JP2002152606A - Solid-state imaging unit - Google Patents
Solid-state imaging unitInfo
- Publication number
- JP2002152606A JP2002152606A JP2000339297A JP2000339297A JP2002152606A JP 2002152606 A JP2002152606 A JP 2002152606A JP 2000339297 A JP2000339297 A JP 2000339297A JP 2000339297 A JP2000339297 A JP 2000339297A JP 2002152606 A JP2002152606 A JP 2002152606A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state imaging
- adhesive
- imaging device
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 53
- 239000000853 adhesive Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 238000004381 surface treatment Methods 0.000 claims abstract description 3
- 230000003044 adaptive effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 4
- 238000001444 catalytic combustion detection Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000012945 sealing adhesive Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Light Receiving Elements (AREA)
- Lens Barrels (AREA)
- Cameras In General (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、主として、ビデオ
カメラ、デジタルスチルカメラなどに用いられる小型の
固体撮像装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small-sized solid-state imaging device mainly used for a video camera, a digital still camera and the like.
【０００２】[0002]
【従来の技術】ビデオカメラ、デジタルスチルカメラな
どの画像入力機器に用いられるCCD,CMOSセンサーなどの
固体撮像素子は、シリコンウェハなどの半導体基板上に
形成される。そして、半導体基板上での所要の工程を終
了した後で、シリコンウェハ上には、カラーフィルター
及びマイクロレンズ形成工程において、アクリル系樹脂
材料を用いて、カラーフィルター及びマイクロレンズ
が、その順で積層される。そして、その後の工程で必要
な寸法に分割され、固体撮像素子チップは、外装セラミ
ックパッケージに納められ、固体撮像装置として構成さ
れる。2. Description of the Related Art Solid-state imaging devices such as CCDs and CMOS sensors used for image input devices such as video cameras and digital still cameras are formed on semiconductor substrates such as silicon wafers. After completing the required steps on the semiconductor substrate, the color filter and the microlens are laminated on the silicon wafer in the color filter and microlens forming step using an acrylic resin material in that order. Is done. Then, the solid-state imaging device chip is divided into necessary dimensions in the subsequent steps, and the solid-state imaging device chip is housed in an external ceramic package to be configured as a solid-state imaging device.
【０００３】従来、この固体撮像素子チップは、前記パ
ッケージ内で、ワイヤーボンディングにより、チップと
リード間の電気的接続をとり、ガラス基板のキャップを
前記パッケージ上に接着した構成になっている。Conventionally, this solid-state imaging device chip has a structure in which an electrical connection between the chip and a lead is established by wire bonding in the package, and a cap of a glass substrate is adhered to the package.
【０００４】近年、デジタルカメラなどで機器の小型化
のため、上記CCD,CMOSセンサなどの固体撮像素子の小型
化、薄型化、軽量なパッケージ化が望まれており、中で
も、特開平０７-０９９２１４号公報に開示されている
ような、TOG(１９９８年１０月電子画像学会 東芝発
表)などが知られている。In recent years, in order to reduce the size of devices such as digital cameras, it has been desired to reduce the size, thickness, and weight of solid-state imaging devices such as CCDs and CMOS sensors. The TOG (to be announced in October 1998 by the Electronic Imaging Society of Japan, Toshiba) and the like, which are disclosed in Japanese Unexamined Patent Publication (KOKAI) No. 2000-163, are known.
【０００５】図３は、従来の固体撮像装置200の断面図
を示している。ここでは、CCDセンサーやCMOSセンサー
などの固体撮像素子チップ100は、電気的接続手段であ
るTABフィルム110とバンプ140とを介して、電気的に接
続されている。TABフィルム110には、銅箔160をポリイ
ミドフィルム170などの絶縁フィルム上に構成したもの
が、一般的である。また、固体撮像素子チップ100の、
撮像素子上にはマイクロレンズ130が設けられている。FIG. 3 is a cross-sectional view of a conventional solid-state imaging device 200. Here, the solid-state imaging device chip 100 such as a CCD sensor or a CMOS sensor is electrically connected via a TAB film 110 and a bump 140, which are electrical connection means. The TAB film 110 generally includes a copper foil 160 formed on an insulating film such as a polyimide film 170. In addition, of the solid-state imaging device chip 100,
A micro lens 130 is provided on the image sensor.
