CN109672806B

CN109672806B - Camera module, photosensitive assembly and packaging method thereof

Info

Publication number: CN109672806B
Application number: CN201710955836.0A
Authority: CN
Inventors: 梅哲文; 赵波杰; 田中武彦; 郭楠
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-10-13
Filing date: 2017-10-13
Publication date: 2022-06-28
Anticipated expiration: 2037-10-13
Also published as: CN109672806A

Abstract

The module of making a video recording and photosensitive assembly and packaging method, this photosensitive assembly includes: the step glue is arranged on the non-photosensitive area of the photosensitive element in a surrounding mode, wherein the molding base is integrally combined with the circuit board, the photosensitive element and the step glue, and the molding base is provided with an extending surface integrally extending from the step glue; the filter element is supported by the step glue so as to buffer stress when the filter element is installed, and the filter element is spaced from the extending surface of the molding base, wherein an optical window for providing a light path for the photosensitive element is formed among the filter element, the step glue and the photosensitive element.

Description

Camera module, photosensitive assembly and packaging method thereof

Technical Field

The invention relates to the field of camera modules, in particular to a camera module based on an integrated packaging process, a photosensitive assembly and a packaging method thereof.

Background

The camera module is one of indispensable components of an intelligent electronic device, such as but not limited to an intelligent electronic device such as a smart phone, a camera, a computer device, and a wearable device. And in the development trend of intelligent light and thin and integration, the requirement on the camera module is higher and higher.

Particularly, in recent years, along with the popularization and development of intelligent devices, the intelligent devices tend to be light and thin increasingly, and accordingly, the camera module is adapted to the development, and the multifunctional integration, the light and thin and the miniaturization are increasingly required, so that the occupied volume of the camera module assembled in the intelligent electronic device can be correspondingly reduced, and the imaging requirement of the device on the camera module is met. Therefore, manufacturers of camera modules are continuously dedicated to designing and manufacturing camera modules satisfying these requirements.

The mold packaging process is an emerging and developed packaging technology based on the traditional cob (chip on board) packaging process. As shown in fig. 1A, a circuit board assembly is prepared by using a conventional molding and packaging process. In the structure, a molding part 1 is packaged on a circuit board 2 in a molding and packaging mode to integrally cover at least one part of the circuit board and electronic components assembled on the circuit board, such as a photosensitive chip 3, passive electronic components and the like, and a filter 4 is attached to the top side of the molding part 1, so that the space independently occupied by the electronic components of the camera module and the matching safety space reserved in the assembling process are reduced. According to another modification, as shown in fig. 1B, the optical filter 4 may be attached to the photosensitive chip 3, and then the molding portion 1 is integrally packaged with the circuit board 2, the photosensitive chip 3 and the optical filter 4. Correspondingly, the size of the camera module can be reduced, and the imaging quality requirement of the electronic equipment on the camera module can be met.

However, for camera modules, it comprises many relatively fragile but highly sensitive electronic components, in particular the photo-sensitive chip 3. In the process of performing the molding process, the photosensitive chip 3 is electrically connected to the corresponding region of the circuit board 2, and the circuit board assembled with the photosensitive chip 3 is further placed in the molding cavity of the molding mold, so as to form the molding portion on the corresponding region of the circuit board 2 by using the molding property of the molding material. It should be noted that the photosensitive chip 3 has a photosensitive region, and a sealing environment is required to be formed for the photosensitive region of the photosensitive chip 3 during the molding process to prevent the molding material with fluidity from penetrating into the photosensitive region and causing the photosensitive chip 3 to fail. Therefore, in the conventional molding process, a molding surface of the molding module closely adheres to the photosensitive chip 3, thereby blocking the molding material from entering the photosensitive chip 3. Accordingly, it is necessary to make at least the photosensitive region of the photosensitive chip 3 adhere to the molding surface as closely as possible to reduce the gap between the photosensitive chip 3 and the molding surface as possible, so as to effectively prevent the molding material from penetrating through the gap and contaminating the photosensitive chip 3, but when a relatively large pressure is applied to the photosensitive chip 3 by the molding surface of the mold, the photosensitive chip may be damaged.

Further, the optical filter 4 is another extremely important component in the camera module, and the infrared light in the light is filtered by the optical filter 4, so that the imaging effect is closer to the effect observed by human eyes. Meanwhile, the filter 4 is also a delicate and highly sensitive precision electrical device. In the conventional camera module, the filter 4 is directly assembled on the top surface of the molding portion 1, so that the filter 4 is held above the photosensitive area of the photosensitive chip 3 by the molding portion 1. In addition, the molding part 1 is formed into a solid state with certain hardness, and the filter 4 is made of a fragile material, so that when the filter 4 is assembled to the molding part 1, the filter 4 is inevitably broken due to mutual stress. If the molding portion 1 is formed after the photosensitive chip 3 is directly attached, the damage of the optical filter may be caused when the molding surface of the mold needs to be pressed on the optical filter 4. Moreover, the molding part 1 is usually a thermosetting material and needs to be thermoset at a relatively high temperature, which may cause the glue connecting the optical filter 4 and the photosensitive chip 3 to shrink after curing, so that the optical filter 4 is stressed unevenly to generate cracks and even break.

Disclosure of Invention

An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein the camera module has a step glue, and the step glue is correspondingly disposed on a photosensitive chip, wherein the step glue is suitable for providing a supporting platform for a filter element, so as to improve an installation environment of the filter element.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein the step glue can provide stress buffering for the filter element, so that the probability of damage to the filter element can be reduced relative to the case that the filter element is mounted on a molding base.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein the mounting process of the filter element is performed after the molding of the molding base, so as to effectively prevent the filter element from being crushed by the mold during the molding process, and prevent the molding base from being integrally formed with the filter element to damage the filter element during the curing process.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein the step glue can contain a light-absorbing and light-impermeable material, such as a black glue, so that the step glue can reduce stray light reaching the photosensitive element.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein the step glue replaces the molding base to provide a support for the optical filter, so that the quality of the molding process of the molding base does not affect the installation process of the optical filter element, and thus the design of the molding process of the molding base is relatively independent, and the installation design of the optical filter is relatively more independent and controllable.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein the step glue is disposed in a non-photosensitive region of the photosensitive element, so as to relatively reduce an area required by the filter element compared to a technical solution of directly mounting the step glue on a molding portion in the prior art.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein a filter element required by the camera module has a relatively small size, so as to effectively reduce the probability of breaking the filter in the process of assembling the camera module.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein a filter element required by the camera module has a relatively small size, so as to reduce the cost required by the filter.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein the filter element is disposed on the step glue through a connecting glue, so that the position of the filter element can be further fine-tuned, and the filter has a relatively high flatness relative to the photosensitive element.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein the step glue has a height higher than that of at least one group of leads for conducting the photosensitive element and the circuit board, so as to prevent the leads from being extruded or even falling off during the molding process.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein the step glue forms a relatively good sealing environment for the photosensitive element through the step glue in a molding process, and simultaneously can prevent the photosensitive element from being damaged.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein the step glue is correspondingly disposed in a non-photosensitive area of the photosensitive element, and in a molding process, a molding material is isolated from the photosensitive area of the photosensitive element by the step glue, so as to prevent the photosensitive element from being contaminated in the molding process.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein in the molding process, the step glue is correspondingly disposed between the photosensitive element and a molding surface of the molding die, so as to absorb the acting force from the molding die through the step glue and prevent the photosensitive element from being damaged due to the large load.

