 14 is bonded to the step portion 13 of the reinforcing plate 2, and the translucent member is obtained. The solid-state imaging device substrate 10 was placed on the metal wiring pattern 1 b of the flexible wiring board 1 so as to face the opening 14 and close the opening. At this time, a bump 10b was formed on an electrode (not shown) of the solid-state imaging device substrate 10, and a conductive adhesive 10c was transferred and formed on the tip thereof. The bump 10b at this time was formed of a gold wire, and the conductive adhesive 10c was a silver paste. After installing the solid-state imaging device substrate 10 on the metal wiring pattern 1b with the reference hole 5 as a reference, the conductive adhesive 1c was heat-cured. Subsequently, the sealing resin 9 was injected and cured by heating to reinforce the connection.

そして図７（ｃ）に示すように、延長板としての第２のフレキシブル配線板３０を第１のフレキシブル配線板１に接合した。このときの接合には、非導電性接着剤（図示せず）を使用し、第１のフレキシブル配線板１の配線パターン１ｂと延長板としての第２のフレキシブル配線板３０の配線パターンを直接接触させて導通させる方法を取った。そして、第１のフレキシブル配線板１と第２のフレキシブル配線板２との接合部を覆うようにモールド樹脂１８を形成する。このとき、固体撮像素子基板１０およびチップ部品１１も含めて覆うようにする。そして、光学レンズ１５を搭載したレンズ筐体１６を設置することにより固体撮像装置が完成する。 Then, as shown in FIG. 7C, the second flexible wiring board 30 as an extension plate was joined to the first flexible wiring board 1. For the bonding at this time, a non-conductive adhesive (not shown) is used, and the wiring pattern 1b of the first flexible wiring board 1 and the wiring pattern of the second flexible wiring board 30 as an extension plate are in direct contact with each other. I took the method of making it conduct. Then, a mold resin 18 is formed so as to cover the joint portion between the first flexible wiring board 1 and the second flexible wiring board 2. At this time, the solid-state imaging device substrate 10 and the chip component 11 are also covered. And the solid-state imaging device is completed by installing the lens housing | casing 16 which mounts the optical lens 15. FIG.

このような製造方法をとることにより、簡易に、薄型で、高剛性で、フレキシブル配線板同士の接続部の密着強度を高めることができるために高精度と高信頼性を持ち、さらに、延長ケーブルに自由度の高い固体撮像装置を製造することができる。 By adopting such a manufacturing method, it is simple, thin, highly rigid, and can increase the adhesion strength of the connection part between flexible wiring boards, so it has high accuracy and high reliability. In addition, a solid-state imaging device with a high degree of freedom can be manufactured.

また、本発明の固体撮像装置においては固体撮像素子基板の裏面からモールド樹脂１８で覆うことで、固体撮像素子やチップ部品の実装強度を補強することができる。 Further, in the solid-state imaging device of the present invention, the mounting strength of the solid-state imaging device and the chip component can be reinforced by covering the back surface of the solid-state imaging device substrate with the mold resin 18.

また、フレキシブル基板と補強板が同じ外形寸法で積層構造をしており、固体撮像素子基板および透光性部材あるいは光学レンズを搭載する際の基準穴もしくは切込みが形成され、その周囲でフレキシブル配線板側に補強板の表面が露出しており、その基準穴を表裏から共通に用いて固体撮像素子基板、透光性部材を設置することができる。従って、固体撮像装置の薄型化が容易で、作業性良く組み立てることができ、高剛性および光軸合わせの高精度性を得ることができる。 In addition, the flexible substrate and the reinforcing plate have a laminated structure with the same outer dimensions, and a reference hole or a notch for mounting a solid-state image pickup device substrate and a translucent member or an optical lens is formed. The surface of the reinforcing plate is exposed on the side, and the solid-state imaging device substrate and the translucent member can be installed using the reference hole from the front and back in common. Therefore, the solid-state imaging device can be easily reduced in thickness, can be assembled with good workability, and high rigidity and high accuracy of optical axis alignment can be obtained.

なおこの穴は貫通穴でなくても切り込みであってもよい。 The hole may not be a through hole but may be a cut.

また、上記実施の形態において、透光性部材として光学フィルタを用いるようにすれば、固体撮像素子基板への入射光の赤外線領域をカットして良好な撮像特性を得ることができる。 In the above embodiment, if an optical filter is used as the translucent member, the infrared region of the incident light on the solid-state image sensor substrate can be cut to obtain good imaging characteristics.

また、本発明の固体撮像装置に用いる透光性部材を設置する補強板の開口部周りの厚みが周囲よりも薄くなっていても良い。その結果、透光性部材の位置ずれを無くし、設置用の接着剤の拡がりも抑制することができる。 Further, the thickness around the opening of the reinforcing plate on which the translucent member used in the solid-state imaging device of the present invention is installed may be thinner than the surroundings. As a result, the displacement of the translucent member can be eliminated and the spread of the adhesive for installation can be suppressed.