【０００６】そして、透光性部材であるガラス120は、
固体撮像素子チップ100に対向して、所望の隙間180を介
して、固体撮像素子チップ100およびTABフィルム110
に、封止接着剤150を用いて、接着されている。[0006] The glass 120, which is a translucent member,
The solid-state image sensor chip 100 and the TAB film 110 are opposed to the solid-state image sensor chip 100 via a desired gap 180.
Are bonded using a sealing adhesive 150.
【０００７】[0007]
【発明が解決しようとする課題】このようなパッケージ
では、製品本体に組み込む際に、レンズなどの光学系と
の位置が重要になってくる。具体的には、焦点方向の調
整のみならず、傾き、あおり、ふれ、横ずれ、縦ずれな
どの位置だしが必要となる。In such a package, the position of the package with an optical system such as a lens becomes important when the package is incorporated into a product body. Specifically, not only adjustment of the focal direction but also positioning of tilt, tilt, shake, lateral shift, vertical shift, and the like are required.
【０００８】従来、レンズ光軸と固体撮像素子との位置
調整は、固体撮像素子チップ上に設けた特定パターンを
所望の位置に合わせたり、レンズ系を通した基準パター
ンを固体撮像素子に結像させ、この出力をモニターしな
がら、位置調整をしたりしている。Conventionally, the position adjustment between the lens optical axis and the solid-state image sensor is performed by adjusting a specific pattern provided on the solid-state image sensor chip to a desired position, or forming a reference pattern through a lens system on the solid-state image sensor. And adjust the position while monitoring this output.
【０００９】そして、その調整後に、透光性部材(主に
ガラス基板)を製品本体側部材に接着するが、この時、
調整範囲内に固体撮像素子を配置するために、例えば、
電気的接続手段としての、TABフィルムなどのフレキ基
板などに位置基準用の穴などを設け、これを基準にし
て、製品本体側部材に係止し、その状態で、その後、固
定していた。After the adjustment, the translucent member (mainly a glass substrate) is adhered to the product body side member.
In order to arrange the solid-state imaging device within the adjustment range, for example,
A hole for position reference is provided in a flexible substrate such as a TAB film as an electric connection means, and the hole is used as a reference to be locked to a product body side member, and then fixed in that state.
【００１０】しかし、電気的接続手段として、AｌやITO
などの電極材料をガラス基板上に配置した構成（COG：C
hip On Glass）では、上述のような基準を設けること
もできず、製品本体取付けが困難であった。However, Al or ITO is used as the electrical connection means.
(COG: C) in which electrode materials such as
hip on Glass), it was not possible to set the above-mentioned standard, and it was difficult to attach the product itself.
【００１１】図４は、従来のTABフィルムを使った固体
撮像装置の斜視図を示している。ここでは、TABフィル
ム110上に、取付け基準穴112が設けられている。そし
て、コネクタ接続部114は、製品本体側の電気回路との
接続に使われる。FIG. 4 is a perspective view of a conventional solid-state imaging device using a TAB film. Here, a mounting reference hole 112 is provided on the TAB film 110. The connector connection section 114 is used for connection with an electric circuit on the product body side.
【００１２】図５は、従来例の製品本体側部材との取付
けを説明する断面図である。ここでは、レンズ400を保
持する鏡筒410に位置合わせ用の基準凸部412を設けてお
り、固体撮像装置200の位置基準穴(図４の112に相当)と
によって位置が決められている。なお、必要に応じて、
レンズと固体撮像素子チップとの位置調整をするため
に、基準穴112と基準凸部412との間に、多少の余裕を持
たせてもいる。FIG. 5 is a sectional view for explaining attachment to a conventional product body side member. Here, a reference projection 412 for alignment is provided on a lens barrel 410 holding the lens 400, and the position is determined by a position reference hole (corresponding to 112 in FIG. 4) of the solid-state imaging device 200. If necessary,
In order to adjust the position of the lens and the solid-state imaging device chip, some allowance is provided between the reference hole 112 and the reference protrusion 412.