Another objective of the present invention is to provide a camera module, a photosensitive assembly thereof and a packaging method thereof, wherein the step glue can reduce the process difficulty of the molding process, and the method is not only simple in operation, but also can improve the yield of the camera module.

Other advantages and features of the invention will become apparent from the following description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

To achieve at least one of the above objectives, the present invention provides a photosensitive assembly, comprising:

a circuit board, a plurality of circuit boards,

a light-sensing element, which is provided with a light-sensing element,

a molding base, a molding base and a molding base,

the step glue, wherein the photosensitive element is electrically connected to the circuit board, the photosensitive element has a photosensitive area and a non-photosensitive area located around the photosensitive area, the step glue is circumferentially arranged in the non-photosensitive area of the photosensitive element, the molding base is integrally combined with the circuit board, the photosensitive element and the step glue, and the molding base has an extending surface integrally extending from the step glue; and

A filter element supported by said step glue and spaced from said extended surface of said mold base, wherein an optical window is formed between said filter element, said step glue and said photosensitive element, said optical window providing an optical path for light rays from said photosensitive element.

According to another aspect of the present invention, there is provided a photosensitive assembly, including:

a circuit board, which is provided with a plurality of circuit boards,

a photosensitive element electrically connected to the circuit board and having a photosensitive region and a non-photosensitive region around the photosensitive region,

a molding base, which is provided with a plurality of molding grooves,

the step glue is arranged in the non-photosensitive area of the photosensitive element in a surrounding manner; and

a filter element, wherein in a molding process, the molding base is integrally combined with the circuit board, the photosensitive element and the step glue, then the filter element is supported on the step glue to provide a buffer by the step glue, and an optical window is formed between the filter element, the step glue and the photosensitive element.

According to another aspect of the present invention, the present invention further provides a photosensitive assembly, including:

A circuit board;

the photosensitive element is electrically connected with the circuit board and is provided with a photosensitive area and a non-photosensitive area positioned around the photosensitive area;

the step glue is arranged in the non-photosensitive area of the photosensitive element in a surrounding mode; and

and the molding base is integrally combined with the circuit board, the photosensitive element and the step glue, the molding base is provided with an extending surface integrally extending from an outer surface of the step glue in the surrounding direction, and a glue containing groove is formed on the outer side of the step glue and the top side of the extending surface of the molding base.

According to another aspect of the present invention, the present invention further provides a camera module, which includes the photosensitive assembly and an optical lens.

According to another aspect of the present invention, the present invention further provides an electronic device, which includes one or more of the above-mentioned camera modules.

According to another aspect of the present invention, the present invention provides a method for molding and packaging a camera module, wherein the method comprises the steps of:

conducting a photosensitive element and a circuit board;

forming a step glue on a non-photosensitive area of the photosensitive element so as to surround a photosensitive area of the photosensitive element through the step glue;

Forming a molding base on the circuit board, the photosensitive element and the step glue;

supporting a filter element on the step glue; and

and assembling an optical lens on the photosensitive path of the photosensitive element.

Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

Fig. 1A is a schematic cross-sectional view of a circuit board assembly of a camera module according to a prior art.

Fig. 1B is a schematic cross-sectional view of a circuit board assembly of a camera module according to another prior art.

Fig. 2A is a schematic cross-sectional view of a camera module according to a preferred embodiment.

Fig. 2B is a schematic cross-sectional view of a camera module according to a modified implementation of the above preferred embodiment of the invention.

Fig. 3A is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 3B is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 3C is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 4A is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 4B is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

FIG. 5 is a schematic view of a process for manufacturing the camera module according to the above preferred embodiment of the present invention, in which a photosensitive element and a circuit board are operatively connected.

Fig. 6A, 6B and 6C are schematic views illustrating the step glue formation process in the preparation process of the camera module according to the above-mentioned preferred embodiment of the invention.

Fig. 7A is a schematic diagram of mold clamping in the molding process of the camera module manufacturing process according to the above preferred embodiment of the present invention.

Fig. 7B is a schematic view of a filling molding material in a molding process of the process for manufacturing the camera module according to the above preferred embodiment of the present invention.

Fig. 7C is an open mold schematic view of a molding process of the preparation process of the camera module according to the above preferred embodiment of the invention.

Fig. 8 is a schematic view of the process of manufacturing the camera module according to the above preferred embodiment of the present invention, in which the filter element is installed.

Fig. 9 is a schematic view of another embodiment of the process of manufacturing the camera module according to the above preferred embodiment of the present invention, in which the filter element is mounted.

Fig. 10 is a schematic view of another embodiment of mounting the filter element in the process of manufacturing the camera module according to the preferred embodiment of the present invention.

Fig. 11 is a schematic diagram of assembling the optical lens according to the preparation process of the camera module according to the above-mentioned preferred embodiment of the invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.

It is to be understood that the terms "a" and "an" are to be interpreted as meaning that a number of elements in one embodiment may be one and a number of elements in another embodiment may be plural, and the terms "a" and "an" are not to be interpreted as limiting the number.

Referring to fig. 2A, a camera module according to a first preferred embodiment of the present invention is illustrated, wherein the camera module can be applied to various electronic devices, such as but not limited to smart phones, wearable devices, computer devices, televisions, vehicles, cameras, monitoring devices, etc., and the camera module is used with the electronic devices to achieve the functions of capturing and reproducing the target image.