なお、固体撮像素子基板と光学レンズとの位置あわせの必要性についてはいうまでもないが、透光性部材と固体撮像素子基板との位置あわせも重要である。この理由について説明する。
光学レンズから出た光は固体撮像素子基板に向かって広がるように設計されており、正確には射出瞳位置から光が出てくるようになっている。このため、透光性部材１４で構成される光学フィルタの大きさとしては板状部材の開口に対して接着部分を加えた寸法が必要となる。また、フィルタはワークサイズ（分割前の板材）が蒸着装置の中で均一な成膜をするために制限があり、ワークサイズは70mm角程である。そしてワークサイズから製品にする際にダイヤモンドブレードなどでダイシングし分割するため、つまりワークサイズからの取り数でコストが決まることになる。そこで接着面積を含めてサイズを最小にすることでコストを圧縮することができる。また大きなフィルタを用いると、平面的にフィルタと固体撮像素子が重なることになる。固体撮像素子の中央部は有効撮像エリアと呼ばれ実際に光をフォトトランジスタ（Tr）で電気信号に光電変換する領域であり、この有効エリアの外側には周辺回路などがあり、その外側に配線用の電極が設けられている。従って、配線部分と光学フィルタが重なってくると厚さ方向（光軸方向）にそれぞれ配置するため厚さが厚くなってくる。以上の観点から、薄型化とコスト低減を実現するために小さなフィルタを用いるのが望ましく、したがって上述したように光線の有効範囲を確実にカバーするために透光性部材の精度が必要となる。 Needless to say, the alignment of the solid-state imaging device substrate and the optical lens is important, but the alignment of the translucent member and the solid-state imaging device substrate is also important. The reason for this will be described.
The light emitted from the optical lens is designed so as to spread toward the solid-state image pickup device substrate, and precisely the light comes out from the exit pupil position. For this reason, the size of the optical filter constituted by the translucent member 14 is required to have a size obtained by adding an adhesive portion to the opening of the plate-like member. In addition, the filter has a limitation in that the work size (plate material before division) is uniformly formed in the vapor deposition apparatus, and the work size is about 70 mm square. When the workpiece size is changed to a product, the cost is determined by dicing and dividing with a diamond blade or the like, that is, the number of workpieces taken from the workpiece size. Therefore, the cost can be reduced by minimizing the size including the adhesion area. If a large filter is used, the filter and the solid-state image sensor overlap in a plane. The central part of the solid-state image sensor is called the effective imaging area and is the area where the light is actually photoelectrically converted into an electrical signal by a phototransistor (Tr). There are peripheral circuits outside this effective area, and the wiring is on the outside. Electrodes are provided. Accordingly, when the wiring portion and the optical filter overlap, the thickness increases because they are arranged in the thickness direction (optical axis direction). From the above viewpoint, it is desirable to use a small filter in order to realize a reduction in thickness and cost. Therefore, as described above, the accuracy of the translucent member is required to reliably cover the effective range of the light beam.

また、上述したように固体撮像装置に用いる固体撮像素子基板の裏面には遮光性膜が形成されていても良く、その結果、薄い固体撮像素子基板の場合に裏面からの光の透過によるノイズの発生を避けることができる。
この遮光性膜は、固体撮像素子基板の裏面に形成された金属膜であってもよい。この構成により、薄型でより確実に裏面からの光を遮光することができる。
また、この遮光性膜は、前記固体撮像素子基板の裏面に形成された遮光性の樹脂膜であってもよい。この構成により、形成が容易でかつ確実に裏面からの光を遮光することができる。 Further, as described above, a light-shielding film may be formed on the back surface of the solid-state imaging device substrate used in the solid-state imaging device. As a result, in the case of a thin solid-state imaging device substrate, noise caused by light transmission from the back surface Occurrence can be avoided.
This light-shielding film may be a metal film formed on the back surface of the solid-state imaging device substrate. With this configuration, light from the back surface can be shielded more reliably with a thin shape.
The light-shielding film may be a light-shielding resin film formed on the back surface of the solid-state imaging device substrate. With this configuration, light from the back surface can be shielded easily and reliably.

なお前記実施の形態では、第１のフレキシブル配線板と補強板とは、貼り合わせてから開口部を形成したが、このとき、レーザなどで切断することにより、フレキシブル配線板の端縁を丸く形成することができ、屑の発生を防ぎ、撮像領域のコンタミを防ぐことができる。 In the above embodiment, the first flexible wiring board and the reinforcing board are bonded together to form the opening. At this time, the edge of the flexible wiring board is formed round by cutting with a laser or the like. It is possible to prevent generation of dust and contamination of the imaging region.

本発明の固体撮像装置は、薄型化、小型化が可能で、簡易に高剛性を持つことから、携帯電話などの携帯端末への使用に有効である。 The solid-state imaging device of the present invention can be reduced in thickness and size, and has high rigidity easily, so that it is effective for use in a mobile terminal such as a mobile phone.