【００１３】この基準穴112は、その位置合わせ時の調
整領域に、固体撮像装置200を設置する働きもある。そ
して、所望の位置に配置されると、接着剤420によっ
て、鏡筒410と固体撮像装置200とが接着固定される。The reference hole 112 also has a function of installing the solid-state imaging device 200 in an adjustment area at the time of positioning. Then, when arranged at a desired position, the lens barrel 410 and the solid-state imaging device 200 are bonded and fixed by the adhesive 420.
【００１４】しかしながら、上述のような従来の方法で
は、以下の課題が残されている。However, the conventional method as described above has the following problems.
【００１５】（１）固体撮像素子が1インチや38mmフィ
ルムサイズなどの、大面積なものでは、フレキシブル基
板の強度が弱いため、該フレキシブル基板などに位置基
準を設けると、よれやそりなどによる精度面で、限界が
ある。(1) If the solid-state imaging device has a large area such as a 1-inch or 38-mm film size, the strength of the flexible substrate is weak. In terms of terms, there are limits.
【００１６】（２）フレキシブル基板の表面は、ポリイ
ミドフィルムなどが使用されているため、製品本体側部
材との接着性が悪く、信頼性の面での不安がある。ま
た、フレキシブル基板の可撓性により、はがれのきっか
けができる場合もある。(2) Since the surface of the flexible substrate is made of a polyimide film or the like, the adhesion to the product body side member is poor, and there is a concern about reliability. Further, peeling may be triggered by the flexibility of the flexible substrate.
【００１７】（３）小型化された場合に、基準部の嵌合
により、位置出しをする方式では、基準穴には入らない
など、自動化をする上で困難が伴う。(3) In the case of miniaturization, in the method of positioning by fitting the reference portion, there is a difficulty in automation, such as not entering the reference hole.
【００１８】本発明は、上記事情に基づいてなされたも
ので、その目的とするところは、小型化に際して、これ
に適応する位置決め、固定の自動化が達成できる構成の
固体撮像装置を提供することである。The present invention has been made based on the above circumstances, and it is an object of the present invention to provide a solid-state imaging device having a configuration capable of achieving automatic positioning and fixing adapted to the miniaturization. is there.
【００１９】[0019]
【課題を解決するための手段】このため、本発明では、
固体撮像素子チップと、該固体撮像チップと外部回路と
を接続する電気的接続手段と、該固体撮像素子チップ上
に配置された透光性部材とを具備する固体撮像装置であ
って、前記透光性部材の、前記固体撮像チップとは反対
側表面に、凹・凸形状の、あるいは、接着剤に対するぬ
れ性が他の領域と異なる表面処理を施した接着剤配置領
域が設けられていることを特徴とする。Therefore, in the present invention,
A solid-state imaging device comprising: a solid-state imaging element chip; electrical connection means for connecting the solid-state imaging chip to an external circuit; and a light-transmissive member disposed on the solid-state imaging element chip. On the surface of the optical member opposite to the solid-state imaging chip, an adhesive disposition area having a concave / convex shape or a surface treatment having a wettability to the adhesive different from other areas is provided. It is characterized by.
【００２０】この場合、本発明の実施の形態として、前
記固体撮像装置には、前記透光性部材に対向するレンズ
および／もしくは該レンズを保持する部材が含まれてお
り、前記レンズもしくは保持部材が、前記透光性部材の
前記接着剤配置領域に接着剤を塗布することで、該接着
剤の表面張力により前記透光性部材の所定の位置に配置
され、前記接着剤の硬化で固定されることが有効であ
る。In this case, as an embodiment of the present invention, the solid-state imaging device includes a lens facing the translucent member and / or a member holding the lens, and the lens or the holding member is provided. By applying an adhesive to the adhesive arrangement area of the translucent member, it is arranged at a predetermined position of the translucent member by the surface tension of the adhesive, and is fixed by curing of the adhesive. Is effective.