The camera module comprises a photosensitive assembly 10 and an optical lens 20, wherein the optical lens 20 is located in a photosensitive path of the photosensitive assembly 10, so as to collect image information of a detected object through the optical lens 20. In particular, in the preferred implementation of the present invention, the camera module is a fixed focus camera module, i.e. the focal length between the optical lens 20 and the photosensitive component 10 is not adjustable, the optical lens 20 is assembled to a lens carrying element 30 implemented as a lens barrel assembled to the top side of the photosensitive component 10, it is understood that in another variant, the optical lens 20 may be directly assembled to the top side of the photosensitive component 10. It should be understood by those skilled in the art that in another embodiment of the present invention, as shown in fig. 2B, the camera module can also be implemented as a moving focus camera module, that is, in this embodiment, the camera module further includes a lens carrying element 30, which can be a driving element 30, wherein the driving element is assembled on the top side of the photosensitive assembly 10, and the optical lens 20 is assembled on the driving element, so as to change the distance between the optical lens 20 and a photosensitive element 12 of the photosensitive assembly 10 through the driving element, so as to implement the function of optical focusing. It is worth mentioning that the driving element 30 includes, but is not limited to, a voice coil motor, a stepping motor, a MEMS, etc.

More specifically, as shown in fig. 2A, the photosensitive assembly 10 includes a circuit board 11, a photosensitive element 12, and a mold base 13. The photosensitive element 12 is conductively connected to the circuit board 11, wherein light from the target passes through the photosensitive assembly 10 and reaches the photosensitive element 12, so as to further convert the optical signal of the target into an electrical signal that can be recognized and operated by an electronic device through the photosensitive reaction of the photosensitive element 12, thereby realizing the functions of image acquisition and reproduction of the target. The molding base 13 is integrally formed on the circuit board 11 and the photosensitive element 12, and covers at least a part of the circuit board 11 and the photosensitive element 12, so that the photosensitive assembly 10 and the camera module have compact and miniaturized structures. It is worth mentioning that the integral molding process includes, but is not limited to, a molding process, a compression molding process, etc.

It is worth mentioning that the photosensitive element 12 is a fragile and sensitive electronic component during the molding process performed to form the mold base 13. Therefore, it is necessary to ensure that the molding material does not flow into the photosensitive region 121 of the photosensitive element 12 during the molding process, so as to prevent the photosensitive element 12 from being contaminated and failed; on the other hand, the photosensitive element 12 may not withstand excessive pressure during the molding process to avoid the photosensitive element 12 from cracking or even breaking and failing due to extrusion. That is, before the molding process is performed to form the molded photosensitive base, on the one hand, a relatively good sealing environment needs to be provided for the photosensitive element 12 to protect at least the photosensitive region 121 of the photosensitive element 12 from the molding material; on the other hand, a corresponding buffer protection mechanism is required to be provided for the photosensitive element 12 to prevent the photosensitive element 12 from being damaged due to excessive pressure.

Accordingly, in the preferred embodiment of the present invention, the photosensitive assembly 10 further includes a step glue 14, and the molding base 13 is further integrally formed on the step glue 14. The step glue 14 is correspondingly disposed in a corresponding region of the photosensitive element 12, so that a good sealing environment is created for the photosensitive element 12 through cooperation between the step glue 14 and a forming mold in a molding process. More specifically, the step glue 14 is disposed at a predetermined region of the photosensitive element 12 to intercept a molding material having fluidity from entering the photosensitive element 12 during a molding process, that is, the step glue 14 functions as a "dam" during the molding process. In addition, the step glue 14 is disposed between the photosensitive element 12 and the forming mold, so that the photosensitive element 12 is prevented from directly contacting the forming mold by the step glue 14. Therefore, the acting force applied to the photosensitive element 12 is absorbed by the step adhesive 14 to relatively weaken the load borne by the photosensitive element 12, thereby effectively preventing the photosensitive element 12 from being damaged or the like due to excessive pressure.

More specifically, in the preferred embodiment of the present invention, the circuit board 11 is provided with a chip mounting area 111 and a peripheral area 112, the peripheral area 112 integrally extends to the outer periphery of the chip mounting area 111, wherein the chip mounting area 111 has a size matched with the photosensitive element 12 to be suitable for mounting the photosensitive element 12. The circuit board 11 further includes a set of circuit board 11 connectors 113, wherein the circuit board connectors 113 are disposed in the peripheral area 112 of the circuit board 11 and are used to connect the circuit board 11 and the photosensitive element 12. It should be noted that, in the present invention, the circuit board 11 may be a hard PCB, a soft PCB, a rigid-flex board, a ceramic substrate, or the like.

The photosensitive element 12 has a photosensitive area 121 and a non-photosensitive area 122, and the non-photosensitive area 122 integrally extends to the outer periphery of the photosensitive area 121. In particular, the photosensitive element 12 further includes a set of chip connectors 123, wherein in the preferred embodiment of the present invention, the chip connectors 123 are disposed on the non-photosensitive region 122 of the photosensitive element 12 and are configured to be electrically connected to the circuit board connectors 113 to electrically connect the photosensitive element 12 and the circuit board 11.

Correspondingly, the photosensitive assembly 10 further includes at least one set of leads 15, wherein each of the leads 15 has a chip connecting terminal 151 and an opposite circuit board connecting terminal 152. After the photosensitive element 12 is mounted on the chip mounting region 111 corresponding to the photosensitive element 12, the chip connecting terminal 151 of the lead 15 is connected to the chip connecting part 123 of the photosensitive element 12, and the opposite circuit board connecting terminal 152 of the lead 15 is connected to the circuit board connecting part 113 of the circuit board 11, so as to conductively connect the photosensitive element 12 to the circuit board 11. That is, the photosensitive element 12 is electrically connected to the wiring board 11 by wire bonding. It should be appreciated that in the wire bonding process, the circuit board connecting terminals 152 of the leads 15 may be first connected to the circuit board connectors 113 of the circuit board 11, then the leads 15 may be extended upward so that the leads 15 are protrudingly disposed with respect to the photosensitive elements 12, and further, the leads 15 may be extended inward and the opposite chip connecting terminals 151 of the leads 15 may be connected to the corresponding chip connectors 123 of the photosensitive elements 12. In the present invention, the extension of such leads is defined as: and (5) performing a lead reverse-bonding process, as shown in fig. 3C.

Similarly, the chip connecting terminal 151 of the lead 15 may be first connected to the chip connecting part 123 of the photosensitive element 12, then the lead 15 may be extended outwardly and downwardly, and the opposite circuit board connecting terminal 152 of the lead 15 may be connected to the circuit board connecting part 113 of the circuit board 11 to electrically connect the photosensitive element 12 and the circuit board 11. In the present invention, the extension of such leads is defined as: and (4) performing a direct printing process, as shown in fig. 2A to 3B.