本実施の形態１の固体撮像装置の分解斜視図1 is an exploded perspective view of the solid-state imaging device according to the first embodiment. 本実施の形態１の固体撮像装置に用いられるフレキシブル配線板の上面図Top view of a flexible wiring board used in the solid-state imaging device of the first embodiment 本実施の形態１の固体撮像装置の分解斜視図1 is an exploded perspective view of the solid-state imaging device according to the first embodiment. 本実施の形態１の固体撮像装置の斜視図The perspective view of the solid-state imaging device of this Embodiment 1. 本実施の形態１の固体撮像装置の斜視図The perspective view of the solid-state imaging device of this Embodiment 1. 本実施の形態２の固体撮像装置の製造方法を示す固体撮像装置の断面図Sectional drawing of the solid-state imaging device which shows the manufacturing method of the solid-state imaging device of this Embodiment 2. 本実施の形態２の固体撮像装置の製造方法を示す固体撮像装置の断面図Sectional drawing of the solid-state imaging device which shows the manufacturing method of the solid-state imaging device of this Embodiment 2. 従来の固体撮像装置の断面図Sectional view of a conventional solid-state imaging device

Explanation of symbols

１第１のフレキシブル配線板
１ａフィルム基体
１ｂ金属配線パターン
２補強板
３基準切込み部
４、６、８補強板の露出部
５基準穴
７開口部
９封止樹脂
１０固体撮像素子基板
１０ｂバンプ
１０ｃ導電性接着剤
１１チップ部品
１２コネクタ
１３段差部
１４透光性部材
１５光学レンズ
１６レンズ筐体
１７基準突起部
１８モールド樹脂
１９モールド樹脂切込み部
３０第２のフレキシブル配線板 DESCRIPTION OF SYMBOLS 1 1st flexible wiring board 1a Film base | substrate 1b Metal wiring pattern 2 Reinforcement board
3 Reference cutting part 4, 6, 8 Exposed part of reinforcing plate
5 Reference hole 7 Opening
DESCRIPTION OF SYMBOLS 9 Sealing resin 10 Solid-state image sensor substrate 10b Bump 10c Conductive adhesive 11 Chip component 12 Connector 13 Step part 14 Translucent member 15 Optical lens 16 Lens housing 17 Reference protrusion part 18 Mold resin 19 Mold resin cutting part 30 1st 2 Flexible wiring board

Claims

A first flexible wiring board having an opening;
A reinforcing plate having an opening coinciding with the opening, and laminated on the first flexible wiring board;
A translucent member mounted on the reinforcing plate side so as to close the opening, and a solid-state imaging device substrate mounted on the flexible wiring board side;
A second flexible wiring board joined to the first flexible wiring board;
A solid-state imaging device comprising: a resin mold portion that covers a joint portion between the first flexible wiring board and the second flexible wiring board.

The solid-state imaging device according to claim 1,
A component is mounted on the first flexible wiring board,
The solid-state imaging device formed so that the said resin mold part may cover the said components.

The solid-state imaging device according to claim 1 or 2,
A solid-state imaging device in which an optical lens is installed on the reinforcing plate side.

The solid-state imaging device according to claim 1, wherein
The solid-state imaging device in which the optical lens and the solid-state imaging device substrate are aligned using a reference hole formed in the laminated substrate as a common reference from the front and back.

The solid-state imaging device according to claim 1,
The translucent member is a solid-state imaging device which is an optical filter.

The solid-state imaging device according to any one of claims 1 to 5,
A solid-state imaging device in which the reinforcing plate is a metal plate.

The solid-state imaging device according to claim 6,
A solid-state imaging device in which a ground portion of a wiring pattern of the first flexible wiring board is electrically connected to the reinforcing plate.

The solid-state imaging device according to claim 1,
A solid-state imaging device in which a thickness around an opening of the reinforcing plate on which the translucent member is installed is thinner than the surroundings.

The solid-state imaging device according to any one of claims 1 to 8,
A solid-state imaging device in which a connector is disposed on the second flexible wiring board.

The solid-state imaging device according to claim 1,
A solid-state imaging device in which a light-shielding film is formed on the back surface of the solid-state imaging device substrate.

The solid-state imaging device according to claim 10,
The solid-state imaging device, wherein the light-shielding film is a metal film formed on a back surface of the solid-state imaging element substrate.

The solid-state imaging device according to claim 10,
The solid-state imaging device, wherein the light-shielding film is a light-shielding resin film formed on a back surface of the solid-state imaging element substrate.

A step of attaching the first flexible wiring board to the reinforcing plate, a step of mounting the solid-state imaging device substrate so as to close the opening of the first flexible wiring board, and a translucency so as to close the opening of the reinforcing plate A step of mounting the member, a step of bonding the second flexible wiring board to the first flexible wiring board, and a joint portion of the solid-state imaging device substrate and the second flexible wiring board and the first flexible wiring board. A method for manufacturing a solid-state imaging device, comprising: a step of performing resin molding so as to cover.

It is a manufacturing method of the solid-state imaging device according to claim 13,
In the step of mounting the solid-state image pickup device substrate, after forming bumps on the wiring portion of the solid-state image pickup device substrate, the conductive adhesive is transferred to the bumps, flip-chip mounted on a flexible substrate, and electrically by thermosetting. A method for manufacturing a solid-state imaging device, including a step of bonding and injecting a sealing resin around a bonded portion.