【００２１】また、前記透光性部材上の接着剤配置領域
と対向する前記レンズもしくは保持部材側の接着位置
に、凸形状あるいは凹形状を設けたこと、また、前記接
着剤が、紫外線硬化型接着剤であることが好ましい。Further, a convex or concave shape is provided at the bonding position on the lens or holding member side facing the adhesive disposing area on the translucent member. Preferably, it is an adhesive.
【００２２】[0022]
【発明の実施の形態】以下、本発明に係わる実施の形態
について、図面を参照して、詳細に説明する。図１は、
本発明の固体撮像装置の要部を示す斜視図、図２は全体
の縦断側面図であり、これに使用した符号は、上述した
従来例と同一部分について、同一符号を付している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments according to the present invention will be described below in detail with reference to the drawings. FIG.
FIG. 2 is a perspective view showing a main part of the solid-state imaging device according to the present invention, and FIG. 2 is a longitudinal sectional side view of the whole. The same reference numerals are used for the same parts as those in the above-described conventional example.
【００２３】図１においては、接着剤配置領域１２２
を、透光性部材としてのガラス１２０上に、配置してあ
る。この接着剤配置領域１２２は、例えば、Ｃｒ、Ａｌ
などを蒸着した後、パターニングしてもよいし、樹脂な
どの印刷などによって形成してもよい。また、その形状
は、凸あるいは凹形状であってもよい。また、印刷など
の手段で、表面活性剤をガラス１２０上に配置して、接
着剤とのぬれ性を、他の部分と異ならせてもよい（高い
ぬれ性とする）。In FIG. 1, the adhesive placement area 122
Is disposed on a glass 120 as a light transmitting member. The adhesive placement region 122 is made of, for example, Cr, Al
After vapor deposition, a patterning may be performed, or a resin or the like may be formed by printing. Further, the shape may be convex or concave. Further, a surfactant may be arranged on the glass 120 by means such as printing to make the wettability with the adhesive different from that of other parts (high wettability).
【００２４】図２は、本発明の固体撮像装置200と本体
側部品との取付け状況を示しており、鏡筒410に設けら
れた基準凸部412は、透光性部材120に設けられた接着剤
配置領域122と対向している。鏡筒410と透光性部材120
とは、接着剤配置領域122と基準凸部412との間で、紫外
線硬化型接着剤420を介して、配置されている。FIG. 2 shows the state of attachment between the solid-state imaging device 200 of the present invention and the body-side component. The reference projection 412 provided on the lens barrel 410 is bonded to the adhesive provided on the translucent member 120. It faces the agent disposition area 122. Lens barrel 410 and translucent member 120
Is disposed between the adhesive disposing region 122 and the reference convex portion 412 via the ultraviolet curable adhesive 420.
【００２５】接着剤配置領域122と基準凸部412とを設け
ることにより、この領域内で接着剤は、接着剤自身の表
面張力で安定化を図ろうとする。したがって、鏡筒410
と透光性部材120とは、その表面張力により、所望の位
置に自動調整されることになる。なお、その表面張力の
安定化をより促進するために、振動を加えてやってもよ
い。By providing the adhesive disposing area 122 and the reference convex portion 412, the adhesive is intended to be stabilized in this area by the surface tension of the adhesive itself. Therefore, the lens barrel 410
The light transmitting member 120 and the light transmitting member 120 are automatically adjusted to a desired position by the surface tension. In order to further promote the stabilization of the surface tension, vibration may be applied.
【００２６】その後、この接着剤420に紫外線を照射
し、硬化させることによって、鏡筒410と固体撮像装置2
00とが、位置出しされた状態で固定されることになる。
なお、この接着剤420を、位置出しだけのために使用し
て、湿度の進入を防止する封止接着を、別に塗布しても
よく、この処置は、本発明の目的からは逸脱しない。更
に、必要によっては、鏡筒410とレンズ400とを、焦点方
向に微妙に調整してやってもよい。Thereafter, the adhesive 420 is irradiated with ultraviolet rays to be cured, whereby the lens barrel 410 and the solid-state imaging device 2 are cured.
00 is fixed in a state where it is located.