It should be noted that, in the present invention, the photosensitive element 12 may be electrically connected to the circuit board 11 through a "forward bonding" process, and the photosensitive element 12 and the circuit board 11 may also be electrically connected through a "reverse bonding" process. However, the arrangement of the leads affects the relative height change of the protrusions of the leads 15, thereby affecting the subsequent arrangement of the step glue 14. More specifically, when the leads 15 are disposed using a "flip-chip" process, the leads 15 extend from the wiring board 11, and after the leads 15 extend upward to a height exceeding the thickness of the photosensitive elements 12, the leads 15 can be extended rearward and connected to the photosensitive elements 12. Further, when the lead 15 is disposed using the "lead-forward" process, the lead 15 extends from the photosensitive element 12 with its extending start point disposed at the photosensitive element 12, and its extending start point is high compared to the "lead-reverse" process, so that the height of the final upward projection of the lead 15 is higher than the height of the upward projection of the lead 15 disposed by the "lead-reverse" process. Those skilled in the art will appreciate that during the molding process for designing the camera module, the contact between the leads 15 and the mold is prevented, so that the leads 15 are deformed by being pressed lightly, and the leads 15 are released from the photosensitive elements 12 and the circuit board 11 by being pressed heavily. That is, in the present invention, the arrangement of the leads affects the layout design of the step glue 14, and this will be described in more detail in the following description.

Further, in the preferred embodiment of the present invention, the step glue 14 is disposed on the corresponding non-photosensitive region 122 of the photosensitive element 12, and has a closed integrated structure, in which a light window 141 is formed, so as to protect at least the photosensitive region 121 of the photosensitive element 12 from being disposed in the inner region surrounded by the step glue 14. More specifically, after the forming mold is closed, a forming surface of the forming mold closely fits the step glue 14, so that the photosensitive area 121 of the photosensitive element 12 is hermetically disposed inside the forming area thereof through the forming surface and the step glue 14, and the molding material with fluidity is prevented from flowing into the photosensitive element 12, so as to prevent the photosensitive area 121 of the photosensitive element 12 from being contaminated.

As shown in fig. 2A, further, the step glue 14 is disposed between the die attach member 123 and the photosensitive area 121 of the photosensitive element 12, so as to facilitate the disposition of the step glue 14. It should be appreciated that a flat area is provided between the chip connector 123 of the photosensitive element 12 and the photosensitive area, and no other electronic components are provided, so that a relatively flat base surface is provided for the step adhesive 14, so as to control parameters such as the shape and size of the step adhesive 14. It should be noted that, in the present invention, it is preferable that the height of the step glue 14 is slightly higher than the height of the upward protrusion of the lead 15, so as to limit the molding surface of the molding die by the step glue 14, thereby effectively preventing the lead 15 from unnecessarily touching the molding die in the molding process.

Fig. 3B shows a modified implementation of the preferred embodiment of the present invention, wherein the step adhesive 14 is disposed on the die attach part 123 of the non-photosensitive region 122 of the photosensitive element 12, such that the step adhesive 14 covers at least a portion of the die attach part 123 and the leads 15. In this way, the relative positional relationship between the step glue 14 and the lead wires 15 can be visually observed to facilitate control of the height of the step glue 14 and eventually make the height of the step glue 14 higher, e.g., slightly higher than the height at which the lead wires 15 project upward. It should be noted that the step adhesive 14 is disposed on the chip connector 123 of the photosensitive element 12 and covers at least a portion of the lead 15, that is, the step adhesive 14 can further enhance the connection stability between the lead 15 and the photosensitive element 12, so that the lead 15 can effectively resist the flow impact of the molding material during the molding process, and the lead 15 is prevented from swinging relative to the photosensitive chip or even falling off from the connection of the photosensitive element 12.

It should be noted that, in the modified embodiment of the present invention, preferably, the leads 15 are disposed between the photosensitive element 12 and the circuit board 11 through a "direct printing" process, so that the protruding portions of the leads 15 are directly disposed at the chip connection sites of the photosensitive element 12, thereby further facilitating the operator to observe and control the height of the step adhesive 14 protruding upward.

In addition, the step glue 14 is disposed at the die attach 123 of the photosensitive element 12, wherein the die attach 123 is located at a position farther than the photosensitive region 121 of the photosensitive element 12, so that in the process of disposing the step glue 14, there is no need to worry about that the step glue 14 overflows to the photosensitive region 121 of the photosensitive element 12, so as to prevent the photosensitive element 12 from being contaminated by the step glue 14.

Fig. 3B shows another modified embodiment of the preferred embodiment of the present invention, wherein the step adhesive 14 is disposed between the die attach part 123 of the photosensitive element 12 and the circuit board attach part 113 of the circuit board 11, so that the step adhesive 14 completely covers the leads 15 extending between the die attach part 123 and the circuit board attach part 113. In this way, the relative positional relationship between the step glue 14 and the lead wires 15 can be visually observed, so as to control the height of the step glue 14, and finally make the height of the step glue 14 slightly higher than the height of the lead wires 15 protruding upward. It should be noted that the step adhesive 14 is disposed on the chip connecting member 123 of the photosensitive element 12 and completely covers the lead 15, that is, the step adhesive 14 can further enhance the connection stability between the lead 15 and the photosensitive element 12, so that the lead 15 can effectively resist the flow impact of the molding material during the molding process, and the lead 15 is prevented from swinging relative to the photosensitive chip and the circuit board 11 or even falling off from the connection position of the photosensitive element 12 and the circuit board 11.

It should be noted that the step glue 14 is disposed between the die attach part 123 of the photosensitive element 12 and the circuit board attach part 113 of the circuit board 11, wherein the step glue 14 is disposed at a position far from the photosensitive area 121 of the photosensitive element 12, so that in the process of disposing the step glue 14, there is no need to worry about that the step glue 14 overflows to the photosensitive area 121 of the photosensitive element 12, so as to prevent the photosensitive element 12 from being contaminated by the material of the step glue 14.

Further, it is worth mentioning that in the preferred embodiment of the present invention, the step glue 14 is made of a deformable material to increase the sealed effect of the photosensitive element 12 by the deformable property of the step glue 14, and at the same time, the leakage effect of the step glue 14 is enhanced by the deformable property of the step glue 14 to protect the photosensitive element 12 more effectively. It should be appreciated that, during the process of clamping the forming mold, the forming surface of the forming mold and the step glue 14 are jointed with each other, however, since the heights of the parts of the step glue 14 cannot be ensured to be uniform during the setting process, during the jointing process, the parts of the step glue 14 are further pressed by the forming surface of the forming mold to deform, so as to uniformize the heights of the parts of the step glue 14, and thus a closer fit is formed between the forming surface and the step glue 14, so as to improve the sealing effect of the photosensitive element 12. In addition, since the step glue 14 has deformation performance to effectively absorb the external force applied to the step glue 14, the magnitude of the external force applied to the photosensitive element 12 can be relatively reduced, and in this way, the photosensitive element 12 can be effectively prevented from being damaged in the molding process.

It should be noted that, in the present invention, the step glue 14 can be formed by glue application, and can also be made of other materials with predetermined elasticity and capable of deforming. It should be appreciated that, in the present invention, the material of the step glue 14 is not a limitation of the present invention.

As shown in fig. 3C, in the preferred embodiment of the present invention, the photosensitive assembly 10 further includes a filter element 16, wherein the filter element 16 is used to filter the light passing through the optical lens 20, so that the image of the measured object captured by the camera module is closer to the effect observed by the human eye.

More specifically, in the preferred embodiment of the present invention, the optical filter is correspondingly disposed on the step glue 14 to maintain the optical filter element 16 at a corresponding upper region of the photosensitive region 121 of the photosensitive element 12, and to form a sealed space between the optical filter element 16 and the photosensitive element 12. In other words, the filter element 16 is held between the photosensitive element 12 and the optical lens 20, so that stray light such as infrared light in the light passing through the lens and incident on the filter element 16 can be effectively filtered by the filter element 16 into the optical window 141 and further reach the photosensitive area 121 of the photosensitive element 12, thereby improving the imaging performance of the camera module. It is to be noted in particular that, in this preferred embodiment of the invention, the mounting process of the filtering element 16 is carried out after the moulding of the base 13. That is, the molding base 13 is not integrally formed on the light filtering element 16, the molding base 13 has an extending surface 133 integrally extending to the outer side of the step glue 14, the extending surface 133 is a surface exposed after the molding base 13 is integrally formed in a molding process, the light filtering element 16 is spaced from the extending surface 133 of the molding base 13, that is, the molding base 13 is not directly integrally formed on the light filtering element 16, but has a distance therebetween, so that such a structure prevents a fluid molding material from entering the inside of the step glue 14 and then contaminating the photosensitive area 121 of the photosensitive element 12 in the molding process, and at least a part of the spaced spaces are filled with a connecting glue 17 described below and fixed to each other.

Whereas in fig. 1B the assembly process of the filter 4 is operated before the molding process is performed. Firstly, in the molding process, the optical filter 4 is pressed by a forming mold, so that inevitably, the optical filter 4 generates cracks and even breaks due to bearing of a large pressure; next, the mold part 1 is prepared in accordance with the chemical properties of the molding material, for example, by thermosetting of the molding material. However, since the curing temperature of the molding material is high, usually about 150-.

In the present invention, the mold base 13 is integrally bonded to the outside of the step glue 14, that is, integrally bonded to an outer surface 142 extending in the circumferential direction of the filter element 14, and does not extend to the apex 143 of the top side of the filter element 14, that is, the position 1331 where the extending surface 133 of the mold base is bonded to the outer surface 142 of the filter element is lower than the apex 143 of the filter element 14, and the step glue 14 is used to directly support the filter element 16 when the filter element 16 is mounted, and to provide stress buffering when the filter element 16 is mounted. Preferably, the shore hardness range of the step glue 14 is A50-A80, and the elastic modulus range is 0.001Gpa-0.1 Gpa.

Further, in the preferred embodiment of the present invention, the photosensitive assembly 10 further includes a connection glue 17, and the connection glue 17 is used for adhering and fixing the filter element 16 above the step glue 14, so that the mounting process of the filter element 16 is optimized by the connection glue 17, and the mounting yield is improved. The molding base 14 is formed at a top side thereof with a concave glue receiving groove 142 at an outer side of the step glue 14 and a top side of the extension surface 133 for receiving the connection glue 17 before being cured, and the connection glue 17 is adhered to the filter element 16 and then cured to firmly mount the filter element 16.

More specifically, the connection paste 17 may be applied in the paste receiving groove 132 and then the filter element 16 is mounted, or may be applied to the bottom edge of the filter element 16 and then mounted on the top side of the step paste 14, or both the paste receiving groove 132 and the bottom edge of the filter element 16 may be applied with a portion of adhesive paste and then the mounting of the filter element 16 is performed.

It can be understood that, when the filter element 16 is assembled above the step glue 14 and pressure is applied to the filter element 16, the filter element 16 will contact the step glue 14 first, and the step glue 14 provides support, but will not contact the molding base 13 directly, i.e. the step glue 14 can provide elastic buffer for the filter element 16, and avoid the stress from being transmitted to the molding base 13 directly, so that the relatively hard molding base 13 can apply a reaction force to the filter element 16 to cause damage to the filter element 16.

In addition, the connection glue 17 may be located on the bottom side of the filter element 16 and the outer periphery of the filter element 16, i.e. on the top side of the extension surface 133 and combined with at least a part of the bottom edge 161 and at least a part of the outer periphery 162 of the filter element 16. Of course, in a variant embodiment, it is also possible for the connection glue 17 to be bonded only to at least one portion of the bottom edge 161 or only to at least one portion of the outer peripheral surface 162 of the filter element 16. In the preferred embodiment of the present invention, the mold base 13 is provided with the glue receiving groove 132, and the glue receiving groove 132 is concavely formed on the top surface of the mold base 13 and is located outside the step glue 14. The glue containing groove 132 is circumferentially formed on the outer peripheral side of the step glue 14, and the step glue 14 convexly extends upward relative to the extending surface 133, so that during the process of applying the glue layer, the glue is guided to flow to the glue containing groove 132, and the step glue 14 further prevents the glue from entering the light window 141 of the step glue 14, so as to avoid the photosensitive area 121 of the photosensitive element 12 from being polluted by the glue.

In the preferred embodiment of the present invention, the filter element 16 includes, by way of example and not limitation, an infrared cut filter, a blue glass filter, and a wafer level infrared cut filter. In the present invention, the selection of the kind of the filter element 16 is not a limitation of the present invention.

In addition, the step glue 14 includes a light-absorbing and light-impermeable material, such as a black glue material, so that stray light incident on the step glue 14 is absorbed by the step glue 14, thereby preventing the stray light from reaching the photosensitive element 12. It is understood that the step glue 14 functions to block stray light, so that the filter element 16 may be selected without additionally forming a light shielding layer by means of photoresist or silk screen printing.

As shown in fig. 4A and 4B, in both of these modified embodiments, the glue receiving groove 132 may not be provided. As shown in fig. 4A, the top 143 of the step glue 14 is a flat top surface, the extension surface 133 of the mold base 13 may be substantially flush with the top 143 of the step glue 14, and the connection glue 17 is disposed between the step glue 14 and the filter element 16 to be bonded to at least a portion of the bottom edge 161 of the filter element 16.

As shown in fig. 4B, the extension surface 133 of the mold base 13 may be combined with the plane of the apex 143 of the step glue 14 and extend upward to be higher than the plane of the apex 143 of the step glue 14. Accordingly, the filter element 16 is spaced apart from the extension surface 133, and the filter element 16 is adhesively fixed to the step adhesive 14 by a connection adhesive 17 provided on the bottom side thereof.

It should be appreciated that the solution of supporting the filter element 16 by the step adhesive 14 has the following advantages compared to the prior art solution of directly mounting the filter 4 on the top surface of the molding portion 1 or integrally covering the molding portion 1:

one is as follows: the step adhesive 14 has a buffering property, so that when the filter element 16 is disposed on the step adhesive 14, the step adhesive 14 can effectively absorb an external force applied to the filter element 16, so as to prevent the filter element 16 from being cracked due to a large stress during the installation process.

And the second step is as follows: the step glue 14 replaces the molding base 13 to provide a supporting position for the filter element 16. That is, the molding process quality of the mold base 13 does not affect the mounting process of the filter element 16, so that not only the molding process design of the mold base 13 can be relatively independent, but also the mounting layout of the filters can be relatively more independent and controllable.

And thirdly: compared with the prior art which is directly mounted on the molding part, the area required by the filter element 16 is relatively reduced, so that the cost of the filter element 16 can be reduced.

Fourthly, the method comprises the following steps: due to the required size reduction of the filter element 16, the filter has a relatively high strength, so that the number of cracks or breakage of the filter in the process of assembling the camera module can be effectively reduced.

And the fifth step: the filter element 16 is assembled above the step glue 14 by the connecting glue 17 and supported by the step glue 14, so that the relative position relationship between the filter element 16 and the step glue 14 can be further safely adjusted, and the filter element 16 has relatively high flatness. In particular, the connection glue 17 has a deformable property, so that when the initial position of the filter element 16 on the step glue 14 does not meet the design requirement, the relative position of the filter element 16 on the step glue 14 can be conveniently and safely adjusted. It will be appreciated that during adjustment of the filter element 16, external forces applied to the filter element 16 are effectively absorbed by the step glue 14, so that the position adjustment process of the filter element 16 is relatively safe and convenient.

Further, fig. 5 to 11 are schematic views illustrating a manufacturing process of the camera module according to the preferred embodiment of the present invention, wherein fig. 5 to 11 are schematic views illustrating a manufacturing process of only a single camera module. Those skilled in the art will appreciate that the camera module can also be obtained by a plate-making process, i.e. a photosensitive assembly 10 is formed by one-time molding, and further the photosensitive assembly 10 is cut to obtain a plurality of photosensitive assembly 10 units at one time.

In the manufacturing step shown in fig. 5, the photosensitive element 12 is conductively connected to the wiring board 11. In the preferred embodiment of the present invention, the photosensitive element 12 is correspondingly mounted on the chip mounting region 111 of the circuit board 11, and further, two ends of the lead 15 are respectively connected to the photosensitive element 12 and the circuit board 11 by a "wire bonding" process, so as to electrically connect the photosensitive element 12 and the circuit board 11 through the lead 15. It is worth mentioning that, preferably, in the conducting step, the lead 15 extends between the photosensitive element 12 and the circuit board 11 through a "reverse-striking" process to relatively reduce the height of the upward projection of the lead 15. Of course, it will be appreciated by those skilled in the art that the leads 15 may also extend between the photosensitive element 12 and the circuit board 11 through a "direct wire bonding" process to achieve electrical connection between the photosensitive element 12 and the circuit board 11.

It should be noted that, in another embodiment of the present invention, the chip mounting region 111 and the surrounding region of the circuit board 11 can be disposed in a staggered manner to form a groove in the corresponding region of the chip mounting region, wherein the groove is suitable for receiving the photosensitive element 12, and further, the photosensitive element 12 can be electrically connected to the circuit board 11 through a "wire bonding" process. In this way, not only the overall height of the photosensitive assembly 10 can be reduced, but also the height of the leads 15 protruding upward can be reduced, so as to facilitate the subsequent arrangement of the step glue 14.

In the manufacturing steps shown in fig. 6A to 6C, the step glue 14 is formed on a predetermined region of the photosensitive element 12. In particular, in the preferred embodiment of the present invention, the step glue 14 has an integrally closed structure, which is uniformly applied to the non-photosensitive area 122 of the photosensitive element 12, so as to seal at least the photosensitive area 121 of the photosensitive element 12 and prevent the photosensitive element 12 from being damaged due to a large load applied thereto by the step glue 14. It should be noted that the height of the step glue 14 is slightly higher than the height of the upward protrusion of the lead 15, so as to prevent unnecessary contact between the lead 15 and the forming mold in the subsequent molding process.

More specifically, in the preferred embodiment of the present invention, the step glue 14 is implemented as a glue layer uniformly and circumferentially disposed outside the photosensitive area 121 of the photosensitive element 12, and adapted to press a molding surface 104 of the molding die thereon after curing. In this embodiment, the step paste 14 is disposed between the die attach 123 of the photosensitive element 12 and the photosensitive region 121, and the step paste 14 is disposed to have a height slightly higher than the upward projection of the leads 15.

In another embodiment of the present invention, the step adhesive 14 is implemented as an adhesive layer which is uniformly and circumferentially disposed outside the photosensitive region 121 of the photosensitive element 12, in particular, disposed on the die attach part 123 of the photosensitive element 12, and covers at least a portion of the lead 15. Likewise, the step paste 14 has a height slightly higher than the upward projection of the lead 15.

In another embodiment of the present invention, the step adhesive 14 is implemented as an adhesive layer which is uniformly and circumferentially disposed outside the photosensitive region 121 of the photosensitive element 12, and particularly, between the chip connecting part 123 of the photosensitive element 12 and the circuit board connecting part 113 of the circuit board 11 to completely cover the leads 15. Likewise, the step paste 14 has a height slightly higher than the upward projection of the lead 15.

In the manufacturing steps shown in fig. 7A to 7C, the circuit board 11 with the photosensitive element 12 and the step glue 14 is placed in a molding mold 100, and a molding process is performed to mold the molding base 13 on the circuit board 11, wherein the molding base 13 integrally covers the circuit board 11, at least a portion of the photosensitive element 12 and at least a portion of the step glue 14, so that the photosensitive assembly 10 has a more compact and compact integrated structure.

More specifically, the molding die includes an upper die 101 and a lower die 102, wherein the upper die and the lower die can be abutted to form a molding cavity 103, wherein the circuit board 11 with the photosensitive element 12 and the step glue 14 is placed in the corresponding region of the molding cavity. At this time, a molding surface 104 of the upper mold closely fits the step glue 14 to seal at least the photosensitive region 121 of the photosensitive element 12, so that the step glue 14 cooperates with the molding surface 104 to effectively prevent the molding material from flowing into the photosensitive region 121 of the photosensitive element 12 after the molding material is filled into the molding cavity 103. The upper mold 101 may further have a protrusion 105 extending in a circumferential direction to form the glue receiving groove 132 after a molding process, and the upper mold 101 may accordingly have a receiving groove 106 formed inside the protrusion 105, and a top end portion of the step glue 14 may be received in the receiving groove 106 during the molding process. The portion of the protrusion 105 engaged with the step glue 14 has a shape adapted to the top end portion of the step glue 14 so as to closely fit with the top end portion of the step glue 14, preventing the molding material from entering the inside of the step glue 14 during the molding process.

More specifically, in the manufacturing step shown in fig. 8, the optical filter is correspondingly disposed on the step glue 14 to maintain the optical filter element 16 at the corresponding upper region of the photosensitive region 121 of the photosensitive element 12. In other words, the filter element 16 is held between the photosensitive element 12 and the optical lens 20, so that stray light in the light passing through the lens and incident on the filter element 16 can be effectively filtered by the filter element 16, thereby improving the imaging performance of the camera module.

Further, a connection glue 17 is further disposed between the filter element 16 and the step glue 14 to complete the mounting process of the filter element 16 through the connection glue 17. In the manufacturing step shown in fig. 8, the connection glue 17 is implemented as a first glue layer 171, and the first glue layer 171 is circumferentially coated on the outer side of the step glue 14 and in the glue receiving groove 132. The filter element 16 is then mounted to the first glue layer 171. The step glue 14 preferably has a uniform thickness so that the filter element 16 has a relatively high flatness when the filter element 16 is supported on the step glue 14.

In addition, as shown in fig. 9, which is a schematic view of a manufacturing step of forming the connection adhesive 17 according to another embodiment of the present invention, the connection adhesive 17 is implemented as a second adhesive layer 172, wherein the second adhesive layer 172 is disposed on the filter element 16, so that when the filter element 16 is correspondingly attached on the step adhesive 14, the filter element 16 can be smoothly seated on the step adhesive 14 and supported by the step adhesive 14, the second adhesive layer 172 is accommodated in the adhesive accommodating groove 14, and the top of the step adhesive 14 prevents the second adhesive layer 172 from entering the optical window 141 of the step adhesive 14. In particular, the second glue layer 172 is circumferentially disposed on the bottom side of the filter element 16.

As shown in fig. 10, in this modified embodiment of the present invention, the first glue layer 171 may be applied to the extended surface 133 of the molding base 13 and located outside the step glue 14, and the second glue layer 172 may be correspondingly applied to the bottom side of the filter element 16, and both the glue receiving groove 132 and the bottom side of the filter element 16 may be glued. It will be appreciated that in other embodiments of the present invention, the first glue layer 171 is applied to two opposite sides of the step glue 14, and the second glue layer 172 is applied to two other opposite sides of the filter element 16.

It is understood that in the embodiment illustrated in fig. 8 to 10, after the filter element 16 is supported on the step glue 14, glue may be further applied to the glue receiving groove 132 as the case may be, to ensure that the filter element 16 is firmly bonded.

In the manufacturing step shown in fig. 11, the optical lens 20 is assembled on the top surface of the mold base 13 to form the image pickup module. More specifically, in the preferred embodiment of the present invention, the optical lens 20 is directly assembled on the top surface of the mold base 13 and is located on the same optical axis as the filter element 16 and the photosensitive element 12, so as to establish a complete light path for the camera module. Namely, the camera module is a fixed-focus camera module. Of course, it is also possible to mount a lens carrying member 30 implemented as a lens barrel on the top surface of the mold base 13. Alternatively, in another embodiment of the present invention, the camera module is a moving focus camera module. At this time, the optical lens 20 is assembled to a lens carrying element 30 implemented as a driving element, such as a voice coil motor, which is directly assembled to the top surface of the mold base 13, wherein the driving element can drive the optical lens 20 to move so as to change the focal length of the camera module.

It can thus be seen that the objects of the invention are sufficiently well-attained. The embodiments illustrated to explain the functional and structural principles of the present invention have been fully illustrated and described, and the present invention is not to be limited by changes based on the principles of these embodiments. Accordingly, this invention includes all modifications encompassed within the scope and spirit of the following claims.

Claims

1. A photosensitive assembly, comprising:

a circuit board, a plurality of circuit boards,

a light-sensing element, which is provided with a light-sensing element,

a molding base, a molding base and a molding base,

a filter element supported by the step glue and spaced from the extension surface of the molding base, wherein an optical window for providing a light path for the photosensitive element is formed among the filter element, the step glue and the photosensitive element, wherein the top side of the molding base is provided with a concave glue containing groove along a surrounding direction, the photosensitive assembly further comprises a connecting glue which is at least partially arranged in the glue containing groove for bonding the filter element, wherein the shore hardness range of the step glue is A50-A80, and the elastic modulus range of the step glue is 0.001Gpa-0.1 Gpa.

2. The photosensitive assembly according to claim 1, wherein the step glue has an outer surface along the circumferential direction, the extended surface is integrally combined with the outer surface along the circumferential direction of the step glue at a position lower than a vertex of the step glue, and the glue receiving groove is formed outside the step glue.

3. A photosensitive assembly according to claim 2, wherein said connecting glue is attached to at least a portion of the bottom edge and/or at least a portion of the peripheral surface of said filter element.

4. The photosensitive assembly of claim 1, wherein said extension surface is integrally joined to a surface at an apex of said step glue, said photosensitive assembly further comprising a connection glue between said filter element and said step glue.

5. The photosensitive assembly according to any one of claims 1 to 4, wherein said photosensitive assembly further comprises at least one set of leads, wherein one end of each of said leads is connected to a chip connector of said photosensitive element, and the opposite end of said lead is connected to a circuit board connector of said circuit board, so as to electrically connect said photosensitive element and said circuit board through said lead.

6. The photosensitive assembly of claim 5, wherein said die attach member is disposed in said non-photosensitive region of said photosensitive element, and said step glue is disposed between said die attach member and said photosensitive region of said photosensitive element.

7. The photosensitive assembly of claim 5, wherein the die attach member is disposed in the non-photosensitive region of the photosensitive element, and wherein the step glue is disposed on the die attach member of the photosensitive element to cover a portion of the leads.

8. The photosensitive assembly of claim 5, wherein the chip connector is disposed in the non-photosensitive region of the photosensitive element, and wherein the step glue is disposed between the chip connector of the photosensitive element and the circuit board connector of the circuit board to completely cover the leads.

9. The photosensitive assembly of claim 5, wherein said step glue has a height higher than said leads are raised upward.

10. The photosensitive assembly according to any one of claims 1 to 4, wherein the step glue comprises a light-absorbing and light-impermeable material to reduce stray light reflected to the photosensitive element via the step glue.

11. A photosensitive assembly, comprising:

a circuit board, a plurality of circuit boards,

A molding base, a molding base and a molding base,

the step glue is arranged in the non-photosensitive area of the photosensitive element in a surrounding manner; and a filter element, wherein in a molding process, the molding base is integrally combined with the circuit board, the photosensitive element and the step glue, and then the filter element is supported on the step glue to provide a buffer by the step glue and form an optical window among the filter element, the step glue and the photosensitive element.

12. The photosensitive assembly of claim 11, wherein said mold base has an extension surface extending from an outer surface of said step glue in a circumferential direction, and a glue receiving groove in the circumferential direction is formed on a top side of said extension surface and an outer side of said step glue, said photosensitive assembly further comprising a connection glue at least partially disposed in said glue receiving groove to bond said filter element.

13. The photosensitive assembly of claim 12, wherein the connection paste extends on a bottom side of the filter element and/or an outer circumferential side of the filter element.

14. The photosensitive assembly of claim 12, wherein said extension surface is integrally joined to a surface at an apex of said step glue, said photosensitive assembly further comprising a connection glue between said filter element and said step glue.

15. A photosensitive assembly according to any one of claims 11 to 14, wherein said photosensitive assembly further comprises at least one set of leads, wherein one end of each of said leads is connected to a chip connector of said photosensitive element, and the opposite end of said lead is connected to a circuit board connector of said circuit board, so as to electrically connect said photosensitive element and said circuit board through said lead.

16. The photosensitive assembly of claim 15, wherein said die attach member is disposed in said non-photosensitive region of said photosensitive element, said step glue being disposed between said die attach member and said photosensitive region of said photosensitive element; or the step glue is arranged on the chip connecting piece of the photosensitive element so as to coat one part of the lead; or the step glue is arranged between the chip connecting piece of the photosensitive element and the circuit board connecting piece of the circuit board so as to completely coat the lead.

17. The photosensitive assembly of claim 15, wherein said step glue has a height higher than said leads are raised upward.

18. The photosensitive assembly according to any one of claims 11 to 14, wherein the step glue has a shore hardness in a range of a50-a80 and an elastic modulus in a range of 0.001Gpa to 0.1 Gpa.

19. The photosensitive assembly according to any one of claims 12 to 14, wherein the step glue comprises a light-absorbing and light-impermeable material to reduce stray light reflected to the photosensitive element via the step glue.

20. A photosensitive assembly, comprising:

a circuit board;

the photosensitive element is electrically connected to the circuit board and is provided with a photosensitive area and a non-photosensitive area positioned around the photosensitive area;

at least one set of leads;

a molding base, wherein the molding base is integrally combined with the circuit board, the photosensitive element and the step glue, wherein the molding base has an extension surface integrally extending from an outer surface of the step glue in a surrounding direction, wherein a glue accommodating groove is formed at an outer side of the step glue and a top side of the extension surface of the molding base, wherein one end of each of the leads is connected to a chip connector of the photosensitive element, and an opposite end of the lead is connected to a circuit board connector of the circuit board to electrically connect the photosensitive element and the circuit board through the lead, wherein the step glue has a height higher than an upward projection of the lead, wherein the shore hardness range of the step glue is A50-A80, and the elastic modulus range is 0.001Gpa-0.1 Gpa.

21. The photosensitive assembly of claim 20, wherein said die attach member is disposed in said non-photosensitive region of said photosensitive element, said step glue being disposed between said die attach member and said photosensitive region of said photosensitive element; or the step glue is arranged on the chip connecting piece of the photosensitive element so as to coat one part of the lead; or the step glue is arranged between the chip connecting piece of the photosensitive element and the circuit board connecting piece of the circuit board so as to completely coat the lead.

22. The photosensitive assembly according to claim 20 or 21, wherein a position of a junction where the extension surface is integrally joined to an outer surface of the step glue in the circulating direction is lower than a position at a vertex of the step glue.

23. The photosensitive assembly according to any one of claims 20 or 21, wherein the step glue includes a light absorbing and light non-transmitting material to reduce stray light reflected to the photosensitive element via the step glue.

24. A camera module comprising an optical lens and a photosensitive assembly according to any one of claims 1-22, wherein the optical lens is located in a photosensitive path of the photosensitive assembly.

25. The camera module of claim 24, wherein the optical lens is assembled to the molded base of the photosensitive assembly; or the optical lens is assembled on a lens bearing element which is assembled on the molding base, wherein the lens bearing element is a lens cone or a driving element.

26. An electronic device comprising one or more camera modules according to any one of claims 24-25.

27. A method for molding and packaging a camera module, wherein the method comprises the following steps:

conducting a photosensitive element and a circuit board;

supporting a filter element on the step glue; and

and assembling an optical lens on a photosensitive path of the photosensitive element, wherein the Shore hardness range of the step rubber is A50-A80, and the elastic modulus range is 0.001Gpa-0.1 Gpa.

28. The packaging method of claim 27, wherein the step of forming the molded base further comprises the steps of:

The top end part of the step glue is accommodated in a corresponding accommodating groove of a forming die; and

and forming a concave glue containing groove positioned at the top of the molding base outside the step glue, wherein the glue containing groove is formed after the forming mold is demolded.

29. The packaging method of claim 28, further comprising the step of: and the filter element is fixed by bonding through a connecting glue accommodated in the glue accommodating groove.

30. The packaging method of claim 27, wherein the filter element is adhesively secured to the step glue by a bonding glue applied between the filter element and the step glue.