It should be noted that this adhesive 420 may be used solely for positioning and a separate sealing bond may be applied to prevent the ingress of humidity, and this procedure does not depart from the objectives of the present invention. Further, if necessary, the lens barrel 410 and the lens 400 may be finely adjusted in the focal direction.
【００２７】また、この実施の形態では、レンズ400と
鏡筒410とが別体で示されているが、透明樹脂などで、
レンズを成形し、そのレンズを、直接、固体撮像装置20
0に固定する場合でも、これまで述べてきた方法で、製
造することが可能である。In this embodiment, the lens 400 and the lens barrel 410 are shown as separate bodies.
A lens is formed, and the lens is directly
Even when it is fixed to 0, it can be manufactured by the method described above.
【００２８】[0028]
【発明の効果】以上説明したように、本発明の固体撮像
装置によれば、従来の課題であった、光学系などへの取
付け精度を、薄型化・小型化・軽量化の特色を損なうこ
となく、大幅に改善することができる。また、従来、そ
の調整・固定法が難しい、大面積の撮像素子チップに
も、この取付手段を適用できるのであり、更に、大掛か
りな、設備やそれ自体の構造をもたずに、位置調整が可
能となるため、自動化に対応できる固体撮像装置が提供
できることになった。As described above, according to the solid-state imaging device of the present invention, the accuracy of attachment to an optical system or the like, which has been a problem to be solved by the prior art, is impaired in the characteristics of thinning, miniaturization, and weight reduction. But can be greatly improved. In addition, this mounting means can also be applied to a large-area image sensor chip, which is conventionally difficult to adjust and fix, and furthermore, the position can be adjusted without using a large-scale facility or its own structure. As a result, a solid-state imaging device that can respond to automation can be provided.
【図１】本発明に係わる固体撮像装置の実施の形態を示
す要部の斜視図である。FIG. 1 is a perspective view of a main part showing an embodiment of a solid-state imaging device according to the present invention.
【図２】同じく、固体撮像装置の本体取付けを説明する
ための縦断側面図である。FIG. 2 is a vertical sectional side view for explaining attachment of the main body of the solid-state imaging device.
【図３】従来の固体撮像装置の断面図である。FIG. 3 is a cross-sectional view of a conventional solid-state imaging device.
【図４】従来の固体撮像装置の斜視図である。FIG. 4 is a perspective view of a conventional solid-state imaging device.
【図５】従来の固体撮像装置の本体取付けを説明する断
面図である。FIG. 5 is a cross-sectional view illustrating attachment of a main body of a conventional solid-state imaging device.
100 固体撮像素子チップ 110 TABフィルム 112 取り付け用基準穴 114 コネクタ接続部 120 ガラス 122 接着剤配置領域 130 マイクロレンズ 140 バンプ 150 封止接着剤 160 銅箔 170 ポリイミドフィルム 200 固体撮像装置 400 レンズ 410 鏡筒 412 基準凸部 420 接着剤 100 Solid-state image sensor chip 110 TAB film 112 Mounting reference hole 114 Connector connection section 120 Glass 122 Adhesive placement area 130 Micro lens 140 Bump 150 Sealing adhesive 160 Copper foil 170 Polyimide film 200 Solid-state imaging device 400 Lens 410 Lens tube 412 Reference convex part 420 adhesive
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｌ 27/14 Ｈ０１Ｌ 27/14 Ｄ 31/0232 31/02 Ｄ Ｆターム(参考） 2H044 AA02 AA16 AC01 AE06 AE09 AE10 2H054 AA01 4M118 AA08 AA10 AB01 BA10 BA14 GD02 GD04 HA23 HA24 HA26 HA27 HA31 5C024 CY47 CY48 CY49 EX21 GY01 GY31 5F088 BA15 BB03 EA04 JA12 JA20──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (reference) H01L 27/14 H01L 27/14 D 31/0232 31/02 DF term (reference) 2H044 AA02 AA16 AC01 AE06 AE09 AE10 2H054 AA01 4M118 AA08 AA10 AB01 BA10 BA14 GD02 GD04 HA23 HA24 HA26 HA27 HA31 5C024 CY47 CY48 CY49 EX21 GY01 GY31 5F088 BA15 BB03 EA04 JA12 JA20
Claims (4)
プと外部回路とを接続する電気的接続手段と、該固体撮
像素子チップ上に配置された透光性部材とを具備する固
体撮像装置であって、 前記透光性部材の、前記固体撮像チップとは反対側表面
に、凹・凸形状の、あるいは、接着剤に対するぬれ性が
他の領域と異なる表面処理を施した接着剤配置領域が設
けられていることを特徴とする固体撮像装置。1. A solid-state imaging device comprising: a solid-state imaging device chip; electrical connection means for connecting the solid-state imaging chip to an external circuit; and a light-transmitting member disposed on the solid-state imaging device chip. There is a concave / convex shape or an adhesive disposition area on which the surface of the translucent member opposite to the solid-state imaging chip has been subjected to a surface treatment different from other areas in wettability to the adhesive. A solid-state imaging device, which is provided.
に対向するレンズおよび／もしくは該レンズを保持する
部材が含まれており、前記レンズもしくは保持部材が、
前記透光性部材の前記接着剤配置領域に接着剤を塗布す
ることで、該接着剤の表面張力により前記透光性部材の
所定の位置に配置され、前記接着剤の硬化で固定される
ことを特徴とする、請求項１に記載の固体撮像装置。2. The solid-state imaging device includes a lens facing the translucent member and / or a member that holds the lens, wherein the lens or the holding member includes:
By applying an adhesive to the adhesive disposing area of the translucent member, the adhesive is disposed at a predetermined position of the translucent member by surface tension of the adhesive, and is fixed by curing of the adhesive. The solid-state imaging device according to claim 1, wherein:
向する前記レンズもしくは保持部材側の接着位置に、凸
形状あるいは凹形状を設けたことを特徴とする、請求項
２に記載の固体撮像装置。3. The lens according to claim 2, wherein a convex shape or a concave shape is provided at the bonding position on the lens or holding member side facing the adhesive arrangement region on the light transmitting member. Solid-state imaging device.
ることを特徴とする、請求項２あるいは３に記載の固体
撮像装置。4. The solid-state imaging device according to claim 2, wherein the adhesive is an ultraviolet-curable adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000339297A JP2002152606A (en) | 2000-11-07 | 2000-11-07 | Solid-state imaging unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000339297A JP2002152606A (en) | 2000-11-07 | 2000-11-07 | Solid-state imaging unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002152606A true JP2002152606A (en) | 2002-05-24 |
Family
ID=18814390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000339297A Pending JP2002152606A (en) | 2000-11-07 | 2000-11-07 | Solid-state imaging unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002152606A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008263551A (en) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | Solid-state imaging device and manufacturing method therefor |
| JP2008263553A (en) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | Solid-state imaging device and manufacturing method therefor |
| JP2008263550A (en) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | Solid-state imaging device and manufacturing method therefor |
| JP2008263552A (en) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | Solid-state imaging device and manufacturing method thereof |
| WO2008132802A1 (en) * | 2007-04-13 | 2008-11-06 | Panasonic Corporation | Solid-state imaging device and method for manufacturing the same |
| JP2008312104A (en) * | 2007-06-18 | 2008-12-25 | Panasonic Corp | Solid-state imaging apparatus, and method for manufacturing the same |
-
2000
- 2000-11-07 JP JP2000339297A patent/JP2002152606A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008263551A (en) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | Solid-state imaging device and manufacturing method therefor |
| JP2008263553A (en) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | Solid-state imaging device and manufacturing method therefor |
| JP2008263550A (en) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | Solid-state imaging device and manufacturing method therefor |
| JP2008263552A (en) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | Solid-state imaging device and manufacturing method thereof |
| WO2008132802A1 (en) * | 2007-04-13 | 2008-11-06 | Panasonic Corporation | Solid-state imaging device and method for manufacturing the same |
| JP2008312104A (en) * | 2007-06-18 | 2008-12-25 | Panasonic Corp | Solid-state imaging apparatus, and method for manufacturing the same |